BD61246EFV [ROHM]
BD61246EFV是内置电机驱动部,通过功率DMOSFET构成H桥的单芯片驱动器。与以往机型相比,减少了搭载零件,简化了参数设置,从而提高了使用便利性。与转速脉冲信号(FG)输出的BD61245EFV引脚兼容。;型号: | BD61246EFV |
厂家: | ROHM |
描述: | BD61246EFV是内置电机驱动部,通过功率DMOSFET构成H桥的单芯片驱动器。与以往机型相比,减少了搭载零件,简化了参数设置,从而提高了使用便利性。与转速脉冲信号(FG)输出的BD61245EFV引脚兼容。 电机 驱动 脉冲 驱动器 |
文件: | 总29页 (文件大小:1484K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
DC Brushless Fan Motor Drivers
Multifunction Single-phase Full-wave
Fan Motor Driver
BD61246EFV
General Description
Key Specifications
BD61246EFV is a 1chip driver that is composed of
H-bridge power DMOS FET. Moreover, the circuit
configuration is restructured, and convenience has been
improved by reducing the external parts and simplifying
the setting compared with the conventional driver.
The pin is compatible with BD61245EFV (Rotation
speed pulse signal output).
Operating Voltage Range:
4V to 16V
–40°C to +105°C
0.2V(Typ) at 0.4A
Operating Temperature Range:
Output Voltage(total):
Features
Package
W (Typ) x D (Typ) x H (Max)
5.00mm x 6.40mm x 1.00mm
High Heat Radiation Package
Driver Including Power DMOS FET
Speed Controllable by DC / PWM Input
I/O Duty Slope Adjust
HTSSOP-B16
PWM Soft Switching
Current Limit
Start Duty Assist
Lock Protection and Automatic Restart
Quick Start
Lock Alarm Signal (AL) Output
HTSSOP-B16
Applications
Fan motors for general consumer equipment of desktop PC, Projector, etc.
Typical Application Circuits
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SIG
AL
GND
ADJ
SIG
AL
GND
ADJ
H–
H–
H
H
H+
SSW
ZPER
MIN
H+
SSW
ZPER
MIN
SST
SLP
PWM
OUT2
RNF
SST
SLP
PWM
OUT2
RNF
DC
PWM
REF
REF
VCC
OUT1
VCC
OUT1
+
-
+
-
M
M
Figure 1. Application of Direct PWM Input
Figure 2. Application of DC Voltage Input
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD61246EFV
Pin Configuration
Block Diagram
(TOP VIEW)
AL
GND
SIGNAL
OUTPUT
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
OSC
TSD
AL
H–
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
ADJ
H–
ADJ
SSW
ZPER
MIN
A/D
-
COMP
+
H+
H+
SSW
ZPER
MIN
A/D
A/D
A/D
SST
SLP
PWM
OUT2
RNF
SST
SLP
A/D
A/D
CONTROL
LOGIC
REF
INSIDE
REG
REF
REFE-
RENCE
FILTER
VCC
OUT1
PWM
VCL
PRE-
DRIVER
+
VCC
OUT2
COMP
-
OUT1
RNF
Pin Description
Pin No. Pin Name
Function
1
2
3
4
5
6
7
AL
H–
Lock alarm signal output terminal
Hall – input terminal
H+
Hall + input terminal
SST
SLP
PWM
OUT2
Soft start setting terminal
I/O duty slope setting terminal
PWM input duty terminal
Motor output terminal 2
Output current detecting resistor
connecting terminal (motor ground)
Motor output terminal 1
8
RNF
9
OUT1
VCC
REF
MIN
10
11
12
13
14
Power supply terminal
Reference voltage output terminal
Minimum output duty setting terminal
ZPER Re-circulate period setting terminal
SSW
Soft switching setting terminal
Output duty correction setting
terminal
15
16
ADJ
GND
Ground terminal (signal ground)
I/O Truth Table
Motor state
Rotating
Locking
AL output
Hall input
Driver output
L
H+
H–
L
OUT1
OUT2
Hi-Z
H
L
L
H
L
H
H
H; High, L; Low, Hi-Z; High impedance
AL output is open-drain type.
.
