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KMZ51,115 [NXP]

Magnetic Field Sensor, MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, -.25-0.25mT, RECTANGULAR, THROUGH HOLE MOUNT, 3.9 MM WIDTH, PLASTIC, SOT-96-1, SO-8;
KMZ51,115
型号： KMZ51,115
厂家： NXP    NXP
描述：

Magnetic Field Sensor, MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, -.25-0.25mT, RECTANGULAR, THROUGH HOLE MOUNT, 3.9 MM WIDTH, PLASTIC, SOT-96-1, SO-8

传感器 换能器
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
M
KMZ51  
Magnetic field sensor  
Product specification  
2000 Jun 13  
Supersedes data 1998 Mar 24  
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ51  
FEATURES  
PINNING  
PIN  
• High sensitivity  
SYMBOL  
DESCRIPTION  
• Integrated compensation coil  
• Integrated set/reset coil.  
1
2
3
4
5
6
7
8
+Iflip  
VCC  
flip coil  
bridge supply voltage  
ground  
GND  
+Icomp  
−Icomp  
−VO  
APPLICATIONS  
compensation coil  
compensation coil  
bridge output voltage  
bridge output voltage  
flip coil  
• Navigation  
• Current and earth magnetic field measurement  
• Traffic detection.  
+VO  
−Iflip  
DESCRIPTION  
The KMZ51 is an extremely sensitive magnetic field  
sensor, employing the magnetoresistive effect of thin-film  
permalloy. The sensor contains one magnetoresistive  
Wheatstone bridge and integrated compensation and  
set/reset coils. The integrated compensation coil allows  
magnetic field measurement with current feedback loops  
to generate an output that is independent of drift in  
sensitivity. The orientation of sensitivity may be set or  
changed (flipped) by means of the integrated set/reset coil.  
A short current pulse should be applied to the  
compensation coil to recover (set) the sensor after  
exposure to strong disturbing magnetic fields. A negative  
current pulse will reset the sensor to reversed sensitivity.  
By use of periodically alternated flipping pulses and a  
lock-in amplifier, output is made independent of sensor  
and amplifier offset.  
8
5
handbook, halfpage  
H
ext  
pin 1  
index  
1
4
MGD827  
Fig.1 Simplified outline.  
QUICK REFERENCE DATA  
SYMBOL  
VCC  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
bridge supply voltage  
−
5
8
V
S
sensitivity (uncompensated)  
12  
16  
−
mV/V  
--------------  
kA/m  
Voffset  
Rbridge  
Rcomp  
Acomp  
offset voltage  
−1.5  
1
−
−
+1.5  
3
mV/V  
kΩ  
bridge resistance  
compensation coil resistance  
compensation coil field factor; note 1  
100  
19  
170  
22  
300  
25  
Ω
A ⁄ m  
------------  
mA  
2000 Jun 13  
2
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ51  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
Rflip  
flip coil resistance  
1
2
3
Ω
Iflip (min)  
tflip (min)  
minimum recommended flipping current; note 2  
minimum flip pulse duration; note 2  
800  
1
1000  
3
1200  
100  
mA  
µs  
Notes  
1. The compensation coil generates a field Hcomp = Acomp × Icomp in addition to the external field Hext. Sensor output will  
become zero if Hext = −Hcomp  
.
2. Average power consumption of the flipping coil, defined by current, pulse duration and pulse repetition rate may not  
exceed the specified limit, see Chapter “Limiting values”.  
CIRCUIT DIAGRAM  
handbook, halfpage  
+V  
−I  
−V  
−I  
C
O
F
O
6
8
7
5
Z
Z
1
1
1
2
3
4
MGD793  
V
+I  
GND  
+I  
CC  
F
C
Fig.2 Simplified circuit diagram.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL PARAMETER  
VCC  
MIN.  
MAX.  
UNIT  
bridge supply voltage  
total power dissipation  
storage temperature  
−
−
9
V
Ptot  
130  
+150  
+125  
15  
mW  
°C  
Tstg  
−65  
−40  
−
Tbridge  
Icomp  
bridge operating temperature  
maximum compensation current  
maximum flipping current  
°C  
mA  
mA  
mW  
V
Iflip (max)  
Pflip (max)  
Visol  
−
1500  
50  
maximum flipping power dissipation  
−
voltage between isolated systems:  
flip coil and Wheatstone bridge;  
compensation coil and Wheatstone bridge;  
flip coil and compensation coil  
−
60  
2000 Jun 13  
3
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ51  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
Rth j-a  
thermal resistance from junction to ambient  
155  
K/W  
CHARACTERISTICS  
amb = 25 °C unless otherwise specified.  
T
SYMBOL PARAMETER  
VCC bridge supply voltage  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
−
5
−
−
8
V
Hy  
Hx  
operating range in sensitive direction  
−0.2  
−0.2  
+0.2  
+0.2  
kA/m  
kA/m  
operating range perpendicular to  
sensitive direction  
S
sensitivity  
open circuit  
12  
16  
−
mV/V  
--------------  
kA/m  
TCS  
temperature coefficient of sensitivity  
Ts = −25 to +125 °C  
−
−
0.31  
−
−
%/K  
%/K  
TCVO  
temperature coefficient of output voltage VCC = 5 V;  
−0.4  
Tamb = −25 to +125 °C  
ICC 3 mA;  
−
−0.1  
−
%/K  
Tamb = −25 to +125 °C  
Rbridge  
bridge resistance  
resistance pins 2 to 3  
1
−
3
kΩ  
TCRbridge  
temperature coefficient of bridge  
resistance  
Tbridge = −25 to +125 °C  
−
0.3  
−
%/K  
