AXA173011P [PANASONIC]
PCB Connector, Socket, ROHS COMPLIANT;
| 型号： | AXA173011P |
| 厂家： | 
PANASONIC |
| 描述： | PCB Connector, Socket, ROHS COMPLIANT PC 连接器 |
| 文件： | 总5页 (文件大小：308K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Discontinued products (
)
TRIPLE CONTACT CONSTRUCTION OF
POWER TERMINAL FOR SUPERIOR
PREVENTION OF MINUTE CIRCUIT
CUTOFF FROM DROPPING
SOCKETS FOR
miniSD™ CARD
FEATURES
1.Triple contact construction for
improved prevention of minute circuit
cutoff from dropping.
The terminals in the power supply section
have been made with triple contacts.This
construction means that there will be no
circuit cutoff over 0.1 µs even if the
device is dropped.
2. Robustness and resistance to ESD
and EMI have been fortified using
upper and lower metal shells.
The socket is effective against ESD and
EMI, since both the front and back of the
card are covered with metal when
inserted.
● What is V notch construction?
By having the contacting portion of the
detection contact make contact with the
edges and by increasing the per-unit-area
contact pressure, this product is more
effective at the removal of foreign matter.
This also helps to prevent foreign matter
from getting inside.
Standard mounting type
[Cross section of contacting part]
Without notch
With V notch
Socket side contact cross section
Header side contact cross section
Reverse mounting type
Patented (Japan, Korea and Taiwan)
Metal shell
Also, since a more robust design is
possible compared to single-sided plastic
molding, the influence of reflow heat is
reduced.
3. Constructed with double spring and
horseshoe shaped slider
Since a horseshoe shaped slider and
double spring system is used and since
the entire bottom of the card pushes the
slider, the right-to-left balance is good,
which allows smooth insertion and
removal.
What is a miniSD™ card?
To satisfy the trend toward applications that
are getting thinner and more compact, the
miniSD card, at 40% the volume, is an even
more compact version of the SD memory
card that is now enjoying a solid reputation
in the market.
Horseshoe
shaped slider
Triple contact
structure
Spring
Spring
24mm
20mm
Metal shell
32mm
21.5mm
4. Better contact reliability through
use of V notch construction in
detection contact.
V notch construction, a design proven in
our narrow-pitch connectors, is used in
the detection contact. This increases
resistance to the environment and to
dust.
5. 2.3 mm ultra-thin socket thickness
contributes to device compactness
Space savings realized. Width: 24.3 mm
(incl. solder terminal) × Depth: 21.5 mm
(incl. lead terminal) × Thickness: 2.3 mm
6. Simple card lock mechanism
(prevents card from falling out)
Thickness
2.1mm
Thickness
1.4mm
SD memory card
miniSD™ card
Compliance with RoHS Directive
APPLICATIONS
Use in applications (mobile phones and
voice recorders, etc.) that employ a
miniSD™ card.
1) Mobile phones
2) Voice recorders
Matsushita Electric Works, Ltd.
http://www.mew.co.jp/ac/e/
Discontinued products (
)
(AXA1)
ORDERING INFORMATION
AXA
1
3
0
1
1: Sockets for miniSD™ card
<Board mounting direction>
6: On board mounting reverse type (outside terminal)
7: On board mounting standard type (outside terminal)
<Eject type>
3: Push-push type
<Stand off height>
0: Not available (0 mm)
<Function>
1: Without card jump-out prevention function 5: With card jump-out prevention function
With card presence detection SW
With card presence detection SW
<Terminal/Positioning boss>
1: SMD terminal/with positioning boss
<Packing>
T: 40 pcs., tray package × 20 trays
P: 350 pcs. embossed tape and paper reel package × 2 reels
PRODUCT TYPES
Card jump-out
prevention
function
Standoff
height
(mm)
Packing quantity
Card
Product name Eject type
Mounting type
Part No.
detection
Inner carton
Outer carton
On board mounting
standard type
AXA173011∗
AXA163011∗
AXA173051∗
AXA163051∗
Asterisk “∗” mark on end of
Part No.;
P: 350 pieces (1 reel)
(Embossed tape package)
T: 40 pieces (1 tray)
(Tray package)
Asterisk “∗” mark on end of
Part No.;
P: 700 pieces (2 reels)
(Embossed tape package)
T: 800 pieces (20 trays)
(Tray package)
Not available
Available
On board mounting
reverse type
Sockets for
miniSD™ card
Push-push
type
Available
0
On board mounting
standard type
On board mounting
reverse type
SPECIFICATIONS
1. Characteristics (Performance when miniSD™ card is mated. Based on miniSD™ card specification Ver. 1.02.)
Item
Specifications
Condition
Rated voltage
Rated current
7.0V DC
0.5A DC/1 terminal
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 150mΩ
Min. 1,000MΩ
Electrical
characteristics
Contact resistance
Insulation resistance
Breakdown voltage
Measured with the HP4338B
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1 mA.
