ISL54003 [RENESAS]
Integrated Audio Amplifier Systems;
| 型号： | ISL54003 |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | Integrated Audio Amplifier Systems |
| 文件： | 总16页 (文件大小：719K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATASHEET
ISL54003, ISL54005, ISL54006
Data Sheet
Integrated Audio Amplifier Systems
FN6514
Rev 2.00
October 30, 2007
The Intersil ISL54003, ISL54005, ISL54006 family of devices
are integrated audio power amplifier systems that combine a
mono BTL amplifier and stereo headphone amplifiers in a
single device. The devices are designed to operate from a
single +2.7V to +5V power supply. Targeted applications
include handheld equipment such as cell-phones, MP3
players, and games/toys.
Features
• Pb-Free (RoHS Compliant)
• Class AB 94mW Headphone Amplifiers and 941mW Mono
BTL Speaker Amplifier
• THD+N at 1kHz, 800mW into 8 BTL. . . . . . . . . . . . . . 0.4%
• THD+N at 1kHz, 15mW into 32 Headphone . . . . . . 0.07%
• THD+N at 1kHz, 50mW into 32 Headphone . . . . . . . 0.3%
• Single Supply Operation. . . . . . . . . . . . . . . . . +2.7V to +5.5V
• Headphone Sense Input and Low Power Shutdown
• Thermal Shutdown Protection
These parts contain one class AB BTL type power amplifier
for driving an 8 mono speaker and two class AB headphone
amplifiers for driving 16 or 32 headphone speakers.
The BTL when using a 5V supply is capable of delivering
800mW (typ) with 0.4% THD+N and 941mW (typ) with 1%
THD+N of continuous average power into an 8BTL speaker
load.
• “Click and Pop” Suppression Circuitry
• 2:1 Stereo Input Mux (ISL54005, ISL54006)
• Mixing of Two Stereo Inputs (ISL54006)
Each headphone amplifier when using a 5V supply is capable
of delivering 50mW (typ) with 0.3% THD+N and 94mW (typ)
with 1% THD+N of continuous average power into a 32
headphone speaker.
• TTL Logic-Compatible
• Available in 20 Ld 4x4 Thin QFN
When in Mono Mode these devices automatically mix the
active left and right audio inputs and send the combined signal
to the BTL driver. In Headphone Mode the active right channel
input is sent to the right headphone speaker and the active left
channel is sent to the left headphone speaker.
Applications
• Battery powered, Handheld, and Portable Equipment
- Cellular/mobile Phones
- PDA’s, MP3 Players, DVD Players, Cameras
- Laptops, Notebooks, Palmtops
The ISL54005 and ISL54006 feature a 2:1 stereo input
multiplexer front-end. This allows selection between two
stereo sources. In addition the ISL54006 can mix the four
inputs to the BTL driver or the two pairs of inputs to the
headphone drivers.
- Handheld Games and Toys
• Desktop Computers
Simplified Block Diagram
These parts feature headphone sense circuitry that detects
when a headphone jack has been inserted and automatically
switches the active audio inputs from the mono BTL output
driver to the headphone drivers. These parts also feature a
logic control pin that can override the headphone sense
input circuitry.
V
DD
R1
L1
R2
L2
ROUTER/
MIXER
All devices in this family feature low power shutdown,
thermal overload protection and click/pop suppression. The
click and pop circuitry eliminates audible transients during
audio source changes and transitioning in and out of
shutdown.
CLICK
AND
POP
BIAS
SD
THERMAL
SHUTDOWN
INS
MIX
HO
LOGIC
CONTROL
ISL54006
FN6514 Rev 2.00
October 30, 2007
Page 1 of 16
ISL54003, ISL54005, ISL54006
Pinouts
Pin Descriptions
ISL54003
(20 LD 4X4 TQFN)
TOP VIEW
PIN
ISL54003 ISL54005 ISL54006 NAME
FUNCTION
3, 6, 12
4, 9, 20
11
3, 6, 12
4, 9, 20
3, 6, 12
4, 9, 20
V
System Power Supply
DD
GND Ground Connection
20 19 18
17
16
IN
Left Channel Audio
Input 1
L
SPK-
HO
SD
NC
V
1
2
3
4
5
15
14
13
12
11
SPK+
11
13
11
13
IN
IN
Left Channel Audio
Input 1
1L
V
DD
-
Left Channel Audio
Input 2
2L
GND
HpR
DD
17
IN
Right Channel Audio
Input 1
IN
R
L
6
7
8
9
10
17
19
5
17
19
5
IN
IN
Right Channel Audio
Input 1
1R
-
5
Right Channel Audio
Input 2
2R
ISL54005
HpR Headphone Right
Ouput
(20 LD 4X4 TQFN)
TOP VIEW
7
7
7
HpL Headphone Left
Ouput
20 19
18
17
16
2
2
2
SPK+ Positive Speaker
Output
SPK-
HO
SD
IN
1
2
3
4
5
15
14
13
12
11
1
1
1
SPK- Negative Speaker
Output
SPK+
V
14
14
14
SD
HD
Shutdown, High to
disable amplifiers,
Low for normal
operation.
