BD2221G-LB [ROHM]
本产品是面向工业设备市场的产品，保证长期稳定供货。 是适合这些用途的产品。存储卡插槽用高边开关为用于存储卡插槽电源线的带过电流限制功能的高边开关IC。开关部内置了1个电路的低导通电阻N沟道MOSFET。还内置了过温检测、欠压锁定、软启动等功能。;
| 型号： | BD2221G-LB |
| 厂家： | 
ROHM |
| 描述： | 本产品是面向工业设备市场的产品，保证长期稳定供货。 是适合这些用途的产品。存储卡插槽用高边开关为用于存储卡插槽电源线的带过电流限制功能的高边开关IC。开关部内置了1个电路的低导通电阻N沟道MOSFET。还内置了过温检测、欠压锁定、软启动等功能。 开关 软启动 存储 |
| 文件： | 总24页 (文件大小：549K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
1ch Small Package
High Side Switch ICs
for USB Devices and Memory Cards
BD2220G-LB BD2221G-LB
General Description
Key Specifications
Input voltage range:
ON resistance:
This is the product guarantees long time support in
Industrial market.
2.7V to 5.5V
160mΩ(Typ.)
BD2220G and BD2221G are low on-resistance
N-channel MOSFET high-side power switches,
optimized for Universal Serial Bus (USB) applications.
BD2220G and BD2221G are equipped with the function
Over current threshold:
Standby current:
Operating temperature range:
0.5A min., 1.0A max.
0.01μA (Typ.)
-40℃ to +85℃
of
over-current
detection,
thermal
shutdown,
Package
W(Typ.) D (Typ.) H (Max.)
2.90mm x 2.80mm x 1.25mm
under-voltage lockout and soft-start.
SSOP5
Features
■
■
■
Long time support a product for Industrial
applications.
Low On-Resistance (Typ. 160mΩ) N-channel
MOSFET Built-in
Over-Current Detection
(Output off-latch operation)
Thermal Shutdown
■
■
■
■
■
Open-Drain Fault Flag Output
Under-Voltage Lockout
Soft-Start Circuit
SSOP5
Control Input Logic
¾
¾
Active-High : BD2220G
Active-Low : BD2221G
■
Reverse Current Protection when
Power Switch Off
Applications
Industrial Equipment,
USB hub in consumer appliances, Car accessory, PC,
PC peripheral equipment, and so forth
Typical Application Circuit
5V (Typ.)
3.3V
CIN
VIN
GND
EN
VOUT
/OC
+
-
L
C
10kΩ~
100kΩ
Lineup
Over current detection
Control input logic
Package
Orderable Part Number
Min.
Typ.
Max.
0.5A
-
1.0A
High
Low
SSOP5
SSOP5
Reel of 3000 BD2220G – LBTR
Reel of 3000 BD2221G – LBTR
0.5A
-
1.0A
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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Datasheet
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Block Diagram
GND
Delay
Counter
/OC
OCD
S Q
R
Charge
pump
TSD
UVLO
EN
VIN
VOUT
Pin Configurations
BD2220G
TOP VIEW
BD2221G
TOP VIEW
1 VIN
VOUT 5
/OC 4
1 VIN
VOUT 5
/OC 4
2 GND
3 EN
2 GND
3 /EN
Pin Description
Pin No.
Symbol
I/O
-
Function
1
VIN
Switch input and the supply voltage for the IC.
Ground.
2
3
4
5
GND
-
I
Enable input.
EN, /EN
/OC
EN: High level input turns on the switch. (BD2220G)
/EN: Low level input turns on the switch. (BD2221G)
Over-current notification terminal.
O
O
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
VOUT
Switch output.
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Datasheet
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Absolute Maximum Ratings (Ta=25℃)
Parameter
VIN supply voltage
EN(/EN) input voltage
/OC voltage
Symbol
Ratings
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
5
Unit
V
VIN
VEN(/EN)
V/OC
I/OC
V
V
/OC sink current
VOUT voltage
mA
V
VOUT
TSTG
Pd
-0.3 to 6.0
-55 to 150
675 *1
Storage temperature
Power dissipation
*1 Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1oC above 25oC.
℃
mW
Recommended Operation Range
Ratings
Parameter
Symbol
Unit
Min.
