TDA1308TD-G [NXP]
IC 0.06 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8, PLASTIC, SO-8, Audio/Video Amplifier;
| 型号： | TDA1308TD-G |
| 厂家： | 
NXP |
| 描述： | IC 0.06 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8, PLASTIC, SO-8, Audio/Video Amplifier 放大器 光电二极管 |
| 文件： | 总26页 (文件大小：197K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
FEATURES
GENERAL DESCRIPTION
• Wide temperature range
• No switch ON/OFF clicks
• Excellent power supply ripple rejection
• Low power consumption
• Short-circuit resistant
• High performance
The TDA1308 is an integrated class AB stereo headphone
driver contained in an SO8 or a DIP8 plastic package. The
device is fabricated in a 1 mm CMOS process and has
been primarily developed for portable digital audio
applications.
– high signal-to-noise ratio
– high slew rate
– low distortion
• Large output voltage swing.
QUICK REFERENCE DATA
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS
VDD supply voltage
MIN.
TYP. MAX. UNIT
single
3.0
5.0
2.5
−2.5
3
7.0
3.5
−3.5
5
V
dual
1.5
−1.5
−
V
VSS
negative supply voltage
supply current
V
IDD
no load
no load
mA
mW
mW
Ptot
total power dissipation
maximum output power
−
15
25
−
Po
THD < 0.1%; note 1
−
60
(THD + N)/S
total harmonic distortion plus note 1
noise-to-signal ratio
−
0.03
−70
−101
110
70
0.06
−65
−
%
−
dB
dB
dB
dB
dB
dB
°C
RL = 5 kΩ
−
S/N
signal-to-noise ratio
channel separation
100
−
−
αcs
−
RL = 5 kΩ
−
105
90
−
PSRR
Tamb
power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV
−
−
operating ambient
temperature
−40
−
+85
Note
1.
VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA1308
DIP8
SO8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
SOT96-1
TDA1308T
plastic small outline package; 8 leads; body width 3.9 mm
August 1994
2
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
BLOCK DIAGRAM
Fig.1 Block diagram.
PINNING
SYMBOL PIN
DESCRIPTION
OUTA
1
2
3
4
5
6
7
8
output A
INA(neg)
INA(pos)
VSS
inverting input A
non-inverting input A
negative supply
non-inverting input B
inverting input B
output B
INB(pos)
INB(neg)
OUTB
VDD
positive supply
Fig.2 Pin configuration.
August 1994
3
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
August 1994
4
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
SYMBOL
VDD
tSC(O)
Tstg
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
8.0
UNIT
0
V
output short-circuit duration
storage temperature
Tamb = 25 °C; Ptot = 1 W
20
−
s
−65
+150
+85
°C
°C
V
Tamb
Vesd
operating ambient temperature
electrostatic discharge
−40
note 1
note 2
−2000
−200
+2000
+200
V
Notes
1. Human body model: C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.
2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 Ω; 3 pulses positive plus 3 pulses negative.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
UNIT
thermal resistance from junction to ambient in free air
DIP8
SO8
109
210
K/W
K/W
QUALITY SPECIFICATION
In accordance with “UZW-BO/FQ-0601”. The numbers of the quality specification can be found in the “Quality Reference
Handbook”. The handbook can be ordered using the code 9398 510 63011.
August 1994
5
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
CHARACTERISTICS
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDD
supply voltage
single
3.0
5.0
7.0
V
V
V
dual
1.5
−1.5
−
2.5
−2.5
3
3.5
−3.5
5
VSS
IDD
negative supply voltage
supply current
total power dissipation
no load
mA
Ptot
no load
−
15
25
mW
DC characteristics
VI(os)
Ibias
VCM
Gv
input offset voltage
−
10
10
−
−
mV
pA
V
input bias current
−
−
common mode voltage
open-loop voltage gain
maximum output current
output resistance
0
3.5
−
RL = 5 kΩ
−
70
60
0.25
−
dB
mA
Ω
IO
(THD + N)/S < 0.1%
−
−
RO
−
−
VO
output voltage swing
note 1
0.75
1.5
0.1
−
4.25
3.5
4.9
−
V
RL = 16 Ω; note 1
RL = 5 kΩ; note 1
−
V
−
V
PSRR
power supply rejection ratio fi = 100 Hz;
