MM74HCT541SJ [ROCHESTER]
HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 5.30 MM, EIAJ TYPE2, SOP-20;
| 型号： | MM74HCT541SJ |
| 厂家： | 
Rochester Electronics |
| 描述： | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 5.30 MM, EIAJ TYPE2, SOP-20 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总12页 (文件大小：962K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
June 2007
MM74HCT540, Inverting Octal 3-STATE Buffer
MM74HCT541, Octal 3-STATE Buffer
tm
Features
General Description
■ TTL input compatible
The MM74HCT540 and MM74HCT541 3-STATE buffers
utilize advanced silicon-gate CMOS technology and are
general purpose high speed inverting and non-inverting
buffers. They possess high drive current outputs which
enable high speed operation even when driving large
bus capacitances. These circuits achieve speeds com-
parable to low power Schottky devices, while retaining
the low power consumption of CMOS. Both devices are
TTL input compatible and have a fanout of 15 LS-TTL
equivalent inputs.
■ Typical propagation delay: 12ns
■ 3-STATE outputs for connection to system buses
■ Low quiescent current: 80µA
■ Output current: 6mA (Min.)
MM74HCT devices are intended to interface between
TTL and NMOS components and standard CMOS
devices. These parts are also plug-in replacements for
LS-TTL devices and can be used to reduce power con-
sumption in existing designs.
The MM74HCT540 is an inverting buffer and the
MM74HCT541 is a non-inverting buffer. The 3-STATE
control gate operates as a two-input NOR such that if
either G1 or G2 are HIGH, all eight outputs are in the
high-impedance state.
In order to enhance PC board layout, the MM74HCT540
and MM74HCT541 offers a pinout having inputs and
outputs on opposite sides of the package. All inputs are
protected from damage due to static discharge by diodes
to V and ground.
CC
Ordering Information
Package
Order Number
MM74HCT540WM
MM74HCT540SJ
MM74HCT540MTC
Number
Package Description
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
M20D
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
MM74HCT541WM
MM74HCT541SJ
MM74HCT541MTC
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
MM74HCT541N
N20A
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering number.
©1984 Fairchild Semiconductor Corporation
MM74HCT540, MM74HCT541 Rev. 1.3
www.fairchildsemi.com
Connection Diagrams
Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View, MM74HCT540
Top View, MM74HCT541
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
2
(1)
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Rating
V
Supply Voltage
–0.5 to +7.0V
–1.5 to V +1.5V
CC
V
DC Input Voltage
IN
CC
V
DC Output Voltage
Clamp Diode Current
DC Output Current, per pin
–0.5 to V +0.5V
OUT
CC
I , I
20mA
35mA
IK OK
I
OUT
I
DC V or GND Current, per pin
70mA
CC
CC
T
Storage Temperature Range
Power Dissipation
–65°C to +150°C
STG
P
D
Note 2
600mW
500mW
260°C
S.O. Package only
T
Lead Temperature (Soldering 10 seconds)
L
Note:
1. Unless otherwise specified all voltages are referenced to ground.
2. Power Dissipation temperature derating — plastic “N” package: –12mW/°C from 65°C to 85°C.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
4.5
0
Max.
Units
V
V
Supply Voltage
5.5
CC
V , V
DC Input or Output Voltage
Operating Temperature Range
Input Rise and Fall Times
V
V
IN OUT
CC
T
–40
+85
500
°C
A
t , t
ns
r
f
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
3
DC Electrical Characteristics
V
= 5V 10ꢀ (unless otherwise specified)
CC
T = –40 T = –55
A
A
T = 25°C
to 85°C to 125°C
A
Symbol
Parameter
Conditions
Typ.
Guaranteed Limits
Units
V
Minimum HIGH
Level Input Voltage
2.0
0.8
2.0
0.8
2.0
0.8
V
IH
V
Maximum LOW
Level Input Voltage
V
V
IL
V
Minimum HIGH
Level Output
Voltage
V
= V or V :
OH
IN
IH
IL
|I
|I
|I
| = 20µA
V
V
– 0.1
V
– 0.1
V
– 0.1
OUT
OUT
OUT
CC
CC
CC
CC
| = 6.0mA, V = 4.5V
4.2
5.2
3.98
4.98
3.84
4.84
3.7
4.7
CC
| = 7.2mA, V = 5.5V
CC
V
Maximum LOW
Level Voltage
V
= V or V :
OL
IN
IH
IL
V
|I
|I
|I
| = 20µA
0
0.1
0.26
0.26
0.1
0.1
0.33
0.33
1.0
0.1
0.4
0.4
1.0
OUT
OUT
OUT
| = 6.0mA, V = 4.5V
0.2
0.2
CC
| = 7.2mA, V = 5.5V
CC
I
Maximum Input
Current
V
= V or GND
µA
µA
IN
IN
CC
I
Maximum 3-STATE
Output Leakage
Current
V
= V or GND, G = V
0.5
5.0
10
OZ
OUT
CC
IH
I
Maximum
Quiescent Supply
Current
V
V
= V or GND, I
= 0µA
8.0
1.0
80
160
1.5
µA
CC
IN
CC
OUT
(3)
= 2.4V or 0.5V
0.6
1.3
mA
IN
Note:
3. Measured per input. All other inputs at V or GND.
CC
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
4
AC Electrical Characteristics
MM74HCT540: V = 5.0V, t = t = 6ns, T = 25°C, (unless otherwise specified).
