NVMTS0D7N06CTXG [ONSEMI]

Single N-Channel Power MOSFET 60V, 464A, 0.72mΩ;
NVMTS0D7N06CTXG
型号: NVMTS0D7N06CTXG
厂家: ONSEMI    ONSEMI
描述:

Single N-Channel Power MOSFET 60V, 464A, 0.72mΩ

文件: 总7页 (文件大小:383K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel  
60 V, 0.72 mW, 464 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
60 V  
0.72 mW @ 10 V  
464 A  
D (58)  
NVMTS0D7N06C  
Features  
G (1)  
Small Footprint (8x8 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
S (24)  
Low Q and Capacitance to Minimize Driver Losses  
G
NCHANNEL MOSFET  
AECQ101 Qualified and PPAP Capable  
Wettable Flank Plated for Enhanced Optical Inspection  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
TDFNW8  
Continuous Drain  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
464  
A
CASE 507AP  
C
D
Current R  
(Note 2)  
q
JC  
T
C
328.1  
294.6  
147.3  
60.5  
42.7  
5.0  
Power Dissipation  
(Note 2)  
Steady  
State  
T
C
P
W
A
D
MARKING DIAGRAM  
R
q
JC  
T
C
= 100°C  
Continuous Drain  
Current R  
Steady  
State  
T = 25°C  
A
I
D
q
JA  
0D7N06C  
AWLYWW  
T = 100°C  
A
(Notes 1, 2)  
Power Dissipation  
Steady  
State  
T = 25°C  
A
P
W
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
2.5  
A
= Assembly Location  
WL = Wafer Lot Code  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
A
I
DM  
900  
A
p
Y
= Year Code  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
WW = Work Week Code  
Source Current (Body Diode)  
I
245.5  
1754  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
ORDERING INFORMATION  
Energy (I  
= 40 A)  
L(pk)  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.5  
Unit  
JunctiontoCase Steady State (Note 2)  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
30  
q
JA  
2
1. Surfacemounted on FR4 board using a 1 in pad size, 1 oz. Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
August, 2022 Rev. 4  
NVMTS0D7N06C/D  
 
NVMTS0D7N06C  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
60  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/
I
D
= 250 mA, ref to 25°C  
24.7  
(BR)DSS  
mV/°C  
T
J
Zero Gate Voltage Drain Current  
I
V
= 0 V,  
T = 25°C  
10  
DSS  
GS  
DS  
J
V
= 60 V  
mA  
T = 125°C  
J
250  
100  
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 3)  
Gate Threshold Voltage  
I
V
= 0 V, V = 20 V  
nA  
GSS  
DS  
GS  
GS  
V
V
= V , I = 250 mA  
2.0  
4.0  
V
mV/°C  
mW  
S
GS(TH)  
DS  
D
Negative Threshold Temperature Coefficient  
DraintoSource On Resistance  
Forward Transconductance  
V
/T  
J
I
= 250 mA, ref to 25°C  
7.93  
0.55  
250  
GS(TH)  
D
R
V
GS  
= 10 V  
I = 50 A  
D
0.72  
DS(on)  
g
FS  
V =5 V, I = 50 A  
DS D  
Gate Resistance  
R
T = 25°C  
A
1.0  
W
G
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
11535  
8010  
174  
ISS  
Output Capacitance  
C
V
V
= 0 V, f = 1 MHz, V = 30 V  
pF  
nC  
OSS  
RSS  
GS  
DS  
Reverse Transfer Capacitance  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Total Gate Charge  
C
Q
25.7  
40.0  
20.7  
152  
G(TH)  
Q
GS  
Q
= 10 V, V = 30 V; I = 50 A  
GD  
GS  
DS  
D
Q
Q
G(TOT)  
Voltage Plateau  
V
3.71  
72  
V
GP  
Total Gate Charge  
V
GS  
= 4.5 V, V = 30 V; I = 50 A  
nC  
G(TOT)  
DS  
D
SWITCHING CHARACTERISTICS (Note 4)  
TurnOn Delay Time  
t
39.7  
29.3  
127  
d(ON)  
Rise Time  
t
r
V
= 10 V, V = 30 V,  
DS  
GS  
D
ns  
V
I
= 50 A, R = 6 W  
G
TurnOff Delay Time  
t
d(OFF)  
Fall Time  
t
42.6  
f
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
T = 25°C  
0.72  
0.59  
120  
60  
1.2  
SD  
RR  
J
V
S
= 0 V,  
GS  
I
= 50 A  
T = 125°C  
J
Reverse Recovery Time  
Charge Time  
t
t
a
ns  
V
= 0 V, dIS/dt = 100 A/ms,  
GS  
I
S
= 50 A  
Discharge Time  
t
b
60  
Reverse Recovery Charge  
Q
324  
nC  
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Pulse Test: pulse width v 300 ms, duty cycle v 2%.  
4. Switching characteristics are independent of operating junction temperatures.  
www.onsemi.com  
2
 
