BD63005MUV-E2_技术文档

Datasheet

3-Phase Brushless Motor Driver

BD63005MUV

General Description

Key Specifications

BD63005MUV is a 3-phase brushless motor driver with

a 33V power supply voltage rating and a 2A (3.5A peak)

output current rating. It generates a driving signal from

the Hall sensor and drives PWM through the input

control signal. In addition, the power supply can use 12V

or 24V and it has various controls and built-in protection

functions, making it useful for variety of purposes. Since

the IC adopts small packages, it can be used on small

diameter motors.

Power supply voltage rating

33V

Output current rating (Continuous):

Output current rating (Peak):

Operating temperature range:

Stand-by current:

Current limit detect voltage:

Output ON Resistance (top & bottom total):

2.0A

3.5^(Note1)

A

-25 to +85°C

1.2mA(Max)

0.2V±10%

0.17Ω(Typ)

6.0V(Typ)

UVLO lockout voltage:

(Note1) Pulse width tw≤1ms, duty=20% pulse

Features

Package

W(Typ) x D(Typ) x H(Max)

6.00mm x 6.00mm x 1.00mm

 Built-in 120° Commutation Logic Circuit

 Low ON Resistance DMOS Output

 PWM Control Mode (low side arm switching)

 Built-in Power-saving Circuit

 CW/CCW Function

VQFN040V6060

 Short Brake Function

 FG Output (1FG/3FG conversion)

 Built-in Protection Circuit for Current Limiting (CL),

Overheating (TSD), Over Current (OCP), Under

Voltage (UVLO), Over Voltage (OVLO), Motor Lock

(MLP)

Applications

 OA machines

 Other consumer products

Typical Application Circuit(s)

Figure 1. Application Circuit

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration

Block Diagram

VG

24

VREG

(TOP VIEW)

23 CP2

22 CP1

CHARGE

PUMP

VREG

14

VCC

25 27

VCC

26 28

15

16

HUP

HUN

U

38 39

HVP 17

PRE

DRIVER

LOGIC

V

7

8

HVN

18

19

20

HWP

HWN

W

11 12

RNF

5

2

3

4

9

4

FGSW

PWMB

CW

35

31

32

30

34

RCL

FGO

1

33

TSD, OCP

UVLO, OVLO

OSC

CLNMT

LPE

36

29

BRKB

ENB

21

10

GND

PGND

Figure 2. Pin Configuration

Figure 3. Block Diagram

Pin Description

No.

Pin Name

Function

Pin Name

Function

RCL

RNF

NC

Detect voltage input for over current

Detect resistor for over current

NC

GND

CP1

CP2

VG

Ground

1

2

3

4

5

6

7

8

21

22

23

24

25

26

27

28

Charge pump setting 1

Charge pump setting 2

Charge pump output

Power supply

VCC

Power supply

V

V phase output

Power supply

V

V phase output

Power supply

Setting about motor lock protection

(H/M/L input)

NC

LPE

9

29

PGND

W

Ground

BRKB

PWMB

CW

Brake input (negative logic)

PWM input (negative logic)

CW/CCW input (H:CW, L:CCW)

FG output (1FG or 3FG)

10

11

12

13

14

15

30

31

32

33

34

35

W phase output

NC

W

NC

FGO

VREG

HUP

Regulator output (OFF at stand-by)

U phase Hall input＋

ENB

Enable input (negative logic)

1FG/3FG switching (H:3FG, L:1FG)

FGSW

Current limit mask time setting

(H/M/L input)

HUN

U phase Hall input－

CLNMT

16

36

HVP

HVN

HWP

HWN

V phase Hall input＋

V phase Hall input－

W phase Hall input＋

W phase Hall input－

NC

U

NC

17

18

19

20

37

38

39

40

U phase output

NC

U

NC

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Absolute Maximum Ratings (Ta = 25°C)

Item

Limit

-0.3 to +33.0

-0.3 to +38.0

-0.3 to +5.5

-0.3 to +7.0

0.7

Unit

Symbol

Power Supply Voltage

V_CC

V

VG Voltage

V_G

V

Control Input Voltage

V_IN,V_IN2

V_FGO

V

FGO Terminal Voltage

V

RNF Maximum Apply Voltage

VREG Output Current

V_RNF

I_VREG

-30^{(Note 1)}

5^{(Note 1)}

mA

FGO Output Current

I_FGO

mA

Driver Output Current (continuous)

Driver Output Current (peak)^(Note2)

Operating Temperature Range

Storage Temperature Range

I_OUT(DC)

I_OUT(PEAK)

T_OPR

2.0^{(Note 1)}

3.5^{(Note 1)}

-25 to +85

-55 to +150

1.00^{(Note 3)}

4.66^{(Note 4)}

150

A/Phase

°C

T_STG

°C

W

Power Dissipation

Pd

W

Junction Temperature

T_jmax

°C

(Note 1)

(Note 2)

(Note 3)

(Note 4)

Do not exceed Pd, ASO, and T_j=150°C.