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BD61246EFV
Absolute Maximum Ratings
Parameter
Symbol
VCC
Rating
18
Unit
V
Supply Voltage
Power Dissipation
Pd
0.95 (Note 1)
–40 to +105
–55 to +150
18
W
Operating Temperature Range
Storage Temperature Range
Output Voltage
Topr
Tstg
VOMAX
IOMAX
VAL
°C
°C
V
Output Current
1.8 (Note 2)
A
Lock Alarm Signal (AL) Output Voltage
Lock Alarm Signal (AL) Output Current
Reference Voltage (REF) Output Current
Input Voltage1
18
V
IAL
10
mA
mA
IREF
10
VIN1
2.6
V
(H+,H–,MIN,SSW,SST,ZPER,SLP,ADJ)
Input Voltage2 (PWM)
VIN2
Tj
6.5
V
Junction Temperature
150
°C
(Note 1) Derate by 7.6mW/°C when operating over Ta=25°C.
(Note 2) Do not exceed Pd and Tj=150°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
HTSSOP-B16
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
131.5
9
30.8
3
°C/W
°C/W
ΨJT
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-5, 7.
Thermal Via(Note 5)
Layer Number of
Material
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Measurement Board
Pitch
Diameter
4 Layers
FR-4
1.20mm
Φ0.30mm
Top
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
70μm
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
(Note 5) This thermal via connects with the copper pattern of all layers..
.
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BD61246EFV
Recommended Operating Conditions
Parameter
Symbol
VCC
Min
4
Typ
12
-
Max
16
2
Unit
V
Operating Supply Voltage
Hall Input Voltage
VH
0
V
PWM Input Frequency
fPWM
15
-
50
kHz
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V)
Limit
Characteristic
Data
Parameter
Circuit Current
Symbol
ICC
Unit
mA
V
Conditions
Min
1.8
Typ Max
3.3
4.8
Figure 3
Figure 4 to
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12 to
Figure 13
Figure 14
-
IO=±400mA,
Output Voltage
VO
-
0.2
0.44
High and low side total
Lock Detection ON Time
tON
tOFF
0.3
3.0
8
0.5
5.0
10
0.7
7.0
12
s
s
Lock Detection OFF Time
Lock Detection OFF/ON Ratio
Hall Input Hysteresis Voltage
rLCK
-
rLCK=tOFF / tON
VHYS+
±7 ±12 ±17
mV
AL Output Low Voltage
VALL
-
-
0.3
V
IAL=5mA
VAL=16V
AL Output Leak Current
IALL
-
-
-
10
5.0
1.0
10
μA
V
PWM Input High Level Voltage
PWM Input Low Level Voltage
VPWMH
VPWML
IPWMH
IPWML
2.5
-0.3
-10
-50
-
V
-
0
μA
μA
VPWM=5V
VPWM=0V
Figure 15 to
Figure 16
Figure 17 to
Figure 18
Figure 19
PWM Input Current
-25
-12
Reference Voltage
VREF
VCL
2.2
2.4
2.6
V
IREF=-1mA
Current Limit Setting Voltage
120
150
180
mV
For parameters involving current, positive notation means inflow of current to IC while negative notation means outflow of current from IC.
.
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BD61246EFV
Typical Performance Curves (Reference Data)
0.00
-0.15
-0.30
-0.45
-0.60
8
6
105°C
25°C
–40°C
4
2
0
–40°C
25°C
Operating Voltage Range
105°C
0
5
10
15
CC[V]
20
0.0
0.6
1.2
1.8
Supply Voltage: V
Output Source Current: I [A]
O
Figure 3. Circuit Current vs Supply Voltage
Figure 4. Output High Voltage vs Output Source Current
(VCC=12V)
0.00
-0.15
-0.30
-0.45
-0.60
0.60
0.45
105°C 25°C
–40°C
0.30
16V
12V
0.15
0.00
4V
0.0
0.6
1.2
1.8
0.0
0.6
1.2
1.8
O
Output Source Current: I [A]
Output Sink Current: IO[A]
Figure 5. Output High Voltage vs Output Source Current
(Ta=25°C)
Figure 6. Output Low Voltage vs Output Sink Current
(VCC=12V)
.
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BD61246EFV
Typical Performance Curves (Reference Data) – continued
0.7
0.60
0.45
0.30
0.15
0.00
0.6
0.5
0.4
0.3
4V
12V
16V
–40°C
25°C
105°C
Operating Voltage Range
0
5
10
15
20
0.0
0.6
1.2
1.8
Supply Voltage: Vcc[V]
Output Sink Current: Io[A]
Figure 7. Output Low Voltage vs Output Sink Current
(Ta=25°C)
Figure 8. Lock Detection ON Time vs Supply Voltage
12.0
11.0
10.0
9.0
7.0
6.0
5.0
4.0
3.0
–40°C
25°C
105°C
–40°C
25°C
105°C
Operating Voltage Range
Operating Voltage Range
8.0
0
5
10
15
20
0
5
10
15
20
Supply Voltage: Vcc[V]
Supply Voltage: Vcc[V]
Figure 9. Lock Detection OFF Time vs Supply Voltage
Figure 10. Lock Detection OFF/ON Ratio vs Supply Voltage
.
