2SD1992Q [PANASONIC]

Transistor;
2SD1992Q
型号: 2SD1992Q
厂家: PANASONIC    PANASONIC
描述:

Transistor

文件: 总4页 (文件大小:247K)
中文:  中文翻译
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This product complies with the RoHS Directive (EU 2002/95/EC).  
Transistors  
2SD1992A  
Silicon NPN epitaxial planar type  
For low-frequency power strengthening and drive  
Complementary to 2SB1321A  
Unit: mm  
6.9 0.1  
(4.0)  
2.5 0.1  
(0.8)  
(0)  
Features  
Low collector-emitter saturation voltage VCE(sat)  
Allowing supply with the radial taping  
0.65 max.  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Rag  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Emitter-base voltage (Collector open)  
Collector current  
+0.10  
+0.10  
045  
0.45  
–0.05  
–0.05  
V
1.05 0.05  
2.5 0.5  
7
V
2.5 0.5  
500  
mA  
A
1: Emitter  
2: Collector  
3: Base  
Peak collector current  
CP  
600  
1
2
3
Collector power dissipao
Junction temperatur
PC  
mW  
°C  
°C  
MT-1-A1 Package  
Tj  
10  
Storage tmperatre  
Tstg  
55 to +150  
Electrical Characteristics Ta = 25°C 3°C  
Parmeter  
Symbl  
VCBO  
VCEO  
VEBO  
ICBO  
Conditions  
in  
60  
50  
7
Typ  
Max  
Unit  
V
Collecvoltag(Emitter open)  
Coltage (Base open)  
Emitte (Collector opn)  
Collector-boff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
I= 10 µA, IE = 0  
IC = 2 mA, IB = 0  
V
IE = 10 µA, IC = 0  
V
VCB = 20 V, IE = 0  
VCE = 20 V, IB = 0  
VCE = 10 V, IC = 10 mA  
VCE = 10 V, IC = 500 mA  
0.1  
1
µA  
µA  
ICEO  
1
2
Forward current transfer ratio *  
hFE1  
hFE2  
85  
40  
340  
*
90  
0.35  
200  
6
1
Collector-emitter saturation voltage *  
VCE(sat) IC = 300 mA, IB = 30 mA  
0.60  
15  
V
MHz  
pF  
Transition frequency  
fT  
VCB = 10 V, IE = −10 mA, f = 200 MHz  
VCB = 10 V, IE = 0, f = 1 MHz  
Collector output capacitance  
Cob  
(Common base, input open circuited)  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. 1: Pulse measurement  
*
2: Rank classification  
*
Rank  
Q
R
S
No rank  
hFE1  
85 to 170  
120 to 240  
170 to 340  
85 to 340  
Product of no-rank classification is not marked.  
Publication date: April 2003  
SJC00235BED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
2SD1992A  
PC Ta  
IC VCE  
IC IB  
800  
600  
400  
200  
0
800  
600  
400  
200  
0
800  
600  
400  
200  
0
VCE = 10 V  
Ta = 25°C  
Ta = 25°C  
IB = 10 mA  
9 mA  
8 mA  
7 mA  
6 mA  
5 mA  
4 mA  
3 mA  
2 mA  
1 mA  
0
2
4
6
8
)
10  
0
4
8
12  
16  
20  
0
40  
80  
120  
160  
(
Base current IB mA  
(
)
V
(
)
Collector-emitter voltage VCE  
Ambient temperature Ta °C  
VCE(sat) IC  
VBE(sat) IC  
hFE IC  
100  
10  
300  
250  
200  
150  
100  
50  
100  
10  
IC / IB = 10  
IC / IB = 10  
VCE = 10 V  
Ta = 75°C  
25°C  
25°C  
25°C  
Ta = 75°C  
1
1
25°C  
Ta = 75°C  
25°C  
25°C  
0.1  
0.01  
0.1  
0.01  
0
0.01  
0.01  
0.1  
1
10  
0.01  
0.1  
1
10  
0.1  
1
10  
(
)
Collector current IC  
A
(
)
( )  
Collector current IC A  
Collector current IC  
A
fT IE  
Cob VCB  
VCER RBE  
240  
120  
12  
IE = 0  
VCB = 10 V  
Ta = 25°C  
IC = 2 mA  
Ta = 25°C  
f = 1 MHz  
Ta = 25°C  
200  
160  
120  
80  
100  
80  
60  
40  
20  
0
10  
8
6
4
40  
2
0
1  
0
10  
Emitter current IE mA  
100  
1
10  
100  
1000  
)
1
10  
100  
(
)
(
(
)
V
Base-emitter resistance RBE k  
Collector-base voltage VCB  
SJC00235BED  
2
This product complies with the RoHS Directive (EU 2002/95/EC).  
2SD1992A  
ICEO Ta  
104  
103  
102  
10  
1
VCE = 10 V  
0
40  
80  
120  
160  
200  
(
)
Ambient temperature Ta °C  
SJC00235BED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  

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