DD
2L
GND
HpR
V
DD
IN
1L
8
8
8
Headphone
Detection, Internally
6
7
8
9
10
pulled up to V
Low
DD,
in Mono Mode, High in
Headphone Mode if
HO = Low
ISL54006
(20 LD 4X4 TQFN)
15
15
15
HO
Headphone Override,
High in Mono Mode,
Low in Headphone
Mode if HD = High
TOP VIEW
20 19
18
17
16
-
-
18
-
18
16
INS Input Select
MIX Mixer, High to mix
Right and Left Audio
Inputs, Low to pass
Audio Inputs without
mixing
SPK-
HO
SD
IN
1
2
3
4
5
15
14
13
12
11
SPK+
V
DD
2L
10
10
16
10
REF Common-mode Bias
Voltage, Bypass with
a 1µF capacitor to
GND.
GND
HpR
V
DD
IN
1L
6
7
8
9
10
13, 16,
18, 19
NC
No Connect
FN6514 Rev 2.00
October 30, 2007
Page 2 of 16
ISL54003, ISL54005, ISL54006
Ordering Information
ISL54003 Truth Table
PART
NUMBER
(Note)
TEMP.
RANGE
(°C)
PACKAGE
Tape & Reel
(Pb-Free)
SD HD HO
SPK+/SPK-
HpR
Disabled
-
HpL
Disabled
-
PART
MARKING
PKG.
DWG. #
1
0
0
0
X
0
1
1
X
X
0
1
Disabled
IN + IN
R
L
ISL54003IRTZ* 540 03IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A
ISL54005IRTZ* 540 05IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A
ISL54006IRTZ* 540 06IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A
-
IN
-
IN
R
L
IN + IN
-
R
L
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
ISL54005 Truth Table
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets; molding compounds/die attach materials
and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which
is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
SD INS HD HO
SPK+/SPK-
HpR
HpL
Disabled
-
1
0
0
0
0
0
0
X
0
0
0
1
1
1
X
0
1
1
0
1
1
X
X
0
1
X
0
1
Disabled
Disabled
-
IN + IN
1R
1L
-
IN
IN
1L
1R
IN + IN
1R
-
-
-
-
1L
IN + IN
2R
2L
-
IN
IN
2L
2R
IN + IN
2R
-
-
2L
ISL54006 Truth Table
SD MIX INS HD HO SPK+/SPK-
HpR
HpL
1
0
0
0
0
0
0
0
X
0
0
0
0
0
0
1
X
0
0
0
1
1
1
X
X
0
1
1
0
1
1
0
X
X
0
1
X
0
1
X
Disabled
Disabled Disabled
IN + IN
1R
-
-
1L
-
IN
IN
1L
1R
IN + IN
1R
-
-
-
-
1L
2L
IN + IN
2R
-
IN
IN
2L
2R
IN + IN
2R
-
-
-
-
2L
IN + IN
1R
+
2R
IN + IN
1L
2L
0
0
1
1
X
X
1
1
0
1
-
IN
IN
+
IN
IN
+
1L
1R
2R
2L
IN + IN
1R
+
-
-
2R
IN + IN
1L 2L
FN6514 Rev 2.00
October 30, 2007
Page 3 of 16
ISL54003, ISL54005, ISL54006
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.5V
Input Voltages
Thermal Resistance (Typical, Notes 1, 2)
20 Ld 4x4 TQFN Package . . . . . . . . . .
(°C/W)
45
(°C/W)
6.5
JA
JC
In_R, In_L, SD, INS, MIX, H_. . . . . . . . . . . . -0.3 to (VDD + 0.3V)
Output Voltages
SPK+, SPK-, Hp_. . . . . . . . . . . . . . . . . . . . . -0.3 to (VDD + 0.3V)
Continuous Current (VDD, SPK_, Hp_, GND). . . . . . . . . . . . 750mA
ESD Rating:
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2kV
Machine Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>200V
Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1kV
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1. is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
the
JA
JC,
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
2. For , the “case temp” location is the center of the exposed metal pad on the package underside.
JC
Electrical Specifications - 5V Supply
Test Conditions: V
= +5V, GND = 0V, V
= 2.4V, V
= 0.8V, SD = MIX = INS = HD =
INL
DD
INH
V
, C
= 1µF, R is terminated between SPK+ and SPK- for BTL driver and between
INL REF
L
Hp_ and GND for SE drivers, Unless Otherwise Specified (Note 3).
