ISL76683AROZ-T7 [RENESAS]

Light-to-Digital Output Sensor with Gain Selection, Interrupt Function and I2C Interface;
ISL76683AROZ-T7
型号: ISL76683AROZ-T7
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Light-to-Digital Output Sensor with Gain Selection, Interrupt Function and I2C Interface

光电二极管
文件: 总18页 (文件大小:850K)
中文:  中文翻译
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DATASHEET  
ISL76683  
FN7697  
Rev 9.00  
Mar 2, 2018  
Light-to-Digital Output Sensor with Gain Selection, Interrupt Function and  
2
I C Interface  
The ISL76683 is an integrated light sensor with an internal  
Features  
integrating ADC intended for automotive applications. The ADC  
provides 16-bit resolution and is capable of rejecting 50Hz and  
2
• Range select with I C  
2
60Hz flicker caused by artificial light sources. The I C interface  
- Range 1 = 0 lux to 1000 lux  
- Range 2 = 0 lux to 4000 lux  
provides four user programmable lux sensitivity ranges for  
optimized counts/lux in a variety of lighting conditions. The I C  
2
- Range 3 = 0 lux to 16000 lux  
- Range 4 = 0 lux to 64000 lux  
interface also provides multi-function control of the sensor and  
remote monitoring capabilities.  
• Human eye response (540nm peak sensitivity)  
• Temperature compensated  
In normal operation, power consumption is less than 300µA.  
Furthermore, a software power-down mode controlled with the  
I C interface reduces power consumption to less than 1µA.  
2
• 16-bit resolution  
The ISL76683 supports twin (upper and lower) user  
programmed thresholds and provides a hardware interrupt  
that remains asserted low until the host clears it with the I C  
control interface.  
• Adjustable sensitivity: up to 65 counts per lux  
• User-programmable upper and lower threshold interrupt  
• Simple output code, directly proportional to lux  
• IR + UV rejection  
2
The ISL76683 is designed to operate on supplies from 2.5V to  
3.3V, and is AEC-Q100 qualified and specified for operation  
across the -40°C to +105°C (grade 2) ambient temperature  
range. To achieve this, the ISL76683 is packaged in a special  
extended temperature clear package.  
• 50Hz/60Hz rejection  
• 2.5V to 3.3V supply  
• 6 Ld ODFN (2.1mmx2mm)  
AEC-Q100 qualified  
Related Literature  
For a full list of related documents, visit our website  
ISL76683 product page  
• Pb-free (RoHS compliant)  
Applications  
• Automotive ambient light sensing  
• Backlight control  
• Lighting controls  
VDD  
1
PHOTODIODE 1  
COMMAND  
REGISTER  
INTEGRATING  
ADC  
DATA  
REGISTER  
MUX  
5
6
SCL  
SDA  
PHOTODIODE 2  
IREF  
2
I C  
EXT  
TIMING  
FOSC  
INT  
16  
2
INTERRUPT  
4
INT  
COUNTER  
3
2
REXT  
GND  
ISL76683  
FIGURE 1. BLOCK DIAGRAM  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 1 of 18  
ISL76683  
Pin Configuration  
ISL76683  
(6 LD ODFN)  
TOP VIEW  
VDD  
GND  
1
2
3
6
5
4
SDA  
SCL  
INT  
THERMAL  
PAD  
REXT  
Pin Descriptions  
PIN NUMBER  
PIN NAME  
DESCRIPTION  
1
2
3
4
5
6
VDD  
Positive supply. Connect this pin to a regulated 2.5V to 3.3V supply  
GND  
Ground pin. The thermal pad is connected to the GND pin  
REXT  
INT  
External resistor pin for ADC reference. Connect this pin to ground through a (nominal) 100kresistor  
Interrupt pin; LO for interrupt/alarming. The INT pin is an open drain.  
2
2
SCL  
I C serial clock  
The I C bus lines can be pulled above VDD, 5.5V max  
2
SDA  
I C serial data  
Ordering Information  
PART NUMBER  
TEMP RANGE  
(°C)  
TAPE AND REEL  
(UNITS)  
PACKAGE  
(RoHS Compliant)  
PKG.  
DWG. #  
(Notes 1, 2, 3)  
ISL76683AROZ-T7  
ISL76683AROZ-T7A  
-40 to +105  
-40 to +105  
3k  
6 Ld ODFN  
6 Ld ODFN  
L6.2x2.1  
L6.2x2.1  
250  
ISL76683EVAL1Z  
NOTES:  
Evaluation Board  
1. Refer to TB347 for details about reel specifications.  
2. These Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination  
finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified at Pb-free peak reflow  
temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.  
3. For Moisture Sensitivity Level (MSL), refer to the ISL76683 product information page. For more information about MSL, refer to TB477.  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 2 of 18  
ISL76683  
Absolute Maximum Ratings (T = +25°C)  
Thermal Information  
A
V
, Supply Voltage between VDD and GND . . . . . . . . . . . . . . . . . . . . .3.6V  
Thermal Resistance (Typical)  
6 Ld ODFN Package (Notes 4, 5) . . . . . . . .  
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+105°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C  
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C  
Pb-Free Reflow Profile (Note 6). . . . . . . . . . . . . . . . . . . . . . . . . . . see TB477  
JA (°C/W)  
88  
JC (°C/W)  
7.94  
DD  
2
I C Bus Pin Voltage (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 5.5V  
2
I C Bus Pin Current (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA  
INT, R  
ESD Rating  
Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to V  
EXT  
DD  
Human Body Model (Tested per AEC-Q100-002) . . . . . . . . . . . . . . . . 2kV  
Machine Model (Tested per AEC-Q100-003). . . . . . . . . . . . . . . . . . 200V  
Charge Device Model (Tested per AEC-Q100-011). . . . . . . . . . . . . . . 1kV  
Latch-Up (Tested per AEC-Q100-004, Class II, Level A) . . . . . . . . . . 100mA  
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product  
reliability and result in failures not covered by warranty.  
NOTES:  
4. is measured with in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach” features. See  
JA  
TB379.  
5. For , “case temperature” location is at the center of the exposed metal pad on the package underside. See TB379.  
JC  
6. Peak temperature during solder reflow +260°C max.  
Electrical Specifications V = 3V, T = +25°C, R = 100kΩ 1% tolerance, unless otherwise specified, Internal Timing Mode Operation  
DD  
A
EXT  
(see “Principles of Operation” on page 6).  
