BD63150AFM_技术文档

Datasheet

Driver IC for PPC

High Performance, High Reliability

50V DC Brush Motor Drivers

for PPC's etc.

BD63150AFM

General Description

Key Specifications

BD63150AFM is a built-in channel H-bridge motor driver

for DC brush motor. This driver can facilitate low power

consumption by direct PWM or PWM constant current

control. There are built in protection circuits in this IC. It is

possible to output an abnormal detection signal for

Wired-OR that notifies each protection circuit operation,

which contributes to set high reliability.

 Power Supply Voltage Range:

 Rated Output Current:

 Rated Output Current (Peak):

 Operating Temperature Range:

 Output ON-Resistance:

8.0V to 46.2V

5.0A

6.0A

-25°C to +85 °C

0.30Ω(Typ)

(Total of upper and lower resistors)

Features

Package

HSOP-M36

W(Typ) x D(Typ) x H(Max)

18.50mm x 9.90mm x 2.40mm

 Single Power Supply Input (rated voltage of 50V)

 Rated Output Current (peak): 5.0A(6.0A)

 Low ON-Resistance DMOS Output

 Forward, Reverse, Brake, Open

 Power Save Function

 External PWM Control

 PWM Constant Current Control (current limit function)

 Built-in Spike Noise Cancel Function (external noise

filter is unnecessary)

 Driver for DC Brush Motor

 Built-in logic input pull-down resistor

 Cross-conduction Prevention Circuit

 Output detection signal during abnormal states

(Wired-OR)

Figure 1. HSOP-M36

 Thermal Shutdown Circuit (TSD)

 Over-current Protection Circuit (OCP)

 Under Voltage Lock out Circuit (UVLO)

 Over Voltage Lock out Circuit (OVLO)

 Ghost Supply Prevention (protects against malfunction

when power supply is disconnected)

 HSOP-M36 package

Typical Application Circuit

GND

PS

VREF

IN1

IN2

Application

■ Plain Paper Copier (PPC), Multi-function Printer, Laser

Printer, Inkjet Printer, Photo Printer, FAX, Mini Printer

and etc.

FAILA

VCC

TEST

OUT1

OUT2

TEST1

RNF

RNFS

GND

Figure 2. Application Circuit

○Product structure：silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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Pin Configuration

Block Diagram

(TOP VIEW)

36

35

34

33

NC

1

2

OUT1

＋

－

FAILA

＋

－

VREF

1/3

RNFS

Regulator

RNF

OUT1

NC

3

4

5

32 RNFS

NC

GND

28 NC

31

30

29

6

7

OUT2

NC

TSD

OCP

Blank time

PWM control

UVLO

OVLO

8

9

OSC

FIN

VCC

10

27

26

25

NC

VCC

NC

IN1

IN2

PS

NC

TEST

FAILA

NC

OUT1

OUT2

Forward

Reverse

BRAKE

Open

11

12

13

14

15

16

17

18

IN1

IN2

RNF

24 VCC

23

22

PS

RNFS

GND

NC

GND

NC

VREF

TEST

TEST1

21

20

19

TEST1

NC

Figure 3. Pin Configuration

Figure 4. Block Diagram

Pin Descriptions

Pin No. Pin Name

Function

Pin No. Pin Name

Function

1

2

3

4

5

6

7

8

9

OUT1

NC

19

20

21

22

23

24

25

26

27

NC

VREF

NC

Non-Connection

H bridge output terminal

Output current value setting terminal

Non-Connection

GND

NC

Ground terminal

NC

Non-Connection

OUT2

NC

VCC

NC

H bridge output terminal

Power supply terminal

Non-Connection

Fin terminal

(used by connecting with GND)

Fin terminal

(used by connecting with GND)

FIN

10

11

12

13

NC

IN1

IN2

PS

Non-Connection

28

29

30

31

NC

GND

NC

Non-Connection

Ground terminal

Non-Connection

H Bridge Control Terminal

Power save terminal

NC

Input terminal of current limit

comparator

14

15

16

NC

Non-Connection

32

33

34

RNFS

RNF

Terminal for testing

TEST

FAILA

(used by connecting with GND)

Output signal to detect abnormal

states

Connection terminal of resistor for

output current detection

RNF

17

18

NC

Non-Connection

35

36

RNF

NC

TEST1

(used by connecting with GND)

