V62/08610-01XB [RENESAS]

Switching Controller, Voltage-mode, 700kHz Switching Freq-Max, PQCC16;
V62/08610-01XB
型号: V62/08610-01XB
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Switching Controller, Voltage-mode, 700kHz Switching Freq-Max, PQCC16

文件: 总4页 (文件大小:114K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ISL6406MREP, ISL6406MVEP  
®
Data Sheet  
December 18, 2007  
FN6613.0  
Enhanced Product (EP) Single  
Synchronous Buck Pulse-Width  
Modulation (PWM) Controller  
Features  
• Specifications per DSCC VID V62/08610  
• Full Mil-Temp Electrical Performance from -55°C to +125°C  
The ISL6406MREP and ISL6406MVEP are adjustable  
frequency, synchronous buck switching regulators optimized  
for generating lower voltages for distributed DC/DC  
architectures. Both devices feature an adjustable output  
voltage.  
• Controlled Baseline with One Wafer Fabrication Site and  
One Assembly/Test Site  
• Full Homogeneous Lot Processing in Wafer Fab  
• No Combination of Wafer Fabrication Lots in Assembly  
Designed to drive N-Channel MOSFETs in a synchronous  
buck topology, the ISL6406MREP and ISL6406MVEP  
integrate the control, output adjustment and protection  
functions into a single package.  
• Full Traceability Through Assembly and Test by  
Date/Trace Code Assignment  
• Enhanced Process Change Notification  
• Enhanced Obsolescence Management  
• Eliminates Need for Up-Screening a COTS Component  
• Operates from 3.3V/5V Input  
The ISL6406MREP and ISL6406MVEP provide simple,  
single feedback loop, voltage-mode control with fast  
transient response. The output voltage can be precisely  
regulated to as low as 0.8V. The error amplifier features a  
15MHz gain-bandwidth product and 6V/μs slew rate which  
enables high converter bandwidth for fast transient  
performance.  
• 0.8V to V Output Range  
IN  
- 0.8V Internal Reference  
- ±2.1% Reference Accuracy Over-Temperature  
Protection from overcurrent conditions is provided by  
• Simple Single-Loop Control Design  
- Voltage-Mode PWM Control  
monitoring the r  
of the upper MOSFET to inhibit PWM  
DS(ON)  
operation appropriately. This approach simplifies the  
implementation and improves efficiency by eliminating the  
need for a current sense resistor.  
• Fast Transient Response  
- High-Bandwidth Error Amplifier  
• Lossless, Programmable Overcurrent Protection  
The wide programmable switching frequency range of  
100kHz to 700kHz allows the use of small surface mount  
inductors and capacitors. The device also provides external  
frequency synchronization making it an ideal choice for  
DC/DC converter applications.  
- Uses Upper MOSFET’s r  
DS(on)  
• Programmable Switching Frequency 100kHz to 700kHz  
• External Frequency Synchronization  
• Internal Soft-Start  
Device Information  
Applications  
• 3V/5V DC/DC Converter Modules  
The specifications for an Enhanced Product (EP) device are  
defined in a Vendor Item Drawing (VID), which is controlled  
by the Defense Supply Center in Columbus (DSCC). “Hot-  
links” to the applicable VID and other supporting application  
information are provided on our website.  
• Distributed DC/DC 3.3V, 2.5V and 1.8V Power  
Architectures for DSP, Logic, and Memory  
• Power Supplies for Microprocessors  
- PCs  
- Embedded Controllers  
• Memory Supplies  
• Personal Computer Peripherals  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2007. All Rights Reserved  
1
All other trademarks mentioned are the property of their respective owners.  
ISL6406MREP, ISL6406MVEP  
Pinouts  
ISL6406MREP  
(16 LD QFN)  
TOP VIEW  
ISL6406MVEP  
(16 LD TSSOP)  
TOP VIEW  
GND  
1
16 UGATE  
15 BOOT  
14 PHASE  
13 VCC  
LGATE  
CPVOUT  
OCSET  
CT1  
2
3
4
5
6
7
8
16 15 14 13  
CPVOUT  
PHASE  
VCC  
1
2
3
4
12  
11  
10  
9
12 CPGND  
11 COMP  
10 VOUT  
OCSET  
CT1  
CT2  
CPGND  
COMP  
RT  
CT2  
9
FB  
SYNC/EN  
5
6
7
8
Ordering Information  
VENDOR PART NUMBER  
(Notes 1, 2)  
