NST3906MX2T5G [ONSEMI]

200 mA, 40 V, PNP Bipolar Transistor in SOT-883 ;
NST3906MX2T5G
型号: NST3906MX2T5G
厂家: ONSEMI    ONSEMI
描述:

200 mA, 40 V, PNP Bipolar Transistor in SOT-883 

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DATA SHEET  
www.onsemi.com  
COLLECTOR  
General Purpose Transistor  
PNP Silicon  
3
1
NST3906MX2  
BASE  
Features  
2
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
EMITTER  
Compliant  
3
MAXIMUM RATINGS  
1
2
Rating  
Symbol  
Value  
40  
Unit  
Vdc  
CollectorEmitter Voltage  
CollectorBase Voltage  
V
CEO  
X2DFN3 (1.0 x 0.6 mm)  
CASE 714AC  
V
40  
Vdc  
CBO  
EBO  
EmitterBase Voltage  
V
5.0  
200  
800  
Vdc  
MARKING DIAGRAM  
Collector Current Continuous (Note 1)  
Collector Current Peak (Note 1)  
I
C
mAdc  
mAdc  
I
CM  
AF M  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
AF = Specific Device Code  
M
= Date Code  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
ORDERING INFORMATION  
Total Power Dissipation (Note 2)  
P
D
@ T = 25°C  
165  
mW  
A
Derate above 25°C  
1.39  
mW/°C  
Device  
NST3906MX2T5G  
Package  
Shipping  
X2DFN3  
Thermal Resistance,  
JunctiontoAmbient (Note 2)  
R
720  
°C/W  
8000 / Tape &  
Reel  
q
JA  
(PbFree)  
Total Power Dissipation (Note 3)  
P
D
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
@ T = 25°C  
590  
mW  
A
Derate above 25°C  
4.93  
mW/°C  
Thermal Resistance,  
JunctiontoAmbient (Note 3)  
R
203  
°C/W  
q
JA  
Junction and Storage Temperature Range  
T , T  
55 to  
+150  
°C  
J
stg  
1. Reference SOA Curve  
2
2
2. Surfacemounted on FR4 board using a 0.6 mm , 2 oz. Cu pad  
3. Surfacemounted on FR4 board using a 100 mm , 2 oz. Cu pad  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
January, 2022 Rev. 0  
NST3906MX2/D  
 
NST3906MX2  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Max  
Unit  
CollectorEmitter Breakdown Voltage  
V
Vdc  
Vdc  
(BR)CEO  
(BR)CBO  
(BR)EBO  
(I = 1.0 mAdc, I = 0)  
40  
40  
5.0  
C
B
CollectorBase Breakdown Voltage  
(I = 10 mAdc, I = 0)  
V
V
C
E
EmitterBase Breakdown Voltage  
Vdc  
(I = 10 mAdc, I = 0)  
E
C
Base Cutoff Current  
I
BL  
nAdc  
nAdc  
(V = 30 Vdc, V = 3.0 Vdc)  
50  
50  
CE  
EB  
Collector Cutoff Current  
I
CEX  
(V = 30 Vdc, V = 3.0 Vdc)  
CE  
EB  
ON CHARACTERISTICS (Note 4)  
DC Current Gain  
H
FE  
(I = 0.1 mAdc, V = 1.0 Vdc)  
60  
80  
100  
60  
30  
300  
C
CE  
(I = 1.0 mAdc, V = 1.0 Vdc)  
C
CE  
CE  
CE  
CE  
(I = 10 mAdc, V = 1.0 Vdc)  
C
(I = 50 mAdc, V = 1.0 Vdc)  
C
(I = 100 mAdc, V = 1.0 Vdc)  
C
CollectorEmitter Saturation Voltage  
(I = 10 mAdc, I = 1.0 mAdc)  
V
Vdc  
Vdc  
CE(sat)  
0.25  
0.4  
C
B
(I = 50 mAdc, I = 5.0 mAdc)  
C
B
BaseEmitter Saturation Voltage  
(I = 10 mAdc, I = 1.0 mAdc)  
V
BE(sat)  
0.65  
0.85  
0.95  
C
B
(I = 50 mAdc, I = 5.0 mAdc)  
C
B
SMALLSIGNAL CHARACTERISTICS  
CurrentGain Bandwidth Product  
f
MHz  
pF  
T
(I = 10 mAdc, V = 20 Vdc, f = 100 MHz)  
250  
C
CE  
Output Capacitance  
C
obo  
(V = 5.0 Vdc, I = 0, f = 1.0 MHz)  
4.5  
10  
CB  
E
Input Capacitance  
C
pF  
ibo  
(V = 0.5 Vdc, I = 0, f = 1.0 MHz)  
EB  
C
Input Impedance  
h
kW  
ie  
re  
fe  
(I = 1.0 mAdc, V = 10 Vdc, f = 1.0 kHz)  
2.0  
0.1  
100  
3.0  
12  
C
CE  
4  
Voltage Feedback Ratio  
h
h
X 10  
(I = 1.0 mAdc, V = 10 Vdc, f = 1.0 kHz)  
C
10  
CE  
SmallSignal Current Gain  
(I = 1.0 mAdc, V = 10 Vdc, f = 1.0 kHz)  
400  
60  
C
CE  
Output Admittance  
h
oe  
mmhos  
dB  
(I = 1.0 mAdc, V = 10 Vdc, f = 1.0 kHz)  
C
CE  
Noise Figure  
NF  
(I = 100 mAdc, V = 5.0 Vdc, R = 1.0 kW, f = 1.0 kHz)  
4.0  
C
CE  
S
SWITCHING CHARACTERISTICS  
Delay Time  
t
t
35  
35  
d
(V = 3.0 Vdc, V = 0.5 Vdc,  
CC  
BE  
ns  
ns  
I
= 10 mAdc, I = 1.0 mAdc)  
C
B1  
Rise Time  
t
r
Storage Time  
225  
75  
s
(V = 3.0 Vdc, I = 10 mAdc,  
CC  
C
I
B1  
= I = 1.0 mAdc)  
B2  
Fall Time  
t
f
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.  
www.onsemi.com  
2
 