TEMP
(°C)
MIN
MAX
PARAMETER
GENERAL
TEST CONDITIONS
(Notes 4, 5) TYP (Notes 4, 5) UNITS
Power Supply Range, V
DD
Full
25
2.7
-
5.5
12
-
V
Quiescent Supply Current, I
HO = V
INL
or V
, HD = V , INS = V
INL INL
or V ,
INH
-
-
4.6
5.5
mA
mA
DD
INH
or V
MIX = V
, R = NoneInputs AC coupled
INL
INH
L
Full
to ground (0.13µF)
Shutdown Supply Current, I
SD = V , HO = V
or V
INL
, HD = V
INH INL
,
25
-
-
28
31
50
-
µA
µA
SD
INH
INS = V
or V
, MIX = V
or V
, R = 8
INL
INH INH L
INL
Full
BTLand R = 32SEInputs AC coupled to
L
ground (0.1µF)
Input Resistance, R
INS = 0V or V
DD
25
25
-
-
-
-
100
150
10
-
-
-
-
k
°C
°C
ms
IN
Thermal Shutdown, T
INS = MIX = 0V or V
SD
Thermal Shutdown Hysteresis
SD to Full Operation, t
DD
25
INS = 0V or 5V, MIX = 0V or 5V
HO = V UNLESS OTHERWISE SPECIFIED
Full
1
SD(ON)
BTL AMPLIFIER DRIVER, HD = V
INH,
INH,
Output Offset Voltage, V
Measured between SPK+ and SPK-, Inputs AC
coupled to ground (0.1µF)
25
Full
25
-
-
-
-
38
49
49
47
-
-
-
-
mV
mV
dB
OS
Power Supply Rejection Ratio,
PSRR
V
V
= 200mV , HD =
P-P
F
F
= 217Hz
= 1kHz
RIPPLE
, R = 8nputs AC
RIPPLE
INL
L
25
dB
RIPPLE
coupled to ground (0.1µF)
Output Power, P
OUT
R
R
R
R
R
R
= 8, THD+N = 1%, f = 1kHz
= 8, THD+N = 10%, f = 1kHz
25
25
25
25
25
25
25
-
941
1.23
0.4
0.7
7.7
-
-
-
-
-
-
-
mW
W
L
L
L
L
L
L
-
Total Harmonic Distortion + Noise,
THD + N
= 8P
= 8P
= 8V
= 8P
= 800mW, f = 1kHz
-
%
OUT
= 800mW, f = 20Hz to 20kHz
-
7.2
-
%
OUT
Max Output Voltage Swing, V
Signal to Noise Ratio, SNR
= 5V , f = 1kHz
P-P
V
OUT
SIGNAL
P-P
= 900mW, f = 1kHz
85
dB
OUT
Output Noise, N
OUT
A - Weight filter, BW = 22Hz to 22kHz
-
140
µV
RMS
FN6514 Rev 2.00
October 30, 2007
Page 4 of 16
ISL54003, ISL54005, ISL54006
Electrical Specifications - 5V Supply
Test Conditions: V
= +5V, GND = 0V, V
= 2.4V, V
= 0.8V, SD = MIX = INS = HD =
INL
DD
INH
V
, C
= 1µF, R is terminated between SPK+ and SPK- for BTL driver and between
INL REF
L
Hp_ and GND for SE drivers, Unless Otherwise Specified (Note 3). (Continued)
TEMP
(°C)
MIN
MAX
PARAMETER
TEST CONDITIONS
(Notes 4, 5) TYP (Notes 4, 5) UNITS
Crosstalk
to L , L
R
= 8P
= 800mW, f = 1kHz, Signal coupled
OUT
25
25
-
-
80
-
-
dB
dB
L
R
to R
CH CH CH
from the input of active amplifier to the output of an
adjacent amplifier with its input AC coupled to
ground.
CH
Off-Isolation
SD = V
P
= 800mW, f = 10kHz, Signal
130
DD, OUT
coupled from input to output of a disabled amplifier.
SINGLE ENDED AMPLIFIER DRIVERS, HD = V HO = V UNLESS OTHERWISE SPECIFIED
INH,
INL,
Power Supply Rejection Ratio, PSRR V
R
= 200mV , HD = 0V,
= 32Input AC coupled to
F
F
= 217Hz
= 1kHz
25
25
-
-
48
47
-
-
dB
dB
RIPPLE
P-P
RIPPLE
L
RIPPLE
ground (0.1µF)
Output Power, P
OUT
R
R
R
R
R
R
R
R
R
R
= 16, THD+N = 1%, f = 1kHz
= 32, THD+N = 1%, f = 1kHz
25
25
25
25
25
25
25
25
25
25
-
170
94
-
-
-
-
-
-
-
-
-
-
mW
mW
mW
mW
%
L
L
L
L
L
L
L
L
L
L
-
= 16, THD+N = 10%, f = 1kHz
= 32, THD+N = 10%, f = 1kHz
-
215
116
0.07
0.09
0.3
-
Total Harmonic Distortion + Noise,
THD + N
= 32, P
= 32P
= 32, P
= 32P
= 32V
= 32P
= 15mW, f = 1kHz
-
OUT
= 15mW, f = 20Hz to 20kHz
= 50mW, f = 1kHz
-
%
OUT
-
-
%
OUT
= 50mW, f = 20Hz to 20kHz
0.4
%
OUT
Max Output Voltage Swing, V
Crosstalk
= 5V , f = 1kHz
P-P
3.6
-
4.7
V
OUT
SIGNAL
P-P
= 15mW, f = 1kHz
75
dB
OUT
R
to L , L
to R
CH
CH CH
CH
Off-Isolation
SD = V
R
= 32P = 15mW, f = 10kHz
OUT
25
25
25
-
-
-
120
85
-
-
-
dB
dB
dB
DD,
R = 32POUT = 50mW, f = 1kHz
L
L
Signal to Noise Ratio, SNR
Channel Gain Matching
R = 32VINxR = VINxL = 1.3V
(Connect to the
(Connect to the
±0.2
L
RMS
R
to L
CH
same source)
CH
Channel Phase Matching
to L
R = 32VINxR = VINxL = 1.3V
25
-
1.3
-
°
L
RMS
R
same source)
CH
CH
LOGIC INPUT
Input Leakage Current, I , I
,
,
V
= 5V, SD = 0V, INS = 0V, MIX = 0V, HD = 0V,
25
Full
25
-3
-
1.9
1.9
0.02
0.02
-
3
-
µA
µA
µA
µA
V
SD INS
DD
HO = 0V
I
, I , I
MIX HD HO
Input Leakage Current, I , I
SD INS
V
= 5V, SD = V , INS = V , MIX = V
DD DD
,
DD
-1
-
1
DD
I
, I , I
HD = V , HO = V
MIX HD HO
DD
DD
Full
Full
Full
-
V
V
2.4
-
-
INH
INL
-
0.8
V
FN6514 Rev 2.00
October 30, 2007
Page 5 of 16
ISL54003, ISL54005, ISL54006
Electrical Specifications - 3.6V Supply Test Conditions: V = +3.6V, GND = 0V, V
= 1.4V. V
= 0.4V, SD = MIX = INS =
INL
DD
INH
GSO = GS1 = V , C
= 1µF, R is terminated between SPK+ and SPK- for BTL driver
INL REF
L
and between Hp_ and GND for SE drivers, Unless Otherwise Specified (Note 3).