VENDOR ITEM  
DRAWING  
PART MARKING  
6406MREP  
TEMP. RANGE (°C)  
-55 to +125  
PACKAGE  
16 Ld 5x5 QFN  
16 Ld 5x5 QFN  
16 Ld TSSOP  
16 Ld TSSOP  
PKG. DWG. #  
L16.5x5B  
L16.5x5B  
M16.173  
ISL6406MREP  
ISL6406MREP-TK  
ISL6406MVEP  
ISL6406MVEP-TK  
NOTES:  
V62/08610-01XB  
V62/08610-01XB  
V62/08610-01YB  
V62/08610-01YB  
6406MREP  
6406 MVEP  
6406 MVEP  
-55 to +125  
-55 to +125  
-55 to +125  
M16.173  
1. “-TK” suffix IS for 1,000 piece quantity tape and reel. Please refer to TB347 for details on reel specifications.  
2. Devices must be procured to the VENDOR PART NUMBER.  
FN6613.0  
December 18, 2007  
2
ISL6406MREP, ISL6406MVEP  
Quad Flat No-Lead Plastic Package (QFN)  
Micro Lead Frame Plastic Package (MLFP)  
L16.5x5B  
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE  
(COMPLIANT TO JEDEC MO-220VHHB ISSUE C)  
MILLIMETERS  
SYMBOL  
MIN  
NOMINAL  
MAX  
1.00  
0.05  
1.00  
NOTES  
A
0.80  
0.90  
-
A1  
A2  
A3  
b
-
-
-
-
-
9
0.20 REF  
9
0.28  
2.95  
2.95  
0.33  
0.40  
3.25  
3.25  
5, 8  
D
5.00 BSC  
-
D1  
D2  
E
4.75 BSC  
9
3.10  
7, 8  
5.00 BSC  
-
E1  
E2  
e
4.75 BSC  
9
3.10  
7, 8  
0.80 BSC  
-
k
0.25  
0.35  
-
-
-
-
L
0.60  
0.75  
0.15  
8
L1  
N
-
16  
4
4
-
10  
2
Nd  
Ne  
P
3
3
-
-
0.60  
12  
9
θ
-
9
Rev. 1 10/02  
NOTES:  
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.  
2. N is the number of terminals.  
3. Nd and Ne refer to the number of terminals on each D and E.  
4. All dimensions are in millimeters. Angles are in degrees.  
5. Dimension b applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
6. The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
7. Dimensions D2 and E2 are for the exposed pads which provide  
improved electrical and thermal performance.  
8. Nominal dimensionsare provided toassistwith PCBLandPattern  
Design efforts, see Intersil Technical Brief TB389.  
9. Features and dimensions A2, A3, D1, E1, P & θ are present when  
Anvil singulation method is used and not present for saw  
singulation.  
10. Depending on the method of lead termination at the edge of the  
package, a maximum 0.15mm pull back (L1) maybe present. L  
minus L1 to be equal to or greater than 0.3mm.  
FN6613.0  
December 18, 2007  
3
ISL6406MREP, ISL6406MVEP  
Thin Shrink Small Outline Plastic Packages (TSSOP)  
M16.173  
N
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
E
INCHES  
MIN  
MILLIMETERS  
E1  
-B-  
GAUGE  
PLANE  
SYMBOL  
MAX  
0.043  
0.006  
0.037  
0.012  
0.008  
0.201  
0.177  
MIN  
-
MAX  
1.10  
0.15  
0.95  
0.30  
0.20  
5.10  
4.50  
NOTES  
A
A1  
A2  
b
-
-
0.002  
0.033  
0.0075  
0.0035  
0.193  
0.169  
0.05  
0.85  
0.19  
0.09  
4.90  
4.30  
-
1
2
3
-
L
0.25  
0.010  
0.05(0.002)  
SEATING PLANE  
A
9
-A-  
c
-
D
D
3
-C-  
E1  
e
4
α
0.026 BSC  
0.65 BSC  
-
A2  
e
A1  
c
E
0.246  
0.020  
0.256  
0.028  
6.25  
0.50  
6.50  
0.70  
-
b
0.10(0.004)  
L
6
0.10(0.004) M  
C
A M B S  
N
16  
16  
7
o
o
o
o
0
8
0
8
-
α
NOTES:  
Rev. 1 2/02  
1. These package dimensions are within allowable dimensions of  
JEDEC MO-153-AB, Issue E.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs. Mold flash, protrusion and gate burrs shall not exceed  
0.15mm (0.006 inch) per side.  
4. Dimension “E1” does not include interlead flash or protrusions.  
Interlead flash and protrusions shall not exceed 0.15mm (0.006  
inch) per side.  
5. The chamfer on the body is optional. If it is not present, a visual  
index feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “b” does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.08mm (0.003 inch) total in excess  
of “b” dimension at maximum material condition. Minimum space  
between protrusion and adjacent lead is 0.07mm (0.0027 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are not necessarily exact. (Angles in degrees)  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN6613.0  
December 18, 2007  
4

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