BD2266G-M [ROHM]
BD2266G-M中一个通道内置了用于通用串行总线(USB)电源线的高边开关。电源开关部1个电路内置了低导通电阻的N通道MOSFET。还内置了过电流限制、过热保护、低电压锁定、软启动等功能。;
| 型号： | BD2266G-M |
| 厂家： | 
ROHM |
| 描述： | BD2266G-M中一个通道内置了用于通用串行总线(USB)电源线的高边开关。电源开关部1个电路内置了低导通电阻的N通道MOSFET。还内置了过电流限制、过热保护、低电压锁定、软启动等功能。 开关 软启动 电源开关 |
| 文件： | 总37页 (文件大小：603K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
1 Channel Compact High Side Switch ICs
Current Limit High Side Switch ICs
BD226xG-M Series
General Description
Key Specifications
ꢀ Input Voltage Range:
ꢀ ON-Resistance:
BD226xG-M series are low on-resistance N-channel
MOSFET high-side power switches, optimized for
Universal Serial Bus (USB) applications. BD226xG-M
series are equipped with the function of over-current
detection, thermal shutdown, under-voltage lockout
and soft-start.
2.7V to 5.5V
120mΩ(Typ)
0.3A, 0.76A, 0.97A
0.01µA (Typ)
ꢀ Over-Current Threshold:
ꢀ Standby Current:
ꢀ Operating Temperature Range:
-40°C to +85°C
Package
W(Typ) D(Typ) H(Max)
Features
ꢀ
ꢀ
AEC-Q100 Qualified
Over Current Protection
ꢁ
ꢁ
ꢁ
0.3A: BD2262G-M
0.76A: BD2264G-M / BD2265G-M
0.97A: BD2266G-M / BD2267G-M
ꢀ
ꢀ
Built-in Low ON-Resistance (Typ 120mΩ)
N-Channel MOSFET
Reverse Current Protection when
Power Switch Off
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Thermal Shutdown
SSOP5
2.90mm x 2.80mm x 1.25mm
Under-Voltage Lockout
Open-Drain Error Flag Output
Output Discharge Function
Soft Start Circuit
Control Input Logic
ꢁ
ꢁ
Active-High:
BD2262G-M /BD2264G-M /BD2266G-M
Active-Low:
BD2265G-M /BD2267G-M
Applications
Car accessory, Industrial applications
Typical Application Circuit
5V (Typ)
3.3V
OUT
/OC
IN
IN
C
+
GND
EN
L
C
10kΩ to
100kΩ
-
Lineup
Over-Current Threshold
Typ
Control Input
Logic
Package
Orderable Part Number
Min
Max
0.2A
0.3A
0.76A
0.76A
0.97A
0.97A
0.4A
0.9A
High
High
Low
High
Low
SSOP5
Reel of 3000 BD2262G-MGTR
Reel of 3000 BD2264G-MGTR
Reel of 3000 BD2265G-MGTR
Reel of 3000 BD2266G-MGTR
Reel of 3000 BD2267G-MGTR
0.63A
0.63A
0.82A
0.82A
SSOP5
SSOP5
SSOP5
SSOP5
0.9A
1.12A
1.12A
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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Datasheet
BD226xG-M Series
Block Diagram
OUT
IN
Pin Configurations
TOP VIEW
1
2
3
5
4
IN
OUT
/OC
GND
EN,/EN
Pin Description
Pin No.
Symbol
IN
I/O
Function
1
2
-
-
Switch input and the supply voltage for the IC.
GND
Ground.
Enable input.
3
EN, /EN
I
EN: High level input turns on the switch.(BD2262G-M, BD2264G-M, BD2266G-M)
/EN: Low level input turns on the switch. (BD2265G-M, BD2267G-M )
Over-current detection terminal.
4
5
/OC
O
O
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
OUT
Switch output.