2.7
Typ.
5.0
-
Max.
5.5
VIN operating voltage
Operating temperature
VIN
V
TOPR
-40
85
℃
Electrical Characteristics (VIN= 5V, Ta= 25℃, unless otherwise specified.)
DC Characteristics
Limits
Parameter
Operating current
Standby current
Symbol
IDD
Unit
μA
Conditions
Min.
-
Typ.
Max.
VEN = 5V (BD2220G)
V/EN = 0V (BD2221G)
VOUT = open
VEN = 0V (BD2220G)
V/EN = 5V (BD2221G)
VOUT = open
110
160
5
ISTB
-
0.01
μA
VEN(/EN)
VEN(/EN)
IEN(/EN)
RON
2.0
-
-
-
V
V
High input
EN(/EN) input voltage
-
0.8
1.0
210
1.0
1.0
1.0
-
Low input
EN(/EN) input leakage
On-resistance
-1.0
-
0.01
μA
mΩ
μA
μA
A
VEN(/EN) = 0V or 5V
IOUT = 50mA
160
Switch leak current
ILSW
-
-
VEN(/EN) = 0V, VOUT = 0V
VOUT = 5.5V, VIN = 0V
Reverse leak current
Over-current threshold
Short circuit output current
/OC output low voltage
IREV
-
-
-
ITH
0.5
0.35
-
ISC
-
A
VOUT = 0V, RMS
I/OC = 0.5mA
V/OC
-
0.4
2.5
2.4
V
VTUVH
VTUVL
2.1
2.0
2.3
2.2
V
VIN increasing
VIN decreasing
UVLO threshold
V
AC Characteristics
Parameter
Limits
Typ.
1
Symbol
Unit
Conditions
Min.
Max.
6
Output rise time
Output turn-on time
Output fall time
TON1
TON2
TOFF1
TOFF2
T/OC
-
-
ms
ms
μs
RL = 20Ω
RL = 20Ω
RL = 20Ω
RL = 20Ω
1.5
1
10
20
40
20
-
Output turn-off time
/OC delay time
-
3
μs
10
15
ms
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Measurement Circuit
VIN
VIN
A
A
VIN
VOUT
VIN
VOUT
/OC
L
R
1µF
1µF
GND
GND
EN(/EN)
V
EN(/EN)
V
/OC
EN(/EN)
EN(/EN)
A. Operating current
B. EN,/EN Input voltage, Output rise/fall time
VIN
VIN
A
10kΩ
A
OC
I
VIN
VOUT
/OC
VIN
VOUT
/OC
1µF
1µF
OUT
I
GND
GND
EN(/EN)
V
EN(/EN)
V
EN(/EN)
EN(/EN)
C. On-resistance, Over-current detection
D. /OC Output low voltage
Figure 1. Measurement circuit
Timing Diagram
50%
50%
50%
50%
VEN
V/EN
TON2
TOFF2
TON2
TOFF2
10%
90%
10%
90%
10%
90%
90%
10%
VOUT
VOUT
TON1
TOFF1
TON1
TOFF1
Figure 2. Output rise/fall time
(BD2220G)
Figure 3. Output rise/fall time
(BD2221G)
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Typical Performance Curves
140
140
120
100
80
VIN=5.0V
Ta=25°C
120
100
80
60
40
20
0
60
40
20
0
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : V [V]
AMBIENT TEMPERATURE : Ta[ ]
℃
IN
Figure 4. Operating current
EN,/EN enable
Figure 5. Operating current
EN,/EN enable
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
VIN=5.0V
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VIN [V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 6. Standby current
EN,/EN disable
Figure 7. Standby current
EN,/EN disable
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Typical Performance Curves - continued
2.0
2.0
1.5
1.0
0.5
0.0
Ta=25°C
VIN=5.0V
Low to High
High to Low
1.5
Low to High
High to Low
1.0
0.5
0.0
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 8. EN,/EN input voltage
Figure 9. EN,/EN input voltage
250
200
150
100
50
250
200
150
100
50
Ta=25°C
VIN=5.0V
0
0
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VIN [V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 10. On-resistance
Figure 11. On-resistance
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Typical Performance Curves - continued
1.0
1.0
0.9
0.8
0.7
0.6
0.5
VIN=5.0V
Ta=25°C
0.9
0.8
0.7
0.6
0.5
-50
0
50
100
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[
]
℃
SUPPLY VOLTAGE : V [V]
IN
Figure 12. Over-current threshold
Figure 13. Over-current threshold
100
100
80
60
40
20
0
VIN=5.0V
Ta=25°C
80
60
40
20
0
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 14. /OC output low voltage
Figure 15. /OC output low voltage
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Typical Performance Curves - continued
2.5
1.0
0.8
0.6
0.4
0.2
0.0
VIN=5.0V
VIN=5.0V
2.4
2.3
VTUVH
2.2
VTUVL
2.1
2.0
-50
0
50
100
-50
0
50
100
AMBIENT TEMPERATURE : Ta[
]
℃
AMBIENT TEMPERATURE : Ta[
℃
Figure 16. UVLO threshold
Figure 17. UVLO hysteresis voltage
5.0
5.0
4.0
3.0
2.0
1.0
0.0
VIN=5.0V
Ta=25°C
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 18. Output rise time
Figure 19. Output rise time
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Typical Performance Curves - continued