Non-Connection

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Absolute Maximum Ratings (Ta=25°C)

Parameter

Symbol

V_CC

Rating

-0.2 to +50.0

-0.2 to +5.5

0.7

Unit

V

Supply Voltage

Input Voltage for Control Pin

RNF Maximum Voltage

Output Current

V_IN

V

V_RNF

V

I_OUT

5.0^{(Note 1)}

6.0^{(Note 1)}

12.0^{(Note 1)}

-25 to +85

-55 to +150

+150

A/ch

°C

Output Current (PEAK) ^{(Note 2)}

Output Current (BRAKE) ^{(Note 3)}

Operating Temperature Range

Storage Temperature Range

Junction temperature

I_OUTPEAK

I_OUTBRAKE

Topr

Tstg

°C

Tjmax

°C

(Note 1) Do not, however exceed Tjmax=150°C.

(Note 2) Pulse width tw ≤1ms, duty 20%

(Note 3) This current is flowed switching from forward rotation and reverse rotation to the brake mode.

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Recommended Operating Conditions (Ta= -25 to +85°C)

Range

8.0 to 46.2

3.5^{(Note 4)}

Unit

V

Parameter

Symbol

Supply Voltage

V_CC

Maximum Output Current (Continuous)

I_OUT

A/ch

(Note 4) Do not, however exceed Tjmax=150°C.

Thermal Resistance^{(Note 5)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 7)}

2s2p^{(Note 8)}

HTSOP-M36

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 6)}

θ_JA

53.9

3

26.4

2

°C/W

Ψ_JT

(Note 5) Based on JESD51-2A(Still-Air).

(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 7) Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 8) Using a PCB board based on JESD51-5, 7.

Thermal Via^{(Note 9)}

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

Pitch

Diameter

4 Layers

FR-4

1.20mm

Φ0.30mm

Top

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

70μm

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

(Note 9) This thermal via connects with the copper pattern of all layers.

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Electrical Characteristics (Unless otherwise specified Ta=25°C, V_CC=24V)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

【Whole】

Circuit Current at Standby

Circuit Current

I_CCST

I_CC

-

10

µA

PS=L

2.5

5.0

mA

PS=H, VREF=2V

【Control Input】

H Level Input Voltage

L Level Input Voltage

H Level Input Current

L Level Input Current

【Output (OUT1, OUT2)】

V_INH

V_INL

I_INH

I_INL

2.0

-

V

0.8

100

-

35

-10

50

0

µA

V_IN=5V

V_IN=0V

I_OUT=±3.5A

(Sum of upper and lower)

Output ON-Resistance

R_ON

-

0.30

-

0.39

10

Ω

Output Leak Current

【Current Control】

RNF Input Current

I_LEAK

µA

I_RNF

I_VREF

V_VREF

-80

-2.0

-

-40

-0.1

-

µA

V

RNF=0V

VREF Input Current

VREF Input Voltage Range

VREF=0V

2.0

Minimum on Time

(Blank Time)

Current Limit

t_ONMIN

V_CTH

0.7

1.5

3.0

µs

V

0.475

0.500

0.525

VREF=1.5V

Comparator Threshold

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Application Information

Points to Notice for Terminal Description and PCB Layout

(1) PS/ Power Save Terminal

PS can make circuit into standby state and make motor outputs OPEN.

Please be careful because there is a delay of 40μs(Max) before it returns from OFF state to normal state.

PS

State

POWER SAVE (STANDBY)

ACTIVE

L

H

(2) IN1,IN2/ H Bridge Control Terminal

It decides output logic for H bridge.

Input

Output

State

PS

IN1

X

IN2

X

OUT1

OPEN

H

OUT2

OPEN

L

POWER SAVE (STANDBY)

STOP

H

L

H

L

FORWARD

H

L

H

L

H

REVERSE

H

L

BRAKE

X: H or L

(3) TEST,TEST1/ Terminal for Testing

This is the terminal used at the time of distribution test. Please connect to GND. Please be careful because there is a

possibility of malfunction if it is not connected to GND.