MIN  
MAX  
PARAMETER  
Power Supply Range  
Supply Current  
SYMBOL  
TEST CONDITIONS  
(Note 7)  
TYP  
(Note 7)  
UNIT  
V
V
2.25  
3.3  
0.33  
1
DD  
I
0.29  
0.1  
mA  
DD  
Supply Current Disabled  
I
Software disabled, -40°C to +85°C  
µA  
DD1  
Software disabled, -40°C to +105°C, V = 3.3V  
DD  
0.1  
8
µA  
Internal Oscillator Frequency  
Internal Oscillator Frequency  
f
f
Gain/Range = 1 or 2  
Gain/Range = 3 or 4  
290  
580  
1
327  
655  
360  
720  
400  
5
kHz  
OSC1  
kHz  
OSC2  
2
2
I C Clock Rate  
FI C  
kHz  
Diode1 Dark ADC Code  
Full Scale ADC Code  
DATA0  
DATA1  
DATA2  
E = 0 lux, Mode1, Gain/Range = 1  
Counts  
Counts  
Counts  
65535  
24440  
Diode1 ADC Code Gain/Range = 1  
Accuracy  
Mode1  
Mode2  
Mode1  
Mode2  
Mode1  
Mode2  
Mode1  
Mode2  
E = 300 lux, fluorescent light,  
Gain/Range = 1  
(Note 8)  
15760  
20200  
2020  
5050  
505  
Diode2 ADC Code Gain/Range = 1  
Accuracy  
DATA3  
DATA4  
DATA5  
DATA6  
DATA5  
DATA6  
DATA6  
Counts  
Counts  
Counts  
Counts  
Counts  
Counts  
Counts  
Diode1 ADC Code Gain/Range = 2  
Accuracy  
E = 300 lux, fluorescent light,  
Gain/Range = 2  
(Note 8)  
Diode2 ADC Code Gain/Range = 2  
Accuracy  
Diode1 ADC Code Gain/Range = 3  
Accuracy  
E = 300 lux, fluorescent light,  
Gain/Range = 3  
(Note 8)  
1262  
126  
Diode2 ADC Code Gain/Range = 3  
Accuracy  
Diode1 ADC Code Gain/Range = 4  
Accuracy  
E = 300 lux, fluorescent light,  
Gain/Range = 4  
(Note 8)  
316  
Diode2 ADC Code Gain/Range = 4  
Accuracy  
32  
Voltage of REXT Pin  
V
-40°C to +85°C  
-40°C to +105°C  
(Note 9)  
0.485  
0.51  
0.535  
0.545  
V
V
V
REF  
SCL and SDA Threshold LO  
V
1.05  
TL  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 3 of 18  
ISL76683  
Electrical Specifications V = 3V, T = +25°C, R = 100kΩ 1% tolerance, unless otherwise specified, Internal Timing Mode Operation  
DD  
A
EXT  
(see “Principles of Operation” on page 6). (Continued)  
MIN  
MAX  
PARAMETER  
SCL and SDA Threshold HI  
SDA Current Sinking Capability  
INT Current Sinking Capability  
NOTES:  
SYMBOL  
TEST CONDITIONS  
(Note 7)  
TYP  
1.95  
5
(Note 7)  
UNIT  
V
V
(Note 9)  
TH  
I
3
3
mA  
mA  
SDA  
I
5
INT  
7. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design.  
8. Fluorescent light is substituted by a white LED during production.  
9. The voltage threshold levels of the SDA and SCL pins are V dependent: V = 0.35*V . V = 0.65*V  
DD TL DD TH  
.
DD  
Typical Performance Curves (R = 100k)  
EXT  
100  
90  
RADIATION PATTERN  
0º  
80  
10º  
10º  
ISL76683 D1  
20º  
20º  
70  
LUMINOSITY  
30º  
30º  
ANGLE  
60  
50  
40  
40º  
40º  
50º  
60º  
50º  
60º  
30  
20  
10  
0
ISL76683 D2  
70º  
80º  
90º  
70º  
80º  
90º  
300  
400  
500  
600  
700  
800  
900  
1k  
0.2  
0.4  
0.6  
0.8  
1.0  
WAVELENGTH (nm)  
RELATIVE SENSITIVITY  
FIGURE 2. SPECTRAL RESPONSE  
FIGURE 3. RADIATION PATTERN  
320  
10  
8
T
= +27°C  
T = +27°C  
A
COMMAND = 00H  
0 lux  
A
COMMAND = 00H  
306  
292  
278  
264  
250  
5000 lux  
6
4
200 lux  
RANGE 2  
2
0
2.0  
2.3  
2.6  
2.9  
3.2  
3.5  
3.8  
2.0  
2.3  
2.6  
2.9  
3.2  
3.5  
3.8  
SUPPLY VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
FIGURE 4. SUPPLY CURRENT vs SUPPLY VOLTAGE  
FIGURE 5. OUTPUT CODE FOR 0 LUX vs SUPPLY VOLTAGE  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 4 of 18  
ISL76683  
Typical Performance Curves (R = 100k) (Continued)  
EXT  
1.015  
1.010  
1.005  
1.000  
0.995  
0.990  
320.0  
319.5  
319.0  
318.5  
318.0  
T
= +27°C  
T
= +27°C  
A
A
COMMAND = 00H  
5000 lux  
200 lux  
2.0  
2.3  
2.6  
2.9  
3.2  
3.5  
3.8  
2.0  
2.3  
2.6  
2.9  
3.2  
3.5  
3.8  
SUPPLY VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
FIGURE 6. OUTPUT CODE vs SUPPLY VOLTAGE  
FIGURE 7. OSCILLATOR FREQUENCY vs SUPPLY VOLTAGE  
10  
330  
320  
310  
300  
290  
280  
270  
260  
V
= 3V  
DD  
V
- 3V  
DD  
COMMAND = 00H  
0 LUX  
8
6
4
2
RANGE2  
0
-60  
-40  
-20  
0
20  
40  
60  
80  
100 120  
-60  
-40  
-20  
0
20  
40  
60  
80  
100 120  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
FIGURE 8. SUPPLY CURRENT vs TEMPERATURE  
FIGURE 9. OUTPUT CODE FOR 0 LUX vs TEMPERATURE  
330  
1.10  
V
= 3V  
DD  
V
= 3V  
DD  
1.08  
1.06  
1.04  
1.02  
1.00  
0.98  
0.96  
0.94  
0.92  
COMMAND = 00H  
329  
328  
327  
326  
325  
5000 LUX  
RANGE 3  
200 LUX  
RANGE 1  
-60  
-40  
-20  
0
20  
40  
60  
80  
100 120  
-60  
-40  
-20  
0
20  
40  
60  
80  
100 120  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
FIGURE 10. OUTPUT CODE vs TEMPERATURE  
FIGURE 11. OSCILLATOR FREQUENCY vs TEMPERATURE  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 5 of 18  
ISL76683  
Interrupt Function  
The active low interrupt pin is an open-drain pull-down  
Principles of Operation  
Photodiodes  
The ISL76683 contains two photodiodes. Diode1 is sensitive to  
both visible and infrared light, while Diode2 is sensitive mostly to  
infrared light. The two diodes’ spectral responses are independent  
from one another. See Figure 2 on page 4 in the “Typical  
configuration. The interrupt pin serves as an alarm or monitoring  
function to determine whether the ambient light exceeds the  
upper threshold or the lower threshold. The user can also  
configure the persistency of the interrupt pin. This eliminates any  
false triggers, such as noise or sudden spikes in ambient light  
conditions. For example, an unexpected camera flash can be  
ignored by setting the persistency to eight integration cycles.  