Vripple(p-p) = 100 mV
90
dB
αcs
channel separation
−
−
−
70
105
−
−
dB
dB
pF
RL = 5 kΩ
−
CL
load capacitance
200
AC characteristics
(THD + N)/S total harmonic distortion plus note 2
noise-to-signal ratio
−
−70
0.03
−101
0.0009
110
5.5
60
−65
0.06
−
dB
−
%
note 2; RL = 5 kΩ
−
dB
−
−
%
S/N
fG
signal-to-noise ratio
unity gain frequency
maximum output power
input capacitance
slew rate
100
−
−
dB
open-loop; RL = 5 kΩ
−
MHz
mW
pF
Po
Ci
(THD + N)/S < 0.1%
−
−
−
3
−
SR
B
unity gain inverting
unity gain inverting
−
5
−
V/µs
kHz
power bandwidth
−
20
−
Notes
1. Values are proportional to VDD; (THD + N)/S < 0.1%.
2. VDD = 5.0 V; VO(p-p) = 3.5 V (at 0 dB).
August 1994
6
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
TEST AND APPLICATION INFORMATION
Fig.4 Measurement circuit for inverting application.
Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC).
7
August 1994
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
Fig.6 Open-loop gain as a function of input
frequency.
Fig.7 Crosstalk as a function of input
frequency.
Fig.8 Output power as a function of supply
voltage.
August 1994
8
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency.
Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level.
9
August 1994
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
PACKAGE OUTLINES
8.25
7.80
9.8
9.2
3.2
max
4.2
max
0.51
min
3.60
3.05
2.54
(3x)
0.254
M
0.38 max
1.15
max
0.53
max
7.62
1.73 max
10.0
8.3
MSA252 - 1
8
1
5
6.48
6.20
4
Dimensions in mm.
Fig.11 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1.
August 1994
10
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
4.0
3.8
5.0
4.8
A
6.2
5.8
S
0.1 S
0.7
0.3
8
1
5
4
0.7
0.6
1.45
1.25
1.75
1.35
0.25
0.19
1.0
0.5
0.25
0.10
o
0 to 8
pin 1
index
detail A
MBC180 - 1
1.27
0.49
0.36
0.25 M
(8x)
Dimensions in mm.
Fig.12 Plastic small outline package; 8 leads; body width 3.9 mm. (SO8; SOT96-1).
August 1994
11
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
SOLDERING
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.
Plastic small outline packages
BY WAVE
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
August 1994
12
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 1994
13
V.
PRODUCT LISTING EXPLANATION
Table 1
Prefix
ADC
AM
AU
DAC
FB
ICM
LF
LM
MB
MC
N, NE
P
FAMILY PREFIX AND DEVICE TEMPERATURE
Table 2
A/WP
B/BB/BC/BE/BG
PACKAGE DESCRIPTIONS
Leaded Chip Carrier (PLCC)
Plastic Quad Flat Package(PQFP)
- Dry Pack handling required
Low Profile quad Flat Package(LQFP)
Shrink quad Flat Package(SQFP)
Plastic Small Outline (SO/SOL)
Shrink Small Outline Package (SSOP)
Ceramic Dual In-Line
Hermetic CERDIP - 8 lead
Pcio Gate
Module
Miscellaneous
=
=
Alternate to National part number
Alternate to AMD part number
Automotive -40° to +125°C
Alternate to P.M.I. part number
Futurebus+, 0°C to +70°C
Alternate to lntersil part number
Alternate to National part number
Alternate to National part number
MULTIBYTE™, -40'C to +85'C
Alternate to Motorola part number
O°C to +70°C (O° to +75° C for 9300)
Philips
Programmable Logic
Programmable Logic/Philips Zero Power
MCO Microcontroller
-40°C to +85° C
-55°C to +125°C
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
BD
BF/BH/BK
D
DB/DK/DL
F
FE
GW
M
MSC
N/P
PW/DH/DG/DGG
NB
SC/SD
U
=
=
=
=
=
=
=
=
=
=
=
=
=
=
**
Plastic Dual In-Line (DIL)
Thin Shrink Small Outline Package (TSSOP)
42 Pin Shrink Dual In-Line (DIL)
Microprocessor Support
Plastic Single In-Line (SIL)
The DH on PW and G on some DGG Part
Package Codes have been removed due to
Space constraints in this price book.