NVMTS0D7N06C  
TYPICAL CHARACTERISTICS  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
800  
10 V  
6.0 V  
V
DS  
= 10 V  
700  
600  
500  
400  
300  
V
GS  
= 5.0 V  
4.5 V  
T = 25°C  
J
200  
100  
0
T = 125°C  
J
3.6 V  
T = 55°C  
J
0
1
2
3
4
5
6
0
1
2
3
4
5
6
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
1.2  
1.0  
0.8  
0.6  
0.4  
T = 25°C  
D
J
T = 25°C  
D
J
I
= 50 A  
I
= 50 A  
V
GS  
= 10 V  
0.2  
0
0.5  
0.4  
4
5
6
7
8
9
10  
10 90 170 250 330 410 490 570 650 730 810  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. GatetoSource  
Figure 4. OnResistance vs. Drain Current and  
Voltage  
Gate Voltage  
2.00  
1.75  
1.50  
1.25  
1.00  
1E+00  
1E01  
1E02  
1E03  
1E04  
1E05  
1E06  
1E07  
V
= 10 V  
= 50 A  
GS  
I
D
T = 175°C  
T = 150°C  
J
J
T = 125°C  
J
T = 85°C  
J
1E08  
1E09  
1E10  
T = 25°C  
J
0.75  
0.50  
0
25  
50  
75  
100  
125  
150  
175  
5
15  
, DRAINTOSOURCE VOLTAGE (V)  
DS  
25  
35  
45  
55  
T , JUNCTION TEMPERATURE (°C)  
V
J
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
vs. Voltage  
www.onsemi.com  
3
NVMTS0D7N06C  
TYPICAL CHARACTERISTICS  
10  
9
100K  
10K  
C
ISS  
8
7
6
5
C
OSS  
1K  
Q
Q
GD  
GS  
4
3
2
1
0
100  
10  
C
V = 30 V  
DS  
RSS  
V
= 0 V  
GS  
T = 25°C  
T = 25°C  
J
J
I
D
= 50 A  
f = 1 MHz  
0
20  
40  
60  
80  
100  
120  
140  
0.01  
0.1  
1
10  
100  
Q , TOTAL GATE CHARGE (nC)  
G
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 7. Capacitance Variation  
Figure 8. GatetoSource Voltage vs. Total  
Charge  
1000  
50  
40  
30  
20  
V
GS  
= 0 V  
t
t
d(off)  
t
f
T = 175°C  
J
t
r
T = 150°C  
J
d(on)  
100  
10  
T = 125°C  
J
T = 25°C  
J
V
= 10 V  
= 30 V  
10  
0
GS  
V
DS  
I
T = 55°C  
J
= 50 A  
D
2
6
10 14 18 22 26 30 34 38 42 46 50  
R , GATE RESISTANCE (W)  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
, SOURCETODRAIN VOLTAGE (V)  
V
SD  
G
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
1000  
100  
10  
1000  
100  
10 ms  
T
= 25°C  
J(initial)  
0.5 ms  
1 ms  
10 ms  
T
= 25°C  
C
T
= 100°C  
J(initial)  
Single Pulse  
10 V  
10  
1
V
GS  
1
R
Limit  
DS(on)  
Thermal Limit  
Package Limit  
0.1  
0.1  
1
10  
100  
0.0001  
0.001  
TIME IN AVALANCHE (s)  
0.01  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Drain Current vs. Time in  
Avalanche  
www.onsemi.com  
4
NVMTS0D7N06C  
TYPICAL CHARACTERISTICS  
100  
10  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.1  
0.01  
Single Pulse  
0.001  
0.000001 0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (sec)  
Figure 13. Thermal Characteristics  
DEVICE ORDERING INFORMATION  
Device  
Marking  
Package  
Shipping  
NVMTS0D7N06CTXG  
0D7N06C  
TDFNW8  
(PbFree)  
3000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TDFNW8 8.3x8.4, 2.0P, SINGLE COOL  
CASE 507AP  
ISSUE D  
DATE 29 MAR 2021  
GENERIC  
MARKING DIAGRAM*  
XXXX = Specific Device Code  
A
= Assembly Location  
WL = Wafer Lot Code  
= Year Code  
Y
WW = Work Week Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON80534G  
TDFNW8 8.3x8.4, 2.0P, SINGLE COOL  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
www.onsemi.com/support/sales  

相关型号:

NVMTS1D0N04CLTXG

Power MOSFET, Single, N-Channel Logic Level, 40 V, 1.0 mO, 291 A
ONSEMI

NVMTS1D1N04CTXG

Power MOSFET 40V, 1.1 mΩ, 277 A, Single N−Channel
ONSEMI

NVMTS1D2N08H

Single N-Channel Power MOSFET 80V, 337A, 1.1mΩ
ONSEMI

NVMTS1D5N08H

MOSFET - Power, Single N-Channel, 80 V, 1.4 mΩ, 273 A
ONSEMI

NVMTS1D6N10MCTXG

Single N-Channel Power MOSFET 100V, 273A, 1.7mΩ
ONSEMI

NVMTS2D0N08H

Power Field-Effect Transistor
ONSEMI

NVMTS4D3N15MC

Single N-Channel Power MOSFET 000V, 000A, 0.0mΩ
ONSEMI

NVMTS6D0N15MC

Single N-Channel Power MOSFET 000V, 000A, 0.0mΩ
ONSEMI

NVMTSC1D3N08M7TXG

Power MOSFET 80V, 348 A, 1.25mΩ, Single N-Channel
ONSEMI

NVMTSC1D6N10MCTXG

Power Field-Effect Transistor
ONSEMI

NVMTSC4D3N15MC

Single N-Channel Power MOSFET 150V, 165A, 4.45mΩ
ONSEMI

NVMYS003N08LHTWG

Power Field-Effect Transistor
ONSEMI