(4) VCC/ Power Supply Terminal

Motor’s drive current is flowing in it, so please connect it in such a way that the wire is thick, short and has low

impedance. VCC voltage may have great fluctuation, so please connect the bypass capacitor (100µF to 470µF) as

close as possible to the terminal. Adjust in such a way that the VCC voltage is stable. Please increase the capacitance

if needed, especially when large current or motors that have great back electromotive force are used. In addition, to

reduce the power supply’s impedance in wide frequency bandwidth, parallel connection of multi-layered ceramic

capacitor (0.01µF to 0.1µF) is recommended. Extreme care must be observed to make sure that the VCC voltage

does not exceed the rating even for a moment. Moreover, there is a built-in clamp component in the output terminal to

prevent electrostatic destruction. If sudden pulse or surge voltage of more than the maximum absolute rating is

applied, the clamp component operates which can result to destruction. Please be sure to not exceed the maximum

absolute rating. It is effective to mount a Zener diode with maximum absolute rating. Also, diode is inserted between

VCC terminal and GND terminal to prevent electrostatic destruction. If reverse voltage is applied between VCC

terminal and GND terminal, there is a danger of IC destruction so please be careful.

(5) GND/ Ground Terminal

In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, please

connect it in such a way that the wiring impedance from this terminal is made as low as possible to achieve the lowest

electrical potential no matter what operating state it may be.

(6) OUT1,OUT2/ H Bridge Output Terminal

Motor’s drive current is flowing in it, so please connect it in such a way that the wire is thick, short and has low

impedance. It is also effective to add a Schottky diode if output has great positive or negative fluctuation when large

current is applied. For example, a counter electromotive voltage etc. is great. Moreover, there is a built-in clamp

component in the output terminal to prevent electrostatic destruction. If sudden pulse or surge voltage of more than the

maximum absolute rating is applied, the clamp component operates which can result to destruction. Please be sure to

not exceed the maximum absolute rating.

(7) RNF/ Connection Terminal of Resistor for Detecting of Output Current

Please connect the resistor of 0.1Ω to 0.3Ω for current detection between this terminal and GND. Determine the

resistor in such a way that W=I_OUT²･R[W] does not exceed the power dissipation of the resistor. In addition, please

connect it in such a way that it has low impedance and does not have impedance in common with other GND patterns.

This is because motor’s drive current flows in the pattern through RNF terminal to current-detecting resistor to GND.

Please do not exceed the rating because there is the possibility of circuits’ malfunction etc. if the RNF voltage has

exceeded the maximum rating (0.7V). Moreover, please be careful not to short RNF terminal to GND because there is

the danger that OCP or TSD will operate when large current flows without normal PWM constant current control.

However, if RNF terminal is open, there is also the possibility of malfunction because output current does not flow

either. Please do not let it open.

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(8) RNFS/ Input Terminal of Current Limit Comparator

In this series, RNFS terminal, which is the input terminal of current limit comparator, is independently arranged in order

to decrease the lowering of current-detection accuracy caused by the wire impedance inside the IC of RNF terminal.

Therefore, please make sure to connect RNF terminal and RNFS terminal together when using PWM constant current

control. In addition, in case of interconnection, the lowering of current-detection accuracy caused by the impedance of

board pattern between RNF terminal and the current-detecting resistor can be decreased because the wires from

RNFS terminal is connected near the current-detecting resistor. Moreover, please design the pattern in such a way

that there is no noise spike.

(9) VREF/ Output Current Value-setting Terminal

[When to use current limit]

Please connect the current-detecting resistor to RNF terminal. VREF voltage and RNF resistor value are to set the

output current value for PWM constant current control or motor locking.

The output current value can be set by VREF voltage and current-detecting resistor (RNF resistor).

퐼_푂ꢀꢁ

=

^푉ꢂꢃꢄ/ 푅ꢅꢆ

[A]

3

Where:

I_OUT

is the output current.

VREF is the voltage of output current value-setting terminal.

RNF

is the current-detecting resistor.

Please avoid using it with VREF terminal open. If VREF terminal is open, there is possibility of malfunctions as the

setting current increases and a large current flows etc. This is caused by unstable input and increasing VREF voltage.

Please take note of the input voltage range because if voltage of over 2V is applied on VREF terminal, there is also a

danger that large current flows in the output and OCP or TSD will operate. Also, when selecting the resistance value

please take into consideration the outflow current (Max 2μA) produced by resistance division. The minimum current,

which can be controlled by VREF voltage, is determined by motor coil’s L, R values and minimum ON time. There is a

minimum ON time in PWM drive.