Pulse width tw≤1ms, duty=20% pulse.

74.2mm×74.2mm×1.6mm glass epoxy standard board. Reduce by 8.0mW/°C over Ta=25°C.

4-layer recommended board. Reduce by 37.3mW/°C over Ta=25°C.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Recommended Operating Conditions (Ta= -25°C to +85°C)

Item

Min

Typ

Max

28

Unit

V

Symbol

Supply Voltage

V_CC

10

24

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Description of Block(s)

1) Commutation Logic

This IC adopts 120° commutation mode, and the truth table is as follows:

CW (CW=H or Open)

CCW (CW=L)

V

FGO

HU

HV

HW

U

V

W

U

W

1FG

3FG

H

L

H

L

PWM*

Hi-z

H

Hi-z

H

PWM*

Hi-z

H

Hi-z

PWM*

Hi-z

H

L

Hi-z

L

Hi-z

PWM*

Hi-z

H

L

H

Hi-z

PWM*

Hi-z

L

Hi-z

L

Hi-z

PWM*

H

Hi-z

L

H

Hi-z

PWM*

Hi-z

L

Hi-z

H

* When PWMB=”L”，PWM="L"，When PWMB=”H”，PWM="H".

2) Regulator Output Terminal (VREG)

This is constant voltage output terminal of 5V(Typ). It is recommended to connect capacitors of 0.01µF to 1µF.

Please be careful that VREG current does not exceed ratings in case of being used for bias power supply of hall

elements.

3) Enable Input Terminal (ENB)

Output of each phase can be set to ON/OFF (negative logic) through ENB terminal. When applied voltage is V_ENA, the

motor is driven (enable). When applied voltage is V_STBYor OPEN, the motor stops (stand-by). Stand-by mode has

precedence to other control input signal and VREG output is OFF. In addition, ENB terminal is pulled up by internal

power supply through a resistance of 100kΩ (Typ) ±30kΩ.

ENB

Operation

H or OPEN

L

Stand-by

Enable

4) PWM Input Terminal (PWMB)

Speed can be controlled by inputting PWM signal into PWMB terminal (negative logic). Synchronous rectifier PWM

can be achieved through lower switching. When PWMB=" L", driver output that belongs to Hall input logic is “L”.

When PWMB="H" or open, driver output is "H". When PWMB="H" or OPEN status is detected 104µs (Typ), the

synchronous rectifier is OFF. Synchronous rectifier is ON through falling edges of subsequent PWMB. Additionally,

PWMB terminal is pulled up by VREG through a resistance of 100kΩ (Typ) ±30kΩ.

PWMB

Driver Output

H or OPEN

L

H (Hi-z)

L

5) Brake Input Terminal (BRKB)

Motor rotation can be quickly stopped by BRKB terminal (negative logic). When BRKB="L", all driver outputs are

"L" (short brake). When BRKB="H" or OPEN, then short brake action is released. In addition, BRKB terminal is pulled

up by VREG through a resistance of 100kΩ (Typ) ±30kΩ.

BRKB

Operation

H or OPEN

L

Normal

Short brake

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6) CW/CCW Input Terminal (CW)

Rotation direction can be switched with CW terminal. When CW="H" or OPEN, the direction is CW. When CW="L",

the direction is CCW. Though we do not recommend switching rotation direction when motor is rotating, because if

rotation direction is switched when rotating, the rotation speed becomes hall frequency that is up to less than 40Hz

(Typ) and it is switched to the set rotation direction after the action short brake. In addition, CW terminal is pulled up

by VREG through resistance of 100kΩ (Typ) ±30kΩ.

CW

Direction

H or OPEN

L

CW

CCW

7) 1FG/3FG Switching Terminal (FGSW)

FG signal that is output from FGO terminal can be switched to 1FG/3FG. It becomes 3FG by FGSW="H" or OPEN,

and 1 FG by FGSW="L". Moreover, FGSW terminal is pulled up by VREG through resistance of 100kΩ (Typ)±30kꢀ.

