SFH4651 [OSRAM]
Narrow beam LED in MIDLED package;型号: | SFH4651 |
厂家: | OSRAM GMBH |
描述: | Narrow beam LED in MIDLED package 静态存储器 光电 |
文件: | 总13页 (文件大小:451K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2016-09-26
Narrow beam LED in MIDLED package (850 nm)
Version 1.5
SFH 4651
Features:
•
•
•
•
High Power Infrared LED (40 mW)
Short switching times
Narrow halfangle (± 10°)
The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
•
•
Taping as Toplooker
Also available as Sidelooker (SFH4656)
Applications
•
•
•
•
Infrared Illumination for cameras
IR data transmission
Remote control
Automotive sensors
Notes
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety
precautions given in IEC 60825-1 and IEC 62471.
Ordering Information
Type:
Radiant Intensity
Ie [mW/sr]
Ordering Code
IF = 70 mA, tp = 20 ms
60 (≥ 25)
SFH 4651
Q65110A8396
Q65111A4394
SFH 4651-UV
40 ... 125
Note:
Measured at a solid angle of Ω = 0.01 sr
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Version 1.5
SFH 4651
Maximum Ratings (TA = 25 °C)
Parameter
Symbol
Top; Tstg
VR
Values
Unit
°C
V
Operation and storage temperature range
Reverse voltage
-40 ... 100
5
Forward current
IF
70
0.7
mA
A
Surge current
(tp = 20 µs, D = 0)
IFSM
Power consumption
Ptot
140
2
mW
kV
ESD withstand voltage
VESD
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
Thermal resistance junction - ambient 1) page 12
RthJA
RthJS
380
220
K / W
K / W
Thermal resistance junction - soldering point
2) page 12
Characteristics (TA = 25 °C)
Parameter
Symbol
Values
Unit
Peak wavelength
(typ)
(typ)
(typ)
λpeak
λcentroid
∆λ
860
nm
(IF = 70 mA, tp = 20 ms)
Centroid wavelength
(IF = 70 mA, tp = 20 ms)
850
30
nm
nm
°
Spectral bandwidth at 50% of Imax
(IF = 70 mA, tp = 20 ms)
Half angle
(typ)
(typ)
ϕ
± 10
Dimensions of active chip area
L x W
0.2 x 0.2
mm x
mm
Rise and fall time of Ie ( 10% and 90% of Ie max
)
(typ)
tr, tf
12
ns
(IF = 70 mA, RL = 50 Ω)
Forward voltage
(typ (max)) VF
(typ (max)) VF
IR
1.6 (≤ 2)
2.4 (≤ 3)
V
(IF = 70 mA, tp = 20 ms)
Forward voltage
(IF = 500 mA, tp = 100 µs)
V
Reverse current
(VR = 5 V)
not designed for ꢀA
reverse operation
Total radiant flux
(IF=70 mA, tp=20 ms)
(typ)
Φe
40
mW
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Version 1.5
SFH 4651
Parameter
Symbol
Values
Unit
Temperature coefficient of Ie or Φe
(IF = 70 mA, tp = 20 ms)
(typ)
(typ)
(typ)
TCI
-0.5
% / K
Temperature coefficient of VF
(IF = 70 mA, tp = 20 ms)
TCV
TCλ
-0.7
0.3
mV / K
nm / K
Temperature coefficient of wavelength
(IF = 70 mA, tp = 20 ms)
Grouping (TA = 25 °C)
Group
Min Radiant Intensity
Max Radiant Intensity Typ Radiant Intensity
IF = 70 mA, tp = 20 ms
IF = 70 mA, tp = 20 ms
IF = 500 mA, tp = 25 µs
Ie, min [mW / sr]
Ie, max [mW / sr]
Ie, typ [mW / sr]
SFH 4651-T
SFH 4651-U
SFH 4651-V
SFH 4651-AW
25
50
220
360
560
900
40
80
63
125
200
100
Note:
measured at a solid angle of Ω = 0.01 sr
Only one group in one packing unit (variation lower 2:1).
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Version 1.5
SFH 4651
Relative Spectral Emission 3) page 12
Radiant Intensity 3) page 12
Irel = f(λ), TA = 25°C
Ie / Ie(70 mA) = f(IF), single pulse, tp = 25 µs,
TA= 25°C
OHF04132
100
%
OHF04406
101
Irel
Ie
I
e (70 mA)
80
60
40
20
0
100
5
10-1
5
10-2
5
10-3
700
750
800
850
nm 950
100
5
101
5
102
103
mA
IF
λ
Forward Current 3) page 12
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Max. Permissible Forward Current
IF, max = f(TA), RthJA = 380 K/W
OHF03826
OHF04057
100
A
80
mA
IF
IF
70
60
50
40
30
20
10
0
10-1
5
10-2
5
10-3
5
10-4
0
20
40
60
80 100 ˚C 120
0
0.5
1
1.5
2
2.5 V 3
TA
VF
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Version 1.5
SFH 4651
Permissible Pulse Handling Capability
IF = f(tp), TA = 25 °C, duty cycle D = parameter
Permissible Pulse Handling Capability
IF = f(tp), TA = 85 °C, duty cycle D = parameter
OHF04059
OHF04058
0.7
A
0.7
A
tP
tP
tP
tP
IF
IF
IF
IF
= T
D
D
= T
0.6
0.5
0.4
0.3
0.2
0.1
0
0.6
0.5
0.4
0.3
0.2
0.1
0
T
T
D
=
D
=
0.005
0.01
0.02
0.05
0.1
0.005
0.01
0.02
0.05
0.1
0.2
0.3
0.5
1
0.2
0.3
0.5
1
10-5 10-4 10-3 10-2 10-1 100 101 s 102
10-5 10-4 10-3 10-2 10-1 100 101 s 102
tp
tp
Radiation Characteristics 3) page 12
Irel = f(ϕ), TA= 25°C
40˚
30˚
20˚
10˚
0˚
OHF05593
1.0
50˚
0.8
0.6
0.4
60˚
70˚
0.2
0
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
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Version 1.5
SFH 4651
Package Outline
Dimensions in mm.