5.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
4.0
VIN=5.0V
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 20. Output turn-on time
Figure 21. Output turn-on time
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
VIN=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 22. Output fall time
Figure 23. Output fall time
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Typical Performance Curves - continued
6.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
5.0
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VIN [V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 24. Output turn-off time
Figure 25. Output turn-off time
20
18
16
14
12
10
20
18
16
14
12
10
VIN=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 26. /OC delay time
Figure 27. /OC delay time
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Typical Waveforms
VEN
VEN
(5V/div.)
(5V/div.)
VOC
(5V/div.)
/
V/OC
(5V/div.)
VOUT
VOUT
(5V/div.)
(5V/div.)
IOUT
IOUT
(0.5A/div.)
(0.5A/div.)
VIN=5V
VIN=5V
RL=20Ω
RL=20Ω
TIME(2us/div.)
TIME(1ms/div.)
Figure 29. Output fall characteristic
Figure 28. Output rise characteristic
VEN
V/OC
(5V/div.)
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
CL=220uF
CL=100uF
IOUT
(0.5A/div.)
IOUT
(0.2A/div.)
VIN=5V
VIN=5V
RL=20Ω
CL=47uF
1A/10ms
TIME (2ms/div.)
TIME (1ms/div.)
Figure 31. Over-current response
ramped load
Figure 30. Inrush current response
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Typical Waveforms - continued
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
VOUT
(5V/div.)
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
1A/50ms
VIN=5V
TIME (10ms/div.)
TIME (5ms/div.)
Figure 32. Over-current response
ramped load
Figure 33. Over-current response
enable to short-circuit
V/OC
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(1A/div.)
IOUT
(0.2A/div.)
RL=20Ω
VIN=5V
RL=1Ω
TIME (10ms/div.)
TIME (5ms/div.)
Figure 35. UVLO response
an increasing VIN
Figure 34. Over-current response
1Ω load connected at EN
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Typical Wave Forms - continued
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
RL=20Ω
TIME (10ms/div.)
Figure 36. UVLO response in
a decreasing VIN
Typical Application Circuit
5V (Typ.)
10kΩ
to
100kΩ
VIN
VOUT
/OC
IN
C
+
-
Controller
GND
L
C
EN(/EN)
Application Information
When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source
line to IC, and may cause bad influences on IC operations. In order to avoid this case, connect a bypass capacitor across
IN terminal and GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by a resistance value of 10kΩ to 100kΩ.
Set up value which satisfies the application of either CL.
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as dispersion of the IC.
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Functional Description
1. Switch Operation
VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VIN
terminal is used also as power source input to internal control circuit.
When the switch is turned ON from EN,/EN control input, the switch is bidirectional. VIN terminal and VOUT terminal are
connected by a 160mΩ (Typical) switch., Therefore, when the potential of VOUT terminal is higher than that of VIN
terminal, current flows from VOUT terminal to VIN terminal. On the other hand, when the switch is turned OFF, it is
possible to prevent current from flowing reversely from VOUT to VIN since a parasitic diode between the drain and the
source of switch MOSFET is not present,
2. Thermal Shutdown Circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 170°C (typ.) in the condition of over current detection, thermal shutdown circuit operates and makes power switch
turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 150°C (typ.), power
switch is turned on and fault flag (/OC) is cancelled. Unless the increasing of the chip’s temperature is removed or the
output of power switch is turned off, this operation repeats.
