NRVTS1560PFST3G [ONSEMI]
15 A, 60 V Trench Schottky Rectifier in TO-277 package;
| 型号： | NRVTS1560PFST3G |
| 厂家： | 
ONSEMI |
| 描述： | 15 A, 60 V Trench Schottky Rectifier in TO-277 package |
| 文件： | 总6页 (文件大小：214K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Schottky Barrier Rectifier,
Trench-based
NRTS1560PFS,
NRVTS1560PFS
This TO−277 trench Schottky rectifier provides fast switching
performance in a compact thermally efficient package. The TO−277
package provides an excellent alternative to the DPAK, offering
thermal performance nearly as good in a package occupying less than
half the board space. Its low profile makes it a good option for flat
panel display and other applications with limited vertical clearance.
The device offers low leakage over temperature making it a good
match for applications requiring low quiescent current.
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SCHOTTKY BARRIER
RECTIFIER, 15 AMPERES
60 VOLTS
Features
3
• Package Provides Capability of Inspection and Probe After Board
Mounting
• Low Forward Voltage Drop
• 175°C Operating Junction Temperature
1
2
TO−277−3LD
CASE 340CZ
• NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Anode 1
3
Compliant
Cathode
Anode 2
Mechanical Characteristics:
• Case: Epoxy, Molded
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
MARKING DIAGRAM
• Lead and Mounting Surface Temperature for Soldering Purposes:
TS1560
AWLYW
260°C Max. for 10 Seconds
• Device Meets MSL 1 Requirements
TS1560 = Specific Device Code
A
Y
W
WL
= Assembly Location
= Year
= Work Week
= Wafer Lot
Applications
• Excellent Alternative to DPAK in Space−Constrained Automotive
Applications
• Low Leakage for Higher Temperature Operation
• Output Rectification in Compact Portable Consumer Applications
• Freewheeling Diode used with Inductive Loads
ORDERING INFORMATION
Device
Package
Shipping†
1500 /
NRTS1560PFST3G
TO−277
(Pb−Free) Tape & Reel
NRVTS1560PFST3G
TO−277 1500 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
January, 2020 − Rev. 0
NRTS1560PFS/D
NRTS1560PFS, NRVTS1560PFS
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
60
V
RRM
RWM
R
V
V
Average Rectified Forward Current
I
15
30
A
A
A
F(AV)
(T = 158°C)
C
Peak Repetitive Forward Current,
I
FRM
(T = 151°C, Square Wave, Duty = 0.5)
C
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
I
200
FSM
Storage Temperature Range
Operating Junction Temperature
ESD Rating (Human Body Model)
ESD Rating (Machine Model)
T
−65 to +175
−55 to +175
3B
°C
°C
stg
T
J
M4
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Ambient
(Assumes 600 mm , 1 oz. copper bond pad on a FR4 board)
R
68
°C/W
θ
JA
2
Thermal Resistance, Junction−to−Case, Top
(Assumes 600 mm , 1 oz. copper bond pad on a FR4 board)
R
59
°C/W
°C/W
θ
JCT
JCB
2
Thermal Resistance, Junction−to−Case, Bottom
R
1.9
θ
2
(Assumes 600 mm , 1 oz. copper bond pad on a FR4 board)
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Instantaneous Forward Voltage (Note 1)
v
V
F
(i = 7.5 A, T = 25°C)
0.52
0.45
0.61
0.59
−
F
J
(i = 7.5 A, T = 125°C)
−
F
J
(i = 15 A, T = 25°C)
0.64
0.63
F
J
(i = 15 A, T = 125°C)
F
J
Instantaneous Reverse Current (Note 1)
i
R
(Rated dc Voltage, T = 25°C)
3.0
2.8
10
15
mA
mA
J
(Rated dc Voltage, T = 125°C)
J
Junction Capacitance
C
pF
J
(V = 1 V, T = 25°C, 1 MHz)
1400
−
R
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
NRTS1560PFS, NRVTS1560PFS
TYPICAL CHARACTERISTICS
100
10
100
T = 125°C
A
T = 125°C
A
T = 150°C
10
A
T = 150°C
A
T = 85°C
A
T = 85°C
A
T = 175°C
A
T = 25°C
A
T = 25°C
A
1
1
T = 175°C
A
T = −55°C
T = −55°C
A
A
0.1
0.1
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
T = 175°C
A
T = 175°C
A
T = 150°C
A
T = 150°C
T = 125°C
A
A
T = 125°C
A
T = 85°C
A
T = 85°C
A
1.E−05
1.E−06
1.E−05
1.E−06
T = 25°C
A
T = 25°C
A
1.E−07
1.E−08
1.E−07
1.E−08
T = −55°C
A
1.E−09
1.E−10
1.E−11
1.E−09
1.E−10
1.E−11
T = −55°C
A
0
10
20
30
40
50
60
0
10
20
30
40
50
60
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
10,000
1000
40
35
30
25
20
15
10
R
= 1.9°C/W
T = 175°C
q
JC
T = 25°C
J
J
DC
Square Wave
(Duty = 0.5)
100
10
5
0
0.1
1
10
100
25
40 55 70 85 100 115 130 145 160 175
V , REVERSE VOLTAGE (V)
R
T , CASE TEMPERATURE (°C)
C
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating
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3
NRTS1560PFS, NRVTS1560PFS
TYPICAL CHARACTERISTICS
16
14
12
10
8
T = 175°C
J
Square Wave
(Duty = 0.5)
DC
6
4
2
0
0
3
6
9
12
15
I , AVERAGE FORWARD CURRENT (A)
F(AV)
Figure 7. Forward Power Dissipation
100
10
1
50% (DUTY CYCLE)
20%
10%
5.0%
2.0%
1.0%
0.1
0.01
SINGLE PULSE
2
(Assumes 600 mm , 1 oz. copper bond pad on a FR4 board)
0.001
0.000001 0.00001
0.0001
0.001
0.01
PULSE TIME (s)
0.1
1.0
10
100
1000
Figure 8. Typical Thermal Characteristics, Junction−to−Ambient
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−277−3LD
CASE 340CZ
ISSUE A
DATE 14 FEB 2020
GENERIC
MARKING DIAGRAM*
XXXXXX = Specific Device Code
*This information is generic. Please refer to
A
Y
= Assembly Location
= Year
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
XXXXXX
AWLYW
W
WL
= Work Week
= Wafer Lot
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON97727G
TO−277−3LD
PAGE 1 OF 1
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