SFH-4235 [OSRAM]

High Power Infrared Emitter;
SFH-4235
型号: SFH-4235
厂家: OSRAM GMBH    OSRAM GMBH
描述:

High Power Infrared Emitter

文件: 总13页 (文件大小:415K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2016-05-12  
High Power Infrared Emitter (850 nm)  
Version 1.5  
SFH 4235  
Features:  
IR lightsource with high efficiency  
Double Stack emitter  
Low thermal resistance (Max. 9 K/W)  
Centroid wavelength 850 nm  
Superior Corrosion Robustness (see chapter package outlines)  
The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification  
for Automotive Grade Discrete Semiconductors.  
Applications  
Infrared Illumination for cameras  
Surveillance systems  
Machine vision systems  
Notes  
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which  
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety  
precautions given in IEC 60825-1 and IEC 62471.  
Ordering Information  
Type:  
Total Radiant Flux  
Φe [mW]  
Ordering Code  
IF = 1A, tp = 10 ms  
950 (≥630)  
SFH 4235  
Q65110A8900  
Note:  
Measured with integrating sphere.  
2016-05-12  
1
Version 1.5  
SFH 4235  
Maximum Ratings (TA = 25 °C)  
Parameter  
Symbol  
Top; Tstg  
Tj  
Values  
Unit  
°C  
°C  
V
Operation and storage temperature range  
Junction temperature  
Reverse voltage  
-40 ... 125  
145  
1
VR  
Forward current  
IF  
1000  
5
mA  
A
Surge current  
(tp ≤ 200 µs, D = 0)  
IFSM  
Power consumption  
Ptot  
3400  
2
mW  
kV  
ESD withstand voltage  
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)  
VESD  
Thermal resistance junction - soldering point  
RthJS  
9
K / W  
Characteristics (TA = 25 °C)  
Parameter  
Symbol  
Values  
Unit  
Peak wavelength  
(typ)  
(typ)  
(typ)  
λpeak  
λcentroid  
∆λ  
860  
nm  
(IF = 1 A, tp = 10 ms)  
Centroid wavelength  
(IF = 1 A, tp = 10 ms)  
850  
30  
nm  
nm  
°
Spectral bandwidth at 50% of Imax  
(IF = 1 A, tp = 10 ms)  
Half angle  
(typ)  
(typ)  
ϕ
± 60  
1 x 1  
Dimensions of active chip area  
L x W  
mm x  
mm  
Rise and fall times of Ie ( 10% and 90% of Ie max  
(IF = 5 A, RL = 50 Ω)  
)
(typ)  
tr / tf  
7 / 14  
3 (≤ 3.4)  
3.5 (≤ 4.5)  
320  
ns  
Forward voltage  
(IF = 1 A, tp = 100 ꢀs)  
(typ (max)) VF  
(typ (max)) VF  
V
Forward voltage  
(IF = 5 A, tp = 100 µs)  
V
Radiant intensity  
(IF = 1 A, tp = 100 ꢀs)  
Ie, typ  
mW/sr  
% / K  
mV / K  
nm / K  
Temperature coefficient of Ie or Φe  
(IF = 1 A, tp = 10 ms)  
(typ)  
(typ)  
(typ)  
TCI  
-0.3  
Temperature coefficient of VF  
(IF = 1 A, tp = 10 ms)  
TCV  
-2  
Temperature coefficient of wavelength  
(IF = 1 A, tp = 10 ms)  
TCλ,  
centroid  
0.3  
2016-05-12  
2
Version 1.5  
SFH 4235  
Grouping (TA = 25 °C)  
Group  
Min Total Radiant Flux  
Max Total Radiant Flux  
IF = 1A, tp = 10 ms  
IF = 1A, tp = 10 ms  
Φe max [mW]  
1000  
Φe min [mW]  
630  
SFH4235 - EA  
SFH4235 - EB  
800  
1250  
Note:  
Measured with integrating sphere.  