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BD61246EFV
Typical Performance Curves (Reference Data) – continued
40
20
0
0.4
0.3
0.2
0.1
0.0
105°C
25°C
–40°C
105°C
25°C
–40°C
25°C
105°C
–40°C
-20
-40
Operating Voltage Range
0
2
4
6
8
10
0
5
10
15
20
AL Sink Current: IAL[mA]
Supply Voltage: Vcc[V]
Figure 11. Hall Input Hysteresis Voltage vs Supply Voltage
Figure 12. AL Output Low Voltage vs AL Sink Current
(VCC=12V)
8
0.4
6
4
0.3
4V
0.2
12V
16V
2
105°C
25°C
–40°C
0.1
0.0
0
Operating Voltage Range
-2
0
2
4
6
8
10
0
5
10
AL Voltage: V [V]
15
20
AL
AL
AL Sink Current: I [mA]
Figure 13. AL Output Voltage vs AL Sink Current
(Ta=25°C)
Figure 14. AL Output Leak Current vs AL Voltage
.
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BD61246EFV
Typical Performance Curves (Reference Data) – continued
12
0
105°C
Operating Voltage Range
25°C
-10
-20
-30
-40
-50
–40°C
9
6
3
0
–40°C
25°C
105°C
Operating Voltage Range
0
5
10
15
CC[V]
20
0
5
10
15
20
CC
Supply Voltage: V
Supply Voltage: V [V]
Figure 15. PWM Input High Current vs Supply Voltage
(VPWM=5V)
Figure 16. PWM Input Low Current vs Supply Voltage
(VPWM=0V)
3.0
3.0
2.5
2.0
1.5
1.0
–40°C
25°C
105°C
2.5
2.0
1.5
1.0
16V 12V
4V
Operating Voltage Range
0.0
2.5
5.0
7.5
10.0
0
5
10
15
20
CC
REF
[mA]
Supply Voltage: V [V]
REF Source Current: I
Figure 17. Reference Voltage vs Supply Voltage
(VCC=12V)
Figure 18. Reference Voltage vs REF Source Current
(Ta=25°C)
.
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BD61246EFV
Typical Performance Curves (Reference Data) – continued
200
175
105°C
25°C
–40°C
150
125
Operating Voltage Range
100
0
5
10
15
20
CC
Supply Voltage: V [V]
Figure 19. Current Limit Setting Voltage vs Supply Voltage
.
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BD61246EFV
Application Circuit Examples (Constant Values are for Reference)
1. PWM Input Application
This is the application example of direct PWM input into PWM terminal. Minimum rotational speed is set in MIN
terminal voltage.
Protection of AL open-drain
Hall bias is set according
I/O duty correction setting
to the amplitude of hall
element output and hall
input voltage range.
AL
GND
ADJ
SIGNAL
OUTPUT
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
OSC
TSD
SIG
500Ω
to 2kΩ
H–
A/D
-
Soft switching setting
Re-circulate setting
Minimum duty setting
Noise measures of substrate
COMP
H
+
1kΩ
to 100kΩ
H+
SSW
ZPER
MIN
A/D
A/D
A/D
Soft start time setting
I/O duty slope setting
SST
SLP
A/D
A/D
CONTROL
LOGIC
1kΩ
to 100kΩ
INSIDE
REG
REF
REFE-
RENCE
PWM
FILTER
Stabilization of REF voltage
PWM
VCL
PRE-
DRIVER
+
VCC
OUT2
COMP
+
To limit motor current, the current
is detected.
Note the power consumption of
sense resistance.
-
1μF
to 10μF
Reverse Polarity
Protection
OUT1
9
RNF
0Ω to 0.5Ω
Measure against back EMF
M
-
Connect bypass capacitor near
VCC terminal as much as possible.
Maximum output voltage and current
are 18V and 1.8A respectively
Figure 20. PWM Input Application
When a function is not used, do not let the A/D converter input terminal open.
Resistor Divider
OK
Resistor Pull-down
(GND Short)
Terminal Open
(Prohibited input)
Resistor Pull-up
(REF Short)
OK
NG
OK
REF
A/D
REF
A/D
REF
A/D
REF
A/D
Application Design Note
(1) The bypass capacitor connected must be more than the recommended constant value because there is a
possibility of the motor start-up failure etc. due to IC malfunction.
