PE9304-EK [PSEMI]

1- 7 GHz Low Power CMOS Divide-by-2 Prescaler; 1- 7 GHz的低功耗CMOS分频预分频器
PE9304-EK
型号: PE9304-EK
厂家: Peregrine Semiconductor    Peregrine Semiconductor
描述:

1- 7 GHz Low Power CMOS Divide-by-2 Prescaler
1- 7 GHz的低功耗CMOS分频预分频器

预分频器
文件: 总6页 (文件大小:223K)
中文:  中文翻译
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PRELIMINARY SPECIFICATION  
PE9304  
Rad Hard for Space Applications  
1- 7 GHz Low Power CMOS  
Divide-by-2 Prescaler  
Product Description  
Features  
Fixed divide ratio of 2  
The PE9304 is a high-performance CMOS prescaler with  
a fixed divide ratio of 2. Its operating frequency range is  
1GHz to 7GHz. The PE9304 operates on a nominal 3 V  
supply and draws only 13.5mA. It is packaged in a small  
8-lead ceramic SOIC and is ideal for frequency scaling  
and clock generation solutions.  
Low-power operation: 13.5mA  
typical @ 3 V  
Small package: 8-lead Ceramic  
SOIC  
Guaranteed 100Krads(Si) Total  
The PE9304 is manufactured in Peregrine’s patented  
Ultra-Thin Silicon (UTSi) CMOS process, offering the  
performance of GaAs with the economy and integration  
of conventional CMOS.  
Dose Performance  
Superior Single Event Upset  
Immunity  
Figure 1. Functional Schematic Diagram  
Figure 2. Package Type  
8 Lead Gullwing Glass Flatpack  
.380 / .410  
.210 / .250  
.180 SQ Max  
.166 SQ TYP  
Pin 1  
.050 TYP  
.150 TYP  
.015 TYP  
Table 1. Electrical Specifications (ZS = ZL = 50 )  
VDD = 3.0 V, -40° C TA 85° C, unless otherwise specified  
Parameter  
Conditions  
Minimum  
Typical  
3.0  
Maximum  
3.15  
18.0  
7
Units  
V
Supply Voltage  
2.85  
Supply Current  
13.5  
mA  
Input Frequency (Fin)  
1
+5  
0
GHz  
dBm  
dBm  
dBm  
dBm  
1GHz Fin < 2GHz  
2GHz Fin < 6GHz  
6 GHz Fin 7GHz  
1GHz Fin < 2GHz  
2GHz Fin < 6GHz  
6 GHz Fin 7GHz  
+12  
Input Sensitivity (Pin)  
Output Power (Pout)  
+12  
+5  
0
+12  
-7  
-12  
PEREGRINE SEMICONDUCTOR CORP. | http://www.peregrine-semi.com  
Copyright Peregrine Semiconductor Corp. 2003  
Page 1 of 6  
PE9304  
Preliminary Specification  
Figure 3. Pin Configuration  
Electrostatic Discharge (ESD) Precautions  
When handling this UTSi ® device, observe the  
same precautions that you would use with other  
ESD-sensitive devices. Although this device  
contains circuitry to protect it from damage due to  
ESD, precautions should be taken to avoid  
exceeding the rating specified in Table 3.  
1
2
3
4
8
7
6
5
VDD  
IN  
GND  
OUT  
NC  
PE9304  
DEC  
GND  
GND  
Latch-Up Avoidance  
Unlike conventional CMOS devices, UTSi ®  
Table 2. Pin Descriptions  
CMOS devices are immune to latch-up.  
Pin No.  
Pin  
Description  
Name  
Device Functional Considerations  
1
2
3
4
VDD  
Power supply pin. Bypassing is required  
(eg. 1000pF & 100pF).  
The PE9304 divides a 1GHz – 7GHz input signal  
by a factor of two thereby producing an output  
frequency at half the input frequency. To work  
properly at higher frequencies, the input and  
output signals (pins 2 & 7) must be AC coupled  
via an external capacitor, as shown in the test  
circuit in Figure 7.  