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Datasheet
BD226xG-M Series
Absolute Maximum Ratings (Ta=25°C)
Parameter
IN Supply Voltage
EN(/EN) Input Voltage
/OC Voltage
Symbol
Rating
-0.3 to +6.0
-0.3 to +6.0
-0.3 to +6.0
5
Unit
V
VIN
VEN, V/EN
V/OC
V
V
mA
/OC Sink Current
OUT Voltage
I/OC
VOUT
Tstg
-0.3 to +6.0
-55 to +150
0.67(Note 1)
V
Storage Temperature
Power Dissipation
°C
W
Pd
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1°C above 25°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Rating
Parameter
Symbol
Unit
Min
2.7
-40
Typ
5.0
-
Max
5.5
IN Operating Voltage
VIN
V
Operating Temperature
Topr
+85
°C
Electrical Characteristics
(VIN= 5V, Ta= 25°C, unless otherwise specified.)
DC Characteristics
Limit
Typ
Parameter
Operating Current
Standby Current
Symbol
Unit
µA
Conditions
Min
-
Max
175
VEN = 5V (BD2262G-M)
135
V
OUT = open
VEN = 5V (BD2264/ 66G-M)
/EN = 0V (BD2265/ 67G-M)
IDD
-
-
110
160
5
V
VOUT = open
VEN = 0V (BD2262/ 64/ 66G-M)
V/EN = 5V (BD2265/ 67G-M)
ISTB
0.01
µA
V
OUT = open
VENH(/ENH)
VENL(/ENL)
VENL(/ENL)
IEN(/EN)
2.0
-
-
-
V
V
High Input, VIN=3.3 to 5V
EN Input Voltage
EN Input Leakage
-
-
0.8
0.6
+1
Low Input, VIN=5V
-
V
Low Input, VIN=3.3V
-1
+0.01
µA
VEN(/EN) = 0V or 5V
VIN=5V
-
-
120
140
165
190
I
I
OUT = 100mA (BD2262G-M)
OUT = 500mA (BD2264/ 65/ 66/ 67G-M)
ON-Resistance
RON
mΩ
µA
VIN=3.3V
IOUT = 100mA (BD2262G-M)
I
OUT = 500mA (BD2264/ 65/ 66/ 67G-M)
Reverse Leak Current
IREV
-
-
1.0
400
390
900
890
1120
1110
300
650
850
VOUT = 5.0V, VIN = 0V
200
190
630
600
820
730
100
350
500
300
290
765
740
970
940
200
500
650
VIN = 5V
BD2262G-M
VIN = 3.3V
VIN = 5V
Over-Current Threshold
ITH
mA
BD2264/ 65G-M
BD2266/ 67G-M
VIN = 3.3V
VIN = 5V
V
IN = 3.3V
BD2262G-M
VIN=3.3 to 5V
VOUT = 0V, RMS
Short Circuit Output Current
ISC
mA
BD2264/ 65G-M
BD2266/ 67G-M
Output Discharge Resistance
/OC Output Low Voltage
RDISC
V/OC
30
-
60
-
120
0.4
2.5
2.4
Ω
V
V
V
IDISC = 1mA
I/OC = 0.5mA
VIN Increasing
VIN Decreasing
VTUVH
VTUVL
2.1
2.0
2.3
2.2
UVLO Threshold
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Datasheet
BD226xG-M Series
AC Characteristics
Parameter
Limit
Typ
1
Symbol
Unit
Conditions
Min
Max
6
Output Rise Time
Output Turn ON Time
Output Fall Time
tON1
tON2
tOFF1
tOFF2
t/OC
-
-
ms
ms
µs
BD2262G-M:
RL = 500Ω
BD2264/ 65/ 66/ 67G-M:
1.5
1
10
20
40
20
-
RL = 20Ω
Output Turn OFF Time
/OC Delay Time
-
3
µs
10
15
ms
Measurement Circuit
V
IN
V
IN
A
A
IN
OUT
/OC
IN
OUT
1µF
1µF
R
L
GND
GND
EN(/EN)
V
EN(/EN)
VEN(/EN)
EN(/EN)
/OC
A. Operating Current
B. EN, /EN Input Voltage, Output Rise / Fall Time
V
IN
V
IN
A
10kΩ
A
I
OC
IN
OUT
/OC
IN
OUT
/OC
1µF
1µF
I
OUT
GND
EN(/EN)
GND
EN(/EN)
V
EN(/EN)
V
EN(/EN)
C. ON-Resistance, Over-Current Detection
Figure 1. Measurement Circuit
D. /OC Output Low Voltage
Timing Diagram
V/ENH
VENL
V/ENL
tON2
VENH
tON2
V/EN
VEN
tOFF2
tOFF2
90%
10%
90%
10%
90%
10%
90%
10%
VOUT
VOUT
tON1
tOFF1
tON1
tOFF1
Figure 2. Output Rise / Fall Time
(BD2262G-M, BD2264G-M, BD2266G-M)
Figure 3. Output Rise / Fall Time