Only one group in one package unit ( variation lower 1.6:1)  
Relative Spectral Emission 1) page 12  
Relative Total Radiant Flux 1) page 12  
Φe / Φe (1 A) = f(IF), TA = 25°C, Single pulse,  
tp= 100μs  
Irel = f(λ), TA = 25°C  
OHF04132  
100  
%
OHF04187  
101  
Irel  
Φe  
Φe (1 A)  
80  
60  
40  
20  
0
100  
5
10-1  
5
10-2  
5
10-3  
700  
750  
800  
850  
nm 950  
10-2  
5 10-1  
5 100  
101  
A
IF  
λ
2016-05-12  
3
Version 1.5  
SFH 4235  
Forward Current 1) page 12  
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C  
Max. Permissible Forward Current  
IF = f(TS), RthJS = 9 K/W  
OHF04190  
OHF04188  
1.1  
101  
A
A
IF  
IF  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
100  
5
10-1  
5
10-2  
0
20 40 60 80 100 ˚C 130  
2
2.5  
3
3.5  
V
4
TS  
VF  
Permissible Pulse Handling Capability  
IF = f(tp), TS = 85 °C, duty cycle D = parameter  
OHF04189  
5.5  
A
tP  
tP  
IF  
IF  
D
= T  
T
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
D
=
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.33  
0.5  
1
10-5 10-4 10-3 10-2 10-1 100 101 s 102  
tp  
2016-05-12  
4
Version 1.5  
SFH 4235  
Radiation Characteristics 1) page 12  
Irel = f(ϕ), TA= 25°C  
OHL01660  
40˚  
30˚  
20˚  
10˚  
0˚  
1.0  
ϕ
50˚  
0.8  
0.6  
0.4  
0.2  
0
60˚  
70˚  
80˚  
90˚  
100˚  
1.0  
0.8  
0.6  
0.4  
0˚  
20˚  
40˚  
60˚  
80˚  
100˚  
120˚  
Package Outline  
Dimensions in mm (inch).  
2016-05-12  
5
Version 1.5  
SFH 4235  
Note:  
Corrosion robustness better than EN 60068-2-60 (method 4): with enhanced corrosion test: 40°C / 90%rh  
/ 15ppm H2S / 336h  
Type:  
SFH 4235  
Package  
Platinum Dragon  
Approximate Weight:  
0.2 g  
Note:  
Cathode mark an the bottom side.  
Recommended Solder Pad  
12.0 (0.472)  
11.6 (0.457)  
1.6 (0.063)  
11.6 (0.457)  
3 Lötstellen  
3 solder points  
ø2.5 (0.098)  
ø4.0 (0.157)  
ø4.0 (0.157)  
Heatsink attach  
1.6 (0.063)  
Kupfer  
Copper  
Thermisch optimiertes PCB  
Thermal enhanced PCB  
Lötstopplack  
Solder resist  
Lötpasten Schablone  
Solder paste stencil  
Bare Copper  
Freies Kupfer  
OHAY0681  
Dimensions in mm (inch).  
Attention  
Anode and Heatsink are electrically connected  
2016-05-12  
6
Version 1.5  
SFH 4235  
Reflow Soldering Profile  
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01  
OHA04525  
300  
˚C  
T
250  
T
245 ˚C  
p
240 ˚C  
tP  
tL  
217 ˚C  
200  
150  
tS  
100  
50  
25 ˚C  
0
0
50  
100  
150  
200  
250  
s
300  
t
OHA04612  
Pb-Free (SnAgCu) Assembly  
Profile Feature  
Profil-Charakteristik  
Symbol  
Symbol  
Unit  
Einheit  
Minimum  
Recommendation  
Maximum  
Ramp-up rate to preheat*)  
25 °C to 150 °C  
2
3
K/s  
Time tS  
TSmin to TSmax  
tS  
60  
100  
2
120  
3
s
Ramp-up rate to peak*)  
K/s  
TSmax to TP  
TL  
tL  
Liquidus temperature  
217  
80  
°C  
s
Time above liquidus temperature  
Peak temperature  
100  
TP  
tP  
245  
20  
260  
30  
°C  
s
Time within 5 °C of the specified peak  
temperature TP - 5 K  
10  
3
6
K/s  
s
Ramp-down rate*  
TP to 100 °C  
480  
Time  
25 °C to TP  
All temperatures refer to the center of the package, measured on the top of the component  
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range  
2016-05-12  
7
Version 1.5  
SFH 4235  
Taping  
Cathode/Collector Side  
4 (0.157)  
2 (0.079)  
0.3 (0.012)  
1.55 (0.061)  
0.3 (0.012)  
6.35 (0.250)  
8 (0.315)  
1.9 (0.075)  
OHAY0508  
Dimensions in mm (inch).  