IN  
Input signal pin. Should be coupled with a  
capacitor (eg. 2.2pF).  
DEC  
GND  
Decoupling Pin. This pin should have two  
capacitors in parallel (eg. 1000pf, 10nF)  
Ground pin. Ground pattern on the board  
should be as wide as possible to reduce  
ground impedance.  
The ground pattern on the board should be made  
as wide as possible to minimize ground  
impedance.  
5
6
GND  
NC  
Ground pin.  
No connection. This pin should be left  
open.  
7
8
OUT  
GND  
Divided frequency output pin. This pin  
should be coupled with a capacitor  
(eg. 2.2pF).  
Ground Pin.  
Table 3. Absolute Maximum Ratings  
Symbol  
Parameter/Conditions  
Min Max Units  
VDD  
Pin  
Supply voltage  
Input Power  
3.3  
V
dBm  
V
+12  
VIN  
Voltage on input  
-0.3  
VDD  
+0.3  
TST  
TOP  
Storage temperature range  
-65  
-40  
150  
85  
°C  
°C  
Operating temperature  
range  
ESD voltage (Human Body  
Model, MIL-STD 883  
Method 3015.7)  
500  
50  
V
V
V
ESD voltage (Machine  
Model, JEDEC, JESD22-  
A114-B)  
VESD  
ESD voltage (Charged  
Device Model, JEDEC,  
JESD22-C101)  
1000  
File No. 70/0152~00A | UTSi CMOS RFIC SOLUTIONS  
Copyright Peregrine Semiconductor Corp. 2003  
Page 2 of 6  
PE9304  
Preliminary Specification  
Typical Performance Data: VDD = 3.0V  
Figure 4. Input Sensitivity  
Figure 5. Device Current  
Specified  
Operating Window  
Figure 6. Output Power  
PEREGRINE SEMICONDUCTOR CORP. | http://www.peregrine-semi.com  
Copyright Peregrine Semiconductor Corp. 2003  
Page 3 of 6  
PE9304  
Preliminary Specification  
Figure 7. Evaluation Board Schematic Diagram  
Figure 8. Evaluation Board Layout  
J2-9  
C10  
C2  
1000 pF  
100 pF  
VDD  
IN  
GND  
OUT  
J3  
J1  
C3  
C1  
1000 pF  
2.2pF  
2.2pF  
NC  
NC  
C4  
1000pF  
C6  
10nF  
GND  
GND  
J4  
J5  
Evaluation Kit Operation  
J2 provides DC power to the device via pin 1. Two  
decoupling capacitors (C2=1000pF, C10=100pF)  
are included on this trace. It is the responsibility of  
the customer to determine proper supply decoupling  
for their design application.  
The Ceramic SOIC Prescaler Evaluation Board was  
designed to help customers evaluate the PE9304  
divide-by-2 prescaler. On this board, the device  
input (pin 2) is connected to the SMA connector J1  
through a 50 transmission line. A series  
capacitor (C3) provides the necessary DC block for  
the device input. A value of 2.2pF was used for the  
evaluation board; other applications may require a  
different value.  
The board is constructed using 4 layers. The top  
and bottom layers are comprised of Rogers low loss  
4350 material having a core thickness of 0.010”;  
while the internal layers are comprised of FR-4.  
The overall board thickness is 0.062”.  
The device output (pin 7) is connected to SMA  
connector J3 through a 50 transmission line. A  
series capacitor (C1) provides the necessary DC  
block for the device output. This capacitor value  
must be chosen to have low impedance at the  
desired output frequency of the device. A value of  
2.2pF was chosen for the evaluation board.  
