STK541UC62K-E [ONSEMI]

智能功率模块 (IPM),600V,10A;
STK541UC62K-E
型号: STK541UC62K-E
厂家: ONSEMI    ONSEMI
描述:

智能功率模块 (IPM),600V,10A

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STK541UC62K-E  
Intelligent Power Module (IPM)  
600 V, 10 A  
Overview  
www.onsemi.com  
This “Inverter IPM” is highly integrated device containing all High Voltage  
(HV) control from HV-DC to 3-phase outputs in a single SIP module  
(Single-In line Package). Output stage uses IGBT/FRD technology and  
implements Under Voltage Protection (UVP) and Over Current Protection  
(OCP) with a Fault Detection output flag. Internal Boost diodes are provided  
for high side gate boost drive.  
Function  
Single control power supply due to Internal bootstrap circuit for high side  
pre-driver circuit  
All control input and status output are at low voltage levels directly  
compatible with microcontrollers  
Built-in cross conduction prevention  
Externally accessible embedded thermistor for substrate temperature  
measurement  
Certification  
UL1557 (File Number : E339285)  
Specifications  
Absolute Maximum Ratings at Tc = 25C  
Parameter  
Symbol  
Conditions  
Ratings  
450  
Unit  
V
V
Supply voltage  
P to N, surge < 500 V  
*1  
CC  
V
Collector-emitter voltage  
Output current  
P to U, V, W or U, V, W to N  
600  
V
CE  
P, N, U, V, W terminal current  
±10  
A
Io  
±5  
A
P, N, U, V, W terminal current at Tc = 100C  
Output peak current  
Pre-driver voltage  
Iop  
VD1, 2, 3, 4  
VIN  
P, N, U, V, W terminal current for a Pulse width of 1 ms.  
±20  
A
VB1 to U, VB2 to V, VB3 to W, V  
HIN1, 2, 3, LIN1, 2, 3  
FLTEN terminal  
to V  
SS  
*2  
20  
V
DD  
Input signal voltage  
V
0.3 to 7  
0.3 to V  
FLTEN terminal voltage  
Maximum power dissipation  
Junction temperature  
Storage temperature  
VFLTEN  
Pd  
V
DD  
IGBT per channel  
22  
150  
W
C  
C  
Tj  
IGBT, FRD  
Tstg  
40 to +125  
Operating substrate  
temperature  
Tc  
IPM case temperature  
40 to +100  
C  
Tightening torque  
Isolation voltage  
Case mounting screws  
*3  
*4  
0.9  
Nm  
Vis  
50 Hz sine wave AC 1 minute  
2000  
VRMS  
Reference voltage is “V ” terminal voltage unless otherwise specified.  
SS  
*1 : Surge voltage developed by the switching operation due to the wiring inductance between “P” and “N” terminal.  
*2 : Terminal voltage: VD1 = VB1 to U, VD2 = VB2 to V, VD3 = VB3 to W, VD4 = V  
to V  
DD  
SS  
*3 : Flatness of the heat-sink should be 0.15 mm and below.  
*4 : Test conditions : AC 2500 V, 1 s.  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,  
damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 14 of this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
October 2016 - Rev. 1  
1
Publication Order Number :  
STK541UC62K-E/D  
STK541UC62K-E  
Electrical Characteristics at Tc 25C, VD1, VD2, VD3, VD4 = 15 V  
Test  
circuit  
Parameter  
Symbol  
Conditions  
min  
typ  
max  
Unit  
Power output section  
I
V
= 600 V  
Collector-emitter cut-off current  
Bootstrap diode reverse current  
mA  
mA  
CE  
IR(BD)  
CE  
0.1  
0.1  
2.3  
2.6  
Fig.1  
Fig.2  
VR(BD)  
Ic = 10 A  
Tj = 25C  
Upper side  
1.4  
1.7  
1.3  
1.6  
1.3  
1.6  
1.2  
1.5  
Collector to emitter  
saturation voltage  
Lower side *1  
Upper side  
V
(sat)  
V
CE  
Ic = 5 A  
Tj = 100C  
Lower side *1  
Upper side  
IF = 10 A  
2.2  
2.5  
Tj = 25C  
Lower side *1  
Upper side  