Tape and Reel  
24 mm tape with 800 pcs. on ∅ 180 mm reel  
W1  
D0  
P0  
P2  
Label  
P1  
Direction of unreeling  
Direction of unreeling  
W2  
Leader: min0 4±± mm *  
Trailer: min0 16± mm *  
*) Dimensions acc0 to IEC 6±.86-3; EIA 481-D  
OHAY0324  
2016-05-12  
8
Version 1.5  
SFH 4235  
Tape dimensions [mm]  
Tape dimensions in mm  
W
E
F
P0  
P1  
P2  
D0  
24 + 0.3 / - 0.1 4 ± 0.1  
8 ± 0.1  
or  
12 ± 0.1  
2 ± 0.1  
1.5 ± 0.1  
1.75 ± 0.1  
11.5 ± 0.05  
Reel dimensions [mm]  
Reel dimensions in mm  
A
W
Nmin  
60 / 100  
W1  
W2max  
30.4  
180  
24  
24.4 + 2  
Barcode-Product-Label (BPL)  
OSRAM Opto  
BIN1: XX-XX-X-XXX-X  
LX XXXX  
Semiconductors  
RoHS Compliant  
(6P) BATCH NO: 1234567890  
(1T) LOT NO: 1234567890  
ML Temp ST  
XXX °C X  
X
(9D) D/C: 1234  
Pack: RXX  
DEMY XXX  
X_X123_1234.1234 X  
(X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X  
OHA04563  
Dry Packing Process and Materials  
Moisture-sensitive label or print  
Barcode label  
OSRAM  
Humidity indicator  
Barcode label  
D o n o t e a t .  
A v o i d m e t a l c o n t a c t .  
D i s c a r d i f c i r c l e s o v e r r u n .  
b a g o p e n i n g .  
P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e r  
c h e c k d o t  
C o m p a r a t o r  
W E T  
b a k e u n i t s  
e x a m i n e u n i t s , i f n e c e s s a r y  
1 5 %  
I f w e t ,  
b a k e u n i t s  
e x a m i n e u n i t s , i f n e c e s s a r y  
1 0 %  
I f w e t ,  
c h a n g e d e s i c c a n t  
p a r t s s t i l l a d e q a t e l y d r y .  
I f w e t ,  
u
5 %  
M I L - I - 8 8 3 5  
H u m i d i t y I n d i c a t o r  
OSRAM  
Desiccant  
OHA00539  
Note:  
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.  
Regarding dry pack you will find further information in the internet. Here you will also find the normative  
references like JEDEC.  
2016-05-12  
9
Version 1.5  
SFH 4235  
Transportation Packing and Materials  
Barcode label  
Barcode label  
Bin1: P-1-20  
Bin2: Q-1-20  
Bin3:  
Temp ST  
220  
240 C R  
260  
C
R
DEMY  
R18  
ML  
2
C
RT  
LSY T676  
Multi T
2a  
3
Additional TEXT  
R077  
PACKVAR:  
P-1+Q-1  
(G) GROUP:  
0144  
(9D) D/C:  
210021998  
2000  
OSRAM Opto  
Semiconductors  
(Q)QTY:  
123GH1234  
(6P) BATCH NO:  
5
2
4
1
0
0
1
(1T) LOT NO:  
1
(X) PROD NO:  
Bin1: P-1-20  
Bin2: Q-1-20  
Bin3:  
Temp ST  
220  
240  
260  
C
R
C
DEMY  
R18  
ML  
R
C RT  
2
LSY T676  
2a  
3
Additional TEXT  
R077  
PACKVAR:  
Multi TOP
P-1+Q-1  
(G) GROUP:  
0144  
(9D) D/C:  
210021998  
2000  
OSRAM Opto  
Semiconductors  
(Q)QTY:  
123GH1234  
(6P) BATCH NO:  
5
2
4
1
0
0
1
(1T) LOT NO:  
1
OSRAM  
(X) PROD NO:  
Packing  
Sealing label  
OHA02044  
Dimensions of transportation box in mm  
Width  
Length  
Height  
195 ± 5  
195 ± 5  
42 ± 5  
2016-05-12  
10  
Version 1.5  
SFH 4235  
Disclaimer  
Language english will prevail in case of any discrepancies or deviations between the two language wordings.  
Attention please!  
The information describes the type of component and shall not be considered as assured characteristics.  
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain  
dangerous substances.  
For information on the types in question please contact our Sales Organization.  
If printed or downloaded, please find the latest version in the Internet.  
Packing  
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.  
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing  
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any  
costs incurred.  
Components used in life-support devices or systems must be expressly authorized for such purpose!  
Critical components* may only be used in life-support devices** or systems with the express written approval of  
OSRAM OS.  
*) A critical component is a component used in a life-support device or system whose failure can reasonably be  
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that  
device or system.  
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or  
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be  
endangered.  
2016-05-12  
11  
Version 1.5  
SFH 4235  
Glossary  
1)  
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or  
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily  
correspond to the actual parameters of each single product, which could differ from the typical data and calculated  
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data  
will be changed without any further notice.  
2016-05-12  
12  
Version 1.5  
SFH 4235  
Published by OSRAM Opto Semiconductors GmbH  
Leibnizstraße 4, D-93055 Regensburg  
www.osram-os.com © All Rights Reserved.  
2016-05-12  
13  

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