PL
PZ
S/SC
SA
SE
Alternate to Silicon General part number
Alternate to National part number
SG
µA
Table 3 - PRODUCT FAMILY
ABBR
PRODUCT FAMILY
BiCMOS Logic
BIC
CLI
CON
DC
DSG
IND
LIC
LOG
LV
CMOS Logic (CLIC)
Consumer Multimedia
Digital/Linear Data Comm/FB+
Discrete
Identification Contact
Linear Industrial
Bipolar Logic
Low Voltage
Microprocessor, Microcontrollers,
CRT (Sunnyvale)
MCO
Multimedia
MM
MOS Microcontrollers/Hamburg
Mass Storage/Motor Control
Philips Digital Interface
Programmable Logic Devices
Proms
MOS
MST
PDI
PLD
PRM
RF
Wireless/RF Products
Telecom
TEL
Table 4 - COLUMN HEADING EXPLANATIONS
PART
NUMBER
CROSS REF.
PRD
FAM
PRODUCT
DESCRIPTION
SPQ
P/C
N74F244D
N74F244D-T
N74F244N
LOG
LOG
Octal Buffer 3 State
Octal Buffer 3 State
1520
1000
20
Product Family-
See Table 3
Pin Count
Description of Product
Quantity per
tube/reel/box
Industry Standard Part Number
-Complexity of LOG Parts
-Product Discontinuation Notice (DN-##)
-Dry Pack Indicator
Special Packaging Alternatives - see following page
Package Code - See Table 2
Device Number
Family Prefix and Device Temperature - See Table 1
04/00
v
VII. COMMERCIAL PRODUCT SPECIAL PROCESSING
SPECIAL PACKAGING ALTERNATIVES
SPECIFICATIONS
Tape and Reel specifications conform to Electronic Industries Association (EIA) standard EIA-481-1, EIA-481-2,
EIA-481-3, and EIA-468-B.
DEVICE AVAILABILITY
Plastic Leaded Chip Carrier (PLCC) and Plastic Small Outline (SO/SOL/SSOP/TSSOP) parts are available in tape
and reel packaging. Products available in tape and reel are identified in the Price Book with a "-T" (13”) or "-G" (7”)
added to the end of basic part number (e.g. N74F379AD-T or TDA1543TD-G). Return of product MUST be in full
reels with unbroken quality seals.
Plastic Quad Flat Pack (PQFP) parts are available in single tray packaging. Products available in single tray are
identified in the Price Book with a "-S" added to the end of basic part number (e.g. SAB9075HB-S). Return of
product MUST be in original container with unbroken quality seals.
VII. DRY PACK HANDLING
Philips Semiconductors is providing moisture barrier protection for plastic Surface Mount Technology (SMT) lCs
prior to shipping/storage. This protection is designed to minimize the absorption of water into the body of the pack-
age in high humidity environments and later causing damage to itself when exposed to the rapid thermal heating
associated with surface mount printed circuit board assembly. As the package is heated, moisture inside the pack-
age rapidly heats and vaporizes, generating pressure within the package, which can result in package cracking.
Philips Semiconductors has conducted susceptibility testing on its entire line of SMT packages and has found that
certain combinations of package outlines and lead frames are sensitive to this accelerated test. These packages
include specific, but not all varieties of Small Outline SO/SSOP-16/24/28 lead, Plastic Leaded Chip Carrier (PLCC)-
32/52/68/84 lead, and all Plastic Quad Flat Pack (PQFP).
Philips Semiconductors products that are dry packed are indicated in the price book with "DRY PACK" entered next
to the device in the "Cross Ref column.
The dry packing process begins with a 24-hour bake at 125°C after electrical test to remove any moisture build-up
within the package. Product is then packed under a partial vacuum in a moisture barrier bag containing desiccant
and a humidity indicator card. The bag interior is maintained at a relative humidity (RH) level of less than 30%.
Once outside the bag (in a typical factory environment of 20°C to 30°C and 50% to 70% RH), product should be
used within 48 hours. If this time is exceeded, or upon opening the bag, the humidity indicator card registers pink on
the 20% level, the product should be baked at 125°C for 24 hours. Product must be baked in metal tubes, not the
plastic tubes or reels in which it was shipped. PQFP products packed in trays can be baked at 125°C.