(BD2265G-M, BD2267G-M)
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Datasheet
BD226xG-M Series
Typical Performance Curves
(BD226xG-M)
1.0
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
VIN=5.0V
0.8
0.6
0.4
0.2
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN[V]
Ambient Temperature : Ta[°C]
Figure 5. Standby Current vs Ambient Temperature
(EN, /EN Disable)
Figure 4. Standby Current vs Supply Voltage
(EN, /EN Disable)
2.0
1.5
2.0
Ta=25°C
VIN=5.0V
Low to High
High to Low
1.5
1.0
Low to High
High to Low
1.0
0.5
0.0
0.5
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VIN[V]
Ambient Temperature : Ta[°C]
Figure 6. EN, /EN Input Voltage vs
Supply Voltage
Figure 7. EN, /EN Input Voltage vs
Ambient Temperature
(VENH, VENL, V/ENH, V/ENL
)
(VENH, VENL, V/ENH, V/ENL)
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD226xG-M)
200
150
100
50
200
Ta=25°C
VIN=5.0V
150
100
50
0
0
-50
0
50
100
2
3
4
5
6
Ambient Temperature : Ta[°C]
Supply Voltage : VIN[V]
Figure 8. ON-Resistance vs Supply Voltage
Figure 9. ON-Resistance vs Ambient Temperature
100
100
VIN=5.0V
Ta=25°C
80
60
40
20
0
80
60
40
20
0
2
3
4
5
6
-50
0
50
100
Ambient Temperature : Ta[°C]
Supply Voltage : VIN[V]
Figure 10. /OC Output Low Voltage vs
Supply Voltage
Figure 11. /OC Output Low Voltage vs
Ambient Temperature
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD226xG-M)
2.5
2.4
1.0
0.8
0.6
0.4
0.2
0.0
2.3
VTUVH
2.2
VTUVL
2.1
2.0
-50
0
50
100
-50
0
50
100
Ambient Temperature: Ta [°C]
Ambient Temperature: Ta [°C]
Figure 12. UVLO Threshold Voltage vs
Ambient Temperature
Figure 13. UVLO Hysteresis Voltage vs
Ambient Temperature
20
20
VIN=5.0V
Ta=25°C
18
16
14
12
10
18
16
14
12
10
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : V[V]
Supply Voltage: VIN [V]
AMBIENT TEMPERATURE : Ta[ ]
Ambient Temperature: Ta [°C]
Figure 14. /OC Delay Time vs
Supply Voltage
Figure 15. /OC Delay Time vs
Ambient Temperature
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD226xG-M)
200
200
150
100
50
Ta=25°C
VIN=5.0V
150
100
50
0
0
2
3
4
5
6
-50
0
50
100
Supply Voltage: VIN [V]
Ambient Temperature: Ta [°C]
Figure 16. Output Discharge Resistance vs
Supply Voltage
Figure 17. Output Discharge Resistance vs
Ambient Temperature
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD2262G-M)
160
160
140
120
100
80
Ta=25°C
VIN=5.0V
140
120
100
80
60
40
20
0
60
40
20
0
2
3
4
5
6
-50
0
50
100
SupplyVoltage : V [V]
Ambient Temperature : Ta [°C]
IN
Figure 19. Operating Current vs Ambient
Temperature
Figure 18. Operating Current vs Supply Voltage
EN Enable
EN Enable
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Ta=25°C
VIN=5.0V
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta [°C]
IN
Figure 20. Over-Current Threshold vs
Supply Voltage
Figure 21. Over-Current Threshold vs
Ambient Temperature
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD2262G-M)
5.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
SupplyVoltage : V [V]
Ambient Temperature : Ta [°C]
IN
Figure 22. Output Rise Time vs