FGSW

FGO

H or OPEN

L

3FG

1FG

8) Hall Input (HALL: HUP, HUN, HVP, HVN, HWP, HWN)

Hall input amplifier is designed with hysteresis (±15mV (Typ)) in order to prevent incorrect action due to noise inside.

So please set bias current for Hall element to make amplitude of Hall input voltage over minimum input voltage

(V_HALLMIN). Here, we recommend you to connect the ceramic capacitor with about 100pF to 0.01µF between

difference input terminals of Hall amplifier. The in-phase input voltage range designed for Hall input Amplifier is

V_HALLCM, 0V to VREG-1.7V, so please set within this range when applying bias to Hall element. When all Hall inputs

become "H" or "L", detect circuit detects these Hall input abnormalities and makes all driver outputs "Hi-z".

9) FG Output Terminal (FGO)

1FG or 3FG signal that is reshaped by hall signal is output from FGO terminal. It is does not have output in stand-by

mode. In addition, because FG terminal is output from open drain, please use resistance of about 10kꢀ to 100kꢀ

pulled up from outside. In that case, please be careful that FGO voltage or current never exceed rating.

10) Power Supply Terminal (VCC)

Please make low impedance thick and short since motor drive current flows. Please stabilize V_CCby placing bypass

capacitor near terminal as much as possible because V_CCmight be changed considerably by motor BEMF and PWM

switching. Please add capacity of capacitor as necessary when using large current and motor with large BEMF.

Moreover, it is recommended to place laminated ceramic capacitor of around 0.01µF to 0.1µF in parallel on the

purpose of decreasing impedance of power supply broadband. Please be careful that V_CCnever exceeds ratings.

VCC terminal has clamp element for preventing ESD damage. If applying steep pulse signal and voltage such as

surge more than ratings, this clamp element operates, which might be a cause of destruction. It is effective to put

zener diode that corresponds to V_CCabsolute maximum ratings. Diode for preventing ESD damage is inserted

between VCC and GND terminals. Please note that IC might be destroyed when BEMF is applied to VCC and GND

terminals.

11) Ground Terminal (GND, PGND)

Wiring impedance from this terminal should be as low as possible for reducing noise of switching current and

stabilizing basic voltage inside of IC, and the impedance also should be the lowest potential in any operating

condition. In addition, please do pattern design not to have same impedance as other GND pattern.

12) Driver Output Terminal (U, V, W)

Impedance wiring should be thick, short, and low due to motor drive current. When using big current, in case that

driver current changes considerably toward positive and negative (when BEMF is large), malfunction or destruction of

IC might occur. It is effective to add shot key diode. Moreover, clamp element is built in driver output terminal in order

to prevent ESD damage. If applying steep pulse signal or voltage such as surge more than ratings, this clamp

element operates. Then it might cause destruction of IC, so that please pay attention not to exceed ratings.

Additionally, When driver output converts "L"→"H" or "H"→"L", for example when synchronous rectification PWM

operating , dead time (1µs to 2µs(Typ)) can be set to prevent simultaneous ON of output top & bottom MOS.

13) Capacitor Connection Terminal for Boosting, Boosting Output Terminal (CP1, CP2, VG)

Charge pump is built-in for upper Nch MOS drive signal of driver output. Boosting voltage of V_CC+5V (Typ) occurs in

VG terminal by connecting capacitor between CP1 to CP2 terminals and VG to VCC terminals. It is recommended to

use capacitor more than 0.1µF.

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14) Resistor Connection Terminal for Detecting Output Current (RNF)

Please insert resistor for detecting current 0.05ꢀ to 0.5ꢀ between RNF and GND. When deciding resistor value, it

should be careful that consumption electricity of resistor for detecting current I_OUT²･R[W] does not exceed rating of

resistor. In addition, please do not have same impedance as other GND patterns by using low impedance wiring,

since motor drive current flows into pattern of RNF terminal to resistor for detecting current to GND. In case that RNF

voltage goes over rating (0.7V), circuit malfunction might occur. Therefore please do not exceed rating. When RNF

terminal is shorted to GND, big current flows due to a lack of normal current limit operation. Please be careful that

OCP or TSD might operate in that case. Similarly, if RNF terminal is OPEN, output current might not flow, which also

becomes a cause of malfunction.

