RF5110G [QORVO]

3V General Purpose/GSM Power Amplifier;
RF5110G
型号: RF5110G
厂家: Qorvo    Qorvo
描述:

3V General Purpose/GSM Power Amplifier

GSM
文件: 总16页 (文件大小:2296K)
中文:  中文翻译
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RF5110G  
3V General Purpose/GSM Power Amplifier  
®
Product Overview  
The RF5110G is a high-power, high-gain, high-efficiency  
power amplifier. The device is manufactured with an  
advanced GaAs HBT process. It is designed for use as the  
final RF amplifier in GSM hand-held equipment in 900 MHz  
band, and General-Purpose radio application in standard  
sub-bands from 150 MHz to 960 MHz. An analog on-board  
power controller provides over 70 dB range of adjustment.  
Which allows for power down with a voltage equals to the  
logic Low” to set the device in standby mode. The  
RF5110G RF Input is internally matched to 50 Ω. On its RF  
Output, it can be easily matched externally to obtain  
optimum power and efficiency for certain applications.  
16 Pad 3x3mm QFN Package  
Key Features  
General Purpose:  
Single 2.8 V to 3.6 V Supply  
+32 dBm Output Power  
53% Efficiency  
150 MHz to 960 MHz Operation  
GSM:  
Single 2.7 V to 4.8 V Supply  
+36 dBm Output Power at 3.6 V  
32 dB Gain with Analog Gain Control  
57% Efficiency  
800 MHz to 950 MHz Operation  
Supports GSM and E-GSM  
Functional Block Diagram  
Applications  
FM Radio Applications  
150 MHz/220 MHz/450 MHz  
865 MHz to 928 MHz  
3 V GSM Cellular Handsets  
GPRS Compatible  
Ordering Information  
Top View  
Part No.  
Description  
RF5110GTR7  
RF5110GPCK-410  
2,500 pieces on a 7” reel (standard)  
GSM900 Fully Tested Evaluation Board  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
1 of 16  
www.qorvo.com  
RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Absolute Maximum Ratings  
Recommended Operating Conditions  
Parameter  
Rating  
Parameter  
Min  
+2.7  
−40  
Typ  
Max  
Units  
Storage Temperature  
55ꢁ°C to +150ꢁ°C  
-0.5 V to +6.0 V  
-0.5 V to +3.0 V  
2400 mA  
+3.5  
Device Voltage  
(VCC, VCC1, VCC2  
Device Voltage (VCC, VCC1, VCC2  
)
+4.8(1)  
+5.5(1)(2)  
+85  
V
V
)
Control Voltage (VAPC1, VAPC2  
)
Device Current (ICC, ICC1, ICC2  
RF Input Power  
)
TCASE  
TJ  
°C  
°C  
+13 dBm  
+150  
Note:  
Duty Cycle at Max Power  
50%  
1. POUT < +35 dBm  
2. With maximum output load VSWR 6:1  
Exceeding any one or a combination of the Absolute Maximum Rating  
conditions may cause permanent damage to the device. Extended  
application of Absolute Maximum Rating conditions to the device may  
reduce device reliability. This rating specified for GSM operation.  
Electrical specifications are measured at specified test conditions.  
Specifications are not guaranteed over all recommended operating  
conditions.  
Electrical Specifications  
Parameter  
Output Power  
Gain  
Conditions(1)  
Min  
Typ  
32  
Max  
Units  
dBm  
dB  
150 MHz  
31.5  
53  
Efficiency  
Output Power  
Gain  
%
32  
dBm  
dB  
220 MHz  
32  
Efficiency  
Output Power  
Gain  
52  
%
32  
dBm  
dB  
450 MHz; VCC, VCC1 and VCC2 = 3.0 V  
32.5  
50.5  
32  
Efficiency  
Output Power  
Gain  
%
dBm  
dB  
865 MHz to 928 MHz  
Equals typical at respective frequency corner  
33.0  
29.5  
Efficiency  
49  
%
Notes:  
1. Test conditions unless otherwise noted: VAPC1 and VAPC2ꢁ=ꢁ2.8 V; VCC, VCC1 and VCC2ꢁ=ꢁ3.3 V; Duty Cycle = 100%; Tempꢁ=ꢁ+25ꢁ°C; 50ꢁΩ system;  
Refer to application circuits  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Electrical Specifications (continue)  
Parameter  
Conditions(1)  
Min  
880  
800  
33.8  
33.1  
50  
Typ  
Max  
915  
950  
Units  
MHz  
MHz  
dBm  
dBm  
%
Operational Frequency Range  
Usable Frequency Range  
Using different EVB tune  
34.5  
Maximum Output Power  
Temp = +60 °C, VCC, VCC1 and VCC2 = 3.3 V  
At Maximum Output Power  
POUT = +20 dBm  
57  
12  
5
Efficiency  
%
POUT = +10 dBm  
%
Input Power for Max. Output  
4.5  
7.0  
9.5  
-72  
dBm  
RBW = 100 KHz; 925-935 MHz;  
VCC, VCC1 and VCC2 = 3.3 to 5.0V  
dBm  
dBm  
dBm  
Output Noise Power  
Forward Isolation  
RBW =100 KHz; 935-960 MHz;  
VCC, VCC1 and VCC2 = 3.3 to 5.0V  
-81  
-22  
Standby Mode VAPC1 and VAPC2 = 0.3 V,  
PIN = +9.5 dBm  