TEMP
(°C)
MIN
(Notes 4, 5)
MAX
PARAMETER
GENERAL
Quiescent Supply Current, I
TEST CONDITIONS
TYP
(Notes 4, 5) UNITS
HO = V
INL
or V
, HD = V , INS = V
INH INL INL
or V
,
INH
25
-
-
2.7
3
12
-
mA
mA
DD
MIX = V
or V , RL = NoneInput AC coupled
INL
INH
Full
to ground (0.1µF)
Shutdown Supply Current, I
SD = V , HO = V
DD
or V
, MIX = V
, HD = Float,
25
-
-
13
15
50
-
µA
SD
INL
INH
INS = V
or V
or V
, R = 8
INL
INH
INL
INH
L
Full
µ
BTLand R = 32SEInput AC coupled to
L
ground (0.1µF)
BTL AMPLIFIER DRIVER, HD = V
INH,
HO = V
UNLESS OTHERWISE SPECIFIED
INH,
Output Offset Voltage, V
Measured between SPK+ and SPK-, Input AC
coupled to ground (0.1µF)
25
Full
25
-
-
-
-
25
40
49
47
-
-
-
-
mV
mV
dB
OS
Power Supply Rejection Ratio,
PSRR
V
= 200mV , HD = 0V,
P-P
F
F
= 217Hz
= 1kHz
RIPPLE
RIPPLE
R
= 8input AC coupled to
L
25
dB
RIPPLE
ground (0.1µF)
Output Power, P
OUT
R
R
R
R
R
= 8, THD+N = 1%, f = 1kHz
25
25
25
25
25
-
-
-
-
-
310
528
0.4
0.4
5.8
-
-
-
-
-
mW
mW
%
L
L
L
L
L
= 8, THD+N = 10%, f = 1kHz
Total Harmonic Distortion + Noise,
THD + N
= 8, P
= 8, P
= 200mW, f = 1kHz
OUT
OUT
= 200mW, f = 20Hz to 20kHz
%
Max Output Voltage Swing, V
OUT
= 8, VSIGNAL = 3.6V , f = 1kHz
P-P
V
P-P
SINGLE ENDED AMPLIFIER DRIVERS, HD = V
HO = V
UNLESS OTHERWISE SPECIFIED
INL,
INH,
Power Supply Rejection Ratio,
PSRR
V
R
= 200mV , HD = 0V,
P-P
= 32nput AC coupled to
F
= 217Hz
= 1kHz
25
25
-
-
48
47
-
-
dB
dB
RIPPLE
RIPPLE
RIPPLE
L
F
ground (0.1µF)
Output Power, P
OUT
R
R
R
R
R
R
R
= 16, THD+N = 1%, f = 1kHz
25
25
25
25
25
25
25
-
-
-
-
-
-
-
80
47
-
-
-
-
-
-
-
mW
mW
mW
mW
%
L
L
L
L
L
L
L
= 32, THD+N = 1%, f = 1kHz
= 16, THD+N = 10%, f = 1kHz
= 32, THD+N = 10%, f = 1kHz
107
58
Total Harmonic Distortion + Noise,
THD + N
= 32, P
= 32, P
= 32V
= 15mW, f = 1kHz
0.15
0.15
3.2
OUT
= 15mW, f = 20Hz to 20kHz
%
OUT
Max Output Voltage Swing, V
= 3.6V , f = 1kHz
P-P
V
P-P
OUT
SIGNAL
LOGIC INPUT
Input Leakage Current, I , I
SD INS
,
,
V
= 3.6V, SD = 0V, INS = 0V, MIX = 0V, HD = 0V,
25
Full
25
-
1.9
1.9
0.02
0.02
-
-
µA
µA
µA
µA
V
DD
I
, I , I
HO = 0V
MIX HD HO
-
-
-
Input Leakage Current, I , I
SD INS
V
= 3.6V, SD = V , INS = V , MIX = V
DD DD
,
DD
-
-
DD
HD = V , HO = V
I
, I , I
MIX HD HO
DD
DD
Full
Full
Full
-
V
V
1.4
-
-
INH
INL
-
0.4
V
NOTES:
3. V = input voltage to perform proper function.
IN
4. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
5. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
FN6514 Rev 2.00
October 30, 2007
Page 6 of 16
ISL54003, ISL54005, ISL54006
ISL54003 Typical Application Circuit and Block Diagram
0.1µF
V
DD
SPK+
SPK-
HpR
0.22µF
BTL
IN
IN
R
L
RIGHT AUDIO
LEFT AUDIO
100k
ROUTER/
MIXER
SE
SE
0.22µF
HD
HpL
HEADPHONE JACK
V
DD
10k
THERMAL
PROTECTION
BIAS
CLICK AND POP
C
REF
REF
SD
1µF
MICRO
CONTROLLER
LOGIC CONTROL
HO
GND
ISL54005 Typical Application Circuit and Block Diagram
0.1µF
V
0.22µF
DD
IN
IN
1R
RIGHT 1 AUDIO
RIGHT 2 AUDIO
SPK+
SPK-
HpR
BTL
0.22µF
2R
100k
MUX/
ROUTER/
MIXER
SE
SE
0.22µF
0.22µF
IN
IN
1L
LEFT 1 AUDIO
LEFT 2 AUDIO
HD
HpL
2L
HEADPHONE JACK
V
DD
10k
THERMAL
PROTECTION
BIAS
CLICK AND POP
C
REF
REF
SD
1µF
INS
MICRO
CONTROLLER
LOGIC CONTROL
HO
GND
FN6514 Rev 2.00
October 30, 2007
Page 7 of 16
ISL54003, ISL54005, ISL54006
ISL54006 Typical Application Circuit and Block Diagram
0.1µF
V
0.22µF
0.22µF
DD
IN
IN
1R
2R
RIGHT 1 AUDIO
RIGHT 2 AUDIO
SPK+
SPK-
HpR
BTL
100k
MUX/
ROUTER/
MIXER
SE
SE
0.22µF
0.22µF
IN
IN
1L
2L
LEFT 1 AUDIO
LEFT 2 AUDIO
HD
HpL
HEADPHONE JACK
V
DD
10k
BIAS
THERMAL
PROTECTION
CLICK AND POP
C
REF
REF
SD
1µF
INS
MICRO
CONTROLLER
LOGIC CONTROL
MIX
HO
GND
the combined signal to the BTL driver. In Headphone Mode the
active right channel input is sent to the right headphone speaker
and the active left channel is sent to the left headphone speaker.
Detailed Description
The Intersil ISL54003, ISL54005, and ISL54006 family of
devices are integrated audio power amplifier systems designed
to provide quality audio, while requiring minimal external
components. The low 0.4% THD+N ensures clean, low
distortion amplification of the audio signals. The devices are
designed to operate from a single +2.7V to +5V power supply.
All devices are offered in a 20 Ld 4x4 TQFN package. Targeted
applications include battery powered equipment such as cell-
phones, MP3 players, and games/toys.
The ISL54005 and ISL54006 feature a 2:1 stereo input
multiplexer front-end. This allows selection between two stereo
sources. The INS control pin determines which stereo input is
active. Applying logic “0” to the INS control pin selects stereo
input 1 (R and L ). Applying logic “1” to the INS control pin
1
1
selects stereo input 2 (R and L ).
2
2
The ISL54006 has the capablity of mixing the two stereo
inputs. When in MIX Mode and HEADPHONE Mode, the part
These parts contain one class AB BTL type power amplifier for
driving an 8mono speaker and two class AB single-ended
(SE) type amplifiers for driving 16 or 32 headphones.
mixes the R input with the R input and sends the combined
1
2
signal to the HpR headphone driver and it mixes the L input
1
with the L input and sends the combined signal to the HpL
headphone driver. When in MIX Mode and MONO Mode, it
2
The BTL when using a 5V supply is capable of delivering
800mW (typ) with 0.4% THD+N and 941mW (typ) with 1%
THD+N of continuous average power into an 8BTL speaker
load. When the speaker load is connected across the positive
and negative terminals of the BTL driver the voltage is doubled
across the load and the power is quadrupled.
mixes all four inputs (R + R + L + L ) and sends the
1
2
1
2
combined signal to the BTL mono driver.
These parts have headphone sense input circuitry that detects
when a headphone jack has been inserted and automatically
switches the active audio inputs from the mono BTL output
driver to the headphone drivers. These parts also feature a
logic control pin (HO) that can override the sense input
circuitry.
Each SE amplifier when using a 5V supply is capable of
delivering 15mW (typ) with 0.07% THD+N and 50mW (typ) with
0.3% THD+N of continuous average power into a 32
headphone speaker.
All devices in this family feature low power shutdown, thermal
overload protection and click/pop suppression. The click and
When in Mono Mode (BTL driver active) these devices
automatically mix the active left and right audio inputs and send
FN6514 Rev 2.00
October 30, 2007
Page 8 of 16
ISL54003, ISL54005, ISL54006
pop circuitry prohibits switching between input channels until
the audio input signals are at there lowest point which
eliminates audible transients in the speakers when changing
the audio input sources. The click/pop circuitry also keeps
speaker transients to an inaudibile level when entering and
leaving shutdown.
One SE amplifier drives the right speaker of the headphone
and other SE amplifier drives the left speaker of the
headphone. The speaker load gets connected between the
output of the amplifier and ground.
