FODM3051R3V [ROCHESTER]
Triac Output Optocoupler,;
| 型号： | FODM3051R3V |
| 厂家： | 
Rochester Electronics |
| 描述： | Triac Output Optocoupler, 三端双向交流开关 输出元件 光电 |
| 文件： | 总9页 (文件大小：1157K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
October 2005
FODM3051, FODM3052, FODM3053
4-Pin Full Pitch Mini-Flat Package Random Phase Triac
Driver Output Optocouplers
Features
Description
■ Compact 4-pin surface mount package (2.4 mm maximum
The FODM305X series consists of a galium arsenide diode
driving a silicon bilateral switch housed in a compact 4-pin mini-
flat package. The lead pitch is 2.54 mm. The FODM305X series
isolates low voltage logic from 115 and 240 Vac lines to provide
random phase control of high current triacs or thyristors. It also
features greatly enhanced static dv/dt capability to ensure
stable switching performance of inductive loads.
standoff height)
■ Peak blocking voltage – 600V
■ Guaranteed static dv/dt of 1000 V/µs
■ Available in tape and reel quantities of 500 and 2500.
■ Applicable to Infrared Ray reflow (230°C max, 30 seconds.)
■ BSI, CSA and VDE certifications pending
■ UL (File# E90700) certified
Applications
■ Solenoid/valve controls
■ Interfacing microprocessors to 115 and 240 Vac peripherals
■ Temperature controls
■ Solid state relays
■ Lamp ballast
■ Static AC power switch
■ Motor control
■ Incandescent lamp dimmers
Package Dimensions
PIN 1
0.026 (0.66)
0.100 (2.54) TYP
0.020 (0.51)
0.012 (0.30)
MAIN
TERMINAL
0.287 (7.29)
0.248 (6.30)
1
2
4
3
ANODE
MAIN
TERMINAL
CATHODE
0.173 (4.40)
0.169 (4.29)
TYP
0.154 (3.91)
0.094 (2.39)
0.079 (2.01)
0.008 (0.20)
0.035 (0.89)
0.012 (0.30)
0.000 (0.0)
0.033 (0.85)
0.026 (0.65)
NOTE
All dimensions are in inches (millimeters)
©2005 Fairchild Semiconductor Corporation
1
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
Absolute Maximum Ratings (T = 25°C unless otherwise specified)
A
Parameter
Symbol
Value
Units
TOTAL PACKAGE
Storage Temperature
Junction Temperature
Operating Temperature
EMITTER
T
-40 to +125
125
°C
°C
°C
STG
T
J
T
-40 to +100
OPR
Continuous Forward Current
Peak Forward Current (1 µs pulse, 300 pps.)
Reverse Input Voltage
I
60
1
mA
A
F (avg)
I
F (pk)
V
P
3
V
R
D
Power Dissipation
100
mW
(No derating required over operating temp. range)
DETECTOR
On-State RMS Current
Off-State Output Terminal Voltage
I
70
mA (RMS)
T(RMS)
V
600
250
V
DRM
Power Dissipation
P
mW
D
(No derating required over operating temp. range)
Electrical Characteristics (T = 25°C Unless otherwise specified)
A
Individual Component Characteristics
Parameter
Test Conditions
Symbol Device Min Typ* Max Unit
EMITTER
Input Forward Voltage
I = 10 mA
V
All
All
1.20
0.01
1.5
V
F
F
Reverse Leakage Current
DETECTOR
V
= 3 V
I
100
µA
R
R
Peak Blocking Current Either Direction
Peak On-State Voltage Either Direction
Critical Rate of Rise of Off-State Voltage
V
= 600V, I = 0 (note 1)
I
DRM
All
All
All
3
100
2.5
nA
V
DRM
F
I
= 100mA peak
V
2.0
TM
TM
I
= 0 (Figure 8, note 2)
dV/dt
1000
V/µs
F
Transfer Characteristics (T = 25°C Unless otherwise specified)
A
DC Characteristics
Test Conditions Symbol
Device
Min
Typ*
Max
15
Unit
LED Trigger Current
Main Terminal
I
FODM3051
FODM3052
FODM3053
All
mA
FT
Voltage = 3V (note 3)
10
5
Holding Current, Either Direction
I
300
µA
H
Isolation Characteristics (T = 25°C Unless otherwise specified)
A
Characteristic
Test Conditions Symbol Device
Min
Typ* Max
Unit
Steady State Isolation Voltage
t = 1 Minute
V
All
3750
V(RMS)
ISO
* All typicals at T = 25°C
A
Note
1. Test voltage must be applied within dv/dt rating.
2. This is static dv/dt. See Figure 1 for test circuit. Commutating dv/dt is function of the load-driving thyristor(s) only.
3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating I lies
F
FT
F
between max I (15 mA for FODM3051, 10 mA for FODM3052, 5 mA for FODM3053) and absolute max I (60 mA).