Performance Curves” section. The photodiodes convert light to  
current, then the diodes’ current outputs are converted to digital by  
a single built-in integrating type 16-bit Analog-to-Digital Converter  
2
2
I C Interface  
(ADC). An I C command mode determines which photodiode will  
be converted to a digital signal. Mode1 is Diode1 only. Mode2 is  
Diode2 only. Mode3 is a sequential Mode1 and Mode2 with an  
internal subtract function (Diode1 - Diode2).  
Eight 8-bit registers are available inside the ISL76683. The  
command and control registers define the operation of the device.  
The command and control registers do not change until the registers  
are overwritten. Two 8-bit registers set the high and low interrupt  
thresholds. There are four 8-bit data Read Only registers; two bytes  
for the sensor reading and another two bytes for the timer counts.  
The data registers contain the ADC's latest digital output and the  
number of clock cycles in the previous integration period.  
Analog-to-Digital Converter (ADC)  
The converter is a charge-balancing integrating type 16-bit ADC.  
The chosen method for conversion is best for converting small  
current signals in the presence of AC periodic noise. For example,  
a 100ms integration time highly rejects 50Hz and 60Hz power  
line noise simultaneously. See “Integration Time or Conversion  
Time” on page 11 and “Noise Rejection” on page 12.  
2
The ISL76683’s I C interface slave address is hardwired  
internally as 1000100. When 1000100x with x as R or W is sent  
after the Start condition, this device compares the first seven bits  
of this byte to its address and matches.  
The built-in ADC offers the user flexibility in integration time or  
conversion time. Two timing modes are available: Internal Timing  
Mode and External Timing Mode. In Internal Timing Mode,  
integration time is determined by an internal dual speed oscillator  
Figure 12 on page 7 shows a sample one-byte read. Figure 13 on  
page 7 shows a sample one-byte write. Figure 14 on page 7  
shows a sync_iic timing diagram sample for externally controlled  
(f  
), and the n-bit (n = 4, 8, 12, 16) counter inside the ADC. In  
2
OSC  
integration time. The I C bus master always drives the SCL  
External Timing Mode, integration time is determined by the time  
(clock) line, while either the master or the slave can drive the  
2
between two consecutive I C External Timing Mode commands. See  
2
SDA (data) line. Figure 13 shows a sample write. Every I C  
“External Timing Mode” on page 10. A good balancing act of  
integration time and resolution depending on the application is  
required for optimal results.  
transaction begins with the master asserting a start condition  
(SDA falling while SCL remains high). The following byte is driven  
by the master and includes the slave address and read/write bit.  
The receiving device is responsible for pulling SDA low during the  
acknowledgment period.  
2
The ADC has four I C programmable range selections to  
dynamically accommodate various lighting conditions. The ADC  
can be configured at its lowest range for very dim conditions. The  
ADC can be configured at its highest range for very bright  
conditions.  
2
Every I C transaction ends with the master asserting a stop  
condition (SDA rising while SCL remains high).  
2
For more information about the I C standard, refer to the Philips  
2
I C specification documents.  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 6 of 18  
ISL76683  
Start  
DEVICE ADDRESS  
A6 A5 A4 A3 A2 A1 A0  
SDA DRIVEN BY MASTER  
W
W
A
A
A
9
REGISTER ADDRESS  
R7 R6 R5 R4 R3 R2 R1 R0  
SDA DRIVEN BY MASTER  
A
A
A
9
STOP  
START  
DEVICE ADDRESS  
A6 A5 A4 A3 A2 A1 A0  
SDA DRIVEN BY MASTER  
A
A
A
9
DATA BYTE0  
A
NAK  
A
STOP  
I2C DATA  
I2C SDA  
In  
ISL76683  
SDA DRIVEN BY
W
I2C SDA  
Out  
D7 D6 D5 D4 D3 D2 D1 D0  
I2C CLK  
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
9
2
FIGURE 12. I C READ TIMING DIAGRAM SAMPLE  
Start  
DEVICE ADDRESS  
W
W
A
A
A
9
REGISTER ADDRESS  
R7 R6 R5 R4 R3 R2 R1 R0  
SDA DRIVEN BY MASTER  
A
A
A
9
FUNCTIONS  
A
A
A
9
STOP  
I2C DATA  
I2C SDA In  
A6 A5 A4 A3 A2 A1 A0  
SDA DRIVEN BY MASTER  
B7 B6 B5 B4 B3 B2 B1 B0  
I2C SDA Out  
I2C CLK In  
SDA DRIVEN BY MASTER  
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
2
FIGURE 13. I C WRITE TIMING DIAGRAM SAMPLE  
Start  
DEVICE ADDRESS  
A6 A5 A4 A3 A2 A1 A0  
SDA DRIVEN BY MASTER  
W
W
A
A
A
9
REGISTER ADDRESS  
A Stop  
I2C DATA  
I2C SDA In  
R7 R6 R5 R4 R3 R2 R1 R0  
A
A
9
I2C SDA Out  
SDA DRIVEN BY MASTER  
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
I2C CLK In  
2
FIGURE 14. I C sync_iic TIMING DIAGRAM SAMPLE  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 7 of 18  
ISL76683  
Register Set  
Eight registers are available in the ISL76683. Table 1 summarizes the available registers and their functions.  
