S3012A [ROCHESTER]

Receiver, 1-Func, PQFP80, PLASTIC, QFP-80;
S3012A
型号: S3012A
厂家: Rochester Electronics    Rochester Electronics
描述:

Receiver, 1-Func, PQFP80, PLASTIC, QFP-80

文件: 总21页 (文件大小:136K)
中文:  中文翻译
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®
DEVICE SPECIFICATION  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
GENERAL DESCRIPTION  
FEATURES  
• Complies with ANSI, Bellcore, and ITU-T  
specifications  
The S3011/S3012 SONET/SDH transmitter and re-  
ceiver chips are fully integrated serialization/  
deserialization SONET OC-3 (155.52 Mbit/s) interface  
devices. With architecture developed by the Pacific  
Microelectronics Centre (PMC), the chipset performs  
allnecessaryserial-to-parallelandparallel-to-serialfunc-  
tions in conformance with SONET/SDH transmission  
standards. The devices are also suitable for ATM appli-  
cations. Figure 1 shows a typical network application.  
• On-chip high-frequency PLL for clock  
generation and clock recovery  
• Supports 155.52 Mbit/s (OC-3)  
• Reference frequency of 19.44 MHz  
• Interface to both PECL and TTL/CMOS logic  
• 8-bit TTL/CMOS datapath  
• Compact 80 PQFP package  
• Diagnostic loopback mode  
• Lock detect  
On-chip clock synthesis is performed by the high-  
frequency phase-locked loop on the S3011 transmitter  
chip allowing the use of a slower external transmit clock  
reference. Clock recovery is performed on the S3012  
receiver chip by synchronizing its on-chip VCO directly  
to the incoming data stream. The S3012 also performs  
SONET/SDH frame detection. The chipset can be used  
with 19.44 MHz reference clocks, in support of existing  
system clocking schemes.  
• Low jitter PECL interface  
• < 2.5 Watt per set  
APPLICATIONS  
• SONET/SDH-based transmission systems  
• SONET/SDH modules  
• SONET/SDH test equipment  
• ATM over SONET  
• Section repeaters  
• Add drop multiplexors  
• Broad-band cross-connects  
• Fiber optic terminators  
• Fiber optic test equipment  
The low jitter PECL interface guarantees compliance  
with the bit-error rate requirements of the Bellcore,  
ANSI, and ITU-T standards. The S3011/S3012 chipset  
is packaged in a 80 PQFP, offering designers a small  
package outline.  
Figure 1. System Block Diagram  
S3011  
SONET/SDH  
Transmitter  
Network  
Interface  
Processor  
8
8
Network  
Interface  
Processor  
S3012  
SONET/SDH  
Receiver  
OTX  
ORX  
1
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
Figure 2. SONET Structure  
SONET OVERVIEW  
Layer Overhead  
(Embedded Ops  
Channel)  
Synchronous Optical Network (SONET) is a standard  
for connecting one fiber system to another at the optical  
level. SONET, together with the Synchronous Digital  
Hierarchy (SDH) administered by the ITU-T, forms a  
single international standard for fiber interconnect be-  
tweentelephonenetworksofdifferentcountries.SONET  
is capable of accommodating a variety of transmission  
rates and applications.  
Functions  
Payload to  
SPE mapping  
Path layer  
Path layer  
Line layer  
Maintenance,  
protection,  
switching  
576 Kbps  
192 Kbps  
Line layer  
Scrambling,  
framing  
Section layer  
Section layer  
The SONET standard is a layered protocol with four  
separate layers defined. These are:  
Optical  
transmission  
Photonic layer  
Photonic layer  
0 bps  
• Photonic  
• Section  
• Line  
Fiber Cable  
End Equipment  
End Equipment  
• Path  
Figure 2 shows the layers and their functions. Each of  
thelayershasoverheadbandwidthdedicatedtoadmin-  
istration and maintenance. The photonic layer simply  
handles the conversion from electrical to optical and  
back with no overhead. It is responsible for transmitting  
the electrical signals in optical form over the physical  
media. The section layer handles the transport of the  
framed electrical signals across the optical cable from  
one end to the next. Key functions of this layer are  
framing, scrambling, and error monitoring. The line  
layer is responsible for the reliable transmission of the  
path layer information stream carrying voice, data, and  
video signals. Its main functions are synchronization,  
multiplexing, and reliable transport. The path layer is  
responsible for the actual transport of services at the  
appropriate signaling rates.  
Table 1. SONET Signal Hierarchy  
Elec.  
STS-1  
ITU-T  
STM-1  
STM-4  
Optical Data Rate (Mbit/s)  
OC-1  
51.84  
STS-3  
OC-3  
155.52  
466.56  
622.08  
933.12  
1244.16  
1866.24  
2488.32  
STS-9  
OC-9  
STS-12  
STS-18  
STS-24  
STS-36  
STS-48  
OC-12  
OC-18  
OC-24  
OC-36  
OC-48  
STM-16  
Figure 3. STS–3/OC–3 Frame Format  
A1 A1 A1 A2 A2 A2 C1 C1 C1  
Data Rates and Signal Hierarchy  
B1  
D1 *  
*
*
*
E1  
D2  
*
*
*
*
F1  
D3 *  
*
*
*
Table 1 contains the data rates and signal designations  
of the SONET hierarchy. The lowest level is the basic  
SONET signal referred to as the synchronous transport  
signal level-1 (STS-1). An STS-N signal is made up of  
N byte-interleaved STS-1 signals. The optical counter-  
part of each STS-N signal is an optical carrier level-N  
signal(OC-N). TheS3011/S3012chipsetsupportsOC-  
3 rates (155.52 Mbit/s).  