Second Harmonic  
PIN = +9.5 dBm  
PIN = +9.5 dBm  
-20  
-25  
-7  
-7  
dBm  
dBm  
dBm  
Third Harmonic  
Non-Harmonic Spurious  
Input Impedance  
-36  
50  
Optimum Source Impedance  
For best noise performance  
(POUT, MAX - 5 dB) < Pout < POUT.MAX  
POUT < (POUT.MAX - 5 dB)  
40 + j10  
2.5:1  
4.0:1  
Input VSWR  
Spurious < -36dBm, RBW=100KHz  
VAPC1 and VAPC2 from 0.3 V to 2.6 V  
Output Load VSWR, Stability  
8:1  
Output Load VSWR, Ruggedness  
Output Load Impedance  
Power Control “ON” Voltage  
Power Control “OFF” Voltage  
Gain Control Range  
No damage  
10:1  
Load Impedance presented at RF OUT pad  
VAPC1, VAPC2; Maximum POUT  
VAPC1, VAPC2; Minimum POUT  
VAPC1 and VAPC2 from 0.2 V to 2.6 V  
POUT from -10 dBm to +35 dBm  
DC to 2 MHz  
2.6 j1.5  
0.5  
V
2.6  
0.2  
75  
5
V
dB  
dB/V  
pF  
Gain Control Slope  
100  
150  
10  
APC Input Capacitance  
VAPC1 and VAPC2 = 2.8V  
4.5  
5
mA  
µA  
ns  
APC Input Current  
Turn ON/OFF Time  
VAPC1 and VAPC2 = 0 V  
25  
VAPC1 and VAPC2 from 0 V to 2.8V  
At Maximum Output Power  
Quiescent, PIN < -30dBm  
100  
2
200  
1
A
15  
335  
10  
mA  
µA  
µA  
°C/W  
Device Current  
(ICC, ICC1, and ICC2  
)
Standby Mode, PIN < -30dBm  
Standby Mode, PIN < -30dBm, Temp = +85°C  
CW Mode, Junction to Case  
1
10  
Thermal Resistance  
Notes:  
25.6  
1. Test conditions unless otherwise noted: VAPC1and VAPC2ꢁ=ꢁ2.8 V; VCC, VCC1 and VCC2ꢁ=ꢁ3.6 V; PIN = +4.5 dBm; Pulse Width = 1731 µs; Duty Cycle =  
37.5%; Tempꢁ=ꢁ+25ꢁ°C; 50ꢁΩ system; Refer to RF5110GPCK-410 GSM900 evaluation board circuit.  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
150 MHz FM Band Application Circuit  
220 MHz FM Band Application Circuit  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
450 MHz FM Band Application Circuit  
865 MHz and 902 MHz to 928 MHz ISM Band Application Circuit  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
850 MHz GSM Band Application Circuit  
GSM900 Evaluation Board Circuit, RF5110GPCK-410  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
6 of 16  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Performance Plots 150 MHz  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Performance Plots 220 MHz  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Performance Plots 450 MHz  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Performance Plots 865 MHz to 925 MHz  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Pad Configuration and Description  
Top View  
Pad No. Label  
Description  
Interface Circuit  
Power supply for the pre-amplifier stage and interstage matching. This pin  
forms the shunt inductance needed for proper tuning of the interstage  
match. Refer to the application circuit for proper configuration. Note that  
position and value of the components are important.  
1
VCC1  
Ground connection for the pre-amplifier stage. Keep traces physically short  
and connect immediately to the ground plane for best performance. For  
stability concert, this pin requires dedicated ground via holes to the ground  
plane to minimize any common inductance.  
2
3
GND1  
RF IN  
RF Input. This is a 50input, but the actual impedance could be affected by  
the interstage matching network connected on pin 1. An external DC  
blocking capacitor is required.  
Ground connection for the driver stage. To minimize the noise power at the  
output, it is recommended to connect this pin with a trace of about 40mil  
long to the ground plane. This will slightly reduce the small signal gain. For  
stability concert, this pin requires dedicated ground via holes to the ground  
plane to minimize any common inductance.  
4
GND2  
Power supply for the driver stage and interstage matching. This pin requires  
5, 6  
VCC2  
NC  
a shunt inductance for proper interstage matching. Please refer to the  
application schematic for proper configuration.  
7, 13  
Not connected.  
Connection for the second harmonic trap. This pin is internally connected  
to the RF OUT pins. With the bonding wire together with an external  
capacitor form a series resonator. It should provide a second harmonic short  
termination to improve amplifier efficiency and reduce spurious outputs.  
