NSQA6V8AW5T2_06 [ONSEMI]

Low Capacitance Quad Array for ESD Protection; 低电容四阵列的ESD保护
NSQA6V8AW5T2_06
型号: NSQA6V8AW5T2_06
厂家: ONSEMI    ONSEMI
描述:

Low Capacitance Quad Array for ESD Protection
低电容四阵列的ESD保护

文件: 总4页 (文件大小:54K)
中文:  中文翻译
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NSQA6V8AW5T2 Series  
Low Capacitance  
Quad Array for  
ESD Protection  
This integrated transient voltage suppressor device (TVS) is  
designed for applications requiring transient overvoltage protection. It  
is intended for use in sensitive equipment such as computers, printers,  
business machines, communication systems, medical equipment, and  
other applications. Its integrated design provides very effective and  
reliable protection for four separate lines using only one package.  
These devices are ideal for situations where board space is at a  
premium.  
http://onsemi.com  
1
2
3
5
4
Features  
ESD Protection: IEC61000−4−2: Level 4  
MILSTD 883C − Method 3015−6: Class 3  
Four Separate Unidirectional Configurations for Protection  
Low Leakage Current < 1 mA  
SC−88A/SOT−323  
CASE 419A  
Power Dissipation: 380 mW  
Small SC−88A SMT Package  
Low Capacitance  
MARKING DIAGRAM  
Pb−Free Package is Available  
4
5
Benefits  
6x MG  
Provides Protection for ESD Industry Standards: IEC 61000, HBM  
Minimize Power Consumption of the System  
Minimize PCB Board Space  
G
1
2
3
x
=H for NSQA6V8AW5T2  
X for NSQA12VAW5T2  
=Date Code  
Typical Applications  
Instrumentation Equipment  
Serial and Parallel Ports  
Microprocessor Based Equipment  
Notebooks, Desktops, Servers  
Cellular and Portable Equipment  
M
G
=Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NSQA6V8AW5T2  
SC−88A 3000/Tape & Reel  
NSQA6V8AW5T2G SC−88A 3000/Tape & Reel  
(Pb−Free)  
NSQA12VAW5T2  
SC−88A 3000/Tape & Reel  
NSQA12VAW5T2G SC−88A 3000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
December, 2006 − Rev. 4  
NSQA6V8AW5T2/D  
NSQA6V8AW5T2 Series  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Rating  
Symbol  
Value  
Unit  
Peak Power Dissipation  
P
20  
W
PK  
8   20 msec Double Exponential Waveform (Note 1)  
Steady State Power − 1 Diode (Note 2)  
P
380  
mW  
D
Thermal Resistance −  
Junction−to−Ambient  
Above 25°C, Derate  
R
q
JA  
327  
3.05  
°C/W  
mW/°C  
Operating Junction Temperature Range  
Storage Temperature Range  
T
−40 to +125  
−55 to +150  
260  
°C  
°C  
°C  
J
T
stg  
Lead Solder Temperature − Maximum 10 Seconds Duration  
T
L
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. Non−repetitive current pulse per Figure 1.  
2. Only 1 diode under power. For all 4 diodes under power, P will be 25%. Mounted on FR4 board with min pad.  
D
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
NSQA6V8AW5T2  
Characteristic  
Symbol  
Min  
6.4  
Typ  
6.8  
Max  
7.1  
1.0  
13  
Unit  
V
Breakdown Voltage (I = 1 mA) (Note 3)  
V
BR  
T
Leakage Current (V  
= 5.0 V)  
I
mA  
V
RWM  
R
Clamping Voltage 1 (I = 1.6 A, 8   20 msec Waveform)  
V
PP  
C
Maximum Peak Pulse Current (8   20 msec Waveform)  
I
1.6  
A
PP  
Junction Capacitance(V = 0 V, f = 1 MHz)  
C
J
12  
6.7  
15  
9.5  
pF  
R
− (V = 3.0 V, f = 1 MHz)  
R
NSQA12VAW5T2  
Breakdown Voltage (I = 5 mA) (Note 3)  
V
11.4  
12.0  
12.7  
0.05  
30  
V
mA  
W
T
BR  
Leakage Current (V  
= 9.0 V)  
I
R
RWM  
Zener Impedence (I = 5 mA)  
Z
T
Z
C
Clamping Voltage 1 (I = 0.9 A, 8   20 msec Waveform)  
V
23  
V
PP  
Maximum Peak Pulse Current (8   20 msec Waveform)  
I
0.9  
15  
A
PP  
Junction Capacitance(V = 0 V, f = 1 MHz)  
C
pF  
R
J
3. V is measured at pulse test current I .  
BR  
T
http://onsemi.com  
2
 
NSQA6V8AW5T2 Series  
100  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
10  
0
1
0
25  
50  
75  
100  
125  
150  
1
10  
100  
1000  
t, TIME (ms)  
T , AMBIENT TEMPERATURE (°C)  
A
Figure 2. Power Derating Curve  
Figure 1. Pulse Width  
0.16  
0.14  
0.12  
0.10  
0.08  
0.06  
0.04  
14  
12  
10  
8
T = 25°C  
A
6 V  
6
4
12 V  
2
0
0.02  
0
−60 −40 −20  
0
20  
40  
60  
80  
100  
0
1
2
3
4
5
6
T, TEMPERATURE (°C)  
BIAS VOLTAGE (V)  
Figure 3. Reverse Leakage versus  
Temperature  
Figure 4. Capacitance  
1
100  
90  
PEAK VALUE I  
@ 8 ms  
t
RSM  
r
PULSE WIDTH (t ) IS DEFINED  
AS THAT POINT WHERE THE  
PEAK CURRENT DECAY = 8 ms  
P
80  
70  
60  
50  
40  
30  
20  
0.1  
HALF VALUE I  
/2 @ 20 ms  
RSM  
0.01  
t
P
10  
0
T = 25°C  
A
0.001  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
0
20  
40  
60  
80  
V , FORWARD VOLTAGE (V)  
F
t, TIME (ms)  
Figure 6. Forward Voltage  
Figure 5. 8 × 20 ms Pulse Waveform  
http://onsemi.com  
3
NSQA6V8AW5T2 Series  
PACKAGE DIMENSIONS  
SC−88A/SOT−323/SC−70  
5−LEAD PACKAGE  
CASE 419A−02  
ISSUE J  
A
NOTES:  
G
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. 419A−01 OBSOLETE. NEW STANDARD  
419A−02.  
4. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
5
4
3
−B−  
S
1
2
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
1.80  
1.15  
0.80  
0.10  
MAX  
2.20  
1.35  
1.10  
0.30  
A
B
C
D
G
H
J
0.071  
0.045  
0.031  
0.004  
0.087  
0.053  
0.043  
0.012  
M
M
B
D 5 PL  
0.2 (0.008)  
0.026 BSC  
0.65 BSC  
−−−  
0.004  
0.004  
0.004  
0.010  
0.012  
−−−  
0.10  
0.10  
0.10  
0.25  
0.30  
N
K
N
S
0.008 REF  
0.20 REF  
0.079  
0.087  
2.00  
2.20  
J
C
K
H
SOLDERING FOOTPRINT*  
0.50  
0.0197  
0.65  
0.025  
0.65  
0.025  
0.40  
0.0157  
1.9  
0.0748  
mm  
inches  
ǒ
Ǔ
SCALE 20:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5773−3850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NSQA6V8AW5T2/D  

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