FT
F
2
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
Typical Performance Curves
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Leakage Current vs. Ambient Temperature
1000
100
10
1.8
VDRM = 600V
1.7
1.6
1.5
1.4
T
= -40°C
A
1.3
1.2
1.1
1.0
0.9
T
= 25°C
A
1
T
= 100°C
A
0.1
-40
-20
0
20
40
60
80
100
1
10
- FORWARD CURRENT (mA)
100
T
- AMBIENT TEMPERATURE (°C)
I
A
F
Fig. 3 Holding Current vs. Ambient Temperature
Fig. 4 Trigger Current vs. Ambient Temperature
1.3
1.2
1.1
1.0
0.9
0.8
5
V
= 3V
TM
NORMALIZED TO T = 25°C
NORMALIZED TO T = 25°C
A
A
2
1.0
0.5
0.2
0.1
-40
-20
0
20
40
60
80
100
100
-40
-20
0
20
40
60
80
T
- AMBIENT TEMPERATURE (°C)
A
T
- AMBIENT TEMPERATURE (°C)
A
Fig. 5 LED Current Required to Trigger vs. LED Pulse Width
Fig. 6 Off-state Output Terminal Voltage vs. Ambient Temperature
10
8
1.4
T
=25°C
NORMALIZED TO T = 25°C
A
A
NORMALIZED TO PW >> 100µs
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
IN
6
4
2
0
0
20
40
60
80
100
-40
-20
1
10
100
T
- AMBIENT TEMPERATURE (°C)
A
PW - LED TRIGGER PULSE WIDTH (µs)
IN
3
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
Fig. 7 On-State Characteristics
800
600
400
200
0
T
= 25°C
A
-200
-400
-600
-800
-6
-4
-2
V
0
2
4
6
- ON-STATE VOLTAGE (V)
TM
1. The mercury wetted relay provides a high speed
repeated pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds
and voltages.
400V
Vdc
RTEST
R = 10 kΩ
3. The worst-case condition for static dv/dt is estab-
lished by triggering the D.U.T. with a normal LED
input current, then removing the current. The vari-
CTEST
PULSE
INPUT
able R
allows the dv/dt to be gradually
MERCURY
WETTED
RELAY
TEST
X100
SCOPE
PROBE
increased until the D.U.T. continues to trigger in
response to the applied voltage pulse, even after
the LED current has been removed. The dv/dt is
then decreased until the D.U.T. stops triggering.
D.U.T.
τ
is measured at this point and recorded.
RC
V
= 400 V
max
APPLIED VOLTAGE
WAVEFORM
252 V
0.63 V
252
max
dv/dt =
=
τ
τ
0 VOLTS
RC
RC
τ
RC
Figure 8. Static dv/dt Test Circuit
4
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
Ordering Information
Option
V
Description
VDE Approved
R1
Tape and Reel (500 units)
R2
Tape and Reel (2500 units)
R3
Tape and Reel (500 units; unit 180° rotated)
Tape and Reel (2500 units; unit 180° rotated)
Tape and Reel (500 units) and VDE Approved
Tape and Reel (2500 units) and VDE Approved
Tape and Reel (500 units; unit 180° rotated) and VDE Approved
Tape and Reel (2500 units; unit 180° rotated) and VDE Approved
R4
R1V
R2V
R3V
R4V
Marking Information
1
2
3051
6
V X YY M
3
4
5
Definitions
1
2
3
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE option –
See order entry table)
4
5
6
One digit year code
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
5
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
P
2
D0
P
0
t
K0
E
A0
W
W
1
B0
F
d
D1
P
2.54 Pitch
Description
Symbol
Dimensions (mm)
12.00 0.4
0.30 0.20
4.00 0.20
1.55 0.20
1.75 0.20
5.50 0.20
2.00 0.20
8.00 0.20
4.40 0.20
7.30 0.20
2.30 0.20
1.55 0.20
9.20
Tape Width
W
t
Tape Thickness
Sprocket Hole Pitch
Sprocket Hole Dia.
P
0
D
0
Sprocket Hole Location
Pocket Location
E
F
P
2
Pocket Pitch
P
Pocket Dimension
A0
B0
K0
D1
Pocket Hole Dia.
Cover Tape Width
Cover Tape Thickness
W
1
d
0.065 0.02
Max. Component Rotation or Tilt
20˚ max
R1
R2
R1
R2
Devices Per Reel
500
2500
Reel Diameter
178 mm (7")
330 mm (13")
6
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
Footprint Drawing for PCB Layout
0.024 (0.61)
0.060 (1.52)
0.190 (4.83)
0.310 (7.87)
0.100 (2.54)
Recommended Infrared Reflow Soldering Profile
(heating)
to 30 s
230°C (peak temperature)
210°C
180°C
to 60 s
150 s
90 s
60 s
Time (s)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
7
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
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not intended to be an exhaustive list of all such trademarks.
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FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NORTHE RIGHTS OF OTHERS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I16
8
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
相关型号：
FODM3051_05
4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers
FAIRCHILD
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