Philips Semiconductors complies with the recommendations of the NEDA Semiconductor Packing and Handling
Committee for Moisture Sensitive Plastic Surface Mount Components that is incorporated in NIGP 103.00. Our in-
ternal specifications are available upon request from Ron Deetz, 408-991-3892: 1) 874-0086, General Operator Dry
Packing Requirements; and 2) 874-0083, General Operator Dry Packing.
Dry packed products must be ordered in full tube or full tray increments and must also meet the order minimums as
determined by each device's Price Book inventory code (I/C).
Only factory Q.A. sealed containers, undamaged, with all labels intact are eligible for stock rotation. Philips Semi-
conductors recommends that the minimum quantity be imposed as a minimum buy to distributor's end customer.
vi
04/00
VIII. PACKING QUANTITY INFORMATION
CERAMIC DUAL IN-LINE (CERDIP)
PACKAGE CODE
QUANTITIES
PIN COUNT
DEVICES
PER TUBE
DEVICES
PER BOX
1920
1000
1000
840
FE
F
8-pin (300 mil)
48
25
25
21
20
17
15
15
15
13
9
14-pin (300 mil)
16-pin (300 mil)
18-pin (300 mil)
20-pin (300 mil)
22-pin (400 mil)
24-pin (300 mil)
24-pin (400 mil)
24-pin (600 mil)
28-pin (600 mil)
40-pin (600 mil)
F
F
F/FA
F
800
544
600
480
360
312
216
F/FA/F24
F
F
F/FA/F28
F/FA/F40
CERQUAD
QUANTITIES
PACKAGE CODE
PIN COUNT
DEVICES
DEVICES
PER TRAY
PER BOX
K/KA/K44
K/KA/K68
KA
44-pin
68-pin
84-pin
6
4
42
6
4
210
QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF
THAT QUANTITY.
04/00
vii
VIII. PACKING QUANTITY INFORMATION
PLASTIC DUAL IN-LINE
PACKAGE CODE
QUANTITIES
DEVICES DEVICES
PIN COUNT
PER TUBE
50 *
25 *
28 *
20
PER BOX
2000
1000
1120
800
N/N8
N/N14
N
N
8-pin (300 mil)
14-/16-pin (300 mil)
14-/16-pin (300 mil long tube)
18-pin (300 mil)
N
N
N
N
18-pin (standard tube)
18-pin (long tube)
20-pin (300 mil)
20-pin (long tube)
22-pin (400 mil)
22
25
18 *
20 *
17
880
1000
720
800
544
N
N/N3/N24
24-pin (300 mil)
15
600
N/N24
24-pin (400 mil)
15
480
N
24-pin (600 mil)
15
360
N
N
N/N3
24-pin (600 mil long tube)
24-pin (600 mil long tube)
28-pin (300 mil)
17
25
13
510
1000
520
N/N28
28-pin (600 mil)
13
312
N
N
28-pin (600 mil long tube)
32-pin (600 mil)
15
11
450
264
N
N/N40
N
NB (Shrink)
N/NB
N/N48
N
28-pin (600 mil shrink)
40-pin (600 mil)
40-pin (600 mil long tube)
42-pin (600 mil)
42-pin (600 mil long tube)
48-pin (600 mil)
50-pin (900 mil)
19
9
10
12
14
7
7
760
216
300
288
420
168
112
N
52-pin (600 mil)
10
240
N/N64
64-pin (900 mil)
5
80
* Selected part types in these packages may be subject to full box multiples. Refer to specific part “PQ” for minimum purchase amount.
PLASTIC LEADED CHIP CARRIER (PLCC)
QUANTITIES
PACKAGE CODE
PIN COUNT
DEVICES
PER TUBE
DEVICES
PER BOX
3680
DEVICES
PER REEL
1000
750
A
20-pin
28-pin
28-pin
32-pin
44-pin
44-pin
52-pin
68-pin
84-pin
46
37
34
31
26
26
23
18
15
A/A28
A
2368
2176
2232
1248
1300
1012
648
420
750
750
500
500
500
250
250
A
A/A44
A/A44
A/A52
A/A68
A/A84
QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF
THAT QUANTITY.