Diode forward voltage  
VF  
Fig.3  
V
IF = 5 A  
Tj = 100C  
Lower side *1  
Junction to case  
θj-c(T)  
θj-c(D)  
IGBT  
FRD  
5.5  
6.5  
C/W  
mA  
thermal resistance  
Control (Pre-driver) section  
VD1, 2, 3 = 15 V  
VD4 = 15 V  
0.08  
1.6  
0.4  
4.0  
Pre-driver current consumption  
ID  
Fig.4  
High level Input voltage  
Vin H  
2.5  
V
V
HIN1, HIN2, HIN3,  
Low level Input voltage  
Vin L  
0.8  
LIN1, LIN2, LIN3 to V  
SS  
Input threshold voltage hysteresis *1  
Logic 0 input leakage current  
Logic 1 input leakage current  
FLTEN terminal input electric current  
FAULT clearance delay time  
Vinth(hys)  
0.5  
76  
97  
0.8  
118  
150  
2
V
I
VIN = +3.3 V  
VIN = 0 V  
160  
203  
A  
A  
mA  
ms  
V
IN+  
I
IN-  
IoSD  
FAULT : ON/VFLTEN = 0.1 V  
Fault output latch time  
Enable  
FLTCLR  
VEN+  
6
9
12  
2.5  
FLTEN Threshold  
VEN-  
Disable  
0.8  
V
and V undervoltage upper  
V
V
V
V
V
V
CCUV+  
CC  
threshold  
and V undervoltage lower  
S
10.5  
10.3  
0.14  
11.1  
10.9  
0.2  
11.7  
V
V
A
SUV+  
V
CCUV-  
SUV-  
CC  
threshold  
S
11.5  
CCUVH  
SUVH-  
V
and V undervoltage hysteresis  
CC  
S
Over current protection level  
Output level for current monitor  
ISD  
ISO  
PW = 100 μs  
Fig.5  
10  
17  
A
V
Io = 10 A  
0.30  
0.33  
0.36  
Reference voltage is “V ” terminal voltage unless otherwise specified.  
SS  
*1 : The lower side’s V (sat) and VF include a loss by the shunt resistance  
CE  
Electrical Characteristics at Tc 25C, VD1, VD2, VD3, VD4 = 15 V, V  
= 300 V, L = 3.9 mH  
Test  
circuit  
CC  
Parameter  
Symbol  
Conditions  
min  
typ  
max  
Unit  
Switching Character  
tON  
Io = 10 A  
0.2  
0.4  
0.5  
1.1  
1.2  
Switching time  
Fig.6  
s  
Inductive load  
tOFF  
Eon  
Turn-on switching loss  
J  
J  
J  
J  
J  
J  
J  
ns  
200  
Ic = 5 A, P = 300 V,  
Turn-off switching loss  
Eoff  
V
DD  
= 15 V, L = 3.9 mH  
Fig.6  
130  
Tc = 25C  
Total switching loss  
Etot  
330  
Turn-on switching loss  
Eon  
240  
Ic = 5 A, P = 300 V,  
Turn-off switching loss  
Eoff  
V
DD  
= 15 V, L = 3.9 mH  
Fig.6  
160  
Tc = 100C  
Total switching loss  
Etot  
400  
Diode reverse recovery energy  
Diode reverse recovery time  
Reverse bias safe operating area  
Short circuit safe operating area  
Erec  
Trr  
17  
IF = 5 A, P = 400 V, V = 15 V,  
DD  
L = 0.5 mH, Tc = 100C  
62  
RBSOA  
SCSOA  
Io = 20 A, V  
= 450 V  
Full square  
CE  
V
= 400 V, Tc = 100C  
s  
4
CE  
Reference voltage is “V ” terminal voltage unless otherwise specified.  
SS  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be  
indicated by the Electrical Characteristics if operated under different conditions.  
Notes :  
1. The pre-drive power supply low voltage protection has approximately 0.2 V of hysteresis and operates as follows.  
Upper side : The gate is turned off and will return to regular operation when recovering to the normal voltage, but the latch will continue till the input signal will  
turn ‘high’.  
Lower side : The gate is turned off and will automatically reset when recovering to normal voltage. It does not depend on input signal voltage.  
2. The pre-drive low voltage protection is the feature to protect devices when the pre-driver supply voltage falls due to an operating malfunction.  
www.onsemi.com  
2
STK541UC62K-E  
Equivalent Block Diagram  
VB1(7)  
U(8)  
VB2(4)  
V(5)  
VB3(1)  
W(2)  
P(10)  
U.V.  
