BD63035EFV-M [ROHM]

Automotive Three Phase Brushless Motor Driver;


型号：	BD63035EFV-M
厂家：	ROHM
描述：	Automotive Three Phase Brushless Motor Driver
文件：	总23页 (文件大小：1027K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Automotive

Three Phase Brushless Motor Driver

BD63035EFV-M

General Description

Key Specifications

BD63035EFV-M is a three phase sinusoidal brushless

motor driver. The rating of the power supply is 36V and

that of current rating is 1.5A (peak current, 2A). PWM

driving signals are generated by the three hall sensors.

Input DC voltage signal can control the rotation speed,

also, you can control by the power voltage. As the

various control circuit and the protection circuit are

built-in, this IC can fit the various applications. It can be

used for the small diameter motor module because of

the small package.

 Power supply voltage rating:

36V(25C°)

 Output Continuous current rating:

 Output Peak^{(Note 1)}current rating:

 Operating temperature range:

 Current limit detect voltage:

 Output ON Resistors (Total):

1.5A

2A^{(Note 2)}

-40°C to +105°C

0.2V±30%

0.6Ω(Typ)

6V(Typ)

 UVLO voltage:

(Note 2: Pulse width tw≤1ms, duty=20% pulse)

Package

W(Typ) x D(Typ) x H(Max)

6.50mm x 6.40mm x 1.00mm

HTSSOP-B20

Features



AEC-Q100 Qulified^{(Note 1)}

Sinusoidal drive

Low ON Resistors DMOS Output (Pch / Nch)

PWM Output

FG Output (3FG)

Built-in Current Limit Circuit (CL)

Built-in Thermal Shut Down Circuit (TSD)

Built-in Over Current Protection Circuit (OCP)

Built-in Under Voltage Lock Out Circuit (UVLO)

Built-in Over Voltage Lock Out Circuit (OVLO)

Built-in Motor Lock Protection Circuit,

Automatic Restart type (MLP)



Built-in HALL error Protection Circuit (HALLERR)

(Note1: Grade 2)

Applications



Automotive Seat Fan etc.

Typical Application Circuit(s)

VREG

HUP

VREG

VCC

0.1µF

10µF

VREG

0.01µF

HUN

HVP

VREG

PRE

DRIVER

LOGIC

HVN

HWP

HWN

VREG

Internal

Reg

VREG

RNF

RCL

FGO

TEST1

VREG

SSB 15

VREG

TEST2

VREG

TSD, OCP

UVLO, OVLO

OSC

DCIN 11

A/D

VREG

14 LPE

GND

Figure 1. Application Circuit

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration

Block Diagram

(TOP VIEW)

VREG

VREG 10

VREG

18 VCC

○

VREG

RNF

RCL

HUP

HUN

HVP

HVN

HWP

HWN

HUP

HUN

HVP

HVN

PRE

DRIVER

LOGIC

18 VCC

17 TEST2

16 FGO

15 SSB

14 LPE

HWP

HWN

VREG

Internal

Reg

VREG

RNF

RCL

TEST1 13

VREG

SSB 15

VREG

16 FGO

13 TEST1

12 GND

11 DCIN

VREG

TEST2 17

TSD, OCP

UVLO, OVLO

OSC

VREG

VREG 10

DCIN 11

A/D

VREG

14 LPE

GND

Figure 3. Block Diagram

Figure 2. Pin Configuration

Pin Description

Name

Function

Pin Name

Function

W Phase Output

Detection Over Current By Resistors

Detection Over Current By Voltage Input

U phase Hall Input +

V Phase Output

U Phase Output

RNF

RCL

HUP

HUN

HVP

VCC

TEST2

FGO

SSB

LPE

Power Supply / Motor Power Supply

Test Input (for shipment)

FG Output (3FG)

U phase Hall Input -

V phase Hall Input +

Soft Start / Soft Stop Mode Input

Motor Lock Protection Mode Input

Test Input (for shipment)

Ground

HVN

HWP

HWN

VREG

V phase Hall Input -

W phase Hall Input +

TEST1

GND

DCIN

W phase Hall Input -

Regulator Output

Controlling Rotation Speed Input

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Absolute Maximum Ratings (Tj = 25°C)

Item

Limit

Unit

Symbol

V_CC

Power Supply Voltage

-0.3 to +36.0

-0.3 to +5.5

-0.3 to +12.0

Control Input Voltage (LPE, SSB)