NST3906MX2  
TYPICAL CHARACTERISTICS  
Turnon  
Turnoff  
3V  
3V  
PW = 20 us  
Duty Cycle =<2%  
RC = 275 Ohms  
RC = 275 Ohms  
+9.1V  
0V  
PW = 300 ns  
Duty Cycle =< 2%  
RB = 10K Ohms  
+0.5 V  
0V  
RB = 10K Ohms  
Cs<15pF*  
Cs<15pF*  
1N916 or  
equivalent  
10.9V  
10.6 V  
VCC = 3V, IC = 10mA  
IB1 = 1mA, IB2 = 1mA  
Forced HFE = 10  
VCC = 3V, IC = 10mA, IB = 1 mA  
Forced HFE = 10  
* Total shunt capacitance of test jig and connecto. rs  
* Total shunt capacitance of test jig and connecto.rs  
Figure 1. Delay and Rise Time Equivalent Test  
Circuit  
Figure 2. Storage and Fall Time Equivalent  
Test Circuit  
10  
1000  
I /I = 10  
C
B
V
CC  
= 40 V  
C
V
CC  
= 20 V  
ibo  
100  
10  
V
CC  
= 5 V  
C
obo  
1
0.1  
1  
10  
1  
10  
100  
REVERSE BIAS VOLTAGE (V)  
I , COLLECTOR CURRENT (mA)  
C
Figure 3. Capacitance  
Figure 4. TurnOn Time  
1000  
1000  
I /I = 10  
t= t 1/8 x t  
C
B
s
s
= I  
f
I
B1  
B2  
V
CC  
= 40 V  
I /I = 10  
C
B
V
= 40 V  
= 5 V  
V
CC  
= 20 V  
CC  
V
CC  
= 20 V  
100  
10  
100  
10  
V
CC  
V
CC  
= 5 V  
1  
10  
100  
1  
10  
100  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 5. Rise Time  
Figure 6. Storage Time  
www.onsemi.com  
3
NST3906MX2  
TYPICAL CHARACTERISTICS  
1000  
1000  
I
= I  
B2  
V
CC  
= 1 V  
B1  
V
CC  
= 40 V  
I /I = 10  
C
B
T = 150°C  
A
T = 25°C  
A
V
CC  
= 20 V  
T = 55°C  
A
100  
10  
100  
10  
V
CC  
= 5 V  
1  
10  
100  
0.1  
1  
10  
100  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 7. Fall Time  
Figure 8. DC Current Gain  
1000  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
V
CC  
= 10 V  
T = 150°C  
A
T = 25°C  
A
T = 55°C  
A
100  
10  
I
C
= 200 mA  
I
C
= 10 mA  
0.2  
0.1  
0
I
C
= 100 mA  
I
C
= 1 mA  
0.1  
1  
10  
100  
0.001 0.01  
0.1  
1  
10 100  
I , COLLECTOR CURRENT (mA)  
C
I , BASE CURRENT (mA)  
B
Figure 9. DC Current Gain  
Figure 10. Collector Saturation Region  
0.40  
0.35  
1.00  
0.95  
0.90  
0.85  
I /I = 10  
T = 25°C  
A
I /I = 10  
T = 25°C  
A
C
B
C
B
0.30  
0.25  
0.20  
0.15  
0.80  
0.75  
0.70  
0.10  
0.05  
0.65  
0.60  
0
0.001  
0.01  
I , COLLECTOR CURRENT (A)  
0.1  
0.001  
0.01  
I , COLLECTOR CURRENT (A)  
0.1  
C
C
Figure 11. CollectorEmitter Saturation  
Figure 12. BaseEmitter Saturation Voltage vs.  
Voltage vs. Collector Current  
Collector Current  
www.onsemi.com  
4
NST3906MX2  
TYPICAL CHARACTERISTICS  
0.18  
0.16  
0.14  
0.12  
0.10  
0.08  
0.06  
0.04  
1000  
I
= 5.0 mA  
4.5 mA  
3.5 mA  
B
4.0 mA  
3.0 mA  
2.0 mA  
2.5 mA  
100  
1.5 mA  
0.5 mA  
1.0 mA  
10  
1
V
= 2 V  
CE  
T = 25°C  
A
0.02  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
1  
10  
I , COLLECTOR CURRENT (mA)  
100  
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
C
Figure 13. Collector Current vs.  
Figure 14. Current Gain Bandwidth vs.  
Collector Current  
CollectorEmitter Voltage  
1000  
100  
1 ms  
Thermal Limit  
10 ms  
100 ms  
1 s  
10  
1  
0.1  
1  
10  
100  
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
Figure 15. Safe Operating Area  
www.onsemi.com  
5
NST3906MX2  
PACKAGE DIMENSIONS  
X2DFN3 1.0x0.6, 0.35P  
CASE 714AC  
ISSUE A  
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