L-S110LBCT [PARALIGHT]
SURFACE MOUNT DEVICE LED;
| 型号： | L-S110LBCT |
| 厂家： | 
PARA LIGHT ELECTRONICS CO., LTD. |
| 描述： | SURFACE MOUNT DEVICE LED |
| 文件： | 总14页 (文件大小：311K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Release by
PARALIGHT DCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan
Tel: 886-2-2225-3733
E-mail: para@para.com.tw
Fax: 886-2-2225-4800
http://www.para.com.tw
DATA SHEET
PART NO.: L-S110LBCT
REV: C / 2
CUSTOMER’S APPROVAL : _______________
DCC : ____________
DRAWING NO. : DS-73-03-0009
DATE : 2009-11-26 PAGE 1 of 14
PARA-FOR-065
Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-S110LBCT
REV:C / 2
z PACKAGE OUTLINE DIMENSIONS
P.C.BOARD
REINFORCING PIN
(NON ELECTRODE)
LED DICE
Notes:
1. All dimensions are in millimeters.
±
2. Tolerance is
0.1mm (.004") unless otherwise noted.
z Features
½
½
½
½
½
½
½
½
Side looking special for LCD backlight.
Package in 8mm tape on 7" diameter reels.
Compatible with automatic Pick & Place equipment.
Compatible with Infrared and Wave soldering reflow solder processes.
EIA STD package.
I.C. compatible.
Pb free product.
Meet RoHS Green Product.
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DATE : 2009-11-26 PAGE
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SURFACE MOUNT DEVICE LED
Part No. : L-S110LBCT
PARALIGHT DCC
REV:C / 2
z Chip Materials
½
½
½
Dice Material : InGaN
Light Color : Blue
Lens Color : Water Clear
z Absolute Maximum Ratings(Ta=25℃)
Symbol
PD
Parameter
Rating
100
Unit
mW
Power Dissipation
Peak Forward Current
IPF
100
mA
(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
IF
-
25
0.25
mA
℃
℃
De-rating Linear From 25
mA/
V
VR
Reverse Voltage
5
ESD
Topr
Tstg
Electrostatic Discharge Threshold(HBM)Note A
Operating Temperature Range
150
V
℃
℃
-40 ~ +85
-40 ~ +85
Storage Temperature Range
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
z Electro-Optical Characteristics(Ta=25℃)
Parameter
Luminous Intensity
Viewing Angle
Peak Emission
Wavelength
Symbol
IV
Min.
60
Typ.
120
130
Max.
Unit
mcd
deg
Test Condition
IF=20mA
Note 2
2θ1/2
λp
λd
468
470
25
nm
nm
nm
Measurement @Peak
IF=20mA
Dominant Wavelength
Spectral Line
Δλ
Half-Width
Forward Voltage
Reverse Current
VF
IR
3.3
3.6
10
V
IF = 20mA
VR = 5V
μA
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Part No. : L-S110LBCT
PARALIGHT DCC
REV:C / 2
z Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA
Forward Voltage(VF), Unit:V@20mA
Bin Code
Min
71.0
112.0
180
Max
112.0
180.0
280
Bin Code
K8
Min
2.80
2.95
3.10
3.25
3.40
Max
2.95
3.10
3.25
3.40
3.55
Q
R
S
K9
K10
K11
K12
Tolerance of each bin are±15%
Tolerance of each bin are±0.1Volt
Dominant Wavelength (Hue),Unit: nm@20mA
Bin Code
AC
Min
465
470
Max
470
475
AD
Tolerance of each bin are±1nm
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. The dominant wavelength λd is derived from the CIE chromaticity diagram and
represents the single wavelength which defines the color of the device.
4. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
5. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
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SURFACE MOUNT DEVICE LED
Part No. : L-S110LBCT
REV:C / 2
z Typical Electro-Optical Characteristics Curves
(25℃Ambient Temperature Unless Otherwise Noted)
Fig.2 Forward Current vs.Forward Voltage
Fig.3 Luminous Intensity vs.Forward Current
1000
100
10
1
-60 -40 -20 -0 20 40 60 80 100
Ambient Temperature Ta(℃)
Fig.5 Luminous Intensity vs.Ambient Temperature
Fig.4Relative Luminous Intensity vs.Forward Current
0° 10° 20°
50
40
30°
30
25
20
40°
1.0
0.9
50°
0.8
60°
10
0
70°
80°
90°
0.7
0
20
40
60
80 100
0.5 0.3 0.1 0.2 0.4 0.6
Ambient Temperature Ta(℃)
Fig.6 Forward Current Derating Curve
Fig.7 Relative Intensity vs.Angle
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Part No. : L-S110LBCT
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z Label Explanation
CUS. PART NO: To be denominated.