Supply Voltage
Figure 23. Output Rise Time vs
Ambient Temperature
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
VIN=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
SupplyVoltage : V [V]
Ambient Temperature : Ta [°C]
IN
Figure 24. Output Turn-on Time vs
Supply Voltage
Figure 25. Output Turn-on Time vs
Ambient Temperature
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD2262G-M)
5.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta [°C]
IN
Figure 26. Output Fall Time vs
Supply Voltage
Figure 27. Output Fall Time vs
Ambient Temperature
6.0
5.0
4.0
3.0
2.0
1.0
0.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VIN=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta [°C]
IN
Figure 29. Output Turn-off Time vs
Ambient Temperature
Figure 28. Output Turn-off Time vs
Supply Voltage
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD2264G-M, BD2265G-M)
140
140
120
100
80
60
40
20
0
Ta=25°C
VIN=5.0V
120
100
80
60
40
20
0
2
3
4
5
6
-50
0
50
100
Ambient Temperature: Ta [°C]
Supply Voltage : VIN[V]
Figure 30. Operating Current vs Supply Voltage
(EN, /EN Enable)
Figure 31. Operating Current vs Ambient Temperature
(EN, /EN Enable)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
1.0
Ta=25°C
VIN=5.0V
0.9
0.8
0.7
0.6
0.5
0.4
2
3
4
5
6
-50
0
50
100
Ambient Temperature: Ta [°C]
Supply Voltage: VIN [V]
Figure 32. Over-Current Threshold vs
Supply Voltage
Figure 33. Over-Current Threshold vs
Ambient Temperature
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD2264G-M, BD2265G-M)
5.0
4.0
3.0
2.0
1.0
5.0
Ta=25°C
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
0.0
-50
0
50
100
2
3
4
5
6
Supply Voltage: VIN [V]
Ambient Temperature: Ta [°C]
Figure 34. Output Rise Time vs
Supply Voltage
Figure 35. Output Rise Time vs
Ambient Temperature
5.0
4.0
3.0
2.0
1.0
5.0
4.0
3.0
2.0
1.0
Ta=25°C
VIN=5.0V
0.0
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage: VIN [V]
Ambient Temperature: Ta [°C]
Figure 36. Output Turn-On Time vs
Supply Voltage
Figure 37. Output Turn-On Time vs
Ambient Temperature
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD2264G-M, BD2265G-M)
5.0
5.0
4.0
3.0
2.0
1.0
VIN=5.0V
Ta=25°C
4.0
3.0
2.0
1.0
0.0
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage: VIN [V]
Ambient Temperature: Ta [°C]
Figure 38. Output Fall Time vs
Supply Voltage
Figure 39. Output Fall Time vs
Ambient Temperature
6.0
5.0
4.0
3.0
2.0
1.0
6.0
5.0
4.0
3.0
2.0
1.0
Ta=25°C
VIN=5.0V
0.0
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage: VIN [V]
Ambient Temperature: Ta [°C]
Figure 40. Output Turn-Off Time vs
Supply Voltage
Figure 41. Output Turn-Off Time vs
Ambient Temperature
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD2266G-M, BD2267G-M)
140
140
120
100
80
60
40
20
0
Ta=25°C
VIN=5.0V
120
100
80
60
40
20
0
2
3
4
5
6
-50
0
50
100
Ambient Temperature: Ta [°C]
Supply Voltage : VIN[V]
Figure 42. Operating Current vs Supply Voltage
(EN, /EN Enable)
Figure 43. Operating Current vs Ambient Temperature
(EN, /EN Enable)
1.3
1.3
Ta=25°C