Applications Support  
If you have a problem with your evaluation kit or if  
you have applications questions call (858) 455-0660  
and ask for applications support. You may also  
contact us by fax or e-mail:  
Fax: (858) 455-0770  
E-Mail: help@peregrine-semi.com  
File No. 70/0152~00A | UTSi CMOS RFIC SOLUTIONS  
Copyright Peregrine Semiconductor Corp. 2003  
Page 4 of 6  
PE9304  
Preliminary Specification  
Figure 9. Package Drawing  
8 Lead Gullwing Glass Flatpack  
.380 / .410  
.210 / .250  
.180 SQ MAX  
Pin 1  
.050 TYP  
.015 TYP  
.150 TYP  
TOP VIEW  
SIDE VIEW  
.070 MAX  
Table 4. Ordering Information  
Order  
Shipping  
Method  
Part Marking  
Code  
Description  
Package  
PE9304-08CFPG-1A Engineering  
Samples  
9304-01  
PE9304  
Gullwing Glass Flatpack  
20 / Tray  
9304-11  
9304-00  
PE9304  
PE9304-08CFPG-1A Flight Units  
PE9304 Evaluation Kit  
Gullwing Glass Flatpack  
Evaluation Kit  
50 / Tray  
1 / Box  
PE9304-EK  
PEREGRINE SEMICONDUCTOR CORP. | http://www.peregrine-semi.com  
Copyright Peregrine Semiconductor Corp. 2003  
Page 5 of 6  
PE9304  
Preliminary Specification  
Sales Offices  
United States  
Japan  
Peregrine Semiconductor Corp.  
6175 Nancy Ridge Drive  
San Diego, CA 92121  
Peregrine Semiconductor K.K.  
5A-5, 5F Imperial Tower  
1-1-1 Uchisiawaicho,  
Chiyoda-ku, Tokyo, Japan  
100-011  
Tel 1-858-455-0660  
Fax 1-858-455-0770  
Tel. 011-81-3-3502-5211  
Fax. 011-81-3-3502-5213  
Europe  
Peregrine Semiconductor Europe  
Aix-En-Provence Office  
Parc Club du Golf, bat 9  
13856 Aix-En-Provence Cedex 3  
France  
Tel 33-0-4-4239-3360  
Fax 33-0-4-4239-7227  
For a list of representatives in your area, please refer to our Web site at: http://www.peregrine-semi.com  
Data Sheet Identification  
Advance Information  
The information in this data sheet is believed to be reliable. However,  
Peregrine assumes no liability for the use of this information. Use  
shall be entirely at the user’s own risk.  
The product is in a formative or design stage. The data sheet  
contains design target specifications for product  
development. Specifications and features may change in any  
manner without notice.  
No patent rights or licenses to any circuits described in this  
data sheet are implied or granted to any third party.  
Preliminary Specification  
Peregrine’s products are not designed or intended for use in devices  
or systems intended for surgical implant, or in other applications  
intended to support or sustain life, or in any application in which the  
failure of the Peregrine product could create a situation in which  
personal injury or death might occur. Peregrine assumes no liability  
for damages, including consequential or incidental damages, arising  
out of the use of its products in such applications.  
The data sheet contains preliminary data. Additional data  
may be added at a later date. Peregrine reserves the right to  
change specifications at any time without notice in order to  
supply the best possible product.  
Product Specification  
The data sheet contains final data. In the event Peregrine  
decides to change the specifications, Peregrine will notify  
customers of the intended changes by issuing a PCN  
(Product Change Notice).  
Peregrine products are protected under one or more of the following  
U.S. patents: 6,090,648; 6,057,555; 5,973,382; 5,973,363; 5,930,638;  
5,920,233; 5,895,957; 5,883,396; 5,864,162; 5,863,823; 5,861,336;  
5,663,570; 5,610,790; 5,600,169; 5,596,205; 5,572,040; 5,492,857;  
5,416,043. Other patents are pending.  
Peregrine, the Peregrine logotype, Peregrine Semiconductor Corp., and UTSi  
are registered trademarks of Peregrine Semiconductor Corporation.  
Copyright © 2002 Peregrine Semiconductor Corp. All rights reserved.  
File No. 70/0152~00A | UTSi CMOS RFIC SOLUTIONS  
Copyright Peregrine Semiconductor Corp. 2003  
Page 6 of 6  

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