Controlling Rotation Speed Input Voltage

V_LPE,V_SSB

V_DCIN

V_HUP,V_HUN,V_HVP,

V_HVN,V_HWP,V_HWN

Hall Input Voltage

-0.3 to +5.5

TEST1 Input Voltage

V_TEST1

V_TEST2

V_U,V_V,V_W,

V_FGO

-0.3 to +5.5

-0.3 to +36.0

-0.3 to +7.0

0.7

TEST2 Input Voltage

Driver Output Voltage

FGO Output Voltage

RNF Voltage

V_RNF

VREG Output Current

I_VREG

-30

FGO Output Current

I_FGO

Driver Output Current (Continuous)

Driver Output Current (Peak)^{(Note 1)}

Operating Temperature Range

Storage Temperature Range

I_OUT(DC)

I_OUT(PEAK)

T_OPR

1.5

A/phase

°C

2.0

-40 to +105

-55 to +150

T_STG

°C

Junction Temperature

T_jmax

150

°C

(Note 1)Pulse width tw≤1ms, duty=20% pulse

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

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Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

HTSSOP-B20

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

143.0

26.8

°C/W

Ψ_JT

(Note 1)Based on JESD51-2A(Still-Air)

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4)Using a PCB board based on JESD51-5, 7.

Thermal Via^{(Note 5)}

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

Pitch

Diameter

4 Layers

FR-4

1.20mm

Φ0.30mm

Top

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

70μm

(Note 5) This thermal via connects with the copper pattern of all layers.

Recommended Operating Conditions (Tj= -40°C to +105°C)

Item

Min

Typ

Max

Unit

Symbol

Supply Voltage

V_CC

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Description of Block(s)

(1) Regulator Output Terminal (VREG)

This is the terminal regulated 5V (Typ). Please set the capacitors of 0.1µF to 1µF. If using VREG for the bias power

supply for HALL elements, please don’t exceed the ratings of VREG current.

(2) Controlling Rotation Speed Input Terminal (DCIN)

Rotation Speed can be controlled by inputting DC signal into DCIN, by changing the PWM duty of driver output. If

VCC is used for controlling the rotation speed, please set DCIN is VREG. When DCIN≤1V (Typ), all of the driver

outputs are controlled to “L”.

100％

DCIN〔V〕

Figure 4. DCIN voltage vs rotation speed

The voltage of DCIN is input into the LOGIC circuit through the A/D inside IC. It sets the duty and makes the signals

of driver outputs demanding DCIN voltage. A/D samples DCIN voltage repeatedly and update the set point. The set

point is updated when it changes over ±1LSB from the previous point and when the next set point is in ±1LSB of

itself three times.(The typical time is 1ms(Typ)). Only the setting point of initial value is updated by the first sampling.

The A/D has 8 bit digital value and the power supply is VREG. 1LSB is about 19.5mV (5V/256,8bit). If VREG

fluctuates, the rotation speed fluctuates, too. So please stabilize VREG. It is better that DCIN is inputted the voltage

divider of VREG.

1ms

t10

0xFF

Setting initial value

Update

+1LSB

-1LSB

+1LSB

-1LSB

Not to update

0x00

time [ms]

Figure 5. A/D sampling operation

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Description of Block(s)

(3) Soft Start / Soft Stop Input Terminal (SSB)

The circuit of Soft Start and Soft Stop (SS mode) is built in to save the start/stop current. Soft Start and Soft Stop

mode is set by inputting V_SSBH(Please see the table of Electrical Characteristics shown P.10). When SSB is V_SSBL

only CL circuit save the start and stop current. Please don’t change SSB terminal voltage during operating because

of the incorrect operation. SSB terminal is pulled up to VREG by the Resistors of 100kꢀ±40kꢀ. With regard to the

bias current, please see the table of Electrical Characteristics shown P.10.

SSB

H or OPEN

Operation

Disable SS mode

Enable SS mode

An example of SS mode operation is shown in the following. This operation is enable at starting, stopping, and

changing the rotation speed.

same slope

at speed up

same slope

at speed down

100%

0.88s

VREG

VREG/2

t：time

Input

speed down

signal

Input

speed down

signal

Input

DCIN signal

Input

speed up

signal

It takes 7s

from 100% to 0%.

It takes 0.88s

from 0% to 100%.