TABLE 1. REGISTER SET  
ADDR  
(HEX)  
REGISTER  
NAME  
BIT(S)  
7
FUNCTION NAME  
Enable  
FUNCTIONS/DESCRIPTION  
00  
Command  
0: Disable ADC-core  
1: Enable ADC-core  
6
5
ADCPD  
0: Normal operation  
1: Power-down Mode  
Timing_Mode  
0: Integration is internally timed  
1: Integration is externally sync/controlled by I C host  
2
4
Reserved  
3:2  
Mode<1:0>  
Selects ADC work mode:  
0: Diode1’s current to unsigned 16-bit data  
1: Diode2’s current to unsigned 16-bit data  
2: Difference between diodes (I1 - I2) to signed 15-bit data  
3: Reserved  
1:0  
Width<1:0>  
Number of clock cycles; n-bit resolution  
16  
0: 2 cycles  
12  
1: 2 cycles  
8
2: 2 cycles  
4
3: 2 cycles  
01  
Control  
7
6
5
Ext_Mode  
Test_Mode  
Int_Flag  
Always set to logic 0. Factory use only  
Always set to logic 0  
0: Interrupt is cleared or not yet triggered  
1: Interrupt is triggered  
4
Reserved  
Always set to logic 0. Factory use only  
3:2  
Gain<1:0>  
Selects the gain so the range is:  
0: 0 to 1000 lux  
1: 0 to 4000 lux  
2: 0 to 16000 lux  
3: 0 to 64000 lux  
1:0  
Int_Persist  
<1:0>  
Interrupt is triggered after:  
0: 1 integration cycle  
1: 4 integration cycles  
2: 8 integration cycles  
3: 16 integration cycles  
02  
03  
04  
05  
06  
07  
Interrupt Threshold  
HI  
7:0  
7:0  
7:0  
7:0  
7:0  
7:0  
Interrupt Threshold High byte of HI interrupt threshold. Default is 0xFF  
HI  
Interrupt Threshold  
LO  
Interrupt Threshold High byte of the LO interrupt threshold. Default is 0x00  
LO  
LSB_Sensor  
MSB_Sensor  
LSB_Timer  
MSB_Timer  
LSB_Sensor  
MSB_Sensor  
LSB_Timer  
MSB_Timer  
Read-Only data register that contains the Least Significant Byte (LSB) of the  
latest sensor reading  
Read-Only data register that contains the Most Significant Byte (MSB) of the  
latest sensor reading  
Read-Only data register that contains the LSB of the timer counter value  
corresponding to the latest sensor reading  
Read-Only data register that contains the MSB of the timer counter value  
corresponding to the latest sensor reading  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 8 of 18  
ISL76683  
4. Photodiode Select Mode; Bits 3 and 2. This function controls  
the mux attached to the two photodiodes. In Mode1, the mux  
directs the current of Diode1 to the ADC. In Mode2, the mux  
directs the current of Diode2 only to the ADC. Mode3 is a  
sequential Mode1 and Mode2 with an internal subtract  
function (Diode1 - Diode2).  
TABLE 2. WRITE ONLY REGISTERS  
REGISTER  
NAME  
FUNCTIONS/  
DESCRIPTION  
ADDRESS  
b1xxx_xxxx  
sync_iic  
clar_int  
Writing a logic 1 to this address bit ends  
the current ADC-integration and starts  
another. Used with External Timing Mode  
only  
TABLE 6. PHOTODIODE SELECT MODE; BITS 2 AND 3  
BITS 3:2  
0:0  
MODE  
bx1xx_xxxx  
Writing a logic 1 to this address bit clears  
the interrupt  
MODE1. ADC integrates or converts Diode1 only. Current  
is converted to an n-bit unsigned data (Note 10)  
0:1  
1:0  
1:1  
MODE2. ADC integrates or coverts Diode2 only. Current is  
converted to an n-bit unsigned data (Note 10)  
Command Register 00(hex)  
The Read/Write command register has five functions:  
MODE3. A sequential MODE1 then MODE2 operation.  
The difference current is an (n-1) signed data (Note 10)  
1. Enable; Bit 7. This function either resets the ADC or enables  
the ADC in normal operation. A logic 0 disables the ADC to  
reset mode. A logic 1 enables the ADC to normal operation.  
No Operation  
NOTE:  
TABLE 3. ENABLE  
10. n = 4, 8, 12, or 16 depending on the number of clock cycles function.  
BIT 7  
OPERATION  
5. Width; Bits 1 and 0. This function determines the number of  
clock cycles per conversion. Changing the number of clock  
cycles changes the resolution of the device and changes the  
integration time, which is the period the device’s ADC  
samples the photodiode current signal for a lux  
measurement.  
0
1
Disable ADC-Core to Reset-Mode (default)  
Enable ADC-Core to Normal Operation  
2. ADCPD; Bit 6. This function puts the device in a power-down  
mode. A logic 0 puts the device in normal operation. A logic 1  
powers down the device.  
TABLE 7. WIDTH  
TABLE 4. ADCPD  
BITS 1:0  
0:0  
NUMBER OF CLOCK CYCLES  
= 65536  
= 4096  
16  
12  
8
BIT 6  
OPERATION  
Normal Operation (default)  
Power-down  
2
2
2
2
0
1
0:1  
1:0  
= 256  
= 16  
4
1:1  
For proper shutdown operation, it is recommended to disable the  
2
ADC first then disable the chip. First send the I C command with  
2
Control Register 01(hex)  
Bit 7 = 0, then send the I C command with Bit 6 = 1.  
The Read/Write control register has three functions:  
3. Timing Mode; Bit 5. This function determines whether the  
integration time is done internally or externally. In Internal  
Timing Mode, integration time is determined by an internal dual  
1. Interrupt flag; Bit 5. This is the status bit of the interrupt. The  
bit is set to logic high when the interrupt thresholds have been  
triggered, and logic low when not yet triggered.  
speed oscillator (f  
), and the n-bit (n = 4, 8, 12, 16) counter  
OSC  
inside the ADC. In External Timing Mode, integration time is  
determined by the time between two consecutive external-sync  
sync_iic pulse commands.  
TABLE 8. INTERRUPT FLAG  
BIT 5  
OPERATION  
Interrupt is cleared or not triggered yet  
Interrupt is triggered  
TABLE 5. TIMING MODE  
0
1
BIT 5  
0
OPERATION  
Internal Timing Mode. Integration time is internally  
timed determined by f  
clock cycles  
, REXT, and the number of  
OSC  
1
External Timing Mode. Integration time is externally  
timed by the I C host  
2
FN7697 Rev 9.00  
Mar 2, 2018  
Page 9 of 18  
ISL76683  
2. Range/Gain; Bits 3 and 2. The Full Scale Range can be  
and the timer counter value can be used to eliminate the  
resulting noise.  
adjusted by an external resistor R  
adjusted with I C using the Gain/Range function.  
and/or it can be  
EXT  
2
TABLE 11. DATA REGISTERS  
Gain/Range has four possible values, Range(k) where k is 1  
through 4. Table 9 lists the possible values of Range(k) and  
ADDRESS  
(hex)  
04  
CONTENTS  
the resulting FSR for some typical value R  
resistors.  
EXT  
Least-significant byte of most recent sensor reading.  
Most-significant byte of most recent sensor reading.  
TABLE 9. RANGE/GAIN TYPICAL FSR LUX RANGES  
05  
FSR LUX  
FSR LUX  
FSR LUX  
06  
Least-significant byte of timer counter value corresponding to  
most recent sensor reading.  