Voffset  
offset voltage  
−1.5  
−3  
0
0
+1.5  
mV/V  
TCVoffset  
temperature coefficient of offset voltage Tbridge = −25 to +125 °C  
+3  
µ V/V  
-------------  
K
FH  
hysteresis of output voltage  
−
−
2
%FS  
Rcomp  
Acomp  
resistance of compensation coil  
field factor of compensation coil  
resistance pins 4 to 5  
100  
19  
170  
22  
300  
25  
Ω
A/m  
----------  
mA  
Rflip  
resistance of set/reset conductor  
resistance pins 1 to 8  
1
2
3
Ω
TCRflip  
temperature coefficient of resistance of  
set/reset coil  
Tflip = −25 to +125 °C  
−
0.39  
−
%/K  
Iflip  
recommended flipping current for stable  
operation  
±800  
±1000 ±1200 mA  
tflip  
flip pulse duration  
isolating resistance  
1
1
3
100  
µs  
Risol  
resistance pins 1 to 2,  
1 to 4 and 2 to 4  
−
−
mΩ  
Visol  
f
voltage between isolated systems  
operating frequency  
voltage pins 1 to 2, 1 to 4  
and 2 to 4  
−
−
−
50  
1
V
0
MHz  
2000 Jun 13  
4
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ51  
PACKAGE OUTLINE  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
4
e
w
M
detail X  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.050  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.20  
0.014 0.0075 0.19  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches 0.069  
0.01 0.004  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
97-05-22  
99-12-27  
SOT96-1  
076E03  
MS-012  
2000 Jun 13  
5
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ51  
DATA SHEET STATUS  
PRODUCT  
STATUS  
DATA SHEET STATUS  
DEFINITIONS (1)  
Objective specification  
Development This data sheet contains the design target or goal specifications for  
product development. Specification may change in any manner without  
notice.  
Preliminary specification Qualification  
This data sheet contains preliminary data, and supplementary data will be  
published at a later date. Philips Semiconductors reserves the right to  
make changes at any time without notice in order to improve design and  
supply the best possible product.  
Product specification  
Production  
This data sheet contains final specifications. Philips Semiconductors  
reserves the right to make changes at any time without notice in order to  
improve design and supply the best possible product.  
Note  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2000 Jun 13  
6
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ51  
NOTES  
2000 Jun 13  
7
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
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Tel. +61 2 9704 8141, Fax. +61 2 9704 8139  
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Tel. +64 9 849 4160, Fax. +64 9 849 7811  
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Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
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220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773  
Pakistan: see Singapore  
Belgium: see The Netherlands  
Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
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Portugal: see Spain  
Romania: see Italy  
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China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
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Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,  
Colombia: see South America  
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Tel. +65 350 2538, Fax. +65 251 6500  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,  
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South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
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Tel. +55 11 821 2333, Fax. +55 11 821 2382  
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Tel. +49 40 2353 60, Fax. +49 40 2353 6300  
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Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
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India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
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Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
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Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,  
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813  
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),  
Tel. +39 039 203 6838, Fax +39 039 203 6800  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
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Tel. +1 800 234 7381, Fax. +1 800 943 0087  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Middle East: see Italy  
Tel. +381 11 3341 299, Fax.+381 11 3342 553  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
69  
SCA  
© Philips Electronics N.V. 2000  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613520/03/pp8  
Date of release: 2000 Jun 13  
Document order number: 9397 750 07047  

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