Figure 6. Soft start / Soft stop operation

(4) HALL Input (HALL: HUP, HUN, HVP, HVN, HWP, HWN)

HUP, HUN, HVP, HVN, HWP, HWN is the input terminal of HALL comparator in IC. The hysteresis voltage

(±15mV(Typ)), please see the table of Electrical Characteristics shown P.10) is set in HALL comparator to prevent

the incorrect operation by the noise. Please set the bias current of HALL elements over the minimum input voltage

(V_HALLMIN, please see the table of Electrical Characteristics shown P.10) Also please set the ceramic capacitors about

1000pF to 0.01uF between the input of HALL comparator. As HALL comparator has the range of In-phase Input Voltage

(V_HALLCM, please see the table of Electrical Characteristics shown P.10), please set the bias current of HALL

elements in V_HALLCM. All of the driver outputs are Hi-Z when all of the outputs of HALL comparator (HU, HV, and HW)

are ”H” or “L”. In addition, if one of the outputs of HALL comparator keeps “H” or “L” on a certain time, all of the driver

outputs are Hi-Z, too. “a certain time” shows the period which the other outputs counted to 32 times of

positive/negative edge, after one of the outputs of HALL comparator is fixed “H” or “L”. This circuit is automatic

restarted if the HALL signals are correct after 5s.

Please pay attention to the positon of HALL elements for fear that the efficiency and the silence characteristic

become worse.

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Description of Block(s)

(5) FG Output Terminal (FGO)

3FG signal which is synthesize from the HALL signals is output from FGO. Please set FGO pulled up by the

resistors about 10kꢀ to 100kꢀ because FGO is the terminal of open-drain. Please pay attention not to exceed the

voltage rating and current rating of FGO because of the destruction of IC.

(6) Power Supply Terminal (VCC)

Please make VCC line low impedance (thick and short) because the Motor current flows. V_CCmight be changed

considerably by MOTOR BEMF and PWM switching, so please place the bypass capacitors as near as possible

between VCC and GND terminal. When the Motor generates large current or big BEMF, please add the value of

capacitors. Also, please set the ceramic capacitors about 0.01µF to 1µF to decrease the impedance of power supply

broadband. Please pay attention not to exceed the rating for a moment. Also, the device against ESD exists on VCC

terminal, so if the serge voltage over the rating, this ESD device operates and so IC may destroy. Please don’t

exceed the rating. It is so useful to add the Zener diode whose breakdown voltage is slightly lower than the rating. In

addition, if the voltage input in reverse, IC may destroy because of the ESD device between VCC and GND.

(7) Ground Terminal (GND)

Please make GND line as thick and short as possible to decrease the switching noise and stabilize the reference

voltage inside IC and please set GND the lowest voltage for a moment. Also, please design that GND of IC should

not have the common impedance in PCB.

(8) Driver Output Terminal (U, V, W)

Please pay attention about the following points in using driver output.



Wiring of U, V, and W should be thick and short (low impedance) because the motor current flows.

IC might destroy because the diodes against ESD operates when the serge pulse signal or the voltage over

the rating input into the terminals. Please don’t exceed the rating.

When the driver outputs change considerably toward positive and negative (for ex. BEMF voltage is so big), IC

operates abnormally or destroys. In the above case, please add the Schottky diode to the driver output terminal.

(9) Resistor Connected Terminal for Detecting Output Current (RNF)

Please insert resistor for detecting current 0.18ꢀ to 0.5ꢀ between RNF and GND. Please pay attention that the

power consumption of resistor for detecting output current (multiply I_OUT²by R[W]) doesn’t be exceeded the rating of

the resistor. Because the Motor current flows to GND through RNF resistor, RNF line should be low impedance and

doesn’t have the common impedance of the other GND line. If RNF voltage exceeds the rating, IC might malfunction

or be destroyed, so please don’t exceed the rating. When RNF terminal is shorted to GND, large current flows due to

a lack of normal current limit operation. Please pay attention that OCP or TSD might operate in that case. Similarly, if

RNF terminal is OPEN, output current might not flow, and it causes malfunction.

(10) Comparator Input Terminal for Detecting Output Current (RCL)

RCL terminal (the terminal that the input of the current detect comparator) exists individually in order to avoid the

deterioration of current detect accuracy by wire impedance inside IC of RNF terminal. Therefore, when operating

current limit, please be sure to connect RNF terminal and RCL terminal. Moreover, it is possible to reduce the

deterioration of current detect accuracy that is caused by the impedance of board pattern between RNF terminal and

resistor for detecting current, to connect wiring from RCL terminal most adjacent to resistor for detecting current.

Please design the PCB pattern considering wiring that is less influenced by noise. Additionally, when RCL terminal is

shorted to GND, IC can’t operate normally and so the large current might flow. Please pay attention that OCP or TSD

might operate in that case.

(11) TEST terminal(TEST1,TEST2)

TEST terminal is for the shipping inspection. Please short to GND at normally use.

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Description of Block(s)

(12) Sequence of control signal

It is recommended to input the signal into LPE after V_CC. (If LPE is input before V_CC, IC operates correctly. However

in the case of LPE is “H” or “M”, please pay attention that Motor can’t be started if the Motor rotation can’t be

detected in the setting time (Please see P.10). IC has the priority between the control signals and the protection

signals. Please see the following table.