The audio signal at the output of each SE driver is biased at
V
/2 and unlike the BTL driver that cancels this offset due to
DD
“Typical Application Circuits and Block Diagrams” for each
device in the family are provided on page 7 and page 8. Truth
tables for each device are provided on page 3.
its differential connection, a capacitor is required at the output
of each SE drivers to remove this DC voltage from the
headphone load.
This coupling capacitor along with the resistance of the
speaker load creates a high pass filter that sets the amplifier’s
lower bandpass frequency limit. The value of this AC coupling
capacitor depends on the low frequency range required by the
application. The formula required to calculate the capacitor
value is shown in Equation 2:
DC Bias Voltage
The ISL54003, ISL54005, and ISL54006 have internal DC bias
circuitry, which DC offsets the incoming audio signal at
V
/2. When using a 5V supply, the DC offset will be 2.5V.
DD
When using a 3.6V supply, the DC offset will be 1.8V.
Since the signal gets biased internally at V /2 the audio
DD
(EQ. 2)
C 1 6.28 f Rspeaker
signals need to be AC coupled to the inputs of the device. The
value of the AC coupling capacitor depends on the low
frequency range required for the application. A capacitor of
0.22µF will pass a signal as low as 7.2Hz. The formula
required to calculated the capacitor value is shown in Equation
1:
For an application driving a 32 headphone with a lower
frequency requirement of 150Hz, the required capacitor value
would be determined by using Equation 3:
(EQ. 3)
C 1 6.28 150 32= 33F
Use the closest standard value.
Headphone Sense Function
With a logic “1” at the HP control pin while the HO control pin is
low will activate the headphone drivers and disable the BTL
driver.
(EQ. 1)
C 1 6.28 f 100k
The 100k is the impedance looking into the input of the
ISL54003, ISL54004, ISL54006 devices.
BTL Speaker Amplifier
The ISL54003, ISL54005, and ISL54006 contain one
bridge-tied load (BTL) amplifier designed to drive an 8
speaker load differentially. The output to the BTL amplifier are
SPK+ and SPK-. The speaker load gets connected across
these terminals.
The “Typical Application Circuits and Block Diagrams” on
page 7 and page 8 show the implementation of the headphone
control function using a common headphone jack.
The HP pin gets connected to the mechanical wiper blade of
the headphone jack. Two external resistors are required for
proper operation. A 100k pull-up resistor from the HP pin to
A single BTL driver consists of an inverting and non-inverting
power op amps. The AC signal out of each op amp are equal in
magnitude but 180° out-of-phase, so the AC signal at SPK+
and SPK- have the same amplitude but are 180° out-of-phase.
V
and a 10k pull-down resistor from the jack’s audio signal
DD
pin to ground of the jack signal pin to which the wiper is
connected. See the block diagrams on page 7 and page 8.
Driving the load differentially using a BTL configuration
doubles the output voltage across the speaker load and
quadruples the power to the load. In effect you get a gain of
two due to this configuration at the load as compared to driving
the load with a single-ended amplifier with its load connected
between a single amplifier’s output and ground.
When no headphone plug is inserted into the jack, the voltage
at the HP pin gets set at a low voltage level due to the 10k
resistor and 100k resistor divider network connection to V
.
DD
When a headphone is inserted into the jack, the 10k resistor
gets disconnected from the HP control pin and the HP pin gets
pulled up to V . Since the HP pin is now high, the headphone
drivers are activated.
DD
The outputs of the BTL are biased at V /2. When the load
DD
gets connected across the + and - terminal of the BTL the mid
supply DC bias voltage at each output gets cancelled out
eliminating the need for large bulky output coupling capacitors.
A microprocessor or a switch can be used to drive the HP pin
rather than using the headphone jack contact pin.
Note: With a logic “1” at the HO pin, the BTL driver remains
active regardless of the voltage level at the HD pin. This allows
a headphone to be plugged into the headphone jack without
activating the HP drivers. Music will continue to play through
the internal 8 speaker rather than the headphones.
Headphone (Single-Ended) Amplifiers
The ISL54003, ISL54005, and ISL54006 contains two single-
ended (SE) headphone amplifiers for driving the left and right
channels of a 32 or 16 headphone speaker.
FN6514 Rev 2.00
October 30, 2007
Page 9 of 16
ISL54003, ISL54005, ISL54006
Low Power Shutdown
QFN Thermal Pad Considerations
With a logic “1” at the SD control pin the device enters the low
power shutdown state. When in shutdown the BTL and
The QFN package features an exposed thermal pad on its
underside. This pad lowers the package’s thermal resistance
by providing a direct heat conduction path from the die to the
PCB. Connect the exposed thermal pad to GND by using a
large copper pad and multiple vias to the GND plane. The vias
should be plugged and tented with plating and solder mask to
ensure good thermal conductivity.
headphone amplifiers go into an high impedance state and I
supply current is reduced to 26µA (typ).
DD
In shutdown mode before the amplifiers enter the high
impedance/low current drive state, the bias voltage of V /2
DD
remains connected at the output of the amplifiers through a
100k resistor.
Best thermal performance is achieved with the largest practical
copper ground plane area.
This resistor is not present during active operation of the
drivers but gets switched in when the SD pin goes high. It gets
removed when the SD pin goes low.