9 x 261 =  
2349 bytes  
H1 H1 H1 H2 H2 H2 H3 H3 H3  
9
B2 B2 B2 K1  
*
*
*
*
*
K2  
*
*
*
*
*
*
*
*
*
*
Rows  
D4 *  
D7 *  
*
*
*
D5 *  
D8  
D11  
D6  
D9  
D12  
*
*
D10  
*
Z1 Z1 Z1 Z2 Z2 Z2 E2  
Transport Overhead  
Synchronous Payload  
Envelope  
9 Columns  
261 Columns  
Frame and Byte Boundary Detection  
125 µsec  
The SONET/SDH fundamental frame format for STS-3  
consists of nine transport overhead bytes followed by  
Synchronous Payload Envelope (SPE) bytes. This pat-  
tern of 9 overhead and 261 SPE bytes is repeated nine  
times in each frame. Frame and byte boundaries are  
detected using the A1 and A2 bytes found in the  
transport overhead. (See Figure 3.)  
For more details on SONET operations, refer to the  
ANSI SONET standard document.  
2
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
S3011/S3012 OVERVIEW  
Internal clocking and control functions are transparent  
totheuser. DetailsofdatatimingcanbeseeninFigures  
9 through 14.  
The S3011 transmitter and S3012 receiver implement  
SONET/SDHserialization/deserialization,transmission,  
and frame detection/recovery functions. The block dia-  
grams in Figures 4 and 5 show basic operation of both  
chips. These chips can be used to implement the front  
end of SONET equipment, which consists primarily of  
the serial transmit interface (S3011) and the serial  
receive interface (S3012). The chipset handles all the  
functions of these two elements, including parallel-to-  
serialandserial-to-parallelconversion,clockgeneration  
and recovery, and system timing, which includes man-  
agement of the datastream, framing, and clock  
distribution throughout the front end.  
A lock detect feature is provided on the S3012, which  
indicates that the PLL is locked (synchronized) to the  
data stream, and facilitates continuous down-stream  
clocking in the absence of data.  
Suggested Interface Devices  
PMC PM5345  
IGT WAC–013–A  
Fujitsu MB86683  
PMC PM5301  
Siemens  
SUNI  
Saturn User Network Interface  
SONET LAN ATM Processor  
Network Termination Controller  
Section Overhead Transceiver  
Fiber Optic Transceiver  
NTC  
SSTX  
Operation of the S3011/S3012 chips is straightforward.  
The sequence of operations is as follows:  
V23806-A8-C1  
HFBR-520X  
ODL-1408  
HP  
Fiber Optic Transceiver  
CTS  
Fiber Optic Transceiver  
Transmitter  
Sumitomo  
AMP  
SDM4123-XC  
269039-1  
Fiber Optic Transceiver  
Fiber Optic Transceiver  
1. 8-bit parallel input  
2. Parallel-to-serial conversion  
3. Serial output  
Mitsubishi  
MF-156DS-TR124  
Fiber Optic Transceiver  
Receiver  
1. Clock and data recovery from serial input  
2. Frame detection  
3. Serial-to-parallel conversion  
4. 8-bit parallel output  
Figure 4. S3011 Functional Block Diagram  
TSCLKSEL  
DLEB  
2
DLDP/N  
TSDP/N  
2
8
D
PIN[7:0]  
8:1 PARALLEL  
TO SERIAL  
PICLK  
PCLK  
PAE  
TIMING  
GEN  
SYNC  
TESTEN  
REFCLK  
CLOCK  
SYNTHESIZER  
RSTB  
CAP1  
CAP2  
TESTRST  
3
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
Figure 5. S3012 Functional Block Diagram  
LOS  
8
1:8 SERIAL  
TO PARALLEL  
POUT[7:0]  
TIMING  
GEN  
OOF  
POCLK  
FP  
FRAME  
BYTE  
DETECT  
DLEB  
2
M
U
X
RSDP/N  
DLDP/N  
BACKUP  
REFERENCE  
GEN  
2
CLOCK  
RECOVERY  
LOCKDET  
REFCLK  
CAP1  
CAP2  
TESTEN  
RSTB  
TESTRST  
4
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
In the parallel-to-serial conversion process, the incom-  
ing data is passed from the PICLK byte clock timing  
domain to the internally generated byte clock timing  
domain, which is phase aligned to transmit serial clock.  
Although the frequency of PICLK and the internally  
generated byte clock is the same, their phase relation-  
ship is arbitrary. To prevent errors caused by short  
setup or hold times between the two timing domains,  
the timing generator circuitry monitors the phase rela-  
tionship between PICLK and the internally generated  
byte clock. Should the magnitude of the phase differ-  
ence be less than one bit period, and if the SYNC input  
is high, the timing block inverts the internal byte clock.  
S3011 TRANSMITTER  
FUNCTIONAL DESCRIPTION  
TheS3011transmitterchipperformstheserializing stage  
in the processing of a transmit SONET STS-3 bit serial  
datastream. Itconvertsthebyteserial19.44Mbyte/sec  
data stream to bit serial format at 155.52 Mbit/sec.  
A high-frequency bit clock can be generated from a  
19.44 MHz frequency reference by using an integral  
frequency synthesizer consisting of a phase-locked  
loop circuit with a divider in the loop.  