Priority of control signals

Priority

1^st

Input / Internal Signals

UVLO

2^nd

3^rd

OCP, TSD

OVLO

4^th

5^th

MLP, HALLERR

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Protection Circuit

(1) Current Limit Circuit(CL circuit)

To change from the output current to the voltage by the resistor between RNF and GND and to input the signal into

RCL work as Current Limit (CL circuit). CL has the mask time to avoid the false detection because of the spike noise

when the output turns ON. Current limit doesn’t work in the mask time that RCL become over 0.2V (Typ). In the case

of SSB is “H”, all of the driver outputs turn “L” and it returns by itself after a certain time (1µs(Typ)). In the case of

SSB is “L”, the Motor torque is saved, after RCL voltage is under 0.2V (Typ), it turns to the normal operation. In both

of case the mask time of CL operation is 0.6µs (Typ).

(2) Thermal Shut Down Circuit(TSD Circuit)

TSD(Thermal Shut Down: TSD) operates when the chip temperature is over(175°C(Typ)) and all of the driver

outputs turn to Hi-Z. TSD circuit has the hysteresis (25°C (Typ)) so if the chip temperature is down, it operates

normally. The purpose of the TSD circuit is to protect driver IC from thermal breakdown. The temperature is over the

rating when TSD operates. Thus, it must have sufficient margin against TSD, and please don’t use continuously by

TSD as a precondition.

(3) Over Current Protection Circuit (OCP Circuit)

OCP (Over Current Protection: OCP) circuit prevent from the destruction of shorted between the output terminals

and VCC/GND shorted. The outputs are latched to Hi-Z when the output current exceeds the current rating and

reaches the OCP current. OCP can be reset by UVLO. It must have sufficient margin against OCP and please pay

attention not to use continuously by OCP as a precondition because the output current exceeds the current rating

when OCP operates. Also when the outputs shorted to GND or shorted between the outputs, the steep wave of VCC

or VREG occurs, finally OCP operation might be reset. So please consider fully.

(4) Under Voltage Lock Out Circuit (UVLO Circuit)

UVLO (Under Voltage Lock Out: UVLO) circuit prevent the false operation from under voltage. When V_CCdeclines

to V_UVL(6V (Typ)), all of the outputs turn to Hi-Z. UVLO circuit has hysteresis (1V (Typ)), so when V_CCreaches more

than V_UVH(7V (Typ)), it operates normally. Also when VREG is under 4V (Typ), UVLO operates.

(5) Over Voltage Lock Out Circuit(OVLO circuit)

Over voltage lock out circuit (Over Voltage Lock Out: OVLO) is built in for the purpose to save the lifted voltage at

the rotation speed down. All of the driver outputs turn “L” if LPE is “H” or “L” and V_CCis over V_OVH2(31V (Typ)), if LPE

is “M” and V_CCis over V_OVH1(15V (Typ)). OVLO circuit has the hysteresis. In the case of V_OVH2, it operates normally

under V_OVL2(30.5V (Typ)). In the case of V_OVH1, it operates normally under V_OVL1(15V (Typ)).

(6) Motor Lock Protection Circuit (MLP Circuit)

Motor lock protection circuit (Motor Lock Protection: MLP) is built in. Enable/Disable of MLP and OVLO threshold

can be set by LPE terminal. All of the driver outputs are Hi-Z when the outputs of HALL comparator keep “H” or “L”

during 1.1s (Typ) at LPE is "H" or "M". It restarts after 5s (Typ) if the outputs of HALL comparator change as the

normal operation. When LPE is "L", MLP circuit does not work. LPE terminal is pulled up by VREG through a

resistance of 100kꢀ±40kꢀ.

LPE

Monitoring Time

OVLO Threshold

H or OPEN

1.1s±30%

Disable

V_OVH2, V_OVL2

V_OVH1, V_OVL1

V_OVH2, V_OVL2

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Electrical Characteristics (Unless otherwise specified Tj=-40 to 105°C, V_CC=12V)

Limit

Item

Symbol

Unit

Conditions

Min

Typ

Max

[Whole]

Circuit Current

VREG Voltage

[Driver Output]

I_CC

V_REG

4.75

5.0

5.25

I_VREG=-10mA

I_OUT=±1.5A

Output On Resistance

R_ON

0.6

1.3

ꢀ

(sum of High/Low side)

Carrier Frequency

[HALL Input]