[When not to use current limit]

Please short RNF terminal with the GND. However there is a possibility of PWM constant current controlling by the

impedance of board pattern. For the reason, when not to use PWM constant current control, please input 1V to 2V to

VREF terminal(Refer to figure 8.).

(10) FAILA/ Fault Signal Output Terminal

FAILA outputs low signal when Over-Current Protection (OCP) or Thermal Shutdown (TSD) operates.

Even if Under Voltage Lock Out (UVLO) or Over Voltage Lock Out (OVLO) operates, FAILA signal doesn’t turn low (i.e.

high).

This terminal is an open drain type, so please set the pull up resistor (5kΩ to 100kΩ) to power supply less than 7V (i.e.

5V or 3.3V). If not using this terminal, please connect it to GND.

OCP

OFF

ON

TSD

OFF

ON

FAILA

H (OFF)

M (ON)

L (ON)

OFF

ON

(11) NC Terminal

This terminal is unconnected electrically with IC internal circuit.

(12) FIN terminal

HSOP-M36 package is mounted with the heat-radiating FIN terminal, and please be sure to connect the metal by

solder with the GND on the board and get as wide GND pattern as possible. Please be careful because Thermal

Resistance is increasing if not connected by solder.

Moreover, the FIN terminal is shorted with IC chip’s back side and becomes the GND potential, so there is the danger

of malfunction and destruction if shorted with potentials other than GND. Therefore, please absolutely do not connect

with potentials other than GND.

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Protection Circuits

Thermal Shutdown (TSD)

This IC has a built-in Thermal Shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175°C

(Typ), the motor output becomes OPEN. Also, when the temperature returns to under 150°C (Typ), it automatically returns

to normal operation. However, even when TSD is in operation, if heat is continued to be applied externally, heat overdrive

can lead to destruction.

Over-Current Protection (OCP)

This IC has a built in Over-Current Protection circuit as a provision against destruction when the motor outputs are shorted

to each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN

condition when the regulated threshold current flows for 4μs (Typ). It returns with power reactivation or a reset of the PS

terminal. The over-current protection circuit aims to prevent the destruction of the IC only from abnormal situations such as

when motor output is shorted and it is not meant to be used as protection or security for the device. Therefore, the device

should not be designed to make use of the function of this circuit. After OCP operation, if abnormal situations continues

and returned by power reactivation or reset of the PS terminal happens repeatedly, then OCP operates constantly. The IC

may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the long wiring and the

over-current flows, the output terminal voltage increases and the absolute maximum values may be exceeded. As a result,

there is a possibility of destruction. Also, when a current flows, which is over the output current rating and under the OCP

detection current, the IC can heat up to over Tjmax=150°C. This can deteriorate the IC. Therefore, current which exceeds

the output rating should not be applied.

Under Voltage Lock Out (UVLO)

This IC has a built-in Under Voltage Lock Out function to prevent false operation such as IC output during power supply

under voltage. When the applied voltage to the VCC terminal goes under 5V (Typ), the motor output is set to OPEN. This

switching voltage has a 1V (Typ) hysteresis to prevent false operation by noise etc. Please be aware that this protection

circuit does not operate during power save mode.

Over Voltage Lock Out (OVLO)

This IC has a built-in Over Voltage Lock Out function to protect the IC output and the motor during power supply over

voltage. When the applied voltage to the VCC terminal goes over 52V (Typ), the motor output is set to OPEN. This

switching voltage has a 1V (Typ) hysteresis and a 4μs (Typ) mask time to prevent false operation by noise etc. Although

this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power

supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Please be aware that this

protection circuit does not operate during power save mode.

Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a control signal (IN1, IN2, PS, and VREF) is applied when there is no power supplied to the IC, there is a function which

prevents false operation by voltage applied via the electrostatic destruction prevention diode from the control input

terminal to the VCC, to this IC or to another IC’s power supply. Therefore, there is no malfunction in the circuit even when

voltage is supplied to these input terminals while there is no power supply.

Operation Under Strong Electromagnetic Field

The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is

found when using the IC in a strong electromagnetic field.

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External PWM Control

This series can drive motors by IN1, IN2 input directly from the microcomputer (up to100kHz).

Decay mode can be SLOW DECAY or FAST DECAY.