CC
r
f
A
Guaranteed
Limits
Symbol
Parameter
Conditions
Typ.
12
Units
ns
t
, t
Maximum Output Propagation Delay C = 45pF
18
28
25
PHL PLH
L
t
t
, t
Maximum Output Enable Time
Maximum Output Disable Time
C = 45pF, R = 1kΩ
14
ns
PZL PZH
L
L
, t
C = 5pF, R = 1kΩ
13
ns
PLZ PHZ
L
L
AC Electrical Characteristics
MM74HCT540: V = 5.0V 10ꢀ, t = t = 6ns (unless otherwise specified).
CC
r
f
T = –40 T = –55
A
A
T = 25°C
to 85°C to 125°C
A
Symbol
Parameter
Conditions
Typ.
Guaranteed Limits
Units
t
, t
Maximum Output
Propagation Delay
C = 50pF
12
22
15
20
15
20
30
30
40
30
25
38
38
50
38
30
45
45
60
45
ns
PHL PLH
L
C = 150pF
L
t
t
, t
Maximum Output Enable R = 1kΩ
Time
C = 50pF
ns
PZH PZL
L
L
C = 150pF
L
, t
Maximum Output Disable R = 1kΩ, C = 50pF
Time
ns
ns
pF
pF
pF
PHZ PLZ
L
L
t
, t
Maximum Output Rise
and Fall Time
C = 50pF
6
5
12
10
20
15
10
20
18
10
20
THL TLH
L
C
Maximum Input
Capacitance
IN
C
Maximum Output
Capacitance
15
OUT
C
Power Dissipation
(per output) G = V
12
50
PD
CC
(4)
Capacitance
G = GND
Note:
4. C determines the no load dynamic power consumption, P = C
V
2 f + I
V
, and the no load dynamic
PD
D
PD CC
CC CC
current consumption, I = C
V
f + I
S
PD CC CC.
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
5
AC Electrical Characteristics
MM74HCT541: V = 5.0V, t = t = 6ns, T = 25°C, (unless otherwise specified).
CC
r
f
A
Guaranteed
Limits
Symbol
Parameter
Conditions
Typ.
13
Units
ns
t
, t
Maximum Output Propagation Delay
Maximum Output Enable Time
Maximum Output Disable Time
C = 45pF
20
28
25
PHL PLH
L
t
t
, t
C = 45pF, R = 1kΩ
17
ns
PZL PZH
L
L
, t
C = 5pF, R = 1kΩ
15
ns
PLZ PHZ
L
L
AC Electrical Characteristics
MM74HCT541: V = 5.0V 10ꢀ, t = t = 6ns (unless otherwise specified).
CC
r
f
T = –40 T = –55
A
A
T = 25°C
to 85°C to 125°C
A
Symbol
Parameter
Conditions
Typ.
Guaranteed Limits
Units
t
, t
Maximum Output
Propagation Delay
C = 50pF
14
17
17
22
17
23
33
30
40
30
29
42
38
50
38
34
49
45
60
45
ns
PHL PLH
L
C = 150pF
L
t
t
, t
Maximum Output
Enable Time
R = 1kΩ
C = 50pF
ns
PZH PZL
L
L
C = 150pF
L
, t
Maximum Output
Disable Time
R = 1kΩ, C = 50pF
ns
ns
pF
pF
pF
PHZ PLZ
L
L
t
, t
Maximum Output Rise C = 50pF
and Fall Time
6
5
12
10
20
15
10
20
18
10
20
THL TLH
L
C
Maximum Input
Capacitance
IN
C
Maximum Output
Capacitance
15
OUT
C
Power Dissipation
(per output) G = V
12
45
PD
CC
(5)
Capacitance
G = GND
Note:
5. C determines the no load dynamic power consumption, P = C
V
2 f + I
V
, and the no load dynamic
PD
D
PD CC
CC CC
current consumption, I = C
V
f + I
S
PD CC CC.
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
6
Physical Dimensions
Dimensions are in inches (millimeters) unless otherwise noted.
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
7
Physical Dimensions (Continued)
Dimensions are in millimeters unless otherwise noted.
Figure 2. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
8
Physical Dimensions (Continued)
Dimensions are in millimeters unless otherwise noted.
Figure 3. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
9
Physical Dimensions (Continued)
Dimensions are in inches (millimeters) unless otherwise noted.
Figure 4. 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N20A
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
10
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HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF
THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE
UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF
FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE
PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in significant injury to the user.
2.
A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
This datasheet contains the design specifications for product development.
Specifications may change in any manner without notice.
Advance Information
Formative or In Design
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve design.
Preliminary
First Production
Full Production
Not In Production
This datasheet contains final specifications. Fairchild Semiconductor reserves
the right to make changes at any time without notice to improve design.
No Identification Needed
Obsolete
This datasheet contains specifications on a product that has been
discontinued by Fairchild semiconductor. The datasheet is printed for
reference information only.
Rev. I28
©1984 Fairchild Semiconductor Corporation
Rev. 1.3
www.fairchildsemi.com
11
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