QEB363ZR [ONSEMI]
超小型塑料红外发光二极管;
| 型号： | QEB363ZR |
| 厂家： | 
ONSEMI |
| 描述： | 超小型塑料红外发光二极管 二极管 |
| 文件： | 总7页 (文件大小：630K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Is Now Part of
To learn more about ON Semiconductor, please visit our website at
www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
product management systems do not have the ability to manage part nomenclature that utilizes an underscore
(_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain
device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated
device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please
email any questions regarding the system integration to Fairchild_questions@onsemi.com.
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON
Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor
is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
September 2006
QEB363
tm
Subminiature Plastic Infrared Emitting Diode
Features
■ T-3/4 (2mm) Surface Mount Package
■ Tape & Reel Option (See Tape & Reel Specifications)
■ Lead Form Options: Gullwing, Yoke, Z-Bend
■ Narrow Emission Angle, 24°
■ Wavelength = 940nm, GaAs
■ Clear Water Lens
■ Matched Photosensor: QSB363
■ High Radiant Intensity
Package Dimensions
ANODE
0.276 (7.0)
MIN
0.087 (2.2)
0.071 (1.8)
0.024 (0.6)
0.016 (0.4)
0.019 (0.5)
0.012 (0.3)
0.074 (1.9)
Schematic
.059 (1.5)
.051 (1.3)
.118 (3.0)
.102 (2.6)
ANODE
0.055 (1.4)
0.008 (0.21)
0.004 (0.11)
0.024 (0.6)
0.106 (2.7)
0.091 (2.3)
Notes:
1. Dimensions are in inches (mm).
2. Tolerance of .010 (.2ꢀ) on all non nominal dimensions unless otherwise specified.
©2002 Fairchild Semiconductor Corporation
QEB363 Rev. 1.0.0
www.fairchildsemi.com
Absolute Maximum Ratings (T = 2ꢀ°C unless otherwise specified)
A
Symbol
Parameter
Rating
-40 to +100
-40 to +100
240 for ꢀ sec
260 for 10 sec
ꢀ0
Unit
°C
T
Operating Temperature
Storage Temperature
OPR
T
°C
STG
(2,3,4)
T
Soldering Temperature (Iron)
Soldering Temperature (Flow)
Continuous Forward Current
Reverse Voltage
°C
SOL-I
(2,3)
T
°C
SOL-F
I
mA
V
F
V
P
ꢀ
R
D
(1)
Power Dissipation
100
mW
Notes:
1. Derate power dissipation linearly 1.33mW/°C above 2ꢀ°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6mm) minimum from housing.
Electrical/Optical Characteristics (T = 2ꢀ°C)
A
Symbol
Parameter
Peak Emission Wavelength
Emission Angle
Forward Voltage
Reverse Current
Radiant Intensity
Rise Time
Test Conditions
Min.
Typ.
940
12
Max.
Units
λ
I = 100mA
nm
°
P
F
Θ
I = 100mA
F
V
I = 100mA, t = 20ms
1.6
V
F
F
p
I
V = ꢀV
100
µA
R
R
I
I = 100mA, tp = 20ms
8
mW/sr
µs
e
F
t
I = 100mA
1
1
r
F
t
Fall Time
t = 20ms
µs
f
p
©2002 Fairchild Semiconductor Corporation
QEB363 Rev. 1.0.0
www.fairchildsemi.com
2
Typical Performance Curves
Fig. 1 Maximum Forward Current vs.
Temperature
Fig. 2 Relative Radiant Intensity vs.
Wavelength
200
160
120
80
100
IF = 20 mA
TA = 25˚C
80
60
40
20
40
0
-25
0
25
50
75 85 100
0
880 900 920 940 960 980 1000 1020 1040
Ambient Temperature T (˚C)
A
Wavelength λ (nm)
Fig. 3 Peak Emission Wavelength vs.
Fig. 4 Forward Current vs.
Ambient Temperature
Forward Voltage
500
980
200
100
960
940
920
50
20
10
5
900
2
1
-25
0
25
50
75
100
Ambient Temperature T (˚C)
A
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5
Forward Voltage V (V)
F
Fig. 5 Relative Radiant Flux vs.