Substrate Design Note
(1) IC power(Vcc), and motor outputs(OUT1, 2) lines are made as wide as possible.
(2) IC ground (GND) line is common with the application ground except motor ground (i.e. hall ground etc.), and
arranged near to (–) land.
(3) The bypass capacitor and/or Zener diode are placed near to VCC pin.
(4) H+ and H– lines are arranged side by side and made from the hall element to IC as short as possible, because it
is easy for the noise to influence the hall lines.
.
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BD61246EFV
Application Circuit Examples (Constant Values are for Reference) – continued
2. DC Voltage Input Application
This is the application example of DC voltage into MIN terminal. Minimum rotational speed setting is disable.
AL
GND
ADJ
SSW
ZPER
MIN
SIGNAL
OUTPUT
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
OSC
TSD
SIG
500Ω
to 2kΩ
H–
A/D
-
COMP
H
+
1kΩ
to 100kΩ
H+
A/D
A/D
A/D
SST
SLP
A/D
A/D
1kΩ
to 100kΩ
CONTROL
LOGIC
DC
INSIDE
REG
REF
VCC
REFE-
RENCE
FILTER
PWM
VCL
PRE-
DRIVER
0Ω
+
OUT2
COMP
+
Short the PWM terminal to
GND.
-
1μF
to 10μF
OUT1
9
RNF
0Ω to 0.5Ω
M
-
Figure 21. DC Voltage Input Application
When a function is not used, do not let the A/D converter input terminal open.
Resistor Divider
OK
Resistor Pull-down
(GND Short)
Terminal Open
(Prohibited input)
Resistor Pull-up
(REF Short)
OK
NG
OK
REF
A/D
REF
A/D
REF
A/D
REF
A/D
.
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BD61246EFV
Functional Descriptions
1. Variable Speed Operation
There are 2 ways to control the speed of motor.
(1) PWM Control (Input PWM pulse into PWM terminal)
(2) Voltage Control (Input DC voltage into MIN terminal)
Both (1) and (2), output PWM frequency is 50kHz. When computed duty is less than 5%, a driving signal is not
output.
(1) PWM Operation by Pulse Input in PWM Terminal
The PWM signal from the controller can be input directly to IC in Figure 22. The output duty is controlled by the
input PWM duty (Figure 23). Refer to recommended operating conditions and electrical characteristics (P.4) for the
input condition.
Internal power-supply voltage (INTERNAL REG; typ 5.0V) is impressed when the PWM terminal is open, it
becomes 100% input of the duty and equivalent, and a full torque is driven. There must be a pull- down resistance
outside of IC to make it to torque 0 when the PWM terminal opens (However, only at the controller of the
complimentary output type.). Insert the protective resistance if necessary.
H–
High
Controller
Motor Unit
H+
Inside
REG
Low
Driver
5.0V
INTERNAL
REG
2.5V
Protection
Resistor
PWM
GND
1.0V
0.0V
PWM
FILTER
PWM
High
Low
OUT1
Motor output ON
: High impedance
Complimen
-tary Output
High
OUT2
Low
Full
Motor
Torque
Figure 22. PWM Input Application
Zero
Figure 23. PWM Input Operation Timing Chart
○Setting of Minimum Output Duty (MIN)
The voltage which divided REF terminal voltage by resistance is input into MIN terminal, and minimum output
duty is set like Figure 24. When input duty from a PWM terminal is lower than minimum output duty which is set
by MIN terminal, the output duty does not fall to lower than minimum output duty.
The MIN terminal is the input terminal of the analog-digital converter to have an input voltage range of the REF
voltage, and the resolution is 128 steps (0.78% per step). When minimum output duty is not set, please perform
resistance pull-down of MIN terminal.
Minimum output duty
(128 steps)
100
100
Minimum duty
25
0
0.6
0
100
REF
Input PWM duty [%]
MIN input voltage [V]
Figure 24. Relation of MIN terminal Voltage and Output
Figure 25. Setting of Minimum Output Duty
.
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BD61246EFV
Functional Descriptions – continued
(2) PWM Operation by DC Input in MIN Terminal
Output duty is controlled by input voltage from MIN terminal. Output duty is 100% when MIN terminal voltage is
2.4V (Typ), output duty is 0% when MIN terminal voltage is 0V. (If using SLP function, it is not like this.)
In voltage control mode, short the PWM terminal to GND.
