NVB6413ANT4G [ONSEMI]

Power MOSFET 100V 42A 28 mohm Single N-Channel D2PAK;
NVB6413ANT4G
型号: NVB6413ANT4G
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET 100V 42A 28 mohm Single N-Channel D2PAK

晶体管 功率场效应晶体管
文件: 总7页 (文件大小:140K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NTB6413AN, NTP6413AN  
N-Channel Power MOSFET  
100 V, 42 A, 28 mW  
Features  
Low R  
DS(on)  
High Current Capability  
100% Avalanche Tested  
These are PbFree Devices  
http://onsemi.com  
I
D
MAX  
V
R
MAX  
DS(ON)  
(Note 1)  
(BR)DSS  
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
100 V  
28 mW @ 10 V  
42 A  
Parameter  
DraintoSource Voltage  
GatetoSource Voltage Continuous  
Symbol  
Value  
100  
$20  
42  
Unit  
V
V
DSS  
NChannel  
V
GS  
V
D
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
D
A
C
q
JC  
T
C
28  
Power Dissipation  
R
Steady  
State  
T
C
P
D
136  
W
q
JC  
G
Pulsed Drain Current  
t = 10 ms  
p
I
178  
A
DM  
S
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
+175  
4
Source Current (Body Diode)  
I
S
42  
A
4
Single Pulse DraintoSource Avalanche  
E
AS  
200  
mJ  
Energy (V = 50 Vdc, V = 10 Vdc,  
DD  
GS  
1
2
I
= 36.5 A, L = 0.3 mH, R = 25 W)  
L(pk)  
G
3
Lead Temperature for Soldering  
Purposes, 1/8from Case for 10 Seconds  
T
L
260  
°C  
2
TO220AB  
D PAK  
CASE 221A  
STYLE 5  
CASE 418B  
STYLE 2  
THERMAL RESISTANCE RATINGS  
Parameter  
1
2
3
Symbol  
Max  
1.1  
35  
Unit  
JunctiontoCase (Drain) Steady State  
JunctiontoAmbient (Note 1)  
R
°C/W  
q
JC  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
R
q
JA  
4
4
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 sq in pad size,  
Drain  
Drain  
NTB  
6413ANG  
AYWW  
(Cu Area 1.127 sq in [2 oz] including traces).  
NTP  
6413ANG  
AYWW  
2
1
Gate  
3
1
Gate  
3
Drain  
Source  
Source  
2
6413AN = Specific Device Code  
Drain  
G
A
Y
= PbFree Device  
= Assembly Location  
= Year  
WW = Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
November, 2009 Rev. 1  
NTB6413AN/D  
 
NTB6413AN, NTP6413AN  
ELECTRICAL CHARACTERISTICS (T = 25°C Unless otherwise specified)  
J
Characteristics  
OFF CHARACTERISTICS  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
100  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage Temper-  
ature Coefficient  
V
/T  
J
115  
mV/°C  
(BR)DSS  
Zero Gate Voltage Drain Current  
I
V
DS  
= 0 V,  
T = 25°C  
1.0  
100  
mA  
DSS  
GS  
J
V
= 100 V  
T = 125°C  
J
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 2)  
Gate Threshold Voltage  
I
V
= 0 V, V = $20 V  
$100  
nA  
GSS  
DS  
GS  
V
GS(th)  
V
= V , I = 250 mA  
2.0  
4.0  
28  
V
mV/°C  
mW  
S
GS  
DS  
D
Negative Threshold Temperature Coefficient  
DraintoSource OnResistance  
Forward Transconductance  
V
/T  
8.1  
GS(th)  
J
R
V
= 10 V, I = 42 A  
25.6  
17.9  
DS(on)  
GS  
D
g
V
= 5 V, I = 20 A  
GS D  
FS  
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
1800  
280  
100  
51  
pF  
nC  
iss  
V
DS  
= 25 V, V = 0 V,  
GS  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
C
oss  
f = 1 MHz  
C
rss  
Q
G(TOT)  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Plateau Voltage  
Q
2.0  
10  
G(TH)  
V
GS  
= 10 V, V = 80 V,  
DS  
Q
GS  
GD  
GP  
I
= 42 A  
D
Q
V
26  
5.8  
2.4  
V
Gate Resistance  
R
W
G
SWITCHING CHARACTERISTICS, V = 10 V (Note 3)  
GS  
TurnOn Delay Time  
Rise Time  
t
13  
84  
52  
71  
ns  
d(on)  
t
r
V
= 10 V, V = 80 V,  
DD  
GS  
D
I
= 42 A, R = 6.2 W  
G
TurnOff Delay Time  
Fall Time  
t
d(off)  
t
f
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
T = 25°C  
0.92  
0.83  
73  
1.3  
V
SD  
J
I
S
= 42 A  
T = 125°C  
J
Reverse Recovery Time  
Charge Time  
t
ns  
rr  
t
56  
a
V
GS  
= 0 V, I = 42 A,  
S
dI /dt = 100 A/ms  
SD  
Discharge Time  
t
17  
b
Reverse Recovery Charge  
Q
230  
nC  
RR  
2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.  
3. Switching characteristics are independent of operating junction temperatures.  
http://onsemi.com  
2
 