BITS  
3:2  
RANGE  
(k)  
RANGE at  
RANGE at  
RANGE at  
k
1
2
3
4
R
= 100k  
R
= 50k  
R
= 500k  
EXT  
EXT  
EXT  
07  
Most-significant byte of timer counter value corresponding to  
most recent sensor reading.  
0:0  
0:1  
1:0  
1:1  
973  
973  
1946  
195  
3892  
3892  
15,568  
62,272  
7784  
778  
3114  
15,568  
62,272  
31,136  
Calculating Lux  
The ISL76683’s output codes, DATA, are directly proportional to lux.  
124,544  
12,454  
(EQ. 1)  
E =   DATA  
3. Interrupt persist; Bits 1 and 0. The interrupt pin and the  
interrupt flag are triggered/set when the data sensor reading  
is out of the interrupt threshold window after m consecutive  
number of integration cycles. The interrupt persist bits  
determine m.  
The proportionality constant is determined by the Full Scale  
Range, FSR, and the n-bit ADC, which is user defined in the  
command register. The proportionality constant can also be  
viewed as the resolution; the smallest lux measurement the  
device can measure is .  
TABLE 10. INTERRUPT PERSIST  
FSR  
------------  
(EQ. 2)  
=  
BITS 1:0  
0:0  
NUMBER OF INTEGRATION CYCLES  
n
2
1
4
Full Scale Range, FSR, is determined by the software  
programmable Range/Gain, Range(k), in the command register  
0:1  
and an external scaling resistor R , which is referenced to  
100kΩ.  
EXT  
1:0  
8
1:1  
16  
(EQ. 3)  
100k  
-----------------  
FSR = Rangek   
R
EXT  
Interrupt Threshold HI Register 02(hex)  
The transfer function effectively for each timing mode becomes:  
This register sets the HI threshold for the interrupt pin and the  
interrupt flag. By default, the Interrupt threshold HI is FF(hex).  
The 8-bit data written to the register represents the upper MSB of  
a 16-bit value. The LSB is always 00(hex).  
INTERNAL TIMING MODE  
100k  
-----------------  
Rangek   
(EQ. 4)  
R
EXT  
----------------------------------------------------  
E =  
DATA  
DATA  
n
2
Interrupt Threshold LO Register 03(hex)  
EXTERNAL TIMING MODE  
This register sets the LO threshold for the interrupt pin and the  
interrupt flag. By default, the Interrupt threshold LO is 00(hex).  
The 8-bit data written to the register represents the upper MSB of  
a 16-bit value. The LSB is always 00(hex).  
100k  
-----------------  
Rangek   
(EQ. 5)  
R
EXT  
----------------------------------------------------  
E =  
COUNTER  
n = 4, 8, 12, or 16. This is the number of clock cycles  
programmed in the command register.  
Sensor Data Register 04(hex) and 05(hex)  
When the device is configured to output a 16-bit data, the LSB is  
accessed at 04(hex), and the MSB can be accessed at 05(hex).  
The sensor data register is refreshed after every integration cycle.  
Range(k) is the user defined range in the Gain/Range bit in the  
command register.  
R
is an external scaling resistor hardwired to the REXT pin.  
EXT  
Timer Data Register 06(hex) and 07(hex)  
DATA is the output sensor reading in number of counts available  
at the data register.  
Note that the timer counter value is only available when using the  
External Timing Mode. The 06(hex) and 07(hex) are the LSB and  
MSB, respectively, of a 16-bit timer counter value corresponding  
to the most recent sensor reading. Each clock cycle increments  
the counter. At the end of each integration period, the value of  
n
2 represents the maximum number of counts possible in  
Internal Timing Mode. For the External Timing Mode, the  
maximum number of counts is stored in the data register named  
COUNTER.  
2
this counter is made available over the I C. This value can be  
used to eliminate noise introduced by slight timing errors caused  
by imprecise external timing. For example, microcontrollers often  
cannot provide high-accuracy command-to-command timing,  
COUNTER is the number increments accrued for between  
integration time for External Timing Mode.  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 10 of 18  
ISL76683  
The automatic f  
OSC  
improvement of signal-to-noise ratio when detecting very low lux  
signals.  
adjustment feature allows significant  
Gain/Range, Range (k)  
The Gain/Range can be programmed in the control register to  
give Range (k) determining the FSR. Note that Range(k) is not  
the FSR (see Equation 3). Range(k) provides four constants  
Integration Time or Conversion Time  
depending on programmed k that will be scaled by R  
(see  
EXT  
Integration time is the period during which the device’s ADC  
samples the photodiode current signal for a lux measurement.  
Integration time, in other words, is the time to complete the  
conversion of analog photodiode current into a digital signal  
(number of counts).  
Table 9). Unlike R , Range(k) dynamically adjusts the FSR. This  
EXT  
function is especially useful for maintaining excellent resolution  
when light conditions are varying drastically.  
Number of Clock Cycles, n-bit ADC  
The number of clock cycles determines “n” in the n-bit ADC; 2 clock  
n
Integration time affects the measurement resolution. For better  
resolution, use a longer integration time. For short and fast  
conversions, use a shorter integration time.  
cycles is a n-bit ADC. n is programmable in the command register in  
the width function. Depending on the application, a good balance of  
speed and resolution has to be considered when deciding for n. For  
fast and quick measurement, choose the smallest n = 4. For  
maximum resolution without regard of time, choose n = 16.  
Table 12 compares the trade-off between integration time and  
resolution. See Equations 10 and 11 for the relation between  
integration time and n. See Equation 3 for the relation between n  
and resolution.  
The ISL76683 offers user flexibility in the integration time to  
balance resolution, speed, and noise rejection. Integration time can  
be set internally or externally and can be programmed in the  
command register 00(hex) Bit 5.  
INTEGRATION TIME IN INTERNAL TIMING MODE  
This timing mode is programmed in the command register  
00(hex) Bit 5. Most applications use this timing mode. When  
TABLE 12. RESOLUTION AND INTEGRATION TIME SELECTION  
using the Internal Timing Mode, f  
and n-bits resolution  
OSC  
determine the integration time. t is a function of the number of  
RANGE1  
RANGE4  
f
= 327kHz  
f
= 655kHz  
int  
OSC  
OSC  
clock cycles and f  
.
OSC  
RESOLUTION  
LUX/COUNT  
RESOLUTION  
(LUX/COUNT)  
n
1
(EQ. 9)  
n
16  
12  
8
t
(ms)  
t
(ms)  
----------  
INT  
INT  
100  
for Internal Timing Mode only  
t
= 2  
int  
f
osc  
200  
0.01  
0.24  
3.90  
62.5  
1
12.8  
0.8  
6.4  
0.4  
16  
n = 4, 8, 12, and 16. n is the number of bits of resolution.  
n
250  
4000  
Therefore, 2 is the number of clock cycles. n can be programmed  
at the command register 00(hex) bits 1 and 0.  