Please refer to input voltage 1(P.3) for the input condition of the MIN terminal. Because terminal voltage becomes
unsettled when MIN terminal is in an open state, like application of Figure 26, please be applied some voltage to
MIN terminal.
Minimum output duty cannot be set in voltage control.
H–
High
H+
Low
INSIDE
REG
200kΩ(Typ)
REF
2.4V
MIN
GND
FILTER
PWM
MIN
0.0V
High
DC
A/D
OUT1
Low
Motor Output ON
: High Impedance
100%
OUT2
duty
0%
Full
Motor
Torque
Zero
Figure 26. DC Input Application
Figure 27. DC Input Operation Timing Chart
2. Input-output Duty Slope Setting (SLP)
Slope properties of input duty and output duty can be set with SLP terminal like Figure 28. SLP setting work in
both mode, PWM control and voltage control. The resolution is 7bit (128 steps).
The voltage of SLP terminal is less than 0.3V (Typ), slope of input-output duty characteristic is fixed to 1. And
fixed to 0.5 in 0.3V to 0.6V (Typ) (refer to Figure 29). When slope setting is not set, pull-down SLP terminal.
Input-output duty slope
(128 steps)
100
2
1.5
1
Slope=0.5
Slope Setting
0.5
Slope=2
0
100
0
0.6
0.3
1.2
1.8
REF
PWM input duty [%]
SLP input voltage [V]
Figure 29. Relations of SLP terminal voltage and the
input-output duty slope characteristics
Figure 28. Adjust of Slope of I/O Duty
.
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Functional Descriptions – continued
3. Input and Output Duty Properties Adjustment Function (ADJ)
When input duty vs output duty shows the characteristic of the straight line, rotational speed may become the
characteristics that middle duty area swells by the characteristic of fan motor. (Figure 30)
Rotational
speed
Output
duty
Figure 30. Properties curve of input PWM duty vs rotational speed
This IC reduces duty in the middle duty area and can adjust rotational speed characteristics of the motor with a straight
line.
Rotational
speed
Output
duty
Figure 31. Properties curve of input PWM duty vs rotational speed after adjusting
The adjustment to reduce duty is performed by ADJ terminal input voltage. The ADJ terminal is input terminal of A/D
converter and the resolution is 7bit. By input 0 (ADJ=GND) of the ADJ terminal, the characteristic of input duty vs.
output duty becomes straight line (no adjustment). The adjustment become maximum by input 127(ADJ=REF), and
output duty in input duty 50% decreases to about 25%.
Figure 32. Input duty vs output duty characteristics
Please set the voltage of ADJ terminal so that motor rotation speed in input duty 50% is on the diagonal which links the
rotation speed of 0% to 100%. IC corrects output duty so that overall rotation speed properties match a straight line.
When it is used together with SLP function, at first ADJ adjustment is performed in slope=1, and please adjust SLP
after adjusting input duty vs. rotation speed property.
.
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Functional Descriptions – continued
4. About Setting of Phase Switching of Output
The period of Soft switching and re-circulate can be adjusted by SSW and ZPER setting.
(1) Soft Switching Period Setting (SSW)
Angle of the soft switching can be set by the input voltage of SSW terminal. When one period of the hall signal
is assumed 360°, the angle of the soft switching can be set from 22.5° to 90° by the input voltage of SSW
terminal (refer to Figure 33). Resolution of SSW terminal is 128 steps. Operational image is shown in Figure 34.
*Soft switching angle means the section where output duty changes between 0% and setting duty at the timing
of output phase change. To smooth off the current waveform, the coefficient table that duty gradually
changes is set inside IC, and the step is 16.
Angle range of soft switching:Min22.5° to Max90°
H+
Set of Soft Switching Period
Angle[°]
(128 Steps)
H–
90
67.5
45
One period of hall signal 360°
High
OUT1
OUT2
Low
22.5
High
Motor
Low
0A
0
0.6
Current
1.2
1.8
REF
SSW input voltage [V]
Soft Switching Angle (Max 90°)
Figure 33. Relation of SSW terminal Voltage
and Soft Switching Period
Figure 34. Soft switching angle
(2) Re-circulate Period Setting (ZPER)
Re-circulate angle at the timing of output phase changes can be set by the input voltage of ZPER terminal.
When one period of the hall signal is assumed 360°, the angle of the re-circulate can be set from 0° to 90° by
the input voltage of ZPER terminal (refer to Figure 35). Resolution of ZPER terminal is 128steps. Operational
image is shown in Figure 36.
When angular degree to regenerate is bigger than soft switching angular degree, a soft switching section for 5.6
degrees enters.