Pad
Description
Anode
1
2
Cathode
Package
MIDLED, Silicone, colourless, clear
Approximate Weight:
23 mg
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Version 1.5
SFH 4651
Recommended Solder Pad
Dimensions in mm.
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
tP
tL
217 ˚C
200
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
2016-09-26
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Version 1.5
SFH 4651
OHA04612
Pb-Free (SnAgCu) Assembly
Profile Feature
Profil-Charakteristik
Symbol
Symbol
Unit
Einheit
Minimum
Recommendation
Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2
3
120
3
K/s
Time tS
TSmin to TSmax
tS
60
100
2
s
Ramp-up rate to peak*)
K/s
TSmax to TP
TL
tL
Liquidus temperature
217
80
°C
s
Time above liquidus temperature
100
TP
tP
Peak temperature
245
20
260
30
°C
s
Time within 5 °C of the specified peak
temperature TP - 5 K
10
3
6
K/s
s
Ramp-down rate*
TP to 100 °C
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Taping
Dimensions in mm (inch).
Note:
Pad 1 = Anode
2016-09-26
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Version 1.5
SFH 4651
Tape and Reel
8 mm tape with 2000 pcs. on ∅ 180 mm reel
W1
D0
P0
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min0 4±± mm *
Trailer: min0 16± mm *
*) Dimensions acc0 to IEC 6±.86-3; EIA 481-D
OHAY0324
Tape dimensions [mm]
Tape dimensions in mm
W
E
F
P0
P1
P2
2 ± 0.05
D0
8 + 0.3 / -0.1 4 ± 0.1
2 ± 0.05
or
4 ± 0.1
1.5 ± 0.1
1.75 ± 0.1
3.5 ± 0.05
Reel dimensions [mm]
Reel dimensions in mm
A
W
Nmin
60
W1
W2max
14.4
180
8
8.4 + 2
Barcode-Product-Label (BPL)
OSRAM Opto
BIN1: XX-XX-X-XXX-X
LX XXXX
Semiconductors
RoHS Compliant
(6P) BATCH NO: 1234567890
(1T) LOT NO: 1234567890
ML Temp ST
XXX °C X
X
(9D) D/C: 1234
Pack: RXX
DEMY XXX
X_X123_1234.1234 X
(X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X
OHA04563
2016-09-26
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Version 1.5
SFH 4651
Dry Packing Process and Materials
Moisture-sensitive label or print
Barcode label
OSRAM
Humidity indicator
Barcode label
D o n o t e a t .
A v o i d m e t a l c o n t a c t .
D i s c a r d i f c i r c l e s o v e r r u n .
b a g o p e n i n g .
P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e r
c h e c k d o t
C o m p a r a t o r
W E T
b a k e u n i t s
e x a m i n e u n i t s , i f n e c e s s a r y
1 5 %
I f w e t ,
b a k e u n i t s
e x a m i n e u n i t s , i f n e c e s s a r y
1 0 %
I f w e t ,
c h a n g e d e s i c c a n t
p a r t s s t i l l a d e q a t e l y d r y .
I f w e t ,
u
5 %
M I L - I - 8 8 3 5
H u m i d i t y I n d i c a t o r
OSRAM
Desiccant
OHA00539
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
Transportation Packing and Materials
Barcode label
Barcode label
Bin1: P-1-20
Bin2: Q-1-20
Bin3:
Temp ST
220
240 C R
260
C
R
DEMY
R18
ML
2
C
RT
LSY T676
Multi TOP
2a
3
Additional TEXT
R077
PACKVAR:
P-1+Q-1
(G) GROUP:
0144
(9D) D/C:
210021998
2000
OSRAM Opto
Semiconductors
(Q)QTY:
123GH1234
(6P) BATCH NO:
5
2
4
1
0
0
1
(1T) LOT NO:
1
(X) PROD NO:
Bin1: P-1-20
Bin2: Q-1-20
Bin3:
Temp ST
220
240 C R
260
C
R
DEMY
R18
ML
2
C
RT
LSY T676
Multi TO
2a
3
Additional TEXT
R077
PACKVAR:
P-1+Q-1
(G) GROUP:
0144
(9D) D/C:
210021998
2000
OSRAM Opto
Semiconductors
(Q)QTY:
123GH1234
(6P) BATCH NO:
5
2
4
1
0
0
1
(1T) LOT NO:
1
OSRAM
(X) PROD NO:
Packing
Sealing label
OHA02044
Dimensions of transportation box in mm
Width
Length
Height
200 ± 5
195 ± 5
30 ± 5
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Version 1.5
SFH 4651
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2016-09-26
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Version 1.5
SFH 4651
Glossary
1)
Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm2 each
2)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)
3)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2016-09-26
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Version 1.5
SFH 4651
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
2016-09-26
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