15) Comparator Input Terminal for Detecting Output Current (RCL)

RCL terminal is placed individually as input terminal of current detect comparator in order to avoid deterioration of

current detect accuracy by wire impedance inside IC of RNF terminal. Therefore, when operating current limit, please

be sure to connect RNF terminal and RCL terminal. Moreover, it is possible to reduce deterioration of current detect

accuracy by impedance of board pattern between RNF terminal and resistor for detecting current by connecting

wiring from RCL terminal most adjacent to resistor for detecting current. Please design pattern considering wiring that

is less influenced by noise. Additionally, when RCL terminal is shorted to GND, big current might flow due to a lack of

normal current limit operation. Please be careful that OCP or TSD might operate in that case.

16) Non-connection Terminal (NC)

It is not connected to internal circuit electrically.

17) Control Signal Sequence

Though we recommend you input control signals of ENB, PWMB, BRKB, FGSW, CW, CLNMT, LPE terminals after

inputting V_CC, there is no problem if you input control signals before inputting V_CC. If LPE terminal is set to "H" or "M"

when being started, please be informed that if motor rotation cannot be detected within the set time (edge of FGO

signal cannot be input), then the MLP circuit starts and motor fails to start. Moreover, the order of priority is set to

control signal and IC internal signal. Please refer to the following table.

Priority of Control Signal

Priority

1^st

Input / Internal Signals

ENB, UVLO

2^nd

3^rd

4^th

BRKB,CW,PWMB↓

TSD, OCP, MLP, HALLERR

OVLO

5^th

BRKB

6^th

CL

7^th

PWMB, CW

Note） means rising and falling edges of signal.

For signal name, please see state transition diagram.

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Protection Circuit

1) Current Limit Circuit (CL circuit)

Current limit of output (Current Limit: CL) can be achieved by changing voltage of output current with resistor

between RNF and GND, and then inputting the voltage into RCL terminal. In order to avoid error detection of current

detection comparator by RNF spike noise that occurs at output ON, using mask time can be efficient. Current

detection is invalid during mask time after RCL voltage becomes more than 0.2V (Typ). Then please turn OFF all

lower MOS of driver output, which is returned automatically after specified time (32µs (Typ)). This operation is not

synchronized with PWM signal that is input into PWMB terminal. Moreover, it is possible to change mask time by

CLNMT terminal. At CLNMT="H" or OPEN, 0.5µs (Typ). At CLNMT="M", 0.75µs (Typ). At CLNMT="L", 0.25µs (Typ).

CLNMT terminal is also pulled up by VREG through a resistance of 100kꢀ (Typ) ±30k ꢀ.

CLNMT

Mask time

H or OPEN

0.5µs (Typ) ±0.3µs

0.75µs (Typ) ±0.4µs

0.25µs (Typ) ±0.2µs

M

L

2) Thermal Shut Down Circuit (TSD Circuit)

When chip temperature of driver IC rises and exceeds the set temperature (175°C (Typ)), the thermal shut down

circuit (Thermal Shut Down: TSD) begins to work. At this time, the driver outputs all become "Hi-z". In addition, the

TSD circuit is designed with hysteresis (25°C (Typ)), therefore, when the chip temperature drops, it returns to normal

working condition. Moreover, the purpose of the TSD circuit is to protect driver IC from thermal breakdown, therefore,

temperature of this circuit will be over working temperature when it is started up. Thus, thermal design should have

sufficient margin, so do not take continuous use and action of the circuit as a precondition.

3) Over Current Protection Circuit (OCP Circuit)

Over current protection (Over Current Protection：OCP) is built-in in order to prevent from destruction when being

shorted between output terminals and also being VCC/GND shorted. Therefore output current exceeds ratings and

specified current flows. In that case, driver outputs are all latched to Hi-z condition. Latch can be released by going

through stand-by condition or switching BRKB/CW logic. However, output current rating is exceeded when this circuit

operates. Thus, please design sufficient margin not to take continuous use and action of the circuit as a precondition.

4) Under Voltage Lock Out Circuit (UVLO Circuit)

There is a built-in under voltage lock out circuit (Under Voltage Lock Out: UVLO) used to ensure the lowest power

supply voltage for drive IC to work and to prevent error action of IC. When V_CCdeclines to V_UVL(6V (Typ)), all of the

driver outputs should be "Hi-z". At the same time, UVLO circuit is designed with hysteresis (1V (Typ)), so when V_CC

reaches more than V_UVH(7V (Typ)), it enters normal working condition.

