HSB276S [RENESAS]
Silicon Schottky Barrier Diode for Detector and Mixer; 硅肖特基二极管检测器和混频器
| 型号： | HSB276S |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | Silicon Schottky Barrier Diode for Detector and Mixer |
| 文件： | 总5页 (文件大小：64K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSB276S
Silicon Schottky Barrier Diode for Detector and Mixer
REJ03G0133-0100Z
(Previous: ADE-208-780)
Rev.1.00
Nov.10.2003
Features
•
•
•
High forward current, Low capacitance.
HSB276S which is interconnected in series configuration is designed for balanced mixer use.
CMPAK package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No.
Laser Mark
Package Code
HSB276S
C2
CMPAK
Pin Arrangement
3
1. Cathode 2
2. Anode 1
3. Cathode 1
Anode 2
2
1
(Top View)
Rev.1.00, Nov.10.2003, page 1 of 4
HSB276S
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Value
Unit
V
Reverse voltage
VR
3
*1
Average rectified current
Junction temperature
Storage temperature
Note: 1. Per one device
IO
30
mA
°C
Tj
125
Tstg
–55 to +125
°C
Electrical Characteristics *
１
(Ta = 25°C)
Item
Symbol Min
Typ
Max
Unit
V
Test Condition
IR = 1 mA
Reverse voltage
Reverse current
Forward current
Capacitance
VR
IR
3
—
—
—
—
—
—
—
—
35
—
—
30
50
—
µA
mA
pF
pF
V
VR = 0.5 V
IF
VF = 0.5 V
C
0.9
0.1
—
VR = 0.5 V, f = 1 MHz
VR = 0.5 V, f = 1 MHz
Capacitance deviation
ESD-Capability *2
∆C
—
C = 200 pF, R = 0 Ω , Both forward and
reverse direction 1 pulse.
Note: 1. Per one device
2. Failure criterion ; IR ≥ 100 µA at VR = 0.5 V
Rev.1.00, Nov.10.2003, page 2 of 4
HSB276S
Main Characteristics
10–1
10–2
10–3
10–4
10–5
10–2
10–3
10–4
10–5
10–6
0
0.2
Forward voltage VF (V)
Fig.1 Forward current vs. Forward voltage
0.4
0.6
0.8
1.0
0
1.0
Reverse voltage VR (V)
Fig.2 Reverse current vs. Reverse voltage
2.0
3.0
4.0
5.0
f=1MHz
10
1.0
0.1
0.1
1.0
10
Reverse voltage VR (V)
Fig.3 Capacitance vs. Reverse voltage
Rev.1.00, Nov.10.2003, page 3 of 4
HSB276S
Package Dimensions
As of January, 2003
Unit: mm
2.0 ± 0.2
+ 0.1
+ 0.1
0.16
0.3
0.3
– 0.06
– 0.05
0 – 0.1
+ 0.1
– 0.05
+ 0.1
– 0.05
0.3
(0.65) (0.65)
1.3 ± 0.2
Package Code
JEDEC
CMPAK
—
JEITA
Mass (reference value)
Conforms
0.006 g
Rev.1.00, Nov.10.2003, page 4 of 4
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
http://www.renesas.com
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501
Renesas Technology Europe Limited.
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom
Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900
Renesas Technology Europe GmbH
Dornacher Str. 3, D-85622 Feldkirchen, Germany
Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11
Renesas Technology Hong Kong Ltd.
7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2375-6836
Renesas Technology Taiwan Co., Ltd.
FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2003. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon 1.0
相关型号：
©2020 ICPDF网 联系我们和版权申明