4
0.05  
0.025  
NOTE: R  
= 100kΩ  
EXT  
t
is dual time because f  
is dual speed depending on the  
OSC  
int  
Gain/Range bit. Integration time as a function of R  
and n is:  
EXT  
External Scaling Resistor R  
The ISL76683 uses an external resistor R  
and f  
to fix its internal  
determines the  
, a dual  
R
n
EXT  
EXT  
osc  
EXT  
(EQ. 10)  
----------------------------------------------  
t
= 2  
int1  
327kHz 100k  
oscillator frequency, f  
. Consequently, R  
OSC EXT  
t
is the integration time when the device is configured for  
Internal Timing Mode and Gain/Range is set to Range1 or  
int1  
f
, integration time, and the FSR of the device. f  
OSC OSC  
speed mode oscillator, is inversely proportional to R . For user  
simplicity, the proportionality constant is referenced to fixed  
constants 100kΩ and 655kHz:  
EXT  
Range2.  
R
n
EXT  
(EQ. 11)  
----------------------------------------------  
t
= 2  
int2  
655kHz 100k  
(EQ. 6)  
(EQ. 7)  
1
2
100k  
-- -----------------  
655kHz  
fosc1 =  
fosc2 =  
R
EXT  
t
is the integration time when the device is configured for  
Internal Timing Mode and Gain/Range is set to Range3 or  
Range4.  
int2  
100k  
-----------------  
655kHz  
R
EXT  
f
1 is the oscillator frequency when Range1 or Range2 are  
OSC  
set. This is nominally 327kHz when R  
is 100kΩ.  
EXT  
f
2 is the oscillator frequency when Range3 or Range4 are  
OSC  
set. This is nominally 655kHz when R  
is 100kΩ.  
EXT  
When the Range/Gain bits are set to Range1 or Range2, f  
OSC  
runs at half speed compared to when Range/Gain bits are set to  
Range3 and Range4.  
(EQ. 8)  
1
2
--  
1 = f  
f
2  
OSC  
OSC  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 11 of 18  
ISL76683  
TABLE 13. INTEGRATION TIMES FOR TYPICAL R  
EXT  
VALUES (Note 11)  
Noise Rejection  
Integrating type ADCs generally have excellent noise-rejection  
characteristics for periodic noise with frequencies that are an  
integer multiple of the integration time. For instance, a 60Hz AC  
RANGE1  
RANGE2  
RANGE3  
RANGE4  
R
(kΩ  
EXT  
n = 16-BIT  
n = 12-BIT  
6.4  
n = 12-BIT  
n = 4  
0.013  
0.025  
unwanted signal’s sum from 0ms to k*16.66ms (k = 1, 2...k ) is  
i
zero. Similarly, setting the device’s integration time to an integer  
multiple of the periodic noise signal greatly improves the light  
sensor output signal in the presence of noise.  
50  
100  
200  
3.2  
6.5  
100  
(Note 12)  
13  
DESIGN EXAMPLE 1  
200  
500  
400  
26  
64  
13  
32  
0.050  
0.125  
The ISL76683 will be designed in a portable system. The  
ambient light conditions that the device will be exposed to are at  
most 500 lux, which is a good office lighting. The light source has  
a 50/60Hz power line noise, which is not visible to the human  
1000  
NOTES:  
11. Integration time in milliseconds.  
12. Recommended R resistor value.  
2
eye. The I C clock is 10kHz.  
EXT  
Solution 1 - Using Internal Timing Mode  
INTEGRATION TIME IN EXTERNAL TIMING MODE  
To achieve both 60Hz and 50Hz AC noise rejection, the  
integration time must be adjusted to coincide with an integer  
multiple of the AC noise cycle times.  
(EQ. 14)  
This timing mode is programmed in the command register  
00(hex) Bit 5. External Timing Mode is recommended when  
integration time can be synchronized to an external signal (such  
as a PWM) to eliminate noise.  
t
= i1 60Hz= j1 50Hz  
int  
For Mode1 or Mode2 operation, the integration starts when the  
sync_iic command is sent over the I C lines. The device needs  
two sync_iic commands to complete a photodiode conversion.  
The integration then stops when another sync_iic command is  
received. Writing a logic 1 to the sync_iic bit ends the current  
ADC integration and starts another one.  
The first instance of integer values at which t rejects both 60Hz  
int  
and 50Hz is when i = 6 and j = 5.  
2
t
= 61 60Hz= 51 50Hz  
= 100ms  
int  
int  
(EQ. 15)  
t
For Mode3, the operation is a sequential Mode1 and Mode2. The  
device needs three sync_iic commands to complete two  
photodiode measurements. The first sync_iic command starts the  
conversion of the Diode1. The second sync_iic completes the  
conversion of Diode1 and starts the conversion of Diode2. The  
third sync_iic pulse ends the conversion of Diode2 and starts over  
again to commence conversion of Diode1.  
Next, determine the Gain/Range. Based on the application  
condition given, lux(max) = 500 lux, a range of 1000 lux is  
desirable. This corresponds to a Gain/Range Range1 mode.  
Impose a resolution of n = 16-bit. Equation 10 determines R  
.
EXT  
t
327kHz 100k  
int  
------------------------------------------------------------  
R
=
EXT  
n
2
(EQ. 16)  
The integration time, t , is determined by Equation 12:  
int  
R
= 50k  
EXT  
i 2  
I
C
----------  
t
=
(EQ. 12)  
int  
f 2  
Note: For Internal Timing Mode and Gain/Range set to Range3 or  
Range4 only.  
I
C
2
2
i
f
is the number of I C clock cycles to obtain the t  
I C  
int.  
Equation 3 determines the Full Scale Range, FSR:  
2
2
is the I C operating frequency.  
I C  
100k  
50k  
-----------------  
FSR = 1000 lux  
(EQ. 17)  
(EQ. 18)  
The internal oscillator, f  
, operates identically in both the  
internal and external timing modes, with the same dependence  
OSC  
FSR = 2000 lux  
on R . However, in External Timing Mode, the number of clock  
EXT  
n
cycles per integration is no longer fixed at 2 . The number of  
The effective transfer function becomes:  
clock cycles varies with the chosen integration time, and is  
data  
16  
limited to 2 = 65536. To avoid erroneous lux readings, the  
-------------  
16  
E =  
2000 lux  
2
integration time must be short enough to not allow an overflow in  
the counter register.  
65,535  
-----------------  
t
(EQ. 13)  
when Range/Gain is set to Range1  
when Range/Gain is set to Range3  
int  
f
OSC  
f
= 327kHz*100kΩ/R  
or Range2.  