5) Over Voltage Lock Out Circuit (OVLO circuit)

There is built-in over voltage lock out circuit (Over Voltage Lock Out: OVLO) used to restrain rise of V_CCwhen motor

is decelerating. When LPE terminal is at "M" and V_CCis over V_OVH1(16V (Typ)), and when LPE terminal is at "H" or

"L" and V_CCis over V_OVH2(31V (Typ)), a certain time (4ms (Typ)) of short brake action is conducted. What’s more,

because OVLO circuit is designed with hysteresis, therefore, when V_OVH1is below V_OVL1(15V (Typ)) and when V_OVH2

is below V_OVL2(30.5V (Typ)), it can return to normal working condition after a certain time of short brake action.

6) Motor Lock Protection Circuit (MLP circuit)

There is built-in motor lock protection circuit (Motor Lock Protection: MLP). The ON/OFF of MLP circuit and OVLO

threshold can be set from LPE terminal. In monitoring Hall signals, when the LPE = "H" or "M" and Hall signal logic

does not change to 1.1sec(Typ), all driver outputs are locked as "Hi-z". Latch can be released via standby status or

through switching BRKB/CW logic. Moreover, when PWMB = "H" or OPEN state is detected for about 15ms, latch

can be released by rising and falling edges of subsequent PWMB. However, when LPE = "L", MLP circuit does not

work when short brake action (including switching rotation direction) enables or TSD circuit works. In addition, LPE

terminal is pulled up by VREG through a resistance of 100kꢀ (Typ) ±30 kꢀ.

LPE

Monitoring Time

OVLO Threshold

H or OPEN

1.1sec(Typ) ±30%

Disable

V_OVH2, V_OVL2

V_OVH1, V_OVL1

V_OVH2, V_OVL2

M

L

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Electrical Characteristics (Unless otherwise specified Ta=25°C,V_CC=24V)

Limit

Item

Symbol

Unit

Condition

Min

Typ

Max

[Whole]

Circuit Current

I_CC

-

3.9

0.6

5.0

7.8

1.2

5.5

mA

V

V_ENB=0V

Stand-by Current

VREG Voltage

I_STBY

V_REG

ENB=OPEN

I_VREG=-10mA

4.5

[Driver output]

Output On Resistance

[Hall input]

R_ON

-

0.17

0.27

ꢀ

I_OUT=±1.5A(Upper + Lower)

V_HALL=0V

Input Bias Current

Range of In-phase Input Voltage

Minimum Input Voltage

HYS Level ＋

I_HALL

-2.0

0

-0.1

-

+2.0

µA

V

V_HALLCM

V_HALLMIN

V_HALLHY+

V_HALLHY-

V_REG-1.7

50

5

-

mV_p-p

mV

15

-15

25

-5

HYS Level －

-25

[Input of Control：ENB]

Input Current

I_ENB

V_STBY

V_ENA

-75

2.0

0

-45

-25

V_REG

0.8

µA

V

V_ENB=0V

Standby Voltage

Enable Voltage

-

V

[Input of Control：PWMB, CW, BRKB, FGSW]

Input Current

I_IN

V_INH

-80

2.0

0

-50

-30

V_REG

0.8

-

µA

V

V_IN=0V

Voltage Input H

-

Voltage Input L

V_INL

V

Minimum Input Pulse Width

[Input of Control：LPE, CLNMT]

Input Current

t_PLSMIN

1

msec CW, BRKB

I_IN2

-80

0.8×V_REG

0.4×V_REG

0

-50

-30

µA

V

V_IN2=0V

Input Voltage "H"

Input Voltage "M"

Input Voltage "L"

V_INH2

V_INM2

V_INL2

-

V_REG

0.6×V_REG

0.2×V_REG

V

[FG Output：FGO]

Output Voltage L

V_FGOL

0

0.1

0.3

V

I_FGO=2mA

[Current Limit]

Detect Voltage

[UVLO]

V_CL

0.18

0.20

0.22

Release Voltage

Lockout Voltage

V_UVH

V_UVL

6.5

5.5

7.0

6.0

7.5

6.5

V

[OVLO]

Release Voltage1

Lockout Voltage1

Release Voltage2

Lockout Voltage2

V_OVL1

V_OVH1

V_OVL2

V_OVH2

14.0

15.0

29.0

29.5

15.0

16.0

30.5

31.0

16.0

17.0

32.0

32.5

V

LPE="M"

LPE="H" or "L"

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Timing Chart

CW Direction (CW="H" or Open)

HU

HV

HW

U

V

PWM

W

PWM

CCW Direction (CW="L")