U.V.  
U.V.  
Shunt Resistor  
Thermistor  
N
(12)  
Level  
Shifter  
Level  
Level  
Shifter  
Shifter  
VTH (13)  
HIN1(15)  
HIN2(16)  
HIN3(17)  
LIN1(18)  
LIN2(19)  
LIN3(20)  
FLTEN(21)  
Logic  
Logic  
Logic  
Latch Time About 9ms  
( Automatic Reset )  
ISO(22)  
VDD(14)  
Latch  
Over-Current  
VDD-Under Voltage  
VSS(23)  
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3
STK541UC62K-E  
Module Pin-Out Description  
Pin  
Name  
Description  
1
2
VB3  
High Side Floating Supply Voltage 3  
Output 3 - High Side Floating Supply Offset Voltage  
Witout Pin  
W, VS3  
3
4
VB2  
High Side Floating Supply voltage 2  
Output 2 - High Side Floating Supply Offset Voltage  
Witout Pin  
5
V,VS2  
6
7
VB1  
High Side Floating Supply voltage 1  
Output 1 - High Side Floating Supply Offset Voltage  
Witout Pin  
8
U,VS1  
9
10  
11  
12  
P
Positive Bus Input Voltage  
Witout Pin  
N
Negative Bus Input Voltage  
13 VTH  
14 VDD  
15 HIN1  
16 HIN2  
17 HIN3  
18 LIN1  
19 LIN2  
20 LIN3  
21 FLTEN  
22 ISO  
Temperature Feedback  
+15 V Main Supply  
Logic Input High Side Gate Driver - Phase U  
Logic Input High Side Gate Driver - Phase V  
Logic Input High Side Gate Driver - Phase W  
Logic Input Low Side Gate Driver - Phase U  
Logic Input Low Side Gate Driver - Phase V  
Logic Input Low Side Gate Driver - Phase W  
Fault output and Enable  
Current monitor output  
23 VSS  
Negative Main Supply  
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4
STK541UC62K-E  
Test Circuit  
The tested phase U+ shows the upper side of the U phase and Ushows the lower side of the U phase.  
I  
CE  
/ IR(BD)  
ICE  
1
M
A
VD3=15V  
VD2=15V  
VD1=15V  
VD4=15V  
U+  
10  
8
V+  
10  
5
W+  
10  
2
U-  
8
V-  
5
W-  
2
2
M
N
4
12  
12  
12  
5
VCE  
7
U(BD)  
7
V(BD)  
4
W(BD)  
8
M
N
1
14  
23  
23  
23  
23  
N
Fig.1  
1
M
V (sat) (test by pulse)  
CE  
VD3=15V  
VD2=15V  
VD1=15V  
VD4=15V  
2
4
U+  
10  
8
V+  
10  
5
W+  
10  
2
U-  
8
V-  
5
W-  
2
M
N
5
V
Ic  
12  
18  
12  
19  
12  
20  
7
VCE(SAT)  
m
15  
16  
17  
8
14  
m
N
23  
Fig.2  
VF (test by pulse)  
M
U+  
V+  
10  
5
W+  
10  
2
U-  
8
V-  
5
W-  
2
V
VF  
IF  
M
N
10  
8
12  
12  
12  
N
Fig.3  
ID  
VD1  
7
VD2  
4
VD3  
1
VD4  
14  
ID  
A
M
N
M
N
VD*  
8
5
2
23  
Fig.4  
www.onsemi.com  
5
STK541UC62K-E  
ISD  
1
2
4
5
7
8
VD3=15V  
VD2=15V  
VD1=15V  
Input signal  
(0 to 5 V)  
Io  
8
14  
Io  
SD  
VD4=15V  
Input signal  
18  
23  
12  
100μS  
Fig.5  
Switching time (The circuit is a representative example of the lower side U phase.)  