VIII. PACKING QUANTITY INFORMATION
viii
04/00
PLASTIC QUAD FLAT PACK (PQFP)
PACKAGE CODE
QUANTITIES
DEVICES PER
PIN COUNT
DEVICES
DEVICES
PER 5 TRAY SINGLE TRAY PER REEL
B/BD
B
B
B/B44
BC/BD
B/BE
BB
B/BD
BG
B/BA/BB1
BE
BE/BP
B/BB1
B
32-pin LQFP ( 7x7)
32-Pin LQFP (5x5)
44-pin QFP (14x14)
44-pin QFP (10x10)
44-pin LFQP (10x10)
48-pin LQFP (7x7)
52-pin QFP (10x10)
64-pin LQFP (10x10)
64-pin QPF (14x14)
64/80-pin QFP (14x20)
80-pin LQFP (12x12)
100-pin TQFP (14x14)
100-pin QFP (14x20)
120-pin QFP (28x28)
128-pin LQFP (14x20)
128-pin SQFP (14x20)
128/160-pin QFP (28x28)
208-pin SQFP (28x28)
1250
1800
420
480
800
1250
480
800
420
330
595
450
330
120
360
330
120
120
250
360
84
2000
2000
500
1500
1500
2000
500
-
600
500
1000
1000
-
96
160
250
96
160
84
66
119
90
66
24
72
66
-
-
-
-
BE
BH
B/BB
BF
24
24
-
QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF
THAT QUANTITY.
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ix
VIII. PACKING QUANTITY INFORMATION
PLASTIC SMALL OUTLINE (SO/SOL/SSOP/TSSOP)
PACKAGE CODE PIN COUNT
8-pin (Small)
QUANTITIES
DEVICES
PER TUBE
100 *
64 *
57 *
78
DEVICES
PER BOX
2000
2560
1140
1092
2400
1000
1092
1920
2400
1674
1350
924
DEVICES
PER REEL
2500
1000
2500
2000
2500
2500
2000
1000
2500
2500
2500
1000
2500
2000
1000
2500
1000
1000
1000
1000
500
D/D8
D
8-pin (Large)
14-pin (Small)
14-pin (Medium)
14-pin
D/D14
DB (SSOP)
PW/DH (TSSOP)
96
50 *
78
48 *
96
93
75
66
75
38 *
59
63
30
47
27
24
31
39
31
D
16-pin (Small)
16-pin (Medium)
16-pin (Large)
16-pin
DB (SSOP)
D
PW/DH (TSSOP)
DK (SSOP)
16-pin
DK (SSOP)
DB (SSOP)
PW/DH (TSSOP)
20-pin (Small)
20-pin (Medium)
20-pin
1875
1520
826
1575
1200
658
1080
960
1240
975
D
20-pin (Large)
24-pin (Medium)
24-pin
DB (SSOP)
PW/DH (TSSOP)
D
24-pin (Large)
28-pin (Medium)
28-pin (Large)
32-pin (Large)
40-pin (VSO-40)
48-pin
48-pin (Large)
56-pin
56-pin (Large)
DB (SSOP)
D
D
D
DG/DGG (TSSOP)
DL (SSOP)
DG/DGG (TSSOP)
DL (SSOP)
2000
1000
2000
1000
500
1581
875
1326
35
26
22
D
56-pin (VSO-56)
616
* Selected part types in these packages may be subject to full box multiples. Refer to specific part “PQ” for minimum purchase amount.
QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF
THAT QUANTITY.