VIN=5.0V
1.2
1.1
1.2
1.1
1.0
1.0
0.9
0.8
0.7
0.9
0.8
0.7
2
3
4
5
6
-50
0
50
100
Ambient Temperature: Ta [°C]
Supply Voltage: VIN [V]
Figure 44. Over-current threshold vs
Supply Voltage
Figure 45. Over-current threshold vs
Ambient Temperature
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Datasheet
BD226xG-M Series
Typical Performance Curves - continued
(BD2266G-M, BD2267G-M)
5.0
4.0
3.0
2.0
1.0
5.0
Ta=25°C
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
0.0
-50
0
50
100
2
3
4
5
6
Supply Voltage: VIN [V]
Ambient Temperature: Ta [°C]
Figure 46. Output rise time vs Supply Voltage
Figure 47. Output rise time vs Ambient Temperature
5.0
4.0
3.0
2.0
1.0
5.0
Ta=25°C
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
0.0
2
3
4
5
6
-50
0
50
100
Ambient Temperature: Ta [°C]
Supply Voltage: VIN [V]
Figure 48. Output turn-on time vs
Supply Voltage
Figure 49. Output turn-on time vs
Ambient Temperature
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BD226xG-M Series
Typical Performance Curves - continued
(BD2266G-M, BD2267G-M)
5.0
5.0
4.0
3.0
2.0
1.0
VIN=5.0V
Ta=25°C
4.0
3.0
2.0
1.0
0.0
0.0
2
3
4
5
6
-50
0
50
100
Ambient Temperature: Ta [°C]
Supply Voltage: VIN [V]
Figure 50. Output fall time vs Supply Voltage
Figure 51. Output fall time vs Ambient Temperature
6.0
5.0
4.0
3.0
2.0
1.0
6.0
Ta=25°C
VIN=5.0V
5.0
4.0
3.0
2.0
1.0
0.0
0.0
2
3
4
5
6
-50
0
50
100
Ambient Temperature: Ta [°C]
Supply Voltage: VIN [V]
Figure 52. Output turn-off time vs
Supply Voltage
Figure 53. Output turn-off time vs
Ambient Temperature
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BD226xG-M Series
Typical Wave Forms
(BD2262G-M)
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(10mA/div.)
IOUT
(10mA/div.)
RL=500Ω
VIN=5V
RL=500Ω
TIME (1ms/div.)
TIME (1us/div.)
Figure 54. Output Rise Characteristic
Figure 55. Output Fall Characteristic
V/OC
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
CL=100uF
CL=47uF
IOUT
(100mA/div.)
IOUT
(0.2A/div.)
VIN=5V
VIN=5V
RL=50Ω
CL=22uF
TIME (1ms/div.)
Figure 56. Inrush Current Response
TIME (5ms/div.)
Figure 57. Over-Current Response
Ramped Load
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BD226xG-M Series
Typical Wave Forms – continued
(BD2262G-M)
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
VIN=5V
TIME (5ms/div.)
Figure 58. Over-Current Response
Enable to Shortcircuit
TIME (500ms/div.)
Figure 59. Over-Current Response
Enable to Shortcircuit
VOUT
(5V/div.)
VIN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(1A/div.)
IOUT
(10mA/div.)
TIME (5ms/div.)
Figure 61. UVLO Response
Increasing VIN
TIME (5ms/div.)
Figure 60. Over-Current Response
1Ω Load to Enabled Device
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BD226xG-M Series
Typical Wave Forms – continued
(BD2262G-M)
VIN
(5V/div.)
VOUT
(5V/div.)
RL=500Ω
IOUT
(10mA/div.)
TIME (10ms/div.)
Figure 62. UVLO Response
Decreasing VIN
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BD226xG-M Series
Typical Wave Forms – continued
(BD2264G-M)
VEN
VEN
(5V/div.)