*Re-circulate angle means the section where the coil current re-circulate before the timing of output phase
change. If it is set appropriately, it is effective to suppress leaping up of voltage by BEMF, and reduce invalid
electricity consumption. The logic of the output transistor in the section is decided depending on the hall input
logic. As for the output of the H logic, the logic of the motor output in high impedance (Hi-Z). The output of the
L logic remains L.
Angle range of re-circulate:Min0° to Max90°
H+
ZPER re-circulate angle
Angle[°]
(128 Steps)
90
67.5
45
H–
One period of hall signal 360°
High
OUT1
OUT2
22.5
Low
High
Motor
0
0.6
1.2
1.8
REF
Low
0A
Current
ZPER input voltage [V]
Soft Switching Period
Re-circulate Period(Max 90°)
Figure 35. Relation of ZPER terminal Voltage
and Re-circulate Period
Figure 36. Re-circulate angle
.
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Functional Descriptions – continued
(3) Kickback Restraint Function
When there is induced current to the motor coil , regenerative current flows to the power supply.
However, when reverse connection protection diode is connected, VCC voltage rises because the diode prevents
current flow to power supply. (Figure 37)
ON
Phase
switching
ON
ON
ON
Figure 37. VCC Voltage Rise by Back Electromotive Force
The kickback restraint function is a supporting function to reduce induced current in a motor coil.
To the specifications of the motor, please adjust soft switching period (SSW) and re-circulate period (ZPER) to
reduce leaping up of the output voltage.
In addition, leaping up of the output voltage tends to become big in the motor startup.
In this case soft start time is set for a long time or please perform the safety measures of P21 mention.
.
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Functional Descriptions – continued
5. Soft Start
Soft start function gradually change drive duty to suppress sound noise and peak current when the motor start up etc.
PWM duty resolution is 7bit (128steps, 0.78% per step). SST terminal sets the step up time of duty increment.
Soft start step up time
(128 steps)
76.2
57.2
38.1
19.1
0
0.6
1.2
1.8
VREF
SST input voltage [V]
Figure 38. Relations of SST terminal voltage and soft start step up time
Duty transition time is
(Difference of current duty and Target duty (output duty after SLP/ADJ calculation)) x (step time)
When soft start time is set for a long time, lock protection may be detected without enough motor torque when motor
start up from 0% duty. Therefore start up duty is set to approximately 20% (25/128).
PWM input
50%
PWM input
100%
20%
100%
50%
DRIVE PWM duty
Drive PWM duty
20%
Soft start section
Soft start section
Start with input duty 100%
Start with input duty 50%
Figure 39. Soft start operation image from motor stop condition
When SST terminal voltage = REF terminal voltage, and 100% duty is input on motor stop condition, output duty
arrives at 100% after progress the time of 76.2ms x (128-25step) = 7.84 seconds
Soft start functions always work when the change of input duty as well as motor start up. In addition, it works when
duty goes down from high duty. Duty step down time is the half of duty step up time.
6. Start duty assist
It is the function that enable the motor to start even if drive duty output is low, when the soft start function is not used.
When input duty is within 50% at motor stop condition, 50% duty is output till three times of hall signal change are
detected. Operational image is shown in Figure 40.
Hall edge signal
(Internal signal)
Input duty
10%
50%
50%
Output duty
10%
0%
Hall detect
Power ON
Figure 40. Start duty assist operation at input duty 10%
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Functional Descriptions – continued
7. Current Limit
Current limit function turns off the output when the current flow through the motor coil is detected exceeding a set
value. The working current value of the limit is determined by current limit voltage VCL and RNF terminal voltage.
The value of the current sense resistor is included in not only the RNF resistor but also wire resistance in the IC
(Rwire=Approximately 10mΩ) or the resistance of the substrate pattern line (Rline).
In Figure 41, current flow in motor coil is Io, resistor to detect Io is RNF=50mΩ (@1/2W), wire resistance in the IC is
Rwire=10mΩ, the resistance of the substrate pattern line is Rline=40mΩ, power consumption of RNF is PR, current
limit voltage VCL=150mV (Typ), current limit value and power consumption of RNF can be calculated below expression.
About current limit value, when motor current is big, it is affected by Rwire and Rline.
Please decide the RNF resistor value in considering a real substrate.
When current limit function is not used, please short RNF terminal to GND.
