DB3X207K [PANASONIC]
DB3X207K0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard); DB3X207K0L浮雕式（热压密封） ： 3000个/卷（标准）
| 型号： | DB3X207K |
| 厂家： | 
PANASONIC |
| 描述： | DB3X207K0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard) |
| 文件： | 总4页 (文件大小：410K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DB3X207K
Silicon epitaxial planar type
Unit: mm
For high frequency amplification
Features
Low forward voltage VF
Forward current (Average) IF(AV) = 1Arectification is possible
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
ꢀMarking Symbol: 3F
Packaging
DB3X207K0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
1:Anode
2: N.C.
Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
VR
Rating
Unit
V
3: Cathode
Reverse voltage
20
Panasonic
Mini3-G3-B
Repetitive peak reverse voltage
VRRM
IF(AV)
IFSM
Tj
20
V
JEITA
Code
SC-59A
1
TO-236AA/SOT-23
Forward current (Average)*
1
A
2
Non-repetitive peak forward surge current *
3
A
3
Junction temperature
125
°C
°C
Storage temperature
T
stg
–55 to +125
Note) 1: Mounted on an alumina PC board
*
2: 50 Hz sine wave 1 cycle (Non-repetitive peak current)
*
1
2
Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
V
Forward voltage
Reverse current
VF
IR
Ct
trr
IF = 1.0A
VR = 6 V
0.4
1.5
mA
pF
Terminal capacitance
Reverse recovery time *
VR = 10 V, f = 1 MHz
IF = IR = 100 mA, Irr = 10 mA, RL = 100 Ω
43
12
1
ns
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage
of current from the operating equipment.
3. Absolute frequency of input and output is 400 MHz
1: trr measurement circuit
*
Input Pulse
Output Pulse
trr
Bias Application Unit (N-50BU)
tp
tr
t
10%
IF
t
A
90%
VR
Irr = 10 mA
tp = 2 µs
tr = 0.35 ns
δ = 0.05
IF = 100 mA
IR = 100 mA
RL = 100 Ω
Pulse Generator
Wave Form Analyzer
(SAS-8130)
Ri = 50 Ω
(PG-10N)
Rs = 50 Ω
Publication date: January 2013
Ver. BED
1
DB3X207K
IF VF
IR VR
Ct VR
10−1
10−2
10
1
300
250
Ta = 25°C
Ta = 100°C
85°C
25°C
Ta = 125°C
10−3
10−4
10−5
10−6
10−1
10−2
10−3
10−4
200
150
100
100°C
−30°C
85°C
25°C
−30°C
0.2
50
0
10−7
10−8
10−5
0
0.1
0.3
0.4
0.5
0
4
8
12
16
20
0
5
10
15
20
Reverse voltage VR (V)
Forward voltage VF (V)
Reverse voltage VR (V)
Rth t
IF(AV) Tl
PF(AV) IF(AV)
103
102
10
1
0.5
0.4
1.25
1.00
0.75
0.50
0.25
0
IF
(1)
tp / T
DC
IF
tp
(2)
tp
T
Rth(j-l) = 70°C/W
T
DC
(3)
VR = 10 V
Tj = 125°C
1/2
0.3
0.2
0.1
0
Sine Wave
1/4
1/2
Sine Wave
1/4
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
(3) Mounted on alumina print board.
(50 mm × 50 mm × 0.8 mm)
Solder in : 2 mm × 2 mm
10−3
10−1
10
103
25 50 75 100 125 150 175
0
0
0.25
0.50
0.75
1.00
1.25
Time t (s)
Forward current (Average) IF(AV) (Α)
Lead temperature Tl (°C)
Ver. BED
2
DB3X207K
Unit: mm
Mini3-G3-B
Land Pattern (Reference) (Unit: mm)
Ver. BED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
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