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
VIN=5V
RL=20Ω
IOUT
IOUT
(0.5A/div.)
(0.5A/div.)
TIME(1ms/div.)
TIME(1µs/div.)
Figure 63. Output Rise Characteristic
Figure 64. Output Fall Characteristic
VEN
V/OC
(5V/div.)
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
CL=220µF
CL=100µF
IOUT
(0.5A/div.)
IOUT
(0.2A/div.)
V
IN=5V
CL=47µF
RL=20Ω
VIN=5V
TIME (1ms/div.)
TIME (5ms/div.)
Figure 65. Inrush Current Response
Figure 66. Over-Current Response Ramped Load
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BD226xG-M Series
Typical Wave Forms – continued
(BD2264G-M)
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
VIN=5V
TIME (5ms/div.)
TIME (100ms/div.)
Figure 67. Over-Current Response
Enable to Short Circuit
Figure 68. Over-Current Response
Enable to Short Circuit
VOUT
(5V/div.)
VIN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(0.2A/div.)
IOUT
(1A/div.)
RL=20Ω
TIME (5ms/div.)
TIME (10ms/div.)
Figure 69. Over-Current Response
Figure 70. UVLO Response when
Increasing VIN
1Ω Load Connected at EN
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BD226xG-M Series
Typical Wave Forms – continued
(BD2264G-M)
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
RL=20Ω
TIME (10ms/div.)
Figure 71. UVLO Response when
Decreasing VIN
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BD226xG-M Series
Typical Wave Forms – continued
(BD2266G-M)
VEN
VEN
(5V/div.)
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
RL=20Ω
VIN=5V
RL=20Ω
IOUT
IOUT
(0.5A/div.)
(0.5A/div.)
TIME(1us/div.)
Figure 73. Output fall characteristic
TIME(1ms/div.)
Figure 72. Output rise characteristic
VEN
V/OC
(5V/div.)
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
CL=220uF
CL=100uF
IOUT
(0.5A/div.)
IOUT
VIN=5V
(0.2A/div.)
RL=20Ω
CL=47uF
VIN=5V
TIME (5ms/div.)
Figure 75. Over-current response
ramped load
TIME (1ms/div.)
Figure 74. Inrush current response
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Datasheet
BD226xG-M Series
Typical Wave Forms – continued
(BD2266G-M)
VEN
VEN
(5V/div.)
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
VIN=5V
TIME (5ms/div.)
Figure 76. Over-current response
enable to shortcircuit
TIME (100ms/div.)
Figure 77. Over-current response
enable to shortcircuit
VOUT
(5V/div.)
VIN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(0.2A/div.)
IOUT
(1A/div.)
RL=20Ω
TIME (10ms/div.)
Figure 79. UVLO response
increasing VIN
TIME (5ms/div.)
Figure 78. Over-current response
1Ω load to enabled device
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Datasheet
BD226xG-M Series
Typical Wave Forms – continued
(BD2266G-M)
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
RL=20Ω
TIME (10ms/div.)
Figure 80. UVLO response
decreasing VIN
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Datasheet
BD226xG-M Series
Typical Application Circuit
5V (Typ)
10kΩ to
100kΩ
IN
OUT
/OC
C
IN
+
-
Controller
GND
EN(/EN)
C
L
Application Information
When excessive current flows due to output short-circuit or so, ringing occurs by inductance of power source line and IC.
This may cause bad effects on IC operations. In order to avoid this case, a bypass capacitor (CIN) should be connected
across the IN terminal and GND terminal of IC. A 1µF or higher value is recommended. Moreover, in order to decrease
voltage fluctuations of power source line and IC, connect a low ESR capacitor in parallel with CIN. A 10µF to 100µF or higher
is effective.
Pull up /OC output by resistance 10kΩ to 100kΩ.
Set up values for CL which satisfies the application.
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as dispersion of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal
is also used as power source input to internal control circuit.