8
2F0  
RF Output and power supply for the output stage. Bias voltage for the final  
stage is provided through this wide output pins. An external matching  
network is required to provide the optimum performance.  
9, 10, 11,  
12  
RF OUT  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Pad Configuration and Description (continue)  
Pad No. Label  
Description  
Interface Circuit  
14  
15  
VCC  
Power supply for the bias circuits.  
APC2  
Power Control for the output stage. See pin 16 for more details.  
Power Control for the driver and pre-amplifier stages. When this pin is "low,"  
all circuits shut off. A "low" is typically 0.5V or less at room temperature.  
A shunt bypass capacitor is required. For a typical power control operation,  
the VAPC1 is about 1.0V for -10dBm to 2.6V for +35dBm RF output power.  
The maximum power that can be achieved depends on the actual output  
matching; see the application circuit for more details.  
16  
APC1  
GND  
RF/DC ground. Ground connection for the output stage. This pad should be  
connected to the ground plane by ground via holes directly under the device.  
A short path is required to obtain optimum performance, as well as to  
provide a good thermal path to the PCB for maximum heat dissipation.  
Backside  
Paddle  
Evaluation Board PCB Information  
Evaluation Board: Size 2.0” x 2.0”; Material FR-4; Multi-Layer; Thickness 0.032”  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Package Marking and Dimensions  
Marking: Part Number RF5110  
Trace Code Assigned by sub-contractor  
Notes:  
1. All dimensions are in millimeters. Angles are in degrees.  
2. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.  
3. Contact plating: Matte Sn  
PCB Mounting Pattern  
Notes:  
1. All dimensions are in millimeters. Angles are in degrees.  
2. Use 1 oz. copper minimum for top and bottom layer metal.  
3. ground via holes are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. 0.203 mm to 0.330  
mm finished hole size and 0.5 mm to 1.2 mm grid pattern recommended.  
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Tape and Reel Information Carrier and Cover Tape Dimensions  
Feature  
Measure  
Symbol  
Size (in)  
0.125  
0.125  
0.040  
0.157  
0.079  
0.217  
0.362  
0.472  
Size (mm)  
3.20  
Length  
A0  
B0  
K0  
P1  
P2  
F
Width  
3.20  
Cavity  
Depth  
1.00  
Pitch  
4.00  
Cavity to Perforation - Length Direction  
2.00  
Centerline Distance  
Cavity to Perforation - Width Direction  
5.50  
Cover Tape  
Carrier Tape  
Width  
Width  
C
9.20  
W
12.0  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Tape and Reel Information Reel Dimensions  
Standard T/R size = 2,500 pieces on a 7” reel.  
Feature  
Measure  
Symbol  
Size (in)  
6.969  
0.717  
0.504  
2.283  
0.512  
0.079  
0.787  
Size (mm)  
177  
Diameter  
A
W2  
W1  
N
Flange  
Thickness  
18.2  
Space Between Flange  
Outer Diameter  
Arbor Hole Diameter  
Key Slit Width  
Key Slit Diameter  
12.8  
58.0  
C
13.0  
Hub  
B
2.0  
D
20.0  
Tape and Reel Information Tape Length and Label Placement  
Notes:  
1. Empty part cavities at the trailing and leading ends are sealed with cover tape. See EIA 481-1-A.  
2. Labels are placed on the flange opposite the sprockets in the carrier tape.  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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RF5110G  
®
3 V General Purpose/GSM Power Amplifier  
Handling Precautions  
Parameter  
Rating  
Class 0  
Class A  
Level 2  
Standard  
ESDꢁ–ꢁHuman Body Model (HBM)  
ESDꢁ–ꢁMachine Model  
JESD22-A114  
JESD22-A115  
Caution!  
ESD-Sensitive Device  
MSLꢁ–ꢁMoisture Sensitivity Level  
IPC/JEDEC J-STD-020  
Solderability  
Compatible with both lead-free (260°C max. reflow temp.) and tin/lead (245°C max. reflow temp.) soldering processes.  
Solder profiles available upon request.  
Contact plating: Matte Sn  
RoHS Compliance  
This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and  
Electronic Equipment) as amended by Directive 2015/863/EU.  
This product also has the following attributes:  
Lead Free  
Halogen Free (Chlorine, Bromine)  
Antimony Free  
TBBP-A (C15H12Br402) Free  
PFOS Free  
SVHC Free  
Pb  
Contact Information  
For the latest specifications, additional product information, worldwide sales and distribution locations:  
Web: www.qorvo.com  
Tel: 1-844-890-8163  
Email: customer.support@qorvo.com  
Important Notice  
The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained  
herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained  
herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for  
Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any  
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by  
such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED  
HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER  
EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE,  
INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.  
Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical,  
life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal  
injury or death.  
Copyright 2020 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc.  
Datasheet, Rev. F, December 22, 2020 | Subject to change without notice  
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