HU

HV

HW

U

PWM

V

PWM

W

PWM

FG Output

FGO(3FG)

FGO(1FG)

Figure 4. Timing Chart

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State Transition Diagram

BRKB

CW

f_HALL>40Hz

Short brake

DIR change

(LPC=RESET)

____

f_HALL<40Hz & BRK

f_HALL<40Hz

Short brake

LPC

RESET

____

BRK

DIR

after 4ms

BRK

LPE

OVLO

TSD

Both side drivers off

(LPC=RESET)

Hall edge undetected

& LPE="H" or "M"

____

TSD

LP timer

_________

Hall error & VG_UVLO

________

RUN

(LPC=RUN, LPE="H" or "M" only)

Detect hall edge &

LPE="H" or "M" within 1.1sec.

Hall error

Both side drivers off

+

VG_UVLO

after

32μs

DIR change

____

ENB

+

BRK

+

LPC overflow

&

Over

current

_____

ENB

+

UVLO

PWMB fall edge

after PWMB="H"

over 15ms.

Low side driver off

Stand-by

Both side drivers off

with latch

(LPC=RESET, driver off)

ENB="H"⇒VREG off

ENB + UVLO

ENB

Figure 5. State Transition Diagram

Legend:

DIR: motor rotational direction

LP: motor lock protection

LPC: internal counter for the motor lock protection (watch-dog timer)

_HALL: hall signal frequency

State transition

Command signal

f

Hall error: HU=HV=HW

&: logical "AND"

+: logical "OR"

Note) All values are typical

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I/O Equivalence Circuits

Internal

Reg

VREG

100kꢀ

10kꢀ

100kꢀ

FGSW

PWMB

BRKB

CW

CLNMT

LPE

ENB

10kꢀ

VCC

VREG

FGO

HUP

250kꢀ

2kꢀ

HUN

HVP

HVN

HWP

HWN

5ꢀ

RCL

2kꢀ

VREG

145kꢀ

50kꢀ

VG

VCC

Internal

Reg

20ꢀ

U

V

W

CP2

VCC

20ꢀ

CP1

RNF

Figure 6. I/O Equivalence Circuits

Power Dissipation

VQFN040V6060 package has metal for heat dissipation on backside of IC. It is supposed to use this metal for processing

heat dissipation, so please connect to GND plane on board by soldering and keep GND pattern as large as possible to get

enough heat dissipation area. It is impossible to keep power dissipation as shown below without soldering. The Backside

metal is shorted to backside of IC chip and it is also GND potential. Therefore please do not make wiring pattern other than

GND right under backside metal of IC, since malfunction and destruction of IC might occur by being shorted to potential other

than GND.

5. 0

4. 0

3. 0

2. 0

1. 0

0. 0

③

4.66W

Package thermal resistor

Board θ _j-a[°C/W]

②

3.77W

Board ①

Board ②

Board ③

125

33.2

26.8

①

PCB size：74.2mm×74.2mm×1.6mm

1.00W

Board①：1 layer PCB (1 layer：23.69mm²)

Board②：4 layer PCB (1,4 layer：23.69mm². 2,3 layer：5505mm²)

Board③：4 layer PCB (all layers：5505mm²)

()：Copper foil pattern area size

Caution：Values about heat reducing curve and packaged thermal

resistor are tested values.

0

25

50

75

100

125

150

AMBIENT TEMPERATURE [°C]

Figure 7. Derating Curve

(VQFN040V6060)

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BD63005MUV

Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 74.2mm x 74.2mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6.

7.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

8.

9.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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BD63005MUV

Operational Notes – continued

11. Unused Input Terminals

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pins of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 9. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Current Protection Circuit (OCP)

This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is

strongly advised not to subject the IC to prolonged shorting of the output.

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BD63005MUV

Ordering Information

M U

V

B D 6

3

0

5

-

E 2

Package

MUV: VQFN040V6060

Packaging and forming specification

E2: Embossed tape and reel

Part Number

Marking Diagrams

VQFN040V6060 (TOP VIEW)

Part Number Marking

BD63005

LOT Number

1PIN MARK

Part Number Marking

BD63005

Package

Orderable Part Number

VQFN040V6060 BD63005MUV-E2

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Physical Dimension, Tape and Reel Information

Package Name

VQFN040V6060

Tape

Embossed carrier tape

2000pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD63005MUV-E2
厂家：	ROHM
描述：	3-Phase Brushless Motor Driver
文件：	总18页 (文件大小：771K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63005MUV-E2 [ROHM]

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