500V AC for 1 min.
Frequency: 10 to 55 Hz
Vibration resistance
Card locking force
Acceleration: 20.0 m/s2{2.0G}
Mechanical
characteristics
No current interruption for more than 0.1 µs (signal contact)
Max. 40N {4.08kgf}
Insertion and removal life: 10,000 times
Contact resistance after testing:
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 150mΩ
Lifetime
characteristics
Insertion and removal life of
card
Insertion and removal speed are at a rate of 500 times/
hour or less.
Ambient temperature
Storage temperature
–25°C to +85°C
–40°C to +85°C
(The allowable storage temperature is –40°C to +50°C
if unopened from original packaging)
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
Environment
characteristics
Reflow soldering: peak temperature 250°C or less
Sockets (shell) surface temperature for using infrared
reflow soldering machine
Resistance to soldering heat manual soldering: Soldering iron tip temperature 300°C,
5 sec. or less
Applicable memory card
Unit weight
miniSD™ card (based on specification Ver. 1.02)
1.62g
Note: Please consult us for card falling out prevention mechanism.
2. Material and surface treatment
Portion
Material
Surface
Contact portion: Ni plating on base, PdNi plating + Au plating on surface
Soldering portion: Ni plating on base, Au plating on surface
Signal contact
Copper alloy
Contact portion: Ni plating on base, Au plating on surface
Soldering portion: Ni plating on base, Au plating on surface
Detection contact
Retention fittings
Copper alloy
Stainless steel
Soldering portion: Ni plating on base, Au + Pd plating on surface
Matsushita Electric Works, Ltd.
http://www.mew.co.jp/ac/e/
Discontinued products (
)
(AXA1)
The CAD data of the products with a CAD Data mark can be downloaded from: http://www.mew.co.jp/ac/e
DIMENSIONS (Unit: mm)
1. On board mounting standard type (outside terminal)
Part No.
AXA173011∗
AXA173051∗ (with card jump-out prevention function)
Terminal
coplanarity
0.15
4.10
13.00
CAD Data
2.00
5.75
Pitch: 1.30
0.60
Z
0.15
0.60
9.70
18.80
(11.8)
(11.5)
Contact structure
23.30
24.30
(13.0)
(5.75)
1.30
(Contact pitch)
Terminal No. 3 and 4
Terminal No. 2, 5 to 11
Terminal No. 1
Amount of contact protrusion
when card is inserted.
0.20 max. for pin No. 3 and 4,
0.27 max. for pin No. 9
General tolerance: 0.2
Detailed internal view
View of set card
Recommended PC board pattern (TOP VIEW)
(as seen from Z direction
with the cover shell removed)
: Pattern insulation
is recommended
4.10 0.05
13.00 0.05
(A) (B)
2.00 0.05 5.75 0.05
1.00 0.05
1.30 0.05
(pitch)
: Pattern
forbidden
area
(2.75)
6.20
7.70
(12.00)
(24.30)
Socket edge
10.05
20.10
20.0
miniSD card
Same shape 2 holes
9.70 0.05
0.40 0.05
0.95 0.05
18.80 0.05
11.35 0.05
11.65 0.05
0.95 0.05
: Pattern insulation is recommended (Whole area)
Card detection switch contact condition chart
Card attachment condition
Card not attached
Card attached
Card detection switch
Open
Closed
(A)-(B)
Terminal number
Matsushita Electric Works, Ltd.
http://www.mew.co.jp/ac/e/
Discontinued products (
)
(AXA1)
2. On board mounting reverse type (outside terminal)
Part No.
AXA163011∗
AXA163051∗ (with card jump-out prevention function)
Terminal
coplanarity
13.00
4.10
CAD Data
0.15
5.75
2.00
Pitch: 1.30
0.60
Z direction
9.70
0.15
0.60
18.80
(11.8)
(11.5)
Contact structure
23.30
24.30
Amount of contact protrusion
when card is inserted.