NTB6413AN, NTP6413AN  
TYPICAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
100  
V
DS  
w 10 V  
10 V  
T = 25°C  
J
7.5 V  
80  
60  
40  
20  
0
6.5 V  
6.0 V  
T = 25°C  
J
T = 125°C  
J
5.5 V  
5.0 V  
T = 55°C  
J
0
1
2
3
4
5
2
3
4
5
6
7
8
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 2. Transfer Characteristics  
Figure 1. OnRegion Characteristics  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0.08  
0.06  
0.04  
I
= 42 A  
V
GS  
= 10 V  
D
T = 175°C  
T = 25°C  
J
J
T = 125°C  
J
T = 25°C  
J
0.02  
0.00  
T = 55°C  
J
5
6
7
8
9
10  
10  
20  
30  
40  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnRegion versus Gate Voltage  
Figure 4. OnResistance versus Drain Current  
and Gate Voltage  
3
2.5  
2
10000  
1000  
100  
V
= 0 V  
I
= 42 A  
= 10 V  
GS  
D
V
GS  
T = 150°C  
J
1.5  
1
T = 125°C  
J
0.5  
50 25  
0
25  
50  
75  
100 125 150 175  
10  
20  
30  
40  
50  
60  
70  
80  
90 100  
T , JUNCTION TEMPERATURE (°C)  
J
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
versus Voltage  
http://onsemi.com  
3
NTB6413AN, NTP6413AN  
TYPICAL CHARACTERISTICS  
10  
4000  
3000  
2000  
1000  
0
100  
80  
60  
40  
20  
0
Q
T = 25°C  
T
J
V
GS  
= 0 V  
8
6
4
2
0
V
V
DS  
GS  
Q
Q
gd  
gs  
C
iss  
I
D
= 42 A  
C
oss  
T = 25°C  
J
C
rss  
0
10 20 30 40 50 60 70 80 90 100  
, DRAINTOSOURCE VOLTAGE (V)  
0
10  
20  
30  
40  
50  
V
DS  
Q , TOTAL GATE CHARGE (nC)  
g
Figure 7. Capacitance Variation  
Figure 8. GatetoSource Voltage and  
DraintoSource Voltage versus Total Charge  
1000  
100  
10  
V
I
= 80 V  
= 42 A  
= 10 V  
DS  
T = 25°C  
J
40  
30  
20  
10  
0
D
V
GS  
= 0 V  
V
GS  
t
t
r
f
t
d(off)  
t
d(on)  
1
1
10  
R , GATE RESISTANCE (W)  
100  
0.4  
0.5  
0.6  
, SOURCETODRAIN VOLTAGE (V)  
SD  
0.7  
0.8  
0.9  
1.0  
V
G
Figure 9. Resistive Switching Time Variation  
versus Gate Resistance  
Figure 10. Diode Forward Voltage versus  
Current  
1000  
100  
10  
200  
150  
100  
50  
I
D
= 56 A  
10 ms  
100 ms  
1 ms  
V
= 10 V  
GS  
10 ms  
dc  
SINGLE PULSE  
= 25°C  
T
C
1
R
LIMIT  
DS(on)  
THERMAL LIMIT  
PACKAGE LIMIT  
0
25  
0.1  
1
10  
100  
1000  
50  
75  
100  
125  
150  
175  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
T , STARTING JUNCTION TEMPERATURE  
J
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Avalanche Energy versus  
Starting Junction Temperature  
http://onsemi.com  
4
NTB6413AN, NTP6413AN  
TYPICAL CHARACTERISTICS  
10  
1
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.1  
0.01  
0.01  
0.001  
SINGLE PULSE  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t, PULSE TIME (s)  
Figure 13. Thermal Response  
ORDERING INFORMATION  