PCB Layout Considersations and Power
Supply Bypassing
To maintain the highest load dissipation and widest output
voltage swing, the power supply PCB traces and the traces
that connect the output of the drivers to the speaker loads
should be made as wide as possible to minimize losses due to
parasitic trace resistance.
Leaving the DC bias voltage connected through a 100k
resistor while going into and out of shutdown reduces the
transient at the speakers to a small level preventing clicking or
popping in the speakers.
Note: When the SD pin is High it over-rides all other logic pins.
Proper supply bypassing is necessary for high power supply
rejection and low noise performance. A filter network
consisting of a 10µF capacitor in parallel with a 0.1µF capacitor
is recommended at the voltage regulator that is providing the
power to the ISL54003, ISL54004, ISL54006 IC.
Local bypass capacitors of 0.1µF should be put at each VDD
pin of the ISL54003, ISL54004, ISL54006 devices. They
should be located as close as possible to the pin, keeping the
length of leads and traces as short as possible.
A 1µF capacitor from the REF pin (pin 10) to ground is needed
for optimum PSRR and internal bias voltage stability.
Typical Performance Curves
T = +25°C, Unless Otherwise Specified.
A
1.0
0.9
0.8
1.0
0.9
0.8
0.7
0.6
V
= 5V
V
= 3.6V
DD
BTL
DD
BTL
0.7
R
P
= 8
L
O
R
= 8
= 200mW
L
= 800mW
0.6
0.5
P
O
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
0.1
20
50
100 200
500 1k
2k
5k
10k 20k
20
50
100 200
500
1k
2k
5k
10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 1. THD+N vs FREQUENCY
FIGURE 2. THD+N vs FREQUENCY
FN6514 Rev 2.00
October 30, 2007
Page 10 of 16
ISL54003, ISL54005, ISL54006
Typical Performance Curves
T
= +25°C, Unless Otherwise Specified. (Continued)
A
10.0
10.0
V
= 5V
V
= 3.6V
DD
BTL
= 8
DD
BTL
= 8
5.00
5.00
R
R
L
L
2.00
1.00
0.50
2.00
1.00
0.50
f = 1kHz
f = 1kHz
0.20
0.10
0.05
0.20
0.10
0.05
0.02
0.01
0.02
0.01
10m
20m
40m
70m 100m
200m
600m
10m
20m
50m
100m 200m
500m
600m
OUTPUT POWER (W)
OUTPUT POWER (W)
FIGURE 3. THD+N vs OUTPUT POWER
FIGURE 4. THD+N vs OUTPUT POWER
0.20
0.40
0.30
V
= 3.6V
V
= 5V
DD
DD
SE
SE
R
= 32
= 15mW
R
= 32
L
L
0.20
P
O
P
O
= 15mW
0.10
0.09
0.08
0.07
0.06
0.10
0.05
0.04
0.05
0.04
0.03
0.02
0.03
0.02
0.01
0.01
20
50
100 200
500 1k
2k
5k
10k 20k
20
50
100 200
500 1k
2k
5k
10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 5. THD+N vs FREQUENCY
FIGURE 6. THD+N vs FREQUENCY
1.0
1.0
0.9
0.8
0.9
0.8
V
= 5V
DD
V
= 5V
DD
SE
L
SE
0.7
0.7
R
= 32
R
= 16
L
0.6
0.6
P
= 50mW
O
P
= 50mW
O
0.5
0.4
0.5
0.4
0.3
0.2
0.3
0.2
0.1
0.1
20
50
100 200
500 1k
2k
5k
10k 20k
20
50
100 200
500 1k
2k
5k
10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 8. THD+N vs FREQUENCY
FIGURE 7. THD+N vs FREQUENCY
FN6514 Rev 2.00
October 30, 2007
Page 11 of 16
ISL54003, ISL54005, ISL54006
Typical Performance Curves
T
= +25°C, Unless Otherwise Specified. (Continued)
A
1.00
1.00
V
= 3.6V
DD
SE
V
= 3.6V
DD
SE
0.50
0.50
R
= 32
L
R
= 16
L
P
= 30mW
O
P
= 60mW
O
0.20
0.10
0.05
0.20
0.10
0.05
0.02
0.01
0.02
0.01
20
50
100 200
500 1k
2k
5k
10k 20k
20
50
100 200
500 1k
2k
5k
10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 9. THD+N vs FREQUENCY
FIGURE 10. THD+N vs FREQUENCY
0.20
0.10
0.09
0.08
V
= 5V
DD
SE
L
R
= 32
0.07
f = 1kHz
0.06
0.10
0.09
0.08
0.07
0.06
0.05
0.04
V
= 5V
DD
SE
L
0.05
R
= 16
0.03
0.02
0.04
f = 1kHz
0.03
0.02
0.01
0.01
2
3
4
5
6
7
8
9 10
20
2
3
4
5
6
7
8
9
10
20
OUTPUT POWER (mW)
OUTPUT POWER (mW)
FIGURE 12. THD+N vs OUTPUT POWER
FIGURE 11. THD+N vs OUTPUT POWER
0.30
0.20
0.10
0.09
0.08
V
= 3.6V
DD
SE
R
= 32
0.07
