NE3520S03-T1D [RENESAS]

N-Channel GaAs HJ-FET, K Band Low Noise and High-Gain; N沟道砷化镓HJ -FET ,K波段低噪声和高增益
NE3520S03-T1D
型号: NE3520S03-T1D
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

N-Channel GaAs HJ-FET, K Band Low Noise and High-Gain
N沟道砷化镓HJ -FET ,K波段低噪声和高增益

文件: 总10页 (文件大小:210K)
中文:  中文翻译
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Data Sheet  
NE3520S03  
N-Channel GaAs HJ-FET, K Band Low Noise and High-Gain  
R09DS0029EJ0100  
Rev.1.00  
Oct 18, 2011  
FEATURES  
Low noise figure and high associated gain:  
NF = 0.65 dB TYP., Ga = 13.5 dB TYP. @ f = 20 GHz, VDS = 2 V, ID = 10 mA  
K band Micro-X plastic (S03) package  
APPLICATIONS  
20 GHz band DBS LNB  
Other K band communication system  
ORDERING INFORMATION  
Part Number  
Order Number  
Package  
S03 package  
(Pb-Free)  
Quantity  
Marking  
Supplying Form  
NE3520S03-T1C  
NE3520S03-T1C-A  
2 kpcs/reel  
J
Embossed tape 8 mm wide  
Pin 4 (Gate) face the  
perforation side of the tape  
NE3520S03-T1D  
NE3520S03-T1D-A  
10 kpcs/reel  
Remark To order evaluation samples, please contact your nearby sales office.  
Part number for sample order: NE3520S03  
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
Symbol  
VDS  
VGS  
ID  
Ratings  
Unit  
4.0  
V
–3.0  
V
IDSS  
mA  
μA  
mW  
°C  
Gate Current  
IG  
100  
Total Power Dissipation Note  
Channel Temperature  
Storage Temperature  
Ptot  
165  
Tch  
+125  
Tstg  
–65 to +125  
°C  
Note: Mounted on 1.08 cm2 × 1.0 mm (t) glass epoxy PWB  
CAUTION  
Observe precautions when handling because these devices are sensitive to electrostatic discharge.  
R09DS0029EJ0100 Rev.1.00  
Oct 18, 2011  
Page 1 of 8  
NE3520S03  
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)  
Parameter  
Drain to Source Voltage  
Drain Current  
Symbol  
MIN.  
+1  
5
TYP.  
MAX.  
Unit  
VDS  
+2  
+3  
V
ID  
10  
15  
mA  
dBm  
Input Power  
Pin  
0
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)  
Parameter  
Gate to Source Leak Current  
Saturated Drain Current  
Gate to Source Cut-off Voltage  
Transconductance  
Symbol  
Test Conditions  
VGS = –3.0 V  
VDS = 2 V, VGS = 0 V  
MIN.  
TYP.  
MAX.  
Unit  
μA  
mA  
V
IGSO  
0.5  
10  
IDSS  
25  
40  
70  
VGS (off) VDS = 2 V, ID = 100 μA  
–0.2  
50  
–0.7  
65  
–1.3  
gm  
NF  
Ga  
VDS = 2 V, ID = 10 mA  
mS  
dB  
dB  
Noise Figure  
VDS = 2 V, ID = 10 mA, f = 20 GHz  
0.65  
13.5  
0.90  
Associated Gain  
11.5  
R09DS0029EJ0100 Rev.1.00  
Oct 18, 2011  
Page 2 of 8  
NE3520S03  
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)  
TOTAL POWER DISSIPATION  
vs. AMBIENT TEMPERATURE  
250  
Mounted on Glass Epoxy PCB  
(1.08 cm2 × 1.0 mm (t) )  
200  
150  
100  
50  
0
50  
100  
150  
200  
(°C)  
250  
Ambient Temperature T  
A
DRAIN CURRENT vs.  
DRAIN CURRENT vs.  
DRAIN TO SOURCE VOLTAGE  
GATE TO SOURCE VOLTAGE  
80  
70  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
V
DS = 2 V  
V
GS = 0 V  
0.1 V  
0.2 V  
0.3 V  
0.4 V  
0.5 V  
0.0  
1.0  
2.0  
3.0  
4.0  
–0.8  
–0.6  
–0.4  
–0.2  
0
Drain to Source Voltage VDS (V)  
Gate to Source Voltage VGS (V)  
MINIMUM NOISE FIGURE,  
ASSOCIATED GAIN vs. FREQUENCY  
MINIMUM NOISE FIGURE,  
ASSOCIATED GAIN vs. DRAIN CURRENT  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
16  
15  
14  
13  
12  
11  
10  
9
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
f = 20 GHz  
V
DS = 2 V  
= 10 mA  
V
DS = 2 V  
I
