NSVRB521S30T5G [ONSEMI]
肖特基势垒二极管;
| 型号： | NSVRB521S30T5G |
| 厂家： | 
ONSEMI |
| 描述： | 肖特基势垒二极管 整流二极管 |
| 文件： | 总3页 (文件大小：77K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RB521S30T1G,
RB521S30T5G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
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Features
30 V SCHOTTKY
BARRIER DIODE
• Extremely Fast Switching Speed
• Extremely Low Forward Voltage 0.5 V (max) @ I = 200 mA
F
• Low Reverse Current
1
2
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
CATHODE
ANODE
Compliant
MAXIMUM RATINGS
2
Rating
Symbol
Value
30
Unit
Vdc
mA
A
1
Reverse Voltage
V
R
SOD−523
CASE 502
Forward Current DC
I
F
200
1.0
Peak Forward Surge Current (Note 1)
I
FSM
ESD Rating: Class 1C per Human Body Model
ESD Rating: Class C per Machine Model
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. 60 Hz for 1 cycle.
5M M G
G
1
2
5M
M
G
= Device Code
= Date Code*
= Pb−Free Package
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
(Note: Microdot may be in either location)
Total Device Dissipation FR−5 Board,
P
200
mW
*Date Code orientation may vary depending
upon manufacturing location.
D
(Note 2) T = 25°C
A
Derate above 25°C
1.57
635
mW/°C
°C/W
°C
Thermal Resistance, Junction−to−Ambient
R
q
JA
ORDERING INFORMATION
Junction and Storage
Temperature Range
T , T
J
−55 to +125
stg
†
Device
Package
Shipping
2. FR−5 Minimum Pad.
RB521S30T1G
SOD−523
(Pb−Free)
4 mm Pitch
3000/Tape & Reel
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
RB521S30T5G
SOD−523
(Pb−Free)
4 mm Pitch
8000/Tape & Reel
Characteristic
Symbol
Min
Typ
Max
Unit
Reverse Leakage
I
−
−
30.0
mA
R
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
(V = 10 V)
R
Forward Voltage
V
−
−
0.50
Vdc
F
(I = 200 mA)
F
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
July, 2011 − Rev. 6
RB521S30T1/D
RB521S30T1G, RB521S30T5G
1
100m
10m
10m
1m
T = 125°C
A
T = 125°C
A
100m
10m
1m
T = 75°C
A
T = 75°C
A
1m
T = 25°C
A
100m
T = 25°C
100n
10n
1n
A
T = −25°C
A
10m
1m
T = −25°C
A
0
0.1
0.2
0.3
0.4
0.5
0.6
0
5
10
15
20
25
30
V , FORWARD VOLTAGE (V)
F
V , REVERSE VOLTAGE (VOLTS)
R
Figure 1. Forward Characteristics
Figure 2. Reverse Characteristics
20
18
16
14
12
10
8
6
4
2
0
0
5
10
15
20
25
30
V , REVERSE VOLTAGE (VOLTS)
R
Figure 3. Total Capacitance
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2
RB521S30T1G, RB521S30T5G
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE E
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
−Y−
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
E
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
1
2
2X b
MILLIMETERS
M
0.08
X Y
DIM
A
b
c
D
E
HE
L
MIN
0.50
0.25
0.07
1.10
0.70
1.50
NOM
0.60
0.30
0.14
1.20
0.80
1.60
0.30 REF
0.20
MAX
0.70
0.35
0.20
1.30
0.90
1.70
TOP VIEW
A
L2
0.15
0.25
c
HE
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
1.80
2X
0.48
2X
L
2X
0.40
PACKAGE
OUTLINE
2X
L2
DIMENSION: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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RB521S30T1/D
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