Diagnostic loopback is provided (transmitter to re-  
ceiver) when used with the compatible S3012. (See  
Other Operating Modes.)  
Sincetheinversionoftheinternalbyteclockwillcorrupt one  
byte of data, SYNC should be held low except when a  
phasecorrectionisdesired. Whenatimingdomain phase  
difference of less than one bit period is detected, the  
PhaseAlignmentEventoutput(PAE)pulseshighforone  
PCLK clock period. If the condition persists, PAE will  
remainhigh.WhenPAEconditionsoccur,SYNCshould  
be activated until the condition is no longer present.  
Clock Synthesizer  
The Clock Synthesizer, shown in the block diagram in  
Figure 4, is a monolithic PLL that generates the serial  
output clock phase synchronized with the input refer-  
ence clock (REFCLK).  
The REFCLK input must be generated from a TTL  
crystal oscillator which has a frequency accuracy of  
better than 20 ppm in order for the TSCLK frequency to  
have the same accuracy required for operation in a  
SONET system. Lower accuracy crystal oscillators may  
beusedinapplicationslessdemandingthanSONET/SDH.  
After the S3011 device is reset, two cycles of PICLK are  
required to initialize the internal byte clock. The starting  
pointoftheinternalbyteclockisfourserialbittimesafterthe  
detected rising edge of PICLK. The relative phase  
betweenPICLKandthePCLKoutputisarbitrary,butitmust  
remainconstantwithvariationswithintherangeof-2to +3  
bittimes(-90° to+135°)inordertoavoidgeneratingPAE  
pulses. This operating constraint must be observed if  
the SYNC and PAE functions are not used or desired.  
The on-chip PLL consists of a phase detector, which  
compares the phase relationship between the VCO  
outputandtheREFCLKinput,aloopfilterwhichconverts  
the phase detector output into a smooth DC voltage,  
and a VCO, whose frequency is varied by this voltage.  
Parallel-to-Serial Converter  
The Parallel-to-Serial converter shown in Figure 4 is  
comprised of two byte-wide registers. The first register  
latchesthedatafromthePIN[7:0]busontherisingedge  
ofPICLK.Thesecondregisterisaparallelloadableshift  
registerwhichtakesitsparallelinputfromthefirstregister.  
The loop filter generates a VCO control voltage based  
on the average DC level of the phase discriminator  
output pulses. A single external clean-up capacitor is  
utilized as part of the loop filter. The loop filter’s corner  
frequency is optimized to minimize output phase jitter.  
An internally generated byte clock, which is phase  
aligned to the transmit serial clock as described in the  
Timing Generator description, activates the parallel  
data transfer between registers. The serial data shifts  
out of the second register and into the output selection  
logic at the transmit serial clock rate.  
Timing Generator  
The Timing Generator, seen in Figure 4, provides two  
separate functions. It provides a byte rate version of the  
transmit serial clock, and a mechanism for aligning the  
phase between the incoming byte clock and the clock  
which loads the parallel-to-serial shift register.  
ThePCLKoutputisabyterateversionoftransmitserial  
clock at 19.44 MHz. PCLK is intended for use as a byte  
speed clock for upstream multiplexing and overhead  
processing circuits. Using PCLK for upstream circuits will  
ensure a stable frequency and phase relationship be-  
tweenthedatacomingintoandleavingtheS3011device.  
5
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
This transfer function yields a typical capture time of 32  
µs for random incoming NRZ data. A single external  
clean-up capacitor is utilized as part of the loop filter.  
S3012 RECEIVER  
FUNCTIONAL DESCRIPTION  
The S3012 receiver chip provides the first stage of  
digital processing of a receive SONET STS-3 bit-serial  
stream. It converts the bit-serial 155.52 Mbit/sec data  
stream into a 19.44 Mbyte/sec byte-serial data format.  
The total loop dynamics of the clock recovery PLL yield  
a jitter tolerance which meets, with ample margin, the  
minimum tolerance proposed for SONET equipment by  
the T1X1.6/91-022 document, shown in Figure 6.  
Clockrecoveryisperformedontheincomingscrambled  
NRZ data stream. A 19.44 MHz reference clock is  
required for phase locked loop start-up and proper  
operation under loss of signal conditions. An integral  
prescaler and phase locked loop circuit is used to  
multiply this reference to the nominal bit rate.  
Figure 6. Clock Recovery Jitter Tolerance  
15  
Jitter  
Amplitude  
(Ulpp)  
1.5  
A loopback mode is provided for diagnostic loopback  
(transmittertoreceiver), whenusedwiththecompatible  
S3011 device.  
Minimum proposed  
tolerance  
OC-3  
6.5k  
(T1X1.6/91-022)  
0.15  
Clock Recovery  
30  
300  
25k 65k 250k  
Jitter Frequency (Hz)  
Clock Recovery, as shown in the block diagram in  
Figure 5, generates a clock that is at the same fre-  
quency as the incoming data bit rate at the RSD or DLD  
inputs. The clock is phase aligned by a PLL so that it  
samples the data in the center of the data eye pattern.  
Backup Reference Generator  
The Backup Reference Generator seen in Figure 5  
provides backup reference clock signals to the clock  
recovery block when the clock recovery block detects a  
lossofsignalcondition.Itcontainsacounterthatdivides  
the clock output from the clock recovery block down to  
the same frequency as the reference clock REFCLK.  