D
G
a
G
a
NFmin  
8
NFmin  
7
6
10  
15  
20  
25  
0
5
10  
15  
(mA)  
20  
25  
Frequency f (GHz)  
Drain Current I  
D
Remark The graphs indicate nominal characteristics.  
R09DS0029EJ0100 Rev.1.00  
Oct 18, 2011  
Page 3 of 8  
NE3520S03  
S-PARAMETERS  
S-parameters/Noise-parameters are provided on our web site in a form (S2P) that enables direct import to a microwave  
circuit simulator without keyboard input.  
Click here to download S-parameters.  
[RF and Microwave] [Device Parameters]  
URL http://www2.renesas.com/microwave/  
R09DS0029EJ0100 Rev.1.00  
Oct 18, 2011  
Page 4 of 8  
NE3520S03  
RF MEASURING LAYOUT PATTERN (REFERENCE ONLY) (UNIT: mm)  
2.80  
2.60  
2.06  
0.64  
S–S2.2mm  
1.7  
1.7  
Reference Plane  
Reference Plane  
(Calibration Plane)  
(Calibration Plane)  
φ
0.3 TH  
6.0  
RT/duroid 5880/ROGERS  
t = 0.254 mm  
εr = 2.20  
tan delta = 0.0009 @10 GHz  
Au-flash plate  
R09DS0029EJ0100 Rev.1.00  
Oct 18, 2011  
Page 5 of 8  
NE3520S03  
PACKAGE DIMENSIONS  
S03 (UNIT: mm)  
(Top View)  
(Bottom View)  
3.2 0.2  
0.65 TYP.  
2.2 0.2  
1
1
J
4
2
2
4
3
3
(Side View)  
2.2 0.2  
1.7  
3.2 0.2  
PIN CONNECTIONS  
1. Source  
2. Drain  
3. Source  
4. Gate  
R09DS0029EJ0100 Rev.1.00  
Oct 18, 2011  
Page 6 of 8  
NE3520S03  
RECOMMENDED SOLDERING CONDITIONS  
This product should be soldered and mounted under the following recommended conditions. For soldering methods and  
conditions other than those recommended below, contact your nearby sales office.  
Soldering Method  
Soldering Conditions  
Condition Symbol  
Infrared Reflow  
Peak temperature (package surface temperature) : 260°C or below  
IR260  
Time at peak temperature  
: 10 seconds or less  
: 60 seconds or less  
: 120 30 seconds  
: 3 times  
Time at temperature of 220°C or higher  
Preheating time at 120 to 180°C  
Maximum number of reflow processes  
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below  
Partial Heating  
Peak temperature (terminal temperature)  
Soldering time (per side of device)  
: 350°C or below  
: 3 seconds or less  
HS350  
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below  
CAUTION  
Do not use different soldering methods together (except for partial heating).  
R09DS0029EJ0100 Rev.1.00  
Oct 18, 2011  
Page 7 of 8  
NE3520S03  
This product uses gallium arsenide (GaAs).  
Caution GaAs Products  
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe  
the following points.  
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws  
and/or ordinances, dispose of the product as recommended below.  
1. Commission a disposal company able to (with a license to) collect, transport and dispose of  
materials that contain arsenic and other such industrial waste materials.  
2. Exclude the product from general industrial waste and household garbage, and ensure that the  
product is controlled (as industrial waste subject to special control) up until final disposal.  
• Do not burn, destroy, cut, crush, or chemically dissolve the product.  
• Do not lick the product or in any way allow it to enter the mouth.  
R09DS0029EJ0100 Rev.1.00  
Oct 18, 2011  
Page 8 of 8  
Revision History  
NE3520S03 Data Sheet  
Description  
Summary  
Rev.  
1.00  
Date  
Page  
Oct 18, 2011  
-
First edition issued  
All trademarks and registered trademarks are the property of their respective owners.  
C - 1  
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