1
10  
VD1=15V  
2
4
5
7
Input signal  
(0 to 5 V)  
VD2=15V  
VD3=15V  
8
Vcc  
90%  
CS  
Io  
8
14  
10%  
VD4=15V  
Io  
tOFF  
Input signal  
18  
23  
12  
Fig.6  
www.onsemi.com  
6
STK541UC62K-E  
Input / Output Timing Diagram  
VBS undervoltage protection reset signal  
OFF  
HIN1,2,3  
ON  
LIN1,2,3  
VDD  
VDD undervoltage protection reset voltage  
*2  
VBS undervoltage protection reset voltage  
*3  
VB1,2,3  
*4  
-------------------------------------------------------ISD operation current level----------------------------------------------------  
-terminal  
(BUS line)  
Current  
FLTEN terminal  
Voltage  
(at pulled-up)  
ON  
*1  
*1  
Upper  
U, V, W  
OFF  
Lower  
U ,V, W  
Automatically reset after protection  
(typ.9ms)  
Fig.7  
Notes  
*1 : Diagram shows the prevention of shoot-through via control logic. More dead time to account for switching delay needs to be  
added externally.  
*2 : When V  
decreases all gate output signals will go low and cut off all of 6 IGBT outputs. When V  
rises the operation will  
DD  
DD  
resume immediately.  
*3 : When the upper side gate voltage at VB1, VB2 and VB3 drops only, the corresponding upper side output is turned off. The  
outputs return to normal operation immediately after the upper side gate voltage rises.  
*4 : In case of over current detection, all IGBT’s are turned off and the FAULT output is asserted. Normal operation resumes in 6 to  
12ms after the over current condition is removed.  
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7
STK541UC62K-E  
Logic level table  
P
INPUT  
OUTPUT  
U,V,W  
Upper Lower  
IGBT IGBT  
HIN  
LIN  
OCP  
FAULTEN  
FAULTEN  
H
L
L
OFF  
OFF  
Pulled-UP  
Pulled-UP  
OFF  
ON  
ON  
N
P
OFF  
OFF  
Ho  
H
OFF  
HIN1,2,3  
High  
Impedance  
(15,16,17)  
IC  
Driver  
L
H
X
X
L
H
X
X
OFF  
OFF  
ON  
Pulled-UP  
Pulled-UP  
Pulled-UP  
L
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
ON  
U,V,W  
(8,5,2)  
LIN1,2,3  
(18,19,20)  
High  
Impedance  
Lo  
High  
Impedance  
High  
Impedance  
OFF  
ON  
N
Fig. 8  
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8
STK541UC62K-E  
Sample Application Circuit  
STK541UC62K-E  
1 2  
CB  
4 5  
7 8  
10  
12 15 16 17 18 19 20 21 22 14 23 13  
CB  
CB  
CS  
RP  
VP  
CD  
VDD=15V  
Control Logic  
Vcc  
CI  
Fig. 9  
Recommended Operating Conditions  
Item  
Supply voltage  
Symbol  
Conditions  
min  
typ  
max  
Unit  
V
V
P to N  
VB1 to U, VB2 to V, VB3 to W  
to V  
0
12.5  
13.5  
0
280  
15  
450  
17.5  
16.5  
0.3  
CC  
VD1, 2, 3  
VD4  
Pre-driver supply voltage  
V
V
*1  
15  
DD  
SS  
ON-state input voltage  
OFF-state input voltage  
PWM frequency  
VIN(ON)  
VIN(OFF)  
fPWM  
DT  
HIN1, HIN2, HIN3,  
LIN1, LIN2, LIN3  
V
3.0  
1
5.0  
20  
kHz  
μs  
Dead time  
Turn-off to turn-on  
ON and OFF  
‘M3’ type screw  
2
Allowable input pulse width  
Tightening torque  
PWIN  
1
μs  
0.6  
0.9  
Nm  
*1 Pre-drive power supply (VD4 = 15 ±1.5 V) must have the capacity of Io = 20 mA (DC), 0.5 A (Peak).  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended  
Operating Ranges limits may affect device reliability.  
Usage Precaution  
1. This IPM includes bootstrap diode and resistors. Therefore, by adding a capacitor “CB”, a high side drive voltage is generated;  
each phase requires an individual bootstrap capacitor. The recommended value of CB is in the range of 1 to 47 μF, however this  
value needs to be verified prior to production. If selecting the capacitance more than 47 μF (±20%), connect a resistor (about 20  
) in series between each 3-phase upper side power supply terminals (VB1,2,3) and each bootstrap capacitor.  
When not using the bootstrap circuit, each upper side pre-drive power supply requires an external independent power supply.  
2. It is essential that wirning length between terminals in the snubber circuit be kept as short as possible to reduce the effect of  
surge voltages. Recommended value of “CS” is in the range of 0.1 to 10 μF.  