The phase relationship between the edge transitions of the  
data and those of the generated clock are compared by a  
phase/frequency discriminator. Output pulses from the  
discriminator indicate the required direction of phase  
corrections.Thesepulsesaresmoothedbyanintegralloop  
filter. The output of the loop filter controls the frequency of  
the Voltage Controlled Oscillator (VCO), which generates  
the recovered clock. Frequency stability without incom-  
ing data is guaranteed by an alternate reference input  
(REFCLK) that the PLL locks onto when data is lost.  
Frame and Byte Boundary Detection  
The Frame and Byte Boundary Detection circuitry  
searches the incoming data for three consecutive A1  
bytes followed immediately by three consecutive A2  
bytes. Framing pattern detection is enabled and dis-  
abled by the out-of-frame (OOF) input. Detection is  
enabled by a rising edge on OOF, and remains enabled  
for the duration that OOF is set high. It is disabled when  
a framing pattern is detected and OOF is no longer set  
high. When framing pattern detection is enabled, the  
framing pattern is used to locate byte and frame bound-  
aries in the incoming data stream (RSD or DLD). The  
timing generator block takes the located byte boundary  
and uses it to block the incoming data stream into bytes  
for output on the parallel output data bus (POUT[7:0]).  
Theframeboundaryisreportedontheframepulse(FP)  
output when any 48-bit pattern matching the framing  
pattern is detected on the incoming data stream. When  
framingpatterndetectionisdisabled, thebyteboundary is  
frozen to the location found when detection was previously  
enabled. Only framing patterns aligned to the fixed byte  
boundary are indicated on the FP output.  
The clock recovery circuit monitors the incoming data  
streamforlossofsignal.Iftheincomingdatastreamhas  
had no transitions for between 96 and 208 bit times  
(depending upon the state of an internal counter at the  
timeoflasttransistion),lossofsignalisdeclaredandthe  
PLL will switch from locking onto the incoming data to  
locking onto the reference clock. Alternatively, the loss-  
of-signal(LOS)inputcanbeusedtoforcealoss-of-signal  
condition. When set low, LOS squelches the incoming  
data stream, and thus causes the PLL to switch its  
source of reference 64 to 128 bit times afterwards.  
Loss-of-signal condition is removed when LOS is high,  
and good data, with acceptable pulse density and run  
length, returns on the incoming data stream.  
The loop filter transfer function is optimized to enable the  
PLL to track the jitter, yet tolerate the minimum transi-  
tion density expected in a received SONET data signal.  
6
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
edge of POCLK, which is independent of the byte  
boundaries. The advantage of this serial to parallel  
converter is that POCLK is neither truncated nor ex-  
tended during reframe sequences.  
The probability that random data in an STS-3 stream  
will generate the 48-bit framing pattern is extremely  
small. It is highly improbable that a mimic pattern would  
occur within one frame of data. Therefore, the time to  
match the first frame pattern and to verify it with down-  
stream circuitry, at the next occurrence of the pattern,  
isexpectedtobelessthantherequired250µs, evenfor  
extremely high bit error rates.  
OTHER OPERATING MODES  
Diagnostic Loopback  
Once down-stream overhead circuitry has verified that  
frame and byte synchronization are correct, the OOF  
inputcanbesetlowtodisabletheframesearchprocess  
from trying to synchronize to a mimic frame pattern.  
The Diagnostic Loopback consists of alternate serial  
dataoutputs(inthecaseoftheS3011)andinputs(inthe  
case of the S3012).  
On the S3011, the differential PECL output DLD pro-  
vides Diagnostic Loopback serial data. When the  
Diagnostic Loopback Enable (DLEB) input and  
TSCLKSEL are low, this data output is a replica of TSD.  
When DLD is connected to the S3012, a loopback from  
the transmitter to the receiver at the serial data rate can  
be set up for diagnostic purposes. When DLEB is high  
and TSCLKSEL is low, DLD is held in the inactive state,  
with the positive output high and the negative output  
low. In the inactive state, there will be no interference  
from the transmitter to the receiver.  
Serial-to-Parallel Converter  
The Serial-to-Parallel Converter consists of three 8-bit  
registers. The first is a serial-in, parallel-out shift regis-  
ter,whichperformsserialtoparallelconversionclocked  
by the clock recovery block. The second is an 8-bit  
internal holding register, which transfers data from the  
serial to parallel register on byte boundaries as deter-  
mined by the frame and byte boundary detection block.  
On the falling edge of the free running POCLK, the data  
intheholdingregisteristransferredtoanoutputholding  
register which drives POUT[7:0].  
On the receiver side, the differential PECL input DLD is  
the Diagnostic Loopback serial data input. When the  
Diagnostic Loopback Enable (DLEB) input is set low,  
the DLD input is routed in place of the normal data  
stream (RSD).  
The delay through the Serial-to-Parallel converter can  
vary from 1.5 to 2.5 byte periods (12 to 20 serial bit  
periods) measured from the first bit of an incoming byte  
to the beginning of the parallel output of that byte. The  
variation in the delay is dependent on the alignment of  
the internal parallel load timing, which is synchronized  
to the data byte boundaries, with respect to the falling  
Figure 7. Loopback Diagram  
Data In  
Control  
S3011  
Data Out  
CLK  
S3012  
S3012  
S3011  
Data Out  
CLK  
Data In  
Control  
7
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
S3011 Transmitter Pin Assignment and Descriptions  
Pin Name  
Level I/O  
Pin # Description  
PIN7  
PIN6  
PIN5  
PIN4  
PIN3  
PIN2  
PIN1  
PIN0  
TTL  
I
36  
35  
31  
30  
28  
26  
25  
17  
Parallel data input, a 19.44 Mbyte/sec word, aligned to the  
PICLK parallel input clock. PIN7 is the most significant bit  
(corresponding to bit 1 of each PCM word, the first bit  
transmitted). PIN0 is the least significant bit (corresponding to bit  
8 of each PCM word, the last bit transmitted). PIN(7-0) is  
sampled on the rising edge of PICLK.  