OUT1
IO[A] = VCL[V] / (Rwire + Rline + RNF) [Ω]
= 150[mV] / (10 + 40 + 50 )[mΩ]
= 150[mV] / 100[mΩ]
= 1.5[A]
M
OUT2
RNF
Rline
Rwire
IO
P
RMAX[W] = VCL[V] x IO[A]
= 150[mV] x 1.5[A]
= 0.225[W] *
VCL
CURRENT
LIMIT COMP
GND
*This calculation ignores Rwire and Rline.
RNF
IC Signal GND Line
Motor GND Line
-
Figure 41. Current limit setting and GND line
8. Lock Protection and Automatic Restart
Motor rotation is detected by hall signal period. IC detects motor rotation is stop when the period becomes longer
than the time set up at the internal counter, and IC turns off the output. Lock detection ON time (tON) and lock
detection OFF time (tOFF) are set by the digital counter based on internal oscillator. Therefore the ratio of ON/OFF
time is always constant. Timing chart is shown in Figure 42.
Motor Idling
H–
H+
High
Low
tOFF (Typ 5.0s)
tOFF
tOFF
tON (Typ 0.5s)
tON
tON
High
OUT1
OUT2
AL
Low
High
Low
High
Low
Instruction
torque
Motor
Output ON
duty
0%
: High impedance
Motor Lock Lock Detection
Motor Lock Release
Figure 42. Lock Protection Timing Chart
.
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Functional Descriptions – continued
9. Quick Start
When torque off logic is input by the control signal over a fixed time, the lock protection function is disabled. The motor
can restart quickly once the control signal is applied.
The AL signal is decided by a combination of the control signal (Rotating or Idling) and state of the motor operation
(Rotating or Idling, Locking) like figure 43.
Motor Idling
Under tOFF
Under tOFF
H–
H+
High
Low
High
PWM
Low
Enable
Lock
Protection
(Internalsignal)
Disable
Under 5ms(Typ)
Under 5ms(Typ)
Quick start
Quick start standby mode
PWM or
MIN
torque
standby mode
Motor
Output
ON duty
0%
*
High
AL
Low
Torque OFF
Lock Detection
Torque ON
Torque OFF
Motor Stop
Torque ON
: High impedance
*When a change of the hall signal is detected in quick start
standby mode, the AL signal becomes the L logic.
Figure 43. Timing chart of the quick start and the AL signal
10. Hall Input Setting
The input voltage of a hall signal is input in "Hall Input Voltage" in P.4 including signal amplitude. In order to detect
rotation of a motor, the amplitude of hall signal more than "Hall Input Hysteresis" is required. Input the hall signal
more than 34mVpp at least.
2V
GND
Figure 44. Hall Input Voltage Range
○Reducing the Noise of Hall Signal
Hall element may be affected by VCC noise or the like depending on the wiring pattern of board. In this case, place
a capacitor like C1 in Figure 45. In addition, when wiring from the hall element output to IC hall input is long, noise
may be loaded on wiring. In this case, place a capacitor like C2 in Figure 45.
H–
H+
REF
C2
R1
Bias current
=VREF/ (R1 + RH)
C1
RH
Hall Element
Figure 45. Application near of Hall Signal
11. High-speed detection protection
High-speed detection protection begin lock protection action when it detects that the hall input signal is in an abnormal
state (more than Typ 2.5kHz). Noise may be induced on wiring. In this case, place a capacitor like C2 in Figure 45.
.
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I/O Equivalence Circuit (Resistance Values are Typical)
1. Power supply terminal
2. PWM input duty terminal
3. Hall input terminal
INSIDE
REG
INSIDE
REG
VCC
200kΩ
H+
H–
PWM
GND
4. Variable speed control terminal
Re-circulate angle setting terminal
Soft switching angle setting terminal
5. Reference voltage
output terminal
6. Motor output terminal
Output current detecting
resistor connecting terminal
VCC
VCC
OUT1
OUT2
SLP
MIN
ZPER
SSW
REF
RNF
7. Lock alarm signal
output terminal
AL
.
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Safety Measure
1. Reverse Connection Protection Diode
Reverse connection of power results in IC destruction as shown in Figure 46. When reverse connection is possible,
reverse connection protection diode must be added between power supply and VCC
.
After reverse connection
destruction prevention
In normal energization
Reverse power connection
Vcc
Vcc
Vcc
Circuit
Block
Circuit
Block
Circuit
Block
I/O
I/O
I/O
GND
GND
GND
Internal circuit impedance is high
Large current flows
No destruction
Amperage small
Thermal destruction
Figure 46. Flow of Current When Power is Connected Reversely
2. Protection against VCC Voltage Rise by Back Electromotive Force
Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse
connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply.