SLOW DECAY (forward rotation)

Input

IN1

H

Output

State

PS

H

IN2

L

OUT1

OUT2

H

L

ON

SLOW DECAY

ON

H

L

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (synchronous rectification, forward rotation)

Input

IN1

H

Output

State

PS

H

IN2

L

OUT1

OUT2

H

L

H

L

ON

FAST DECAY

ON

H

L

H

L

H

L

H

L

H

L

H

L

FAST DECAY

ON

H

FAST DECAY

SLOW DECAY

OFF to OFF

ON to OFF

OFF to ON

ON to OFF

OFF to ON

M

ON to ON

OFF to ON

Output ON

Current decay

Figure 5. Route of Regenerative Current during Current Decay

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PWM Constant Current Control

This function can limit the peak current or switching current in driving DC brush motor.

(1) Current Control Operation

When the output transistor is turned on, the output current increases which raises the voltage over the current sense

resistor. When the voltage on the RNF pin reaches the voltage value set by the VREF input voltage, the current limit

comparator operates and enters current decay mode. The output is then held OFF for a period of time determined by

the internal timer. The process repeats itself constantly for PWM operation.

(2) Blank Time (Fixed in Internal Circuit)

In order to avoid misdetection of output current due to RNF spikes that may occur when the output turns ON, the IC

employs an automatic current detection-masking period (t_ONMIN1.5µs Typ). During this period, the current detection is

disabled immediately after the output transistor is turned on. This allows for constant-current drive without the need for

an external filter.

(3) Internal Timer (Fixed in Internal Circuit)

Internal voltage is repeated to charge and discharge in internal circuit.

When internal voltage is changed charge from discharge, the output is then ON from the current decay mode.

Spike noise

Output current

RNF voltage

Current limit value

0mA

Current limit value

GND

0.9V

0.8V

Internal voltage

0.4V

GND

Discharge time : OFF time Toff

Noise cancel time Tn

Figure 6. Timing Chart of Internal Voltage, RNF Voltage and Output Current

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Power Dissipation

Please confirm that the IC’s chip temperature Tj is not over 150°C, while considering the IC’s power consumption (W),

thermal resistance (°C/W) and ambient temperature (Ta). When Tj=150°C is exceeded the functions as a semiconductor do

not operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to

deterioration and eventually destruction of the IC. Tjmax=150°C must be strictly obeyed under all circumstances.

(1) Thermal Calculation

The IC’s consumed power can be estimated roughly with the power supply voltage (V_CC), circuit current (I_CC), output

ON-Resistance (R_ONH, R_ONL) and motor output current value (I_OUT).

The calculation method during external PWM drive, SLOW DECAY, driving channel 1 only is shown here:

푊_푉ꢇꢇ= ꢈ_ꢇꢇ× 퐼_ꢇꢇ

[W]

where:

W_VCCis the consumed power of the V_CC

.

V_CC

I_CC

is the power supply voltage.

is the circuit current.

표ꢎ_푑ꢏꢐꢑ

^{100−표ꢎ_푑ꢏꢐꢑ}ꢒ

[W]

2

(

)

(

)

푊_퐷ꢉ푂ꢊ= � 푅_푂ꢋꢌ+ 푅_푂ꢋꢍ× 퐼_푂ꢀꢁ

×

ꢒ + � 2 × 푅_푂ꢋꢍ× 퐼_푂ꢀꢁ

×

100

During output ON

where:

During current decay

W_DMOS

R_ONH

R_ONL

I_OUT

is the consumed power of the output DMOS.

is the upper P-channel DMOS ON-resistance.

is the lower N-channel DMOS ON-resistance.

is the motor output current value

on_duty PWM on duty[%]

Upper P-Channel DMOS ON-Resistance

Lower N-Channel DMOS ON-Resistance

Model Number

BD63150AFM

R_ONH[Ω] (Typ)

R_ONL[Ω] (Typ)

0.17

0.13

푊_푡ꢓ푡ꢔꢕ = 푊_푉ꢇꢇ+ 푊_퐷ꢉ푂ꢊ

[W]

푇ꢖ = 푇ꢔ + 휃ꢖꢔ × 푊_푡ꢓ푡ꢔꢕ

[°C]

where:

W_total is the consumed total power of IC.

Tj

Ta

θja

is the junction temperature.

is the air temperature.

is the thermal resistance value.