PICLK  
TTL  
I
16  
Parallel input clock, a 19.44 MHz nominally 50% duty cycle input  
clock, to which PIN(7-0) is aligned. PICLK is used to transfer the  
data on the PIN inputs into a holding register in the parallel-to-  
serial converter. The rising edge of PICLK samples PIN(7-0).  
After a Master Reset two rising edges of PICLK are required to  
fully initialize the internal datapath.  
TESTEN  
SYNC  
TTL  
TTL  
I
I
6
Test clock enable signal, set high to provide access to the PLL  
during production tests.  
45  
Active high synchronization enable input that enables the timing  
generator to invert the internal byte transfer clock if transfers  
from the PIN(7-0) input holding register are occurring less than  
one bit period before or after clocking new data into the holding  
register. The SYNC pin is an asynchronous input.  
REFCLK  
DLEB  
TTL  
TTL  
I
I
75  
50  
Input used as the reference for the internal bit clock frequency  
synthesizer.  
Diagnostic loopback enable signal. Enables the DLD output  
when low and TSCLKSEL is low. When DLEB is high, the DLD  
output is held in the inactive state to prevent interference  
between the transmit and receive devices.  
RSTB  
TTL  
TTL  
TTL  
I
I
15  
46  
51  
Reset input for the device, active low.  
TSCLKSEL  
TESTRST  
Active high transmit clock select input which, when enabled,  
directs the transmit serial clock through the DLDP/N output.  
I
Used to reset portions of the clock recovery PLL during  
production testing. Held low for normal operation.  
CAP1  
CAP2  
I
3
78  
The loop filter capacitor is connected to these pins. The  
capacitor value should be 0.01µf ±10% tolerance, X7R dielectric.  
50 V is recommended (16 V is acceptable).  
TSDP  
TSDN  
Diff.  
PECL  
O
73  
71  
Serial data stream signals. Normally connected to an optical  
transmitter module.  
8
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
S3011 Transmitter Pin Assignment and Descriptions (Continued)  
Pin Name Level I/O  
Pin #  
Description  
DLDP  
DLDN  
Diff.  
PECL  
O
69  
67  
Serial data stream signals, normally connected to a companion  
S3012 device for diagnostic loopback purposes. They are held  
inactive when DLEB is high and TSCLKSEL is low. The serial  
data stream is output when DLEB is low and TSCLKSEL is low.  
When enabled by the TSCLKSEL input, the transmit serial clock  
will be output through this pin. The transmit serial clock is a  
buffered version of the internal frequency synthesizer clock,  
which is phase-aligned with the TSD output signal. The TSD is  
updated on the falling edge of the transmit serial clock.  
PCLK  
PAE  
O
O
10  
44  
A reference clock generated by dividing the internal bit clock by  
eight. It is normally used to coordinate byte-wide transfers  
between upstream logic and the S3011 device.  
CMOS  
TTL/  
CMOS  
Phase alignment event signal, that pulses high during each  
PCLK cycle for which there is less than one bit period between  
the internal byte clock and PICLK timing domains. PAE is  
updated on the falling edge of the PCLK outputs.  
+5V  
+5V  
7, 14, 27, Digital +5V  
34, 47,  
54  
TGND  
TTLVCC  
A+5V  
GND  
+5V  
+5V  
76  
TTL Ground (Digital 0V)  
TTL Power Supply (+5V if TTL)  
23, 38  
5, 56, 66, Analog +5V  
74  
AGND  
GND  
+5V  
4, 57, 64, Analog 0V  
72  
ECLIOVCC  
24, 37  
Digital +5V  
IOGND  
GND  
GND  
GND  
18, 43  
Digital 0V  
1, 2, 8, Digital 0V  
13, 19,  
20, 21,  
22, 29,  
32, 39,  
40, 41,  
42, 48,  
53, 59,  
60, 61,  
62, 79,  
80  
9
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
S3011 Transmitter Pin Assignment and Descriptions (Continued)  
Pin Name Level I/O  
Pin #  
Description  
NC  
9, 11, 12, Not connected  
33, 49,  
52, 55,  
58, 63,  
65, 68,  
70, 77  
10  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
S3012 Receiver Pin Assignment and Descriptions  
Pin Name  
Level I/O  
Pin # Description  
RSDP  
RSDN  
Diff.  
PECL  
I
63  
65  
Serial data stream signals normally connected to an optical  
receiver module. A clock is recovered from transitions on the  
RSD inputs.  
DLDP  
DLDN  
Diff.  
PECL  
I
67  
69  
Serial data stream signal, normally connected to a companion  
S3011 device for diagnostic loopback purposes. Clock is  
recovered from transitions on the DLD inputs while in diagnostic  
loopback.  
DLEB  
TTL  
I
51  
Selects diagnostic loopback. When DLEB is high, the S3012  
device uses the primary data (RSD) input. When low, the S3012  
device uses the diagnostic loopback data (DLD) input, and the  
LOS signal is disabled.  