When the switch is turned ON from EN(/EN) control input, the IN and OUT terminals are connected by a 120mΩ (Typ)
switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN
terminal, current flows from OUT to IN terminal. On the other hand, when the switch is turned off, it is possible to prevent
current from flowing reversely from OUT to IN terminal since a parasitic diode between the drain and the source of switch
MOSFET is not present.
2. Thermal Shutdown Circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature goes
beyond 135°C (Typ) in the condition of over-current detection, thermal shutdown circuit operates and turns power switch
off, causing the IC to output a fault flag (/OC). Then, when the junction temperature decreases lower than 115°C (Typ),
the power switch is turned on and fault flag (/OC) is cancelled. This operation repeats, unless the increase of chip’s
temperature is removed or the output of power switch is turned OFF.
The thermal shutdown circuit operates when the switch is ON (EN(/EN) signal is active).
3. Over-Current Detection (OCD)
The over-current detection circuit limits current (ISC) and outputs fault flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. The over-current detection circuit works when the switch is on (EN(/EN) signal is
active). There are three types of response against over-current:
(1) When the switch is turned on while the output is in short circuit status, the switch goes into current limit status
immediately.
(2) When the output short-circuits or high capacity load is connected while the switch is on, very large current
flows until the over-current limit circuit reacts. When the current detection and limit circuit operates, current
limitation is carried out.
(3) When the output current increases gradually, current limitation would not operate unless the output current
exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried
out.
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Datasheet
BD226xG-M Series
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ). If VIN drops below 2.2V(Typ) while the
switch is still ON, then UVLO shuts off the power switch. UVLO has a hysteresis of 100mV(Typ).
Under-voltage lockout circuit operates when the switch is on (EN(/EN) signal is active).
5. Fault Flag (/OC) Output
Fault flag output is N-MOS open drain output. During detection of over-current and/or thermal shutdown, the output level
will turn low.
Over-current detection has delay filter. This delay filter prevents current detection flags from being sent during
instantaneous events such as inrush current at switch on or during hot plug. If fault flag output is unused, /OC pin should
be connected to open or ground line.
Over Current
Detection
Over Current
Load Removed
VOUT
IOUT
ITH
ISC
t/OC
V/OC
Figure 81. Over-Current Detection
VEN
Output Short Circuit
Thermal Shutdown
VOUT
IOUT
V/OC
/OC Delay Time
Figure 82. Over-Current Detection, Thermal Shutdown Timing (BD2262G-M, BD2264G-M, BD2266G-M)
V/EN
VOUT
Output Short Circuit
Thermal Shutdown
IOUT
V/OC
/OC Delay Time
Figure 83. Over-Current Detection, Thermal Shutdown Timing (BD2265G-M, BD2267G-M )
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Datasheet
BD226xG-M Series
Power Dissipation
(SSOP5 Package)
700
600
500
400
300
200
100
0
85
0
25
50
75
100
125
150
Ambient Temperature : Ta[°C]
70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 84. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol
Pin No.
Equivalence Circuit
EN
(/EN)
3
5
4
EN
(/EN)
OUT
VOUT
/OC
/OC
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BD226xG-M Series
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. In rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BD226xG-M Series
Operational Notes - continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 85. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of
use.
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BD226xG-M Series
Ordering Information
B D
2
2
6
x
G
-
M G T R
Part Number
BD2262G
BD2264G
BD2265G
BD2266G
BD2267G
Package
G: SSOP5
Product Rank
M: for Automotive
Packaging and forming specification
G: Halogen free
TR: Embossed tape and reel
Marking Diagram
SSOP5 (TOP VIEW)
Part Number Marking
LOT Number
Part Number
Part Number Marking
BD2262G-M
BD2264G-M
BD2265G-M
BD2266G-M
BD2267G-M
Z0
Z1
Z2
Z3
Z4
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BD226xG-M Series
Physical Dimension, Tape and Reel Information
Package Name
SSOP5
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BD226xG-M Series
Revision History
Date
Revision
001
Changes
03.Feb.2014
New Release
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Daattaasshheeeett
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
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