Note: The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over Current Detection (OCD)
The Over Current Detection circuit limits current (ISC) and outputs a fault flag (/OC) when current flowing in each
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned ON while the output is in shortcircuit status
When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status
immediately.
3-2. When the output shortcircuits while the switch is on
When the output short-circuits or high-current load is connected while the switch is on, very large current flows until
the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typical). If the VIN drops below
2.2V(Typical) while the switch is still ON, then UVLO will shut off the power switch. UVLO has a hysteresis of
100mV(Typical).
Note: Under voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Fault Flag (/OC) Output
Fault flag output is an NMOS open drain output. At detection of over current and/or thermal shutdown, the output level is
low.
Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
T/OC
T/OC
Output current
Switch status
ON
OFF
ON
FLAG Output
VEN
Figure 37. Over-current shutdown operation (reset at toggle of EN）(BD2220G)
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Datasheet
BD2220G-LB BD2221G-LB
T/OC
T/OC
Output current
Switch status
FLAG Output
ON
OFF
ON
VTUVL
VTUVH
VIN
VEN
Figure 38. Over-current shutdown operation (reset at UVLO operation) (BD2220G)
Power Dissipation
700
(SSOP5 package)
675mW
* 70mm x 70mm x 1.6mm Glass Epoxy Board
600
500
400
300
200
100
0
0
25
50
75
100
125
150
85
A MBIENT TEMPERA TURE : Ta [
]
℃
Figure 39. Power dissipation curve (Pd-Ta curve)
I/O Equivalence Circuit
Symbol Pin No.
Equivalence circuit Symbol Pin No.
Equivalence circuit
/OC
EN
3
EN
(/EN)
/OC
4
(/EN)
VOUT
5
-
-
-
VOUT
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Datasheet
BD2220G-LB BD2221G-LB
Operational Notes
(1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as
adding a fuse, in case the IC is operated over the absolute maximum ratings.
(2) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals
(4) Power supply lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
(5) Ground voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
(6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation
or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
(7) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(8) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
(9) Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
C
E
Pin A
B
C
E
N
P+
P+
P+
N
N
N
P+
P
N
P
N
P substrate
P substrate
Parasitic
element
GND
GND
GND
GND
Parasitic element
Parasitic element
Other adjacent elements
Figure 40. Example of monolithic IC structure
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TSZ02201-0E3E0H300380-1-2
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Datasheet
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(10) GND wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the
GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
(11) External capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
(12) Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature
of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do not use the IC in
conditions where this function will always be activated.
(13) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation
Power dissipation
: Pd (W)=(Tjmax－Ta)/θja
: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
.
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TSZ02201-0E3E0H300380-1-2
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© 2013 ROHM Co., Ltd. All rights reserved.
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Datasheet
BD2220G-LB BD2221G-LB
Ordering Information
B D 2 2 2 x G
-
L B T R
Part Number
Package
Product class
G : SSOP5
LB for Industrial applications
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
SSOP5 (TOP VIEW)
Part Number Marking
LOT Number
Part Number
Part Number Marking
BD2220G
BD2221G
DX
DY
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18/20
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Datasheet
BD2220G-LB BD2221G-LB
Physical Dimension Tape and Reel Information
Package Name
SSOP5
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
19/20
Datasheet
BD2220G-LB BD2221G-LB
Revision History
Date
Revision
001
Changes
13.Mar.2013
New Release
Delete sentence “and log life cycle” in General Description and Futures (page 1).
Change “Industrial Applications” to “Industrial Equipment” in Applications (page 1).
Applied new style (“title”, “Ordering Information” and “Physical Dimension Tape and Reel
Information”).
21.Feb.2014
002
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20/20
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Daattaasshheeeett
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
Datasheet
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BD2220G-LB - Web Page
Distribution Inventory
Part Number
Package
BD2220G-LB
SSOP5
Unit Quantity
3000
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
3000
Taping
inquiry
Yes
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