Device  
Package  
Shipping  
2
NTB6413ANG  
D PAK  
50 Units / Rail  
(PbFree)  
2
NTB6413ANT4G  
NTP6413ANG  
D PAK  
800 / Tape & Reel  
50 Units / Rail  
(PbFree)  
TO220  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
5
NTB6413AN, NTP6413AN  
PACKAGE DIMENSIONS  
D2PAK 3  
CASE 418B04  
ISSUE K  
NOTES:  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
C
2. CONTROLLING DIMENSION: INCH.  
3. 418B01 THRU 418B03 OBSOLETE,  
NEW STANDARD 418B04.  
E
V
W
B−  
INCHES  
DIM MIN MAX  
MILLIMETERS  
4
MIN  
MAX  
A
B
C
D
E
F
G
H
J
0.340 0.380  
0.380 0.405  
0.160 0.190  
0.020 0.035  
0.045 0.055  
0.310 0.350  
0.100 BSC  
8.64  
9.65 10.29  
4.06  
0.51  
1.14  
7.87  
9.65  
4.83  
0.89  
1.40  
8.89  
A
S
1
2
3
2.54 BSC  
0.080  
0.018 0.025  
0.090 0.110  
0.110  
2.03  
0.46  
2.29  
1.32  
7.11  
5.00 REF  
2.00 REF  
0.99 REF  
2.79  
0.64  
2.79  
1.83  
8.13  
T−  
SEATING  
PLANE  
K
W
K
L
J
G
0.052 0.072  
0.280 0.320  
0.197 REF  
0.079 REF  
0.039 REF  
0.575 0.625 14.60 15.88  
0.045 0.055 1.14 1.40  
M
N
P
R
S
V
H
D 3 PL  
M
M
0.13 (0.005)  
T B  
VARIABLE  
STYLE 2:  
PIN 1. GATE  
2. DRAIN  
CONFIGURATION  
ZONE  
N
P
R
3. SOURCE  
4. DRAIN  
U
L
L
L
M
M
M
F
F
F
VIEW WW  
VIEW WW  
VIEW WW  
1
2
3
SOLDERING FOOTPRINT*  
10.49  
8.38  
16.155  
3.25X04  
2X  
1.016  
5.080  
PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
6
NTB6413AN, NTP6413AN  
PACKAGE DIMENSIONS  
TO220  
CASE 221A09  
ISSUE AF  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
SEATING  
PLANE  
T−  
C
B
F
T
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
4
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.36  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
---  
MAX  
15.75  
10.28  
4.82  
0.88  
4.09  
2.66  
3.93  
0.64  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
---  
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.014  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
---  
0.620  
0.405  
0.190  
0.035  
0.161  
0.105  
0.155  
0.025  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
---  
A
K
Q
Z
1
2
3
U
H
G
H
J
K
L
N
Q
R
S
T
L
R
V
J
G
U
V
Z
D
0.080  
2.04  
N
STYLE 5:  
PIN 1. GATE  
2. DRAIN  
3. SOURCE  
4. DRAIN  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
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PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
Europe, Middle East and Africa Technical Support:  
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Order Literature: http://www.onsemi.com/orderlit  
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Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NTB6413AN/D  

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