V62/08615-01XE [TI]
增强型产品低电压 4 位 2 选 1 FET 多路复用器/多路信号分离器 | PW | 16 | -55 to 125;
| 型号： | V62/08615-01XE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 增强型产品低电压 4 位 2 选 1 FET 多路复用器/多路信号分离器 | PW | 16 | -55 to 125 复用器 |
| 文件： | 总10页 (文件大小：365K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74CBTLV1G125-Q1
www.ti.com................................................................................................................................................................................................ SCDS289 –AUGUST 2009
LOW-VOLTAGE SINGLE FET BUS SWITCH
Check for Samples: SN74CBTLV1G125-Q1
1
FEATURES
DBV PACKAGE
(TOP VIEW)
•
•
•
•
Qualified for Automotive Applications
5-Ω Switch Connection Between Two Ports
Rail-to-Rail Switching on Data I/O Ports
1
2
3
5
OE
A
VCC
Ioff Supports Partial-Power-Down Mode
Operation
4
B
GND
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The SN74CBTLV1G125 features a single high-speed line switch. The switch is disabled when the output-enable
(OE) input is high.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging
current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION(1)
(2)
TA
PACKAGE
ORDERABLE PART NUMBER
TOP-SIDE MARKING
VCTO
–40°C to 125°C
SOT-23 – DBV
Reel of 3000
74CBTLV1G125DBVRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Table 1. FUNCTION TABLE
INPUT
FUNCTION
OE
L
A port = B port
Disconnect
H
LOGIC DIAGRAM (POSITIVE LOGIC)
2
4
A
SW
B
1
OE
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
SN74CBTLV1G125-Q1
SCDS289 –AUGUST 2009................................................................................................................................................................................................ www.ti.com
SIMPLIFIED SCHEMATIC, EACH FET SWITCH
A
B
(OE)
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
MAX
4.6
UNIT
V
VCC Supply voltage range
VI
Input voltage range(2)
4.6
V
Continuous channel current
128
–50
206
150
mA
mA
°C/W
°C
IIK
Input clamp current
VI/O < 0
DBV package
θJA
Tstg
Package thermal impedance(3)
Storage temperature range
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1)
MIN
2.3
1.7
2
MAX UNIT
VCC
VIH
Supply voltage
3.6
V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
High-level control input voltage
V
0.7
0.8
VIL
TA
Low-level control input voltage
Operating free-air temperature
V
–40
125
°C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): SN74CBTLV1G125-Q1
SN74CBTLV1G125-Q1
www.ti.com................................................................................................................................................................................................ SCDS289 –AUGUST 2009
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
TYP
PARAMETER
TEST CONDITIONS
MIN
MAX UNIT
(1)
VIK
II
VCC = 3 V, II = –18 mA
–1.2
±1
V
VCC = 3.6 V, VI = VCC or GND
μA
VCC = 0, VI or VO = 0 to 3.6 V, OE = 3.6 V
VCC = 0, VI or VO = 0 to 3.6 V, OE = 0 V
VCC = 3.6 V, VI = VCC or GND
15
Ioff
μA
100
10
ICC
μA
μA
pF
pF
(2)
ΔICC
Ci
Control inputs VCC = 3.6 V, One input at 3 V, Other inputs at VCC or GND
Control inputs VI = 3 V or 0
300
2.5
7
Cio(OFF)
VO = 3 V or 0, OE = VCC
II = 32 mA
II = 24 mA
II = 15 mA
II = 32 mA
II = 24 mA
II = 15 mA
7
10
10
25
7
VI = 0
VCC = 2.3 V,
TYP at VCC = 2.5 V
7
VI = 1.7 V,
VI = 0
15
5
(3)
ron
Ω
VCC = 3 V
5
7
VI = 2.4 V,
10
15
(1) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(2) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(3) Measured by the voltage drop between A and B terminals at the indicated current through the switch. On-state resistance is determined
by the lower of the voltages of the two (A or B) terminals.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
MIN
MAX
(1)
tpd
A or B
OE
B or A
A or B
A or B
0.15
8
0.25
7.5
ns
ns
ns
ten
0.5
0.5
0.5
0.5
tdis
OE
8
7.5
(1) The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load
capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance).
Copyright © 2009, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): SN74CBTLV1G125-Q1
SN74CBTLV1G125-Q1
SCDS289 –AUGUST 2009................................................................................................................................................................................................ www.ti.com
PARAMETER MEASUREMENT INFORMATION
2 × V
TEST
S1
CC
S1
t
/t
Open
Open
GND
R
L
PLH PHL
From Output
Under Test
t
/t
2 × V
CC
GND
PLZ PZL
t
/t
PHZ PZH
C
L
R
L
(see Note A)
V
∆
C
L
R
L
V
CC
2.5 V ±0.2 V
3.3 V ±0.3 V
500 Ω
500 Ω
0.15 V
0.3 V
30 pF
50 pF
LOAD CIRCUIT
V
CC
Timing Input
V /2
CC
0 V
t
w
t
su
t
h
V
CC
V
CC
V /2
CC
V /2
CC
Input
V /2
CC
V /2
CC
Data Input
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
V
CC
CC
Output
Control
V /2
CC
V /2
CC
V /2
CC
V /2
CC
Input
0 V
0 V
t
t
PLZ
t
PZL
t
t
PHL
PLH
Output
Waveform 1
V
V
OH
V
V
CC
V
V
/2
/2
V
CC
/2
V
/2
/2
CC
Output
CC
S1 at 2 × V
CC
V
+ V
∆
OL
OL
(see Note B)
OL
t
PHL
PLH
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
V
V
OH
V
OH
V
− V
∆
OH
V
CC
V
CC
/2
CC
Output
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output
control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output
control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns,
tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis
.
F. tPZL and tPZH are the same as ten
.
G. tPLH and tPHL are the same as tpd
.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): SN74CBTLV1G125-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
2-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
74CBTLV1G125DBVRQ1
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74CBTLV1G125-Q1 :
Catalog: SN74CBTLV1G125
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74CBTLV1G125DBVRQ1 SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBV
SPQ
Length (mm) Width (mm) Height (mm)
203.0 203.0 35.0
74CBTLV1G125DBVRQ1
5
3000
Pack Materials-Page 2
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