3. “ISO” (pin22) is terminal for current monitor. When the pull-down resistor is used, please select it more than 5.6 kΩ  
4. “FLTEN” (pin21) is open DRAIN output terminal (Active Low). Pull up resistor is recommended more than 5.6 k.  
5. Inside the IPM, a thermistor used as the temperature monitor for internal subatrate is connected between VSS terminal and VTH  
terminal, therefore, an external pull up resistor connected between the TH terminal and an external power supply should be used.  
The temperature monitor example application is as follows, please refer the Fig.10 and below.  
6. The over-current protection feature is not intended to protect in exceptional fault condition. An external fuse is recommended for  
safety.  
7. When “N” and “V ” terminal are short-circuited on the outside, level that over-current protection (ISD) might be changed from  
SS  
designed value as IPM. Please check it in your set (“N” terminal and “V ” terminal are connected in IPM).  
SS  
8. When input pulse width is less than 1.0 μs, an output may not react to the pulse. (Both ON signal and OFF signal)  
This data shows the example of the application circuit, does not guarantee a design as the mass production set.  
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9
STK541UC62K-E  
The characteristic of thermistor  
Parameter  
Resistance  
Symbol  
Condition  
Min  
Typ.  
Max  
Unit  
R25  
R100  
B
99  
100  
5.38  
4250  
101  
5.66  
4335  
+125  
kΩ  
kΩ  
K
Tc = 25C  
Resistance  
5.12  
4165  
40  
Tc = 100C  
B-Constant (25 to 50 C)  
Temperature Range  
C  
Case Temperature(Tc) - Thermal resistance(RTH)  
10000  
1000  
100  
10  
min  
typ  
max  
1
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90 100 110 120 130  
Case temperature, Tc-degC  
Fig.10 Variation of thermistor resistance with temperature  
Case Temperature(Tc) - TH terminal voltage(VTH)  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
min  
typ  
max  
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90 100 110 120 130  
Case temperature, Tc-degC  
Fig.11 Variation of thermistor terminal voltage with temperature  
(47 kpull-up resistor, 5 V)  
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10  
STK541UC62K-E  
The characteristic of PWM switching frequency  
Fig. 12 Maximum sinusoidal phase current as function of switching frequency  
at Tc = 100, V = 400 V  
CC  
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11  
STK541UC62K-E  
CB capacitor value calculation for bootstrap circuit  
Calculate conditions  
Parameter  
Symbol  
VBS  
Value  
15  
Unit  
V
Upper side power supply  
Total gate charge of output power IGBT at 15 V  
Upper limit power supply low voltage protection  
Upper side power dissipation  
QG  
89  
12  
nC  
V
UVLO  
IDMAX  
TONMAX  
400  
μA  
s
ON time required for CB voltage to fall from 15 V to UVLO  
Capacitance calculation formula  
Thus, the following formula are true  
VBS x CB - QG - IDMAX * TONMAX = UVLO * CB  
therefore,  
CB = (QG + IDMAX * TONMAX) / (VBS - UVLO)  
The relationship between TONMAX and CB becomes as follows. CB is recommended to be approximately 3 times the value calculated  
above. The recommended value of CB is in the range of 1 to 47 μF, however, this value needs to be verified prior to production.  
CB vs Tonmax  
100  
10  
1
0.1  
0.01  
0.1  
1
10  
100  
1000  
Tonmax [ms]  
Fig. 15 Tonmax - CB characteristic  
www.onsemi.com  
12  
STK541UC62K-E  
PACKAGE DIMENSIONS  
unit : mm  
The tolerances of length are +/0.5 mm unless otherwise specified.  
missing pin ; 3, 6, 9, 11  
56.0  
note2  
note3  
4DB00  
STK541UC62K  
note1  
2.0  
23  
1
+0.2  
-0.05  
0.6  
+0.2  
-0.05  
0.5  
2.0  
22.0  
5.0  
22 x 2.0 = 44.0  
3.2  
46.2  
note1 : Mark for No.1 pin identification.  
note2 : The form of a character in this  
drawing differs from that of IPM.  
note3 : This indicates the date code.  
The form of a character in this  
drawing differs from that of IPM.  
50.0  
62.0  
www.onsemi.com  
13  
STK541UC62K-E  
ORDERING INFORMATION  
Device  
Package  
Shipping (Qty / Packing)  
8 / Tube  
SIP23 56x21.8  
(Pb-Free)  
STK541UC62K-E  
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14  

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