F_PWM

22.7

kHz

Input Bias Current

Range of In-phase

Input Voltage

I_HALL

-2.0

-0.1

2.0

µA

V_HALL=0V

V_HALLCM

V_REG-2.0

Minimum Input Voltage

HYS Level +

V_HALLMIN

V_HALLHY+

V_HALLHY-

mV_p-p

-15

-3

HYS Level -

-40

[Control Input: DCIN]

Input Bias Current

Min. Duty Input Voltage

Max. Duty Input Voltage

[Control Input: SSB]

Input Current

I_DCIN

V_MIN

V_MAX

12.5

0.75

3.75

µA

V_DCIN=VREG

1.25

4.25

I_SSB

-100

2.0

-50

-25

V_REG

0.8

µA

V_SS=0V

Voltage Input H

V_SSBH

V_SSBL

Voltage Input L

[Control Input: LPE]

Input Current

I_LPE

V_LPE

-25

0.8×V_REG

0.4×V_REG

-50

-100

V_REG

µA

V_LPE=0V

Input Voltage "H"

Input Voltage "M"

Input Voltage "L"

[FG Output: FGO]

Output Voltage L

0.6×V_REG

0.2×V_REG

V_FGOL

0.1

0.25

0.26

I_FGO=2mA

[Current Limit]

Detect Voltage

[UVLO]

V_CL

0.14

0.20

Detect Voltage

V_UVH

V_UVL

6.2

5.2

7.0

6.0

7.8

6.8

[OVLO]

Release Voltage1

Lockout Voltage1

Release Voltage2

Lockout Voltage2

V_OVL1

V_OVH1

V_OVL2

V_OVH2

13.5

14.5

28.5

29.0

15.0

16.0

30.5

31.0

16.5

17.5

33.5

34.0

LPE=”M”

LPE=”H” or “L”

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Timing Chart

Figure 7. Timing Chart

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State Transition Diagram

Driver Outputs:

Hi-Z

UVLO and TSD and

OVLO and 3HALLERR

(All of the protection released)

UVLO or TSD or

OVLO or 3HALLERR

(Each protection operated)

DCIN≥1V(Typ) and

CL released (SSB="H")

MLP or 1HALLERR operated

Driver Outputs:

Hi-Z (Auto

Restart)

Driver Outputs:

“L” (Short Brake)

Normal

Operation

DCIN≤1V (Typ) or

CL operated (SSB="H")

MLP and 1HALLERR

Protection released

CL released

(SSB="L"時）

CL operated

(SSB="L"）

OCP operated

UVLO operated

Driver Outputs:

Hi-Z (Latched off)

Decreasing Duty

Figure 8. State Transition Diagram

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I/O Equivalence circuits

Name

I/O Equivalence circuit

VCC

VREG

U, V, W

250kꢀ

RCL

RNF

2kꢀ

RNF

VCC

VREG

HUP

HUN

HVP

HVN

HWP

HWN

VREG

VCC

HUP, HUN

HVP, HVN

HWP, HWN

VREG

145kꢀ

2kꢀ

50kꢀ

Internal Reg

200kꢀ

DCIN

100kꢀ

DCIN

TEST1

200kꢀ

TEST1

10kꢀ

VREG

100kꢀ

10kꢀ

LPE

SSB

LPE

SSB

10kꢀ

VREG

TEST2

FGO

5ꢀ

380kꢀ

220kꢀ

10kꢀ

FGO

TEST2

10kꢀ

(Note 1)The above value of resistor is shown typical.

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may

result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the

board size and copper area to prevent exceeding the maximum junction temperature rating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

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Operational Notes – continued

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 9. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all

within the Area of Safe Operation (ASO).

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Operational Notes – continued

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls

below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

17. Disturbance light

In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due

to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip

from being exposed to light.

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Ordering Information

B D 6

ME 2

Package

EFV: HTSSOP-B20

Packaging and forming specification

M: High reliability

Part Number

E2: Embossed tape and real

Marking Diagrams

HTSSOP-B20 (TOP VIEW)

Part Number Marking

LOT Number

D 6 3 0 3 5

1PIN MARK

Part Number Marking

Package

Orderable Part Number

BD63035EFV-ME2

D63035

HTSSOP-B20

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Physical Dimension, Tape and Reel Information

Package Name

HTSSOP-B20

Tape

Embossed carrier tape (with dry pack)

Quantity

2500pcs

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Revision History

Date

Rev.

001

Changes

30.Jun.2016

New Release

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

BD63035EFV-M - Web Page

Part Number

Package

Unit Quantity

BD63035EFV-M

HTSSOP-B20

2500

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

2500

Taping

inquiry

Yes

BD63035EFV-M [ROHM]

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