Ambient Temperature
20
Fig. 6 Relative Radiant Intensity vs.
Angular Displacement
10
30
20
10
0
10
20
30
5
40
50
40
50
2
1
0.5
60
70
60
70
0.2
0.1
80
90
80
90
0.6
0.4
0.2
0
0.2
0.4
0.6
-25
0
25
50
75
100
Ambient Temperature T (˚C)
Ambient Temperature T (˚C)
A
A
©2002 Fairchild Semiconductor Corporation
QEB363 Rev. 1.0.0
www.fairchildsemi.com
3
Surface Mount Options for T-3/4 Package
Features
■ Three lead forming options: Gull Wing, Yoke and Z-Bend
■ Compatible with automatic placement equipment
■ Supplied on tape and reel or in bulk packaging
■ Compatible with vapor phase reflow solder processes
Gull Wing Lead Configuration
Yoke Lead Configuration
0.283 (7.2)
0.098 (2.5)
0.166 (4.2)
0.016 (0.4)
0.016 (0.4)
ANODE
ANODE
0.020 (0.51)
0.020 (0.5)
0.074 (1.9)
0.087 (2.2)
0.071 (1.8)
0.087 (2.2)
0.071 (1.8)
0.074 (1.9)
0.024 (0.6)
0.118 (3.0)
0.102 (2.6)
0.031 (0.8)
0.078 (2.0)
0.043 (1.1)
.118 (3.0)
.102 (2.6)
0.055 (1.4)
0.055 (1.4)
0.051 (1.3)
0.043 (1.1)
0.008 (0.2)
0.005 (0.13)
0.106 (2.7)
0.091 (2.3)
0.141 (3.6)
Z-Bend Lead Configuration
0.236 (6.0)
0.220 (5.6)
0.177 (4.5)
0.161 (4.1)
0.127 (3.25)
0.112 (2.85)
0.016 (0.4)
ANODE
0.020 (0.5)
0.087 (2.2)
0.071 (1.8)
0.074 (1.9)
0.024 (0.6)
0.031 (0.8)
0.080 (2.0)
0.043 (1.1)
.118 (3.0)
.102 (2.6)
0.055 (1.4)
0.106 (2.7)
0.091 (2.3)
Notes: (Applies to all package drawings)
1. Dimensions are in inches (mm).
2. Tolerance of .010 (.2ꢀ) on all non nominal dimensions unless otherwise specified.
©2002 Fairchild Semiconductor Corporation
QEB363 Rev. 1.0.0
www.fairchildsemi.com
4
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
®
ACEx™
FACT Quiet Series™
GlobalOptoisolator™
GTO™
OCX™
OCXPro™
OPTOLOGIC
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerEdge™
PowerSaver™
SILENT SWITCHER
SMART START™
SPM™
UniFET™
UltraFET
VCX™
®
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
CROSSVOLT™
DOME™
®
HiSeC™
Stealth™
Wire™
2
I C™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TCM™
TinyBoost™
TinyBuck™
i-Lo™
ImpliedDisconnect™
IntelliMAX™
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
EcoSPARK™
2
E CMOS™
®
EnSigna™
FACT™
PowerTrench
®
QFET
®
FAST
QS™
FASTr™
FPS™
FRFET™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
TinyPWM™
TinyPower™
®
TinyLogic
TINYOPTO™
TruTranslation™
UHC™
Across the board. Around the world.™
The Power Franchise
®
ScalarPump™
Programmable Active Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which,
(a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Definition
Formative or In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I20
©2002 Fairchild Semiconductor Corporation
QEB363 Rev. 1.0.0
www.fairchildsemi.com
ꢀ
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
© Semiconductor Components Industries, LLC
www.onsemi.com
相关型号：
QEB373ZR
Infrared LED, 2mm, 1-Element, 875nm, ROHS COMPLIANT, SURFACE MOUNT, PLASTIC PACKAGE-2
FAIRCHILD
©2020 ICPDF网 联系我们和版权申明