TESTEN  
OOF  
TTL  
TTL  
I
I
6
Test clock enable signal, set high to provide access to the PLL  
during production tests.  
10  
Out of frame indicator used to enable framing pattern detection  
logic in the S3012. This logic is enabled by a rising edge on  
OOF, and remains enabled until frame boundary is detected or  
when OOF is set low, whichever is longer. OOF is an  
asynchronous signal with a minimum pulse width of one POCLK  
period. (See Figures 13 and 14.)  
LOS  
PECL  
I
9
An active-low, single-ended 10K ECL input to be driven by the  
external optical receiver module to indicate a loss of received  
optical power (Loss of Signal). When LOS is low, the data on  
the Serial Data In (RSDP/N) pins will be internally forced to a  
constant zero, LOCKDET will be forced low, and the PLL will  
lock to the REFCKINP/N inputs. When DLEB is low, LOCKDET  
remains high if there are transitions on DLDP/N for either state  
of LOS. This signal must be used to assure correct automatic  
reacquisition to serial data following an interruption and  
subsequent reconnection of the optical path. (This ensures that  
the PLL does not "wander" out of reacquisition range by tracking  
the random phase/frequency content of the optical detector's  
noise floor while monitoring "dark" fiber.) When LOS is high,  
data on the RSDP/N pins will be processed normally.  
REFCLK  
TESTRST  
RSTB  
TTL  
TTL  
TTL  
I
I
I
75  
49  
50  
Input normally used as the reference for the integral clock  
recovery PLL.  
Used to reset portions of the clock recovery PLL during  
production testing. Held low for normal operation.  
Reset input for the device, active low. Initializes the device to a  
known state and forces the PLL to acquire to the reference  
clock. A reset of at least 16 ms should be applied at power-up  
and whenever the user wishes to force the PLL to re-acquire to  
the reference clock. The S3012 will also re-acquire to the  
reference clock if the serial data input is held quiescent for at  
least 16 ms.  
11  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
S3012 Receiver Pin Assignment and Descriptions (Continued)  
Pin Name Level I/O  
Pin #  
Description  
CAP1  
CAP2  
I
3
78  
The loop filter capacitor is connected to these pins. The  
capacitor value should be 0.1µf ±10% tolerance, X7'R dielectric.  
50 V is recommended (16 V is acceptable).  
POUT7  
POUT6  
POUT5  
POUT4  
POUT3  
POUT2  
POUT1  
POUT0  
TTL/  
CMOS  
O
16  
17  
25  
26  
28  
35  
36  
44  
Parallel data output, a 19.44 Mbyte/sec word, aligned to the  
POCLK parallel output clock. POUT7 is the most significant bit  
(corresponding to bit 1 of each PCM word, the first bit received).  
POUT0 is the least significant bit (corresponding to bit 8 of each  
PCM word, the last bit received). POUT(7-0) is updated on the  
falling edge of POCLK.  
FP  
TTL/  
O
O
12  
Frame pulse. Indicates frame boundaries in the incoming data  
stream (RSD). If framing pattern detection is enabled, as  
controlled by the OOF input, FP pulses high for one POCLK  
cycle when a 48-bit sequence matching the framing pattern is  
detected on the RSD inputs. When framing pattern detection is  
disabled, FP pulses high when the incoming data stream, after  
byte alignment, matches the framing pattern. FP is updated on  
the falling edge of POCLK.  
CMOS  
POCLK  
TTL/  
CMOS  
45  
52  
Parallel output clock, a 19.44 MHz nominally 50% duty cycle,  
byte rate output clock, that is aligned to POUT(7-0) byte serial  
output data. POUT(7-0) and FP are updated on the falling edge  
of POCLK.  
LOCKDET  
+5V  
TTL  
+5V  
O
Clock recovery indicator. Set high when the internal clock  
recovery has locked onto the incoming data stream. LOCKDET  
is an asynchronous output.  
7, 14, 27, Digital +5V  
34, 47,  
54  
TGND  
TTLVCC  
A+5V  
GND  
+5V  
+5V  
76  
TTL Ground (Digital 0V)  
TTL Power Supply (+5V if TTL)  
23, 38  
5, 56, 66, Analog +5V  
70  
AGND  
GND  
+5V  
4, 57, 64, Analog 0V  
68  
ECLIOVCC  
24, 37  
Digital +5V  
IOGND  
GND  
18, 43  
Digital 0V  
12  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
S3012 Receiver Pin Assignment and Descriptions (Continued)  
Pin Name Level I/O  
Pin #  
Description  
ITPWR  
ITGND  
+5V  
31, 46  
Digital +5V  
GND  
11, 15, Digital 0V  
30, 33  
GND  
GND  
1, 2, 8, Digital 0V  
13, 19,  
20, 21,  
22, 29,  
32, 39,  
40, 41,  
42, 48,  
53, 59,  
60, 61,  
62, 79,  
80  
NC  
55, 58, Not connected  
71, 72,  
73, 74,  
77  
13  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
Figure 8. 80 PQFP Package  
80  
78  
76  
74  
72  
70  
68  
66  
64  
62 61  
1
2
60  
59  
4
6
57  
55  
53  
51  
49  
47  
8
10˚  
TOP  
VIEW  
10  
12  
14  
16  
18  
20  
1.28 ± .10  
2.70 ± .10  
1.28 ± .10  
45  
43  
41  
0.30  
0.65  
0.88 + .15 - .10  
14.0 ± .10  
17.2 ± .25  
All dimensions nominal in mm.  