OSC  
EXT  
EXT  
f
= 655kHz*100kΩ/R  
OSC  
or Range4.  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 12 of 18  
ISL76683  
TABLE 14. SOLUTION1 SUMMARY TO EXAMPLE DESIGN PROBLEM  
IR Rejection  
DESIGN PARAMETER  
VALUE  
100ms  
All filament type light sources have a high presence of infrared  
component invisible to the human eye. A white fluorescent lamp,  
however, has a low IR content. As a result, output sensitivity may  
vary depending on the light source. Maximum attenuation of IR  
can be achieved by properly scaling the readings of Diode1 and  
Diode2. Obtain data readings from sensor Diode1 (D1), which is  
sensitive to visible and IR, then read from sensor Diode2 (D2),  
which is mostly sensitive from IR. Equation 19 describes the  
method of cancelling IR in Internal Timing mode.  
t
int  
R
50kΩ  
EXT  
Gain/Range Mode  
FSR  
Range1 = 1000 lux  
2000 lux  
16  
2
Number of Clock Cycles  
Transfer Function  
DATA  
----------------  
(EQ. 19)  
E =  
2000 lux  
D3 = nD1 kD2  
16  
2
where:  
Solution 2 - Using External Timing Mode  
From Solution 1, the desired integration time is 100ms. Note  
that the R resistor only determines the inter oscillator  
Data = lux amount in number of counts less IR presence  
D1 = data reading of Diode1  
D2 = data reading of Diode2  
EXT  
frequency when using External Timing mode. Instead, the  
integration time is the time between two sync_iic commands  
sent through the I C. The programmer determines how many I C  
clock cycles to wait between two external timing commands.  
n = 1.85. This is a rounding factor to scale back the sensitivity to  
ensure Equation 4 is valid.  
2
2
k = 7.5. This is a scaling factor for the IR sensitive Diode2.  
2
2
2
i
i
i
= f  
t
= number of I C clock cycles  
I C  
I C* int  
2
Flat Window Lens Design  
A window lens will surely limit the viewing angle of the ISL76683.  
The window lens should be placed directly on top of the device.  
The thickness of the lens should be kept at minimum to  
= 10kHz 100ms  
*
I C  
2
2
= 1,000 I C clock cycles. An external sync_iic command sent  
I C  
1000 cycles after another sync_iic command rejects both 60Hz  
and 50Hz AC noise signals.  
minimize loss of power due to reflection and also to minimize  
loss of loss due to absorption of energy in the plastic material. A  
thickness of t = 1mm is recommended for a window lens design.  
The bigger the diameter of the window lens, the wider the  
viewing angle is of the ISL76683. Table 16 on page 14 shows the  
recommended dimensions of the optical window to ensure both  
35° and 45° viewing angle. These dimensions are based on a  
window lens thickness of 1.0mm and a refractive index of 1.59.  
Next, pick an arbitrary R  
EXT  
Gain/Range Mode. For a maximum 500 lux, Range1 is  
adequate. From Equation 3:  
= 100kΩ and choose the  
100k  
100k  
-----------------  
FSR = 1000 lux  
FSR = 1000 lux  
The effective transfer function becomes:  
WINDOW LENS  
DATA  
COUNTER  
-------------------------------  
E =  
1000 lux  
DATA is the sensor reading data located in data registers 04(hex)  
and 05(hex)  
t
D
TOTAL  
D1  
COUNTER is the timer counter value data located in data registers  
06(hex) and 07(hex). In this sample problem, COUNTER = 1000.  
TABLE 15. SOLUTION 2 SUMMARY TO EXAMPLE DESIGN PROBLEM  
DESIGN PARAMETER  
VALUE  
100ms  
ISL76683  
D
LENS  
t
int  
= VIEWING ANGLE  
R
100kΩ  
EXT  
FIGURE 15. FLAT WINDOW LENS  
Gain/Range Mode  
FSR  
Range1 = 1000 lux  
1000 lux  
# of Clock Cycles  
Transfer Function  
COUNTER = 1000  
DATA  
-------------------------------  
E =  
1000 lux  
COUNTER  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 13 of 18  
ISL76683  
TABLE 16. RECOMMENDED DIMENSIONS FOR A FLAT WINDOW  
DESIGN  
Window with Light Guide Design  
If a smaller window is desired while maintaining a wide effective  
viewing angle of the ISL76683, a cylindrical piece of transparent  
plastic called the light guide or light pipe is needed to trap the  
light and focus the light on to the device. The pipe should be  
placed directly on top of the device with a distance of  
D1 = 0.5mm to achieve peak performance. The light pipe should  
have a minimum diameter of 1.5mm to ensure that whole area  
of the sensor will be exposed (see Figure 16).  
D
AT 35° VIEWING  
ANGLE  
D
AT 45° VIEWING  
ANGLE  
LENS  
LENS  
D
D1  
TOTAL  
1.5  
0.50  
1.00  
1.50  
2.00  
2.50  
2.25  
3.00  
3.75  
4.30  
5.00  
3.75  
4.75  
5.75  
6.75  
7.75  
2.0  
2.5  
3.0  
3.5  
t = 1  
D1  
Thickness of lens  
Distance between ISL76683 and inner edge of lens  
Diameter of lens  
Distance constraint between the ISL76683 and lens  
outer edge  
D
D
LENS  
TOTAL  
NOTE: All dimensions are in mm.  
D
LENS  
LIGHT PIPE  
D
>1.5mm  
2
t
D
LENS  
D
2
L
ISL76683  
FIGURE 16. WINDOW WITH LIGHT GUIDE/PIPE  
ꢀꢁꢆꢂPP  
ꢂꢁꢀꢇPP  
ꢀꢁꢂꢂPP  
ꢂꢁꢀꢅPP  
ꢂꢁꢇꢈPP  
ꢂꢁꢀꢇPP  
ꢂꢁꢄPP  
FIGURE 17. SENSOR LOCATION DRAWING  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 14 of 18  
ISL76683  
Suggested PCB Footprint  
Typical Circuit  
Footprint pads should be a nominal 1-to-1 correspondence with  
package pads. Because ambient light sensor devices do not  
dissipate high power, heat dissipation through the exposed pad is  
not important; instead, similar to DFN or QFN, the exposed pad  
provides robustness in board mount process. Renesas  
recommends mounting the exposed pad to the PCB, but this is  
not mandatory.  
A typical application for the ISL76683 is shown in Figure 18. The  
2
ISL76683’s I C address is internally hardwired as 1000100. The  
2
device can be tied onto a system’s I C bus together with other  
2
I C compliant devices.  
