SZUESD6.0DT5G [ONSEMI]
ESD Protection Common Anode Diodes;
| 型号： | SZUESD6.0DT5G |
| 厂家： | 
ONSEMI |
| 描述： | ESD Protection Common Anode Diodes 二极管 瞬态抑制器 |
| 文件： | 总4页 (文件大小：40K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
mESD3.3DT5G SERIES
ESD Protection Diodes
In Ultra Small SOT−723 Package
The mESD Series is designed to protect voltage sensitive components
from ESD. Excellent clamping capability, low leakage, and fast response
time, make these parts ideal for ESD protection on designs where board
space is at a premium. Because of its small size, it is suited for use in
cellular phones, portable devices, digital cameras, power supplies and
many other portable applications.
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1
2
PIN 1. CATHODE
2. CATHODE
3. ANODE
Specification Features:
3
• Small Body Outline Dimensions:
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
• Low Body Height: 0.020″ (0.5 mm)
• Stand−off Voltage: 3.3 V − 6.0 V
• Low Leakage
MARKING
DIAGRAM
3
• Response Time is Typically < 1 ns
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• IEC61000−4−2 Level 4 ESD Protection
• IEC61000−4−4 Level 4 EFT Protection
• These are Pb−Free Devices
2
1
xx M
SOT−723
CASE 631AA
STYLE 4
xx = Device Code
M
= Date Code
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
†
Device
mESDxxDT5G
Package
Shipping
SOT−723 8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
IEC 61000−4−2 (ESD)
Symbol
Value
Unit
Air
Contact
±30
±30
kV
DEVICE MARKING INFORMATION
IEC 61000−4−4 (EFT)
40
A
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
ESD Voltage
Per Human Body Model
Per Machine Model
16
400
kV
V
Total Power Dissipation on FR−5 Board
mW
mW/°C
(Note 1) @ T = 25°C
P
D
240
1.9
A
Derate above 25°C
°C/W
Thermal Resistance Junction−to−Ambient
R
525
q
JA
Junction and Storage Temperature Range
T , T
−55 to
+150
°C
J
stg
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
April, 2005 − Rev. 0
mESD3.3DT5G/D
mESD3.3DT5G SERIES
ELECTRICAL CHARACTERISTICS
(T = 25°C unless otherwise noted)
A
I
I
F
Symbol
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
I
PP
V
C
PP
V
RWM
Working Peak Reverse Voltage
V
C
V
V
I
Maximum Reverse Leakage Current @ V
BR RWM
R
RWM
V
I
V
F
R
T
V
BR
Breakdown Voltage @ I
Test Current
T
I
I
T
I
F
Forward Current
V
F
Forward Voltage @ I
F
P
Peak Power Dissipation
Max. Capacitance @V = 0 and f = 1 MHz
pk
I
PP
C
R
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 0.9 V Max. @ I = 10 mA for all types)
A
F
F
V
BR
(V) @ I
T
(Note 2)
V
(V)
I
R
(mA) @ V
Max
1.0
I
T
C (pF)
Typ
47
RWM
RWM
Device
Marking
Max
3.3
5.0
6.0
Min
mA
1.0
1.0
1.0
Device*
mESD3.3DT5G
L0
L2
L3
5.0
mESD5.0DT5G
mESD6.0DT5G
0.1
6.2
38
0.1
7.0
34
*Other voltages available upon request.
2. V is measured with a pulse test current I at an ambient temperature of 25°C.
BR
T
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2
mESD3.3DT5G SERIES
TYPICAL CHARACTERISTICS
7.4
7.3
7.2
7.1
7.0
6.9
6.8
6.7
6.6
6.5
6.4
6.3
20
18
16
14
12
10
8
mESDxxDT5G
6
mESDxxDT5G
4
2
0
−55
−55
+25
+150
+25
+150
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 1. Typical Breakdown Voltage
versus Temperature
Figure 2. Typical Leakage Current
versus Temperature
45
300
40
35
30
250
200
mESDxxDT5G
25
20
15
10
150
100
50
FR−5 BOARD
5
0
0
0
1
2
3
4
5
0
25
50
75
100
125
150
175
BIAS VOLTAGE (V)
TEMPERATURE (°C)
Figure 3. Typical Capacitance versus Bias Voltage
Figure 4. Steady State Power Derating Curve
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3
mESD3.3DT5G SERIES
PACKAGE DIMENSIONS
SOT−723
CASE 631AA−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
−X−
E
D
A
b1
−Y−
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
3
HE
L
1
2
MILLIMETERS
INCHES
NOM MAX
0.018 0.020 0.022
DIM MIN
NOM
0.50
0.20
0.3
0.12
MAX
0.55
0.27 0.0059 0.0079 0.0106
0.35 0.010 0.012 0.014
0.17 0.0028 0.0047 0.0067
MIN
b 2X
C
A
b
b1
C
D
E
e
H E
L
0.45
0.15
0.25
0.07
1.15
0.75
e
0.08 (0.0032) X Y
1.20
0.80
1.25
0.85
0.045 0.047 0.049
0.03 0.032 0.034
0.016 BSC
0.40 BSC
1.20
0.20
1.15
0.15
1.25
0.045 0.047 0.049
0.25 0.0059 0.0079 0.0098
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
SOLDER FOOTPRINT*
0.40
0.0157
0.40
0.0157
1.0
0.039
0.40
0.0157
0.40
0.0157
0.40
0.0157
mm
inches
ǒ
Ǔ
SCALE 20:1
SOT−723
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
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Order Literature: http://www.onsemi.com/litorder
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
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Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
mESD3.3DT5G/D
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