14  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
Performance Specifications  
Parameter  
Min  
Typ  
Max  
Units  
Condition  
Nominal VCO  
Center Frequency  
622.08  
MHz  
In CSU mode, given 56 ps rms  
jitter on REFCLK in 12KHz to  
1 MHz band  
PECL Data Output Jitter  
64  
ps (rms)  
Reference Clock Frequency  
Tolerance  
Required to meet SONET/ATM  
output frequency specification  
lock Synthesis (S3011)  
lock Recovery (S3012)  
-20  
-100  
+20  
+100  
ppm  
ppm  
OC-3/STS-3  
Capture Range  
Lock Range  
Clock Output  
Duty Cycle  
±200ppm  
+8%, -12%  
With respect to fixed reference  
frequency  
48  
30  
52  
% of UI  
Minimum transition density of  
20%  
With device already powered up  
and valid REFCLK  
Acquisition Lock Time  
64.0  
70  
µsec  
Reference Clock  
Input Duty Cycle  
% of period  
Reference Clock Rise & Fall  
Times  
5.0  
ns  
ps  
10% to 90% of amplitude  
PECL Output Rise & Fall  
Times  
20% to 80%, 50 to VCC -2  
equivalent load, 5 pf cap  
600  
15  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
Absolute Maximum Ratings  
PARAMETER  
Case Temperature under Bias  
Typ Max  
125 °C  
Min  
–55  
Unit  
Junction Temperature under Bias  
Storage Temperature  
–55  
–65  
150 °C  
150 °C  
Voltage on VCC with Respect to GND –0.5  
+7.0  
+5.5  
VCC  
V
V
V
Voltage on Any TTL Input Pin  
Voltage on Any PECL Input Pin  
TTL Output Sink Current  
–0.5  
VCC–3  
20 mA  
10 mA  
TTL Output Source Current  
High Speed PECL Output Source  
Current  
50 mA  
V
Static Discharge Voltage  
500  
Recommended Operating  
Conditions  
Typ Max Unit  
70 °C  
125 °C  
Min  
PARAMETER  
Ambient Temperature under Bias  
Junction Temperature under Bias  
Voltage on VCC with Respect to GND  
Voltage on Any TTL Input Pin  
Voltage on Any PECL Input Pin  
S3011 ICC  
0
20  
4.75 5.0 5.25  
V
V
V
0
VCC  
VCC  
VCC–2  
210 mA  
270 mA  
S3012 ICC  
16  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
(TA = 0°C to +70°C, VCC = 5 V ±5%)  
TTL/CMOS Input/Output DC Characteristics  
Symbol  
Parameter  
Input LOW Voltage  
Input HIGH Voltage  
Input LOW Current  
Input HIGH Current  
Min  
Typ  
Max  
0.8  
Unit  
Volts  
Volts  
µA  
Conditions  
Guaranteed Input LOW Voltage  
1
V
V
I
IL  
1
2.0  
Guaranteed Input HIGH Voltage  
IH  
-400.0  
V
V
= MAX, V = 0.5V  
IN  
CC  
CC  
IL  
50.0  
1.0  
µA  
= MAX, V = 2.7V  
IN  
I
I
IH  
Input HIGH Current at  
Max VCC  
mA  
V
= MAX, V = 5.5V  
IN  
I
CC  
-100.0  
-1.2  
-25.0  
0.5  
mA  
V
CC  
V
CC  
V
CC  
V
CC  
= MAX, V  
= 0.5V  
I
Output Short Circuit Current  
Input Clamp Diode Voltage  
Output LOW Voltage  
OUT  
= MIN, I = -18 ma  
OS  
V
V
Volts  
Volts  
IK  
IN  
= MIN, I  
= MIN, I  
= 8 ma  
OL  
OL  
= -1 ma  
Output HIGH Voltage  
Volts  
V
2.7  
OH  
OH  
1. These input levels provide zero noise immunity and should only be tested in a static, noise-free  
environment.  
PECL Input/Output DC Characteristics 1,2  
(TA = 0°C to +70°C, VCC = 5 V ±5%)  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
Conditions  
Guaranteed Input LOW Voltage  
for single-ended inputs  
Input LOW Voltage  
V
V
V
V
V
V
-2.000  
V
V
-1.450  
Volts  
IL  
CC  
CC  
Guaranteed Input HIGH Voltage  
for single-ended inputs  
Volts  
Input HIGH Voltage  
-1.180  
-0.600  
IH  
IL  
CC  
CC  
Guaranteed Input LOW Voltage  
for differential inputs  
Input LOW Voltage  
Input HIGH Voltage  
V
V
-2.000  
-1.750  
V
V
-0.700  
-0.450  
Volts  
Volts  
CC  
CC  
CC  
CC  
Guaranteed Input HIGH Voltage  
for differential inputs  
IH  
ID  
0.250  
0.500  
1.400  
Volts  
µA  
V
I
Input Diff. Voltage  
Input High Current  
Input Low Current  
Differential Input Voltage  
20.000  
20.000  
-0.500  
-0.500  
V
V
= 500mV  
= 500mV  
IH  
ID  
ID  
µA  
I
IL  
V
50 ohm termination to V  
-2V  
-2V  
V
V
-2.000  
V
V
-1.565  
Volts  
Output LOW Voltage  
OL  
CC  
CC  
CC  
CC  
V
V
Output HIGH Voltage  
Output Diff. Voltage  
50 ohm termination to V  
-1.070  
-0.695  
Volts  
Volts  
OH  
OD  
CC  
CC  
0.495  
1.305  
Differential Output Voltage  
1. These conditions will be met with no airflow.  
2. When not used, tie the positive differential PECL pin to V and the negative  
CC  
differential ECL pin to ground via a 3.9K resistor.  