x
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IX. PRODUCT IDENTIFICATION
4000 CMOS PRODUCTS
Example:
H
E
F
4
X
X
X
X
X
X
Philips North America Package Code:
D = Plastic SO
N = Plastic Dual In-Line
DB = Shrink Small Outline (SSOP)
Philips Package Code on part:
P = Plastic Dual In-Line
T = Plastic SO
S = Shrink Small Outline (SSOP)
B = JEDEC “B” series CMOS specification
4XXX = Device number up to 5 digits
F = Limited
Family Identification
BiCMOS PRODUCTS - ABT
Example
74
ABT
XXX
X
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
D = Plastic SO
DB = Shrink Small Outline (SSOP)
N = Plastic Dual In-Line
PW = Thin Shrink Small Outline (TSSOP)
Device Number
Designates Advanced BiCMOS TTL Process
74 = Commercial Operating Temperature Range:
-40°C to +85°C
BiCMOS PRODUCTS - ABT16
Example
74
ABT
16
XXX
X
Package Code:
DL = Shrink Small Outline (SSOP)
DG = Thin Shrink Small Outline (TSSOP)
Device Number
16 Bit
Designates Advanced BiCMOS TTL Process
74 = Commercial Operating Temperature Range:
-40°C to +85°C
BiCMOS PRODUCTS - 3.3V LVT
Example
74
LVT
XXX
D
Package Code:
D = Plastic SO
DB = Shrink Small Outline (SSOP)
PW = Thin Shrink Small Outline (TSSOP)
Device Number
3.3V Device Family
74 = Commercial Operating Temperature Range:
-40°C to +85°C
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xi
IX. PRODUCT IDENTIFICATION
BiCMOS PRODUCTS - 3.3V LVT16
Example
74
LVT
16
XXX
DL
Package Code:
DL = Shrink Small Outline (SSOP)
DG = Thin Shrink Small Outline (TSSOP)
Device Number
16 Bit
3.3V BiCMOS
74 = Commercial Operating Temperature Range:
-40°C to +85°C
CONSUMER & INDUSTRIAL PRODUCTS
PREFIXES PC, SA, TD, TE, TS, UA, UM
Example:
TD
A
XXXX
P
N
Device Family:
PCx
SAx
TDx
TEx
TSx
UAx
UMx
Package Code:
= CMOS Circuit
= Digital Circuit
= Linear Circuit
= Linear Circuit
= Analog Circuit
= Digital Circuit
= Digital Circuit
A = Plastic Leaded Chip Carrier (PLCC)
B = Quad Flat Pack (QFP)
N = Plastic Dual In-Line
D = Plastic SO
DK = Shrink Small Outline Package (SSOP)
F = Ceramic Dual In-Line
U = Plastic Single In-Line
Package Code on Part:
GP = Quad Flat Pack (QFP)
P = Plastic Dual In-Line
T = Plastic SO
D = Ceramic Dual In-Line
M = Shrink Small Outline Package (SSOP)
WP = Plastic Leaded Chip Carrier (PLCC)
Device Number
Operating Temperatures:
A = Temperature range no specified (see
data sheet)
B = 0°C to 70°C
C = -55°C to +125°C
D = -25°C to +70°C
E = -25°C to +85°C
F = -40°C to +85°C
xii
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IX. PRODUCT IDENTIFICATION
DATA COMMUNICATIONS, LOCAL AREA NETWORK, FUTUREBUS+
Example 1:
S
C
N
X
X
X
X
X
C
N
4
8
Philips Designator
Pin Count:
14, 16, 20, 24, 28, 40, 48, etc.
Process:
N = N - Channel
C = C - Channel
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
N = Plastic Dual In-Line
F = Ceramic Dual In-Line
Device Number
See individual data sheets
Temperature:
C = 0°C to +70°C (Commercial)
A = -40°C to +85°C (Industrial)
M = -55°C to +125°C (Military)
E = -40°C to +85°C (Industrial)
Example 2:
S
C
X
X
C
X
X
X
C
1
A
Philips Designator
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
N = Plastic Dual In-Line
Device Number
See individual data sheets
Timing Variation:
1 = Normal
Process/Power Variation:
C = CMOS 5V
L = CMOS 3V
Temperature:
C = 0°C to +70°C (Commercial)
A = -40°C to +85°C (Industrial)
Example 3:
N
E
8
3
X
9
2
A
Philips Designator
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
N = Plastic Dual In-Line
F = Ceramic Dual In-Line
D = Plastic Small Outline
Device Number
See individual data sheets
Applications Designator
(See Data Sheets)
Example 4:
F B
X X X X
B B
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
BB = Quad Flat Pack (QFP)
Device Number
Designates Futurebus+ Product
Temperature Range: 0°C to +70°C
For Industrial -- Contact Factory
04/00
xiii
IX. PRODUCT IDENTIFICATION
FIBER OPTIC, LINE DRIVERS/RECEIVERS, MODEMS
Example 1:
NE
XXXX
N
Package Code:
D = Plastic SO
N = Plastic Dual In-Line
Device Number
Device Family and Temperature Range Prefix:
NE = 0°C to +70°C
SE = -55°C to +125°C
SA = -40°C to +85°C
Example 2:
AM
XX
LS
XX
C
N
Generic Industry Prefix
Package Code:
D = Plastic SO
Device Number
See individual data
sheets
N = Plastic Dual In-Line
Device Family and Temperature Range Prefix:
C = 0°C to +70°C
Generic Industry ID
M = -55°C to +125°C
I
= -40°C to +85°C
HIGH-SPEED CMOS PRODUCTS
Example:
74
HC
XXXXX
N
Package Code:
D = Plastic SO
N = Plastic Dual In-Line
Device Number
HC
=
=
CMOS input switching levels,
supply voltage range 2V to 6V,
fully buffered.