ON
Phase
Switching
ON
ON
ON
Figure 47. VCC Voltage Rise by Back Electromotive Force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place
(A) Capacitor or (B) Zener diode between VCC and GND. If necessary, add both (C).
(A) Capacitor
(B) Zenner diode
(C) Capacitor & Zenner diode
ON
ON
ON
ON
ON
ON
Figure 48. Measure against VCC and Motor Driving Outputs Voltage
3. Problem of GND line PWM Switching
Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.
4. Protection of Lock Alarm (AL) Open-Drain Output
AL output is an open drain and requires pull-up resistor. Adding resistor can protect the IC. Exceeding the absolute
maximum rating, when AL terminal is directly connected to power supply, could damage the IC.
Motor Unit
VCC
Driver
Pull-up
Resistor
Protection
Resistor
Motor
Driver
Controller
M
AL
SIG
Connector
GND
PWM Input
Prohibit
Figure 49. GND Line PWM Switching Prohibited
Figure 50. Protection of AL Terminal
.
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Power Dissipation
1. Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip into the package, that is junction temperature of the absolute maximum
rating, depends on circuit configuration, manufacturing process, etc. Power dissipation is determined by this maximum
joint temperature, the thermal resistance in the state of the substrate mounting, and the ambient temperature.
Therefore, when the power dissipation exceeds the absolute maximum rating, the operating temperature range is not a
guarantee. The maximum junction temperature is in general equal to the maximum value in the storage temperature
range.
2. Thermal Resistance
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter
which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. In the state of
the substrate mounting, thermal resistance from the chip junction to the ambience is shown in θJA [°C/W], and thermal
characterization parameter from junction to the top center of the outside surface of the component package is shown
in ΨJT [°C/W]. Thermal resistance is classified into the package part and the substrate part, and thermal resistance in
the package part depends on the composition materials such as the mold resins and the lead frames. On the other
hand, thermal resistance in the substrate part depends on the substrate heat dissipation capability of the material, the
size, and the copper foil area etc. Therefore, thermal resistance can be decreased by the heat radiation measures like
installing a heat sink etc. in the mounting substrate.
The thermal resistance model is shown in Figure 51, and Equation is shown below.
Ambient temperature: Ta[°C]
θJA = (Tj – Ta) / P [ºC/W]
Package outside surface (top center)
temperature: Tt[°C]
ΨJT = (Tj – Tt) / P [ºC/W]
θ
JA[°C/W]
where:
θJA is the thermal resistance from junction
to ambient [ºC/W]
Junction temperature: Tj[°C]
Ψ
JT[°C/W]
ΨJT is the thermal characterization parameter from
junction to the top center of the outside surface of the
component package [ºC/W]
Tj is the junction temperature [ºC]
Ta is the ambient temperature [ºC]
Tt is the package outside surface (top center)
temperature [ºC]
Mounting Substrate
Figure 51. Thermal Resistance Model of Surface Mount
P is the power consumption [W]
Even if it uses the same package, θJA and ΨJT are changed depending on the chip size, power consumption, and the
measurement environments of the ambient temperature, the mounting condition, and the wind velocity, etc.
3. Thermal De-rating Curve
Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC begins to attenuate at certain ambient temperature (25°C), and becomes 0W at the
maximum joint temperature (150°C). The inclination is reduced by the reciprocal of thermal resistance θja. The thermal
de-rating curve under a condition of thermal resistance (P.3) is shown in Figure 52.
1.0
0.8
-1/θJA = -7.6mW/°C
0.6
0.4
Operating temperature range
0.2
0.0
-50 -25
0
25
Ambient Temperature: Ta[°C]
Figure 52. Power Dissipation vs Ambient Temperature
50
75 100 125 150
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go
below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages
going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors
and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
.
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Operational Notes – continued
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 53. Example of hic IC scture
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown (TSD) Circuit
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature will rise which will activate the TSD circuit that will turn OFF all output pins. When the junction
temperature falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
.
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BD61246EFV
Ordering Information
B
D
6
1
2
4
6
E
F
V
-
E 2
Part Number
Packaging and forming specification
Package
・EFV; HTSSOP-B16
・E2: Embossed tape and reel
Marking Diagram
HTSSOP-B16
(TOP VIEW)
6 1 2 4 6
Part Number
LOT Number
1PIN Mark
.
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Physical Dimension, Tape and Reel Information
Package Name
HTSSOP-B16
<Tape and Reel information>
Tape
Embossed carrier tape
2500pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
Direction of feed
1pin
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
.
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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