0.20 max. for pin No. 3 and 4,
0.27 max. for pin No. 9
Terminal No. 3 and 4
Terminal No. 2, 5 to 11
Terminal No. 1
(5.75)
(13.0)
1.30
(Contact pitch)
General tolerance: 0.2
Detailed internal view
View of set card
Recommended PC board pattern (TOP VIEW)
(as seen from Z direction
with the cover shell removed)
13.00 0.05
5.75 0.05
1.30 0.05(pitch)
4.10 0.05
2.00 0.05
(A) (B)
1.00 0.05
(2.75)
(12.00)
(24.30)
Socket edge
10.05
20.10
20.0
miniSD card
0.40 0.05
Same shape
9.40 0.05
18.80 0.05
11.35 0.05 11.65 0.05
0.95 0.05
0.95 0.05
: Pattern insulation is recommended (Whole area)
Card detection switch contact condition chart
Card attachment condition
Card not attached
Card attached
Card detection switch
Open
Closed
(A)-(B)
Terminal number
Matsushita Electric Works, Ltd.
http://www.mew.co.jp/ac/e/
Discontinued products (
)
(AXA1)
EMBOSSED TAPE AND REEL (Unit: mm)
• Tape dimensions
• Reel dimensions (Conforming to JIS C 0806-1995)
Emboss
carrier tape
(44.4+02
)
Taping reel
Top cover tape
Top cover
tape
Tape
Emboss carrier tape
Socket for miniSD card
A
Cavity
Label
A
(20.20)
(40.40)
(44.00)
(1.75)
A-A cross section
NOTES
1. Regarding the design of PC board
patterns
4. Cleaning after soldering
2) The sockets are constructed to prevent
reverse card insertion. Caution is
required because repeated, mistaken
reverse insertion may damage the socket
and card.
3) When not soldered, be careful not to
insert and remove the socket's card.
Doing so will cause a decrease in
anchoring ability of the mated part and
loss of coplanarity.
4) Forcibly removing a fitted card may
degrade the card removal prevention
lock. To remove a card, be sure to push
the card in the insertion direction to
release the slider lock before pulling out
the card.
Inside the socket there is a slider section
and card detection contact/write
protection mechanism. If anything such
as flux remains inside after washing,
insertion and removal will be hampered
and contact will be faulty. Therefore, do
not use methods that involve submersion
when cleaning. (Partial cleaning of the
PCB and soldered terminals is possible.)
5. After PC board mounting
1) Warping of the PC board should be no
more than 0.03 mm for the entire
connector length.
2) When assembling PCBs or storing
them in block assemblies, make sure that
undue weight is not exerted on a stacked
connector.
3) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
6. Handling single components
1) Make sure not to drop or allow parts to
fall from work bench
2) Be cautious when handling because
excessive force applied to the terminals
will cause deformation and loss of
terminal coplanarity.
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Regarding the socket mounting
1) When reflow soldering when the slider
is locked, heat will cause the slider to
deform and not work. Therefore, please
confirm that the slider lock is released
before mounting if you have inserted and
removed a card before soldering.
2) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
8. Device design
3. Soldering
1) Reflow soldering
(1) Screen-printing method is
1) Contact failure may result if dust or dirt
enters the contact section. Please take
appropriate measures when designing
the device to prevent this from
happening, for example by adding a
cover.
2) To ensure smooth insertion and
removal of cards, please design the
chassis so that no force is applied to the
metal shell on top of the socket. If a force
is present that pushes down on the metal
shell, the card will be pressed, which
might prevent ejection.
recommended for cream solder printing.
(2) Use the recommended foot pattern for
cream solder printing (screen thickness:
0.15 mm).
(3) When applying the different thickness
of a screen, please consult us.
(4) Use the recommended reflow
temperature profile conditions shown on
the right for infrared reflow soldering.
3) Repeated bending of the terminals
may break them.
Temperature
Peak temperature
7. Card fitting
3) Please provide a guide or similar to
keep the socket from having force applied
to it when inserting and removing.
9. Others
If you coat the PCB after soldering for
insulation and to prevent wear, make sure
that the coating does not adhere to the
socket.
250°C max.
1) These products are made for the
design of compact and lightweight
devices and therefore the molded part is
very thin. For this reason, design the
device to prevent undue wrenching forces
from being applied to the product during
use.
180 to 200°C
Preheating
155 to 165°C
60 to 120 sec.
Within 30 sec.
Time
(5) Measure the temperature at the
connector surface.
2) Hand soldering
Set the soldering tip to 300°C, and solder
for no more than 5 seconds.
For other details, please verify with
the product specification sheets.
Matsushita Electric Works, Ltd.
http://www.mew.co.jp/ac/e/
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