HCT
TTL input switching levels,
supply voltage range 4.5V to 5.5V,
fully buffered
74 = Standard Temperature Range:
-40°C to +125°C
LOGIC PRODUCTS - ALS/FAST
Example:
N
74FXXX
N
Package Code
Device Number
Temperature Range
TEMPERATURE
RANGE
DEVICE
NUMBER
PACKAGE CODE
N = Commercial Range 74ALSXXX
0°C to 70°C 74FXX
A = Plastic Leaded Chip Carrier (PLCC)
D = Plastic SO
F = Ceramic Dual In-Line
N = Plastic Dual In-Line
xiv
04/00
IX. PRODUCT IDENTIFICATION
LINEAR AND RF PRODUCTS
Example: NE XXXX
N
Package Code:
A = Plastic Leaded Chip Carriers (PLCC)
D = Plastic SO
DK = Shrink Small Outline (SSOP)
F = Ceramic Dual In-Line
FE = Hermetic Cerdip (8 Lead)
N = Plastic Dual In-Line
Device Number
Device Family and Temperature Range Prefix:
AU = -40°C to +125°C
NE = 0°C to +70°C
SE = -55°C to +125°C
SA = -40°C to +85°C
LOW VOLTAGE (3.3V CMOS) LOGIC - ALVC16
Example:
74ALVC16XXX
D
Package Code
Device Number
TEMPERATURE
RANGE
DEVICE
NUMBER
PACKAGE CODE
Tamb = -40°C to +85°C
74ALVC16XXX
D = Plastic SO
DL = Shrink Small Outline (SSOP)
DG = Thin Shrink Small Outline (TSSOP)
LOW VOLTAGE (3.3V CMOS) LOGIC - HLL
Example:
74HL33XXX
D
Package Code
Device Number
TEMPERATURE
RANGE
DEVICE
NUMBER
PACKAGE CODE
Tamb = -40°C to +85°C
74HL33XXX
D = Plastic SO
DB = Shrink Small Outline (SSOP)
PW = Thin Shrink Small Outline (TSSOP)
LOW VOLTAGE (3.3V CMOS) LOGIC - LV
Example:
74LVXXX
D
Package Code
Device Number
TEMPERATURE
RANGE
DEVICE
NUMBER
PACKAGE CODE
Tamb = -40°C to +85°C
74LVXXX
D = Plastic SO
DB = Shrink Small Outline (SSOP)
N = Plastic Dual In-Line
LOW VOLTAGE (3.3V CMOS) LOGIC - LVC
Example:
74LVCXXX
D
Package Code
Device Number
TEMPERATURE
RANGE
DEVICE
NUMBER
PACKAGE CODE
Tamb = -40°C to +85°C
74LVC16XXX
D = Plastic SO
DB = Shrink Small Outline (SSOP)
PW = Thin Shrink Small Outline (TSSOP)
04/00
xv
IX. PRODUCT IDENTIFICATION
MICROCONTROLLER PRODUCTS
Example:
P 8
X
C
XXX
E
B
P
N
Memory Options:
0 = ROMLESS
3 = ROM
Philips North America Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
B = Quad Flat Pack (QFP)
7 = OTP-EPROM
9 = FEEPROM (FLASH)
N = Plastic Dual In-Line
Philips Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
B = Quad Flat Pack (QFP)
F = Hermetic Cerdip (window)
L = Cerdip (Window))
P = Plastic Dual In-Line
Q = Ceramic Quad Flat Pack (Window)
T = Small Outline (SO)
Device Number
Speed:
C = 3.5MHz to 12MHz
D = 0MHz to 20MHz
E = 3.5MHz to 16mhz
F = 1.2Mhz to 16MHz
G = 3.5MHz to 20MHz
H = 32KHz to 12MHz
I = 3.5MHz to 24MHz
N = 3.5MHz to 33MHz
P = 3.5MHz to 40MHz
S = 0MHz to 16MHz
T = 0MHz to 24MHz
U = 0MHz to 33MHz
Temperature:
B = 0°C to 70°C
F = -40°C to +85°C
H = -40°C to +125°C
Example:
P
8
X C 51 XXX X X
Memory Options:
0 = ROMLESS
3 = ROM
7 = OTP-EPROM
9 = FEEPROM (FLASH)
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
B = Quad Flat Pack (QFP)
N = Plastic Dual In-Line
Temperature / Speed:
Device Number
B = 0ºC to 70ºC / 16 MHz
F = -40ºC to 85ºC / 16 MHz
FX-
FX+
FX2
I
= 0ºC to 70ºC / 33 MHz
J = -40ºC to 85ºC / 33 MHz
xvi
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IX. PRODUCT IDENTIFICATION
MICROCONTROLLER PRODUCTS (Continued)
Example: XXX -1
S
8
X
C
N
24
S = Standard
Pin Count (optional)
P = Static Design
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
B = Quad Flat Pack (QFP)
N = Plastic Dual In-Line
Memory Options:
0 = ROMLESS
3 = ROM
7 = EPROM/OTP
9 = FLASH
Speed / Temperature Range:
1 = 12MHz, 0oC to 70oC
2 = 12MHz, -40oC to +85oC
3 = 0.5 to 12 MHz, 0oC to +70oC
4 = 16MHz, 0oC to 70oC
Device Number
5 = 16MHz, -40oC to +85oC
6 = 12 or 16MHz, -55oC to +125oC
7 = 20MHz, 0oC to 70oC
8 = 20MHz, -40oC to +85oC
A = 24MHz, 0oC to 70oC
B = 24MHz, -40oC to +85oC
I = 33MHz, 0oC to 70oC
J = 33MHz, -40oC to +85oC
- = Other / + = Rx Family
MICROCONTROLLER PRODUCTS - XA
Example:
P51XA G3
7
K
B
A
Philips 80C51 eXtended Architecture
P51XAG3 or PXAG3 or S3 or SCC
Derivative Name
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
B = Quad Flat Pack (QFP)
BD = Thin Quad Flat Pack (TQFP)
N = Plastic Dual In-Line
Temperature:
B = 0°C to 70°C
F = -40°C to +85°C
Speed:
E = 16MHz
G = 20Mhz
K = 30MHz
J = 25MHz
Memory Options:
0 = ROMLESS
3 = ROM
5 = Bondout
7 = EPROM/OTP
9 = FLASH
MICROCONTROLLER PRODUCTS - PXA
Example:
PXA
SCC
K
F
XX
Philips XA extended Architecture
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
BD = Leaded Quad Flat Pack (LQFP)
BE = Plastic Quad Flat Pack (PQFP)
Derivative Name
C = CAN
G = Generic
S = Generic with ADC
Temperature:
A = 0°C to 70°C
F = -40°C to +85°C
Speed:
K = 30MHz
IX. PRODUCT IDENTIFICATION
MICROCONTROLLER PRODUCTS - LPC
04/00
xvii
Example:
P
8
X LPC XXX B N
80C51 Family
Derivative Name
Package Code:
DIP, SO
Memory Options
7 = OTP
Temperature:
B = 0°C to 70°C
F = -40°C to +85°C
Derivative Name
Low Pin Count:
MICROCONTROLLER PRODUCTS – PERIPHERALS
Example: P82B XXX
X
X
Philips North America Package Code:
Philips Package Code
Device Number
MULTIBYTE™ PRODUCTS
Example:
MB
2
XXX
BB
Package Code:
BB = QuadFlat Pack (QFP)
Device Number
Byte-width (2 or 4)
Designates MULTIBYTE™ Product.
Temperature Range: -40°C to +85°C
MULTIBYTE is a registered trademark of Philips Semiconductors.
xviii
04/00
相关型号：
TDA1310AN
IC SERIAL INPUT LOADING, 0.2 us SETTLING TIME, 16-BIT DAC, PDIP8, PLASTIC, SOT-97DE, DIP-8, Digital to Analog Converter
NXP
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