Soldering Considerations  
Convection heating is recommended for reflow soldering; direct  
infrared heating is not recommended. The plastic ODFN package  
does not require a custom reflow soldering profile, and is  
qualified to +260°C. A standard reflow soldering profile with a  
+260°C maximum is recommended.  
Layout Considerations  
The ISL76683 is relatively insensitive to layout. Like other I C  
devices, it is intended to provide excellent performance even in  
significantly noisy environments. The following considerations  
will ensure the best performance.  
2
2
Route the supply and I C traces as far as possible from all  
sources of noise. Use two power supply decoupling capacitors,  
4.7µF and 0.1µF, placed close to the device.  
1.8V TO 5.5V  
2
I C MASTER  
R1  
R2  
R3  
10kΩ 10kΩ RES1  
MICROCONTROLLER  
SDA  
SCL  
2.5V TO 3.3V  
2
2
2
I C SLAVE_1  
I C SLAVE_0  
I C SLAVE_n  
1
2
6
5
4
SDA  
SCL  
SDA  
SCL  
VDD  
SDA  
SCL  
INT  
GND  
REXT  
C1  
C2  
3
4.7µF 0.1µF  
R
EXT  
ISL76683  
100kΩ  
FIGURE 18. ISL76683 TYPICAL CIRCUIT  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 15 of 18  
ISL76683  
Revision History  
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you  
have the latest revision.  
DATE  
REVISION  
FN7697.9  
CHANGE  
Mar 2, 2018  
Applied Renesas logo in header and footer.  
Updated Related Literature section on page 1.  
Updated Figure 17 on page 14.  
Removed About Intersil section and added Renesas disclaimer.  
Feb 26, 2016  
FN7697.8  
Removed sentence from “IR Rejection” on page 13, which referred to Figure 2.  
Added Tape and Reel column to show units in “Ordering Information Table” on page 2.  
Abs Max Ratings on page 3 - changed testing information from “Charge Device Model (Tested per  
JESD22-C101C)” to “Charge Device Model (Tested per AEC-Q100-011)”. “Human Body Model (Tested per  
JESD22-A114E)” to Human Body Model (Tested per AEC-Q100-002)”. “Machine Model (Tested per  
JESD-A115-A)” to Machine Model (Tested per AEC-Q100-003). “Latch-up (Tested per JESD78B” to Latch-Up  
(Tested per AEC-Q100-004, Class II, Level A).  
Updated POD to most current revision. Revision POD change is as follows:  
Changed Note 5 From: Tiebar shown (if present) is a non-functional feature.  
To: Tiebar shown (if present) is a non-functional feature and maybe located on any of the 4 sides (or ends).  
Mar 24, 2014  
Dec 23, 2013  
FN7697.7  
FN7697.6  
Added AEC-Q100 qualified to features on page 1.  
Added Related Literature on page 1.  
Added Eval board to ordering information on page 2.  
Updated Figure 17 Sensor Location Drawing with Pin 1 Marking.  
Page 16  
- 2nd line of the disclaimer changed from:  
"Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted"  
to:  
"Intersil Automotive Qualified products are manufactured, assembled and tested utilizing TS16949 quality  
systems as noted"  
Jul 22, 2013  
Oct 30, 2012  
FN7697.5  
FN7697.4  
Removed Confidential Watermark, Updated Product Information verbiage to About Intersil verbiage.  
Added ISL76683AROZ-T7A to “Ordering Information” on page 2.  
Updated “Package Outline Drawing” on page 17. Added "MAX 0.75" dimension to Side View.  
Jul 9, 2012  
FN7697.3  
In “Control Register 01(hex)” on page 9, removed sentence: “Writing a logic low clears/resets the status bit.”  
from “1. Interrupt flag; Bit 5”  
Mar 8, 2011  
Jan 24, 2011  
FN7697.2  
FN7697.1  
Changed TechBrief reference in ordering information for MSL info from TB363 to TB477.  
Initial Release to web.  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 16 of 18  
ISL76683  
For the most recent package outline drawing, see L6.2x2.1.  
Package Outline Drawing  
L6.2x2.1  
6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN)  
Rev 4, 2/15  
2.10  
A
6
B
PIN #1  
INDEX AREA  
6
1
PIN 1  
INDEX AREA  
0.65  
1.35 1.30 REF  
2.00  
4
6x0.30 ±0.05  
(4X)  
0.10  
0.10 M C A B  
0.65  
6x0.35 ±0.05  
TOP VIEW  
BOTTOM VIEW  
2.50  
2.10  
PACKAGE  
OUTLINE  
SEE DETAIL "X"  
0.10 C  
0.65  
(4x0.65)  
MAX 0.75  
C
BASE PLANE  
SEATING PLANE  
0.08 C  
SIDE VIEW  
0.2 REF  
(1.35)  
5
C
(6x0.30)  
(6x0.20)  
(6x0.55)  
TYPICAL RECOMMENDED LAND PATTERN  
0.00 MIN.  
0.05 MAX.  
DETAIL "X"  
NOTES:  
1. Dimensions are in millimeters.  
Dimensions in ( ) for Reference Only.  
2. Dimensioning and tolerancing conform to ASME Y14.5m-1994.  
3.  
Unless otherwise specified, tolerance: Decimal ± 0.05  
4. Dimension applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
Tiebar shown (if present) is a non-functional feature and  
maybe located on any of the 4 sides (or ends).  
5.  
6.  
The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
FN7697 Rev 9.00  
Mar 2, 2018  
Page 17 of 18  
Notice  
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for  
the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by  
you or third parties arising from the use of these circuits, software, or information.  
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or  
arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application  
examples.  
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.  
4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by  
you or third parties arising from such alteration, modification, copying or reverse engineering.  
5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the  
product’s quality grade, as indicated below.  
"Standard":  
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic  
equipment; industrial robots; etc.  
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.  
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are  
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause  
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liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or  
other Renesas Electronics document.  
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reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation  
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified  
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certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas  
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and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.  
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sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics  
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable  
laws and regulations.  
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or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or  
transactions.  
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third  
party in advance of the contents and conditions set forth in this document.  
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.  
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.  
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.  
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.  
(Rev.4.0-1 November 2017)  
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Refer to "http://www.renesas.com/" for the latest and detailed information.  
http://www.renesas.com  
Renesas Electronics America Inc.  
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.  
Tel: +1-408-432-8888, Fax: +1-408-434-5351  
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9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3  
Tel: +1-905-237-2004  
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Tel: +44-1628-651-700, Fax: +44-1628-651-804  
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Tel: +49-211-6503-0, Fax: +49-211-6503-1327  
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Tel: +82-2-558-3737, Fax: +82-2-558-5338  
© 2018 Renesas Electronics Corporation. All rights reserved.  
Colophon 7.0  

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