CUSTOMER: To be denominated.
PART NO: Refer to P14
IV --- Luminous Intensity Code
VF --- Forward Voltage Code
WD --- Dominant Wavelength Code
LOT NO:
E
L
S 6 8 0001
A
B
C
D
E
F
A---E: For series number
B---L: Local
C---S:SMD
D---Year
F: Foreign
E---Month
F---SPEC.
PACKING QUANTITY OF BAG :
3000pcs max for 150、170、110、115 series
4000pcs max for 191 series
5000pcs max for 192 series
DATE CODE：2006 06 08
G
H
I
G--- Year
H--- Month
I --- Day
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z Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
z Reel Dimensions
Notes:
1. Taping Quantity : 3000pcs for standard
2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm.
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Part No. : L-S110LBCT
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z Package Dimensions Of Tape And Reel
Progressive direction
Polarity
Notes:All dimensions are in millimeters.
Moisture Resistant Packaging
Label
Reel
Label
Desiccant
Aluminum moistue-proof bag
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
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Part No. : L-S110LBCT
REV:C / 2
z Cleaning
½
½
½
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
the oscillator output, size of PCB and LED mounting method. The use of ultrasonic
cleaning should be enforced at proper output after confirming there is no problem.
z Suggest Soldering Pad Dimensions
Direction of PWB camber
and go to reflow furnace
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SURFACE MOUNT DEVICE LED
Part No. : L-S110LBCT
REV:C / 2
● Suggest Sn/Pb IR Reflow Soldering Profile Condition:
● Suggest Pb-Free IR Reflow Soldering Profile Condition:
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z CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household application).Consult PARA’s sales in advance for information on
application in which exceptional quality and reliability are required, particularly when the failure or malfunction of
the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life
support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be storekept at 5°C to 30°C or less and 85%RH or less.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
LEDs stored out of their original packaging for more than a week should be baked at 30°Cforat24hoursbefore
solderassembly.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
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Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60
solder of solder with silver content and don’t to touch LED lens when soldering.Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
、
℃
1 Pre-Heat Temp:150-180 ,120sec.Max.
、
℃
2 Soldering Temp:Temperature Of Soldering Pot Over 230 ,40sec.Max.
、
℃，
3 Peak Temperature:260
5sec.
、
4 Reflow Repetition:2 Times Max.
、
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
、
℃
1 Iron Tip Temp:350 Max.
、
2 Soldering Iron:30w Max.
、
3 Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
、
℃
1 Pre-Heat Temp:150 Max. 120 Sec. Max.
、
℃
2 Bath Temp:265 Max.
、
3 Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
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6.Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Ta= Under Room Temperature As Per Data
Sheet Maximum Rating
*Test Time= 1000HRS
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
Operation Life
(-24HRS,+72HRS)*@20mA.
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 1000HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
Endurance Test
High Temperature
Storage
Ta= 105±5℃
Test Time= 1000HRS (-24HRS,72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,72H RS)
JIS C 7021:B-12 (1982)
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
Temperature
Cycling
105±5℃
10mins
-55±5℃
10mins
100 Cycles
100 Cycles
IR-Reflow In-Board, 2 Times
105±5℃
10mins
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Thermal
Shock
-55℃±5℃
10mins
Environmental
Test
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
Solder
Resistance
Tsol= 260 ± 5℃
Dwell Time= 10 ± 1sec
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
Tsol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Solder ability
Coverage ≧95% of the dipped surface
JIS C 7021:A-2(1982)
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
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Part No. : L-S110LBCT
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XXXX : Special specification for
customer
z PART NO. SYSTEM :
S 1 1 0 X C X X - X X X X
L –
T : Taping for 7 inch reel
TC : Taping for 13 inch reel
TH : IV half binning
TP : Wavelength binning
Lens color
C : Water Clear
W : White Diffused
T : Color Transparent
D : Color Diffused
G : Gap 570nm Green
Y : GaAsp 585 nm Yellow
E : GaAsp 620 nm Orange
SR : GaAlAs 634 nm Red
KG : AlInGap 570nm Super Green
KY : AlInGap 590nm Super Yellow
KF : AlInGap 605nm Super Amber
KR : AlInGap 630 nm Super Red
LB : InGaN 470nm Blue
LG : InGaN 525nm Green……
0 : Single chip
1/2 : Super thin single chip
5/6 : Dual chip
F : Three chip(Full color)
150 : 1206 1.1T Type
170 : 0805 0.8T Type
191 : 0603 0.6T Type
192 : 0603 0.4T Type
110 : 1206 1.0T Type
C : Top View Type
S : Side View Type
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