0.06
L
f = 1kHz
V
SE
R
= 3.6V
= 16W
DD
0.05
0.04
0.10
0.09
0.08
0.07
0.06
L
f = 1kHz
0.03
0.02
0.05
0.04
0.03
0.02
0.01
0.01
2
3
4
5
6
7
8
9 10
20
2
3
4
5
6
7
8
9
10
20
OUTPUT POWER (mW)
OUTPUT POWER (mW)
FIGURE 13. THD+N vs OUTPUT POWER
FIGURE 14. THD+N vs OUTPUT POWER
FN6514 Rev 2.00
October 30, 2007
Page 12 of 16
ISL54003, ISL54005, ISL54006
Typical Performance Curves
T
= +25°C, Unless Otherwise Specified. (Continued)
A
10.0
10.0
5.00
V
= 5V
5.00
DD
SE
V
= 5V
DD
SE
R
= 32
L
2.00
1.00
0.50
2.00
1.00
0.50
R
= 16
L
f = 1kHz
f = 1kHz
0.20
0.10
0.05
0.20
0.10
0.05
0.02
0.01
0.02
0.01
10m
20m
30m 40m 50m
70m
100m
10m
20m
30m
50m 70m 100m
200m
OUTPUT POWER (W)
OUTPUT POWER (W)
FIGURE 15. THD+N vs OUTPUT POWER
FIGURE 16. THD+N vs OUTPUT POWER
1.00
5.00
10.0
5.00
V
= 3.6V
DD
SE
L
V
= 3.6V
DD
SE
R
= 16
R
= 32
2.00
1.00
0.50
L
2.00
1.00
0.50
f = 1kHz
f = 1kHz
0.20
0.10
0.05
0.20
0.01
0.05
0.02
0.01
0.02
0.01
10m 12m 15m
20m 25m
35m
45m 55m
10m
20m
30m 40m 50m
70m
100m
OUTPUT POWER (W)
OUTPUT POWER (W)
FIGURE 17. THD+N vs OUTPUT POWER
FIGURE 18. THD+N vs OUTPUT POWER
-50
-55
-80
-85
V
P
= 5V
DD
= 15mW
-90
O
-60
-95
-65
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
-155
-160
INxR TO HPL
INxL TO HPR
-70
-75
-80
-85
HPR AND HPL
BTL
-90
-95
-100
-105
-110
20
50 100 200
FREQUENCY (Hz)
FIGURE 20. OFF ISOLATION vs FREQUENCY
500 1k
2k
5k 10k 20k
20
50 100 200
500 1k
2k
5k 10k 20k
FREQUENCY (Hz)
FIGURE 19. CROSSTALK vs FREQUENCY
FN6514 Rev 2.00
October 30, 2007
Page 13 of 16
ISL54003, ISL54005, ISL54006
Typical Performance Curves
T
= +25°C, Unless Otherwise Specified. (Continued)
A
-20
-25
-22
V
= 5V
DD
V
= 5V
DD
-26
-30
-34
-38
-42
-46
-50
-54
-58
-62
-66
-70
BTL
V
SE
V
-30
-35
-40
-45
-50
-55
-60
-65
-70
-75
-80
-85
-90
= 200mV
P-P
= 200mV
RIPPLE
RIPPLE
P-P
HPR
HPL
10 20
50 100 200
500 1k 2k
5k 10k 20k
10 20
50 100 200
500 1k 2k
5k 10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 22. PSRR vs FREQUENCY
FIGURE 21. PSRR vs FREQUENCY
700
600
500
400
300
200
100
400
350
300
250
200
150
100
50
V
= 3.6V
DD
BTL
= 8W
V
= 5V
DD
BTL
L
R
= 8W
R
L
0
0
0
0
100
200
300
(mW)
400
500
250
500
(mW)
750
1000
P
P
OUT
OUT
FIGURE 23. POWER DISSIPATION vs OUTPUT POWER
FIGURE 24. POWER DISSIPATION vs OUTPUT POWER
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
PROCESS:
Submicron CMOS
FN6514 Rev 2.00
October 30, 2007
Page 14 of 16
ISL54003, ISL54005, ISL54006
Thin Quad Flat No-Lead Plastic Package
(TQFN)
Thin Micro Lead FramePlastic Package
(TMLFP)
L20.4x4A
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220WGGD-1 ISSUE I)
MILLIMETERS
SYMBOL
MIN
NOMINAL
MAX
0.80
0.05
0.80
NOTES
A
A1
A2
A3
b
0.70
0.75
-
-
-
0.02
-
0.55
9
0.20 REF
9
0.18
1.95
1.95
0.25
0.30
2.25
2.25
5, 8
D
4.00 BSC
-
D1
D2
E
3.75 BSC
9
2.10
7, 8
4.00 BSC
-
E1
E2
e
3.75 BSC
9
2.10
7, 8
0.50 BSC
-
k
0.20
0.35
-
0.60
20
5
-
-
L
0.75
8
N
2
Nd
Ne
P
3
5
3
-
-
-
0.60
12
9
-
9
Rev. 0 11/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensionsare providedtoassist with PCB LandPattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & are present when
Anvil singulation method is used and not present for saw
singulation.
FN6514 Rev 2.00
October 30, 2007
Page 15 of 16
ISL54003, ISL54005, ISL54006
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Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
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FN6514 Rev 2.00
October 30, 2007
Page 16 of 16
相关型号：
ISL54004IR
0.17W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC20, 4 X 4 MM, PLASTIC, MO-220WGGD-1, TQFN-20
RENESAS
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