SBRB2545CTT4G [ONSEMI]
SWITCHMODE Power Rectifier;
| 型号： | SBRB2545CTT4G |
| 厂家： | 
ONSEMI |
| 描述： | SWITCHMODE Power Rectifier 二极管 |
| 文件： | 总5页 (文件大小：103K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MBRB2545CTG,
SBRB2545CTG
SWITCHMODE
Power Rectifier
D2PAK Surface Mount Power Package
http://onsemi.com
2
The D PAK Power Rectifier is a state−of−the−art device that
employs the Schottky Barrier principle with a platinum barrier metal.
SCHOTTKY BARRIER
RECTIFIER
30 AMPERES, 45 VOLTS
Features
• Center−Tap Configuration
• Guardring for Stress Protection
• Low Forward Voltage
• 175°C Operating Junction Temperature
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Short Heat Sink Tab Manufactured − Not Sheared
• Similar in Size to the Industry Standard TO−220 Package
• AEC−Q101 Qualified and PPAP Capable
• SBRB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
• All Packages are Pb−Free*
2
D PAK
CASE 418B
STYLE 3
1
4
3
Mechanical Characteristics
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.7 Grams (Approximately)
MARKING DIAGRAM
• Finish: All External Surfaces Corrosion Resistant and Terminal
AY WW
Leads are Readily Solderable
B2545G
AKA
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Device Meets MSL1 Requirements
• ESD Ratings:
♦ Machine Model = C (> 400 V)
♦ Human Body Model = 3B (> 8000 V)
A
Y
WW
= Assembly Location
= Year
= Work Week
B2545 = Device Code
G
AKA
= Pb−Free Package
= Diode Polarity
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
November, 2013 − Rev. 12
MBRB2545CT/D
MBRB2545CTG, SBRB2545CTG
MAXIMUM RATINGS (Per Leg)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
45
V
RRM
RWM
R
V
V
Average Rectified Forward Current
I
15
30
A
A
A
F(AV)
(Rated V , T = 164°C) Total Device
R
C
Peak Repetitive Forward Current
I
FRM
(Rated V , Square Wave, 20 kHz, T = 160°C)
30
R
C
Non−Repetitive Peak Surge Current
I
FSM
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz)
Storage Temperature Range
150
1.0
I
A
°C
RRM
T
−65 to +175
−65 to +175
10,000
stg
Operating Junction Temperature (Note 1)
T
J
°C
Voltage Rate of Change (Rated V )
dv/dt
V/ms
R
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dP /dT < 1/R
.
q
D
J
JA
THERMAL CHARACTERISTICS (Per Leg)
Characteristic
Symbol
Value
Unit
Thermal Resistance,
°C/W
Junction−to−Case
R
1.5
50
q
JC
JA
Junction−to−Ambient (Note 2)
R
q
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS (Per Diode)
Symbol
Characteristic
Condition
I = 15 Amp, T = 25°C
Min
Typ
Max
Unit
V
F
Instantaneous Forward Voltage
(Note 3)
−
−
−
−
−
0.62
0.57
0.82
0.72
V
F
J
I = 15 Amp, T = 125°C
0.50
−
F
J
I = 30 Amp, T = 25°C
F
J
I = 30 Amp, T = 125°C
0.65
F
J
I
R
Instantaneous Reverse Current
(Note 3)
V
R
V
R
= 45 Volts, T = 25°C
−
−
−
9.0
0.2
25
mA
J
= 45 Volts, T = 125°C
J
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
ORDERING INFORMATION
Device
†
Package
Shipping
2
MBRB2545CTG
D PAK
50 Units / Rail
(Pb−Free)
2
SBRB2545CTG
D PAK
50 Units / Rail
(Pb−Free)
2
MBRB2545CTT4G
SBRB2545CTT4G
D PAK
800 Units / Tape & Reel
800 Units / Tape & Reel
(Pb−Free)
2
D PAK
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
MBRB2545CTG, SBRB2545CTG
1000
100
10
200
100
40
20
10
T = 150°C
J
125°C
4.0
2.0
1.0
T = 125°C
J
100°C
0.4
0.2
0.1
150°C
75°C
25°C
0.04
0.02
0.01
1.0
0.1
25°C
0.004
0.002
0
0.2 0.4 0.6
0.8 1.0 1.2
1.4 1.6
1.8
0
10
20
30
40
50
V , INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Fꢀ
V , REVERSE VOLTAGE (VOLTS)
R
Figure 2. Typical Reverse Current, Per Leg
Figure 1. Typical Forward Voltage, Per Leg
26
24
22
20
18
16
14
12
10
8
32
28
24
20
16
12
8
DC
SQUARE WAVE
T = 125°C
J
I
PK
= p
(RESISTIVE LOAD)
5
I
AV
SQUARE
DC
(CAPACITIVE
LOADS)
10
I
PK
= 20
I
AV
6
4
2
4
0
0
0
4
8
12
16
20
24
28
32
36
40
145
150
155
160
165
170
175
I , AVERAGE FORWARD CURRENT (AMPS)
F
T , CASE TEMPERATURE (°C)
C
Figure 4. Current Derating, Case
per Leg
Figure 3. Typical Forward Power Dissipation
http://onsemi.com
3
MBRB2545CTG, SBRB2545CTG
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
C
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
E
V
W
−B−
INCHES
DIM MIN MAX
MILLIMETERS
4
MIN
MAX
A
B
C
D
E
F
G
H
J
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
8.64
9.65 10.29
4.06
0.51
1.14
7.87
9.65
4.83
0.89
1.40
8.89
A
S
1
2
3
2.54 BSC
0.080
0.018 0.025
0.090 0.110
0.110
2.03
0.46
2.29
1.32
7.11
5.00 REF
2.00 REF
0.99 REF
2.79
0.64
2.79
1.83
8.13
−T−
SEATING
PLANE
K
W
K
L
J
G
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625 14.60 15.88
0.045 0.055 1.14 1.40
M
N
P
R
S
V
H
D 3 PL
M
M
0.13 (0.005)
T B
VARIABLE
CONFIGURATION
ZONE
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
N
P
R
U
4. CATHODE
L
L
L
M
M
M
F
F
F
VIEW W−W
VIEW W−W
VIEW W−W
1
2
3
SOLDERING FOOTPRINT*
10.49
8.38
16.155
3.25X04
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
4
MBRB2545CTG, SBRB2545CTG
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
MBRB2545CT/D
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