17  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
(TA = 0°C to +70°C, VCC = 5 V ±5%)  
Table 2. S3011 AC Timing Characteristics  
Symbol  
Description  
Min  
Max  
Units  
TSCLK Frequency  
156  
MHz  
TSCLK Duty Cycle  
40  
5
60  
%
ns  
ns  
ns  
%
tSPIN  
PIN [7:0] Set-up Time w.r.t. PICLK  
PIN [7:0] Hold Time w.r.t. PICLK  
PCLK Low to PAE Valid Propagation Delay  
PICLK Duty Cycle  
tHPIN  
tPPAE1  
5
10  
65  
35  
Figure 9. PIN AC Input Timing  
PICLK  
tS  
tH  
PIN  
PIN  
PIN[7:0]  
1. When a set-up time is specified on TTL signals between an input and a clock,  
the set-up time is the time in nanoseconds from the 50% point of the input to  
the 50% point of the clock.  
2. When a hold time is specified on TTL signals between an input and a clock,  
the hold time is the time in nanoseconds from the 50% point of the clock to  
the 50% point of the input.  
Figure 10. PAE Output Timing  
PCLK  
tP  
PAE  
PAE  
Notes on TTL Output Timing  
1. Outputpropagationdelaytimeisthetimeinnanosecondsfromthe50%point  
of the reference signal to the 30% or 70% point of the output.  
2. Maximum output propagation delays are measured with a 15 pF load on the  
outputs.  
18  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
Table 3. S3012 AC Timing Characteristics  
Symbol  
Description  
Min  
Max  
60  
Units  
%
POCLK Duty Cycle  
40  
tPPOUT  
tPFP  
POCLK Low to POUT[7:0] Valid Prop. Delay  
POCLK Low to FP Valid Propagation Delay  
RSD Minimum Pulse Width  
15  
ns  
15  
ns  
1.6  
ns  
Figure 11. Output Timing Diagram  
POCLK  
tP  
POUT  
POUT[7:0]  
tP  
FP  
FP  
Notes on Output Timing:  
1. Output propagation delay time of TTL outputs is the time in nanoseconds  
from the 50% point of the reference signal to the 30% or 70% point of the  
output.  
2. Maximum output propagation delays of TTL outputs are measured with a  
15 pF load and 500 ohms to ground on the outputs.  
19  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
The frame and byte boundary detection block is activated  
by the rising edge of OOF, and stays active until the first  
RECEIVER FRAMING  
Figure 12 shows a typical reframe sequence in which a  
byte realignment is made. The frame and byte bound-  
ary detection is enabled by the rising edge of OOF and  
remains enabled while OOF is high. Both boundaries  
are recognized upon receipt of the third A2 byte which  
is the first data byte to be reported with the correct byte  
alignmentontheoutgoingdatabus(POUT[7:0]).Concur-  
rently, the frame pulse is set high for one POCLK cycle.  
FP pulse or until OOF goes low, whichever occurs last.  
Figure 13 shows a typical OOF timing pattern which  
occurs when the S3012 is connected to a down stream  
section terminating device. OOF remains high for one  
full frame after the first FP pulse. The frame and byte  
boundary detection block is active until OOF goes low.  
Figure14showstheframeandbyteboundarydetection  
activation by a rising edge of OOF, and deactivated by  
the first FP pulse.  
When interfacing with a section terminating device, the  
OOF input remains high for one full frame after the first  
framepulsewhilethesectionterminatingdeviceverifies  
internally that the frame and byte alignment are correct, as  
shown in Figure 13. Since at least one framing pattern  
has been detected since the rising edge of OOF,  
boundary detection is disabled when OOF is set low.  
Figure 12. Frame and Byte Detection  
NOTE 1: Range of input to output delay can be 1.5 to 2.5 POCLK cycles  
Figure 13. OOF Operation Timing with SSTX  
Figure 14. Alternate OOF Timing  
BOUNDARY DETECTION ENABLED  
BOUNDARY DETECTION ENABLED  
OOF  
OOF  
FP  
FP  
20  
S3011/S3012  
SONET/SDH/ATM OC-3 TRANSMITTER AND RECEIVER  
Ordering Information  
GRADE  
TRANSMITTER  
PACKAGE  
A – 80 PQFP  
S – commercial  
3011  
PACKAGE  
GRADE  
RECEIVER  
S – commercial  
3012  
A – 80 PQFP  
X XXXX  
X
Grade Part number  
Package  
Applied Micro Circuits Corporation • 6290 Sequence Dr., San Diego, CA 92121  
Phone: (619) 450-9333 • (800)755-2622 • Fax: (619) 450-9885  
http://www.amcc.com  
AMCC reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and  
advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied  
on is current.  
AMCC does not assume any liability arising out of the application or use of any product or circuit described herein, neither does it  
convey any license under its patent rights nor the rights of others.  
AMCC reserves the right to ship devices of higher grade in place of those of lower grade.  
AMCC SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR  
USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.  
AMCC is a registered trademark of Applied Micro Circuits Corporation.  
Copyright ® 1997 Applied Micro Circuits Corporation  
June 2, 1997  

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