However, the thermal resistance value θja [°C/W] differs significantly depending on circuit board conditions. Refer to

the Power Dissipation curve on page 14. Also, we are taking measurements of thermal resistance value θja of the

actual boards used. Please feel free to contact our salesman. The calculated values above are only theoretical. For

actual thermal design, please perform sufficient thermal evaluation for the application board used, and create the

thermal design with enough margin to not exceed Tjmax=150°C. Although not normally used, if the IC is to be used

under specific or strict heat conditions, please consider attaching an external Schottky diode between the motor output

terminal and GND to decrease heat from the IC.

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(2) Temperature Monitoring

There is a way to directly measure the approximate chip temperature by using the TEST terminal. However,

temperature monitor using TEST terminal is only for evaluation and experimenting, and must not be used in actual

usage conditions. TEST terminal has a protection diode to prevent electrostatic discharge. The temperature may be

monitored using this protection diode.

(a) Measure the terminal voltage when a current of Idiode=50μA flows from the TEST terminal to the GND, without

supplying VCC to the IC. This measurement is the Vf voltage inside the diode.

(b) Measure the temperature characteristics of this terminal voltage. (V_Fhas a linear negative temperature factor

against the temperature.) With the results of these temperature characteristics, chip temperature may be calibrated

from the TEST terminal voltage.

(c) Supply VCC, confirm the TEST terminal voltage while running the motor, and the chip temperature can be

approximated from the results of (b).

-Vf [mV]

TEST

Circuitry

Idiode

V

25

150 Chip temperature Tj [°C]

Figure 7. Model Diagram for Measuring Chip Temperature

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Application Circuit Diagram

(1)Constant Voltage Control or External PWM Control

When using the fault output function

⇒Pull up resistor 5kΩ to 100kΩ.

When not using the fault output

function

Sets the voltage value greater

than RNF8x3

Input range: 1.0V to 2.0V

3.3V or 5.0V

⇒Connect to GND.

Refer to page 6.

3.3V or 5.0V

VREF

10kΩ

12.0kΩ

FAILA

＋

－

＋

1/3

Regulator

－

6.8kΩ

RNF1S

TSD

OCP

Blank time

Control input terminal.

Input PWM signal (under 100kHz) at

external PWM control.

PWM control

UVLO

OVLO

Bypass capacitor.

Setting range is

100µF to 470µF (electrolytic)

0.01µF to 0.1µF(multilayer ceramic etc.)

Refer to page 5 for detail.

OSC

VCC

OUT1

100µF

0.1µF

M

Forward

Reverse

BRAKE

Open

Power save terminal

Refer to page 5 for detail.

OUT2

RNF

IN1

IN2

RNFS

VCC

Terminal for testing

Connect to GND.

PS

TEST

GND

TEST1

Figure 8. Block Diagram and Application Circuit Diagram

(a) Input/Output table

Input

Output

State

OUT1

OPEN

H

OUT2

OPEN

L

PS

IN1

X

IN2

X

L

POWER SAVE (STANDBY)

STOP

H

L

H

L

FORWARD

H

L

H

L

H

REVERSE

H

L

BRAKE

X: H or L

(b) Example of external PWM control sequence

SLOW DECAY (forward rotation)

Input

Output

State

OUT1

OUT2

PS

H

IN1

H

IN2

L

H

L

ON

SLOW DECAY

ON

H

L

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (forward rotation)

Input

Output

State

OUT1

OUT2

PS

H

IN1

H

IN2

L

H

L

H

L

ON

FAST DECAY

ON

H

L

H

L

H

L

H

L

H

L

H

L

FAST DECAY

ON

H

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(2)PWM Constant Current Control

When using the fault output function

⇒Pull up resistor 5kΩ to 100kΩ.

When not using the fault output

function

Sets the current limit value.

Input range: 0V to 2V

Refer to page 6 for detail.

⇒Connect to GND.

Refer to page 6.

3.3V or 5.0V

12.0kΩ

10kΩ

FAILA

VREF

＋

－

1/3

Regulator

－

6.8kΩ

RNF1S

TSD

OCP

Bypass capacitor.

Setting range is

Blank time

PWM control

UVLO

OVLO

100µF to 470µF(electrolytic)

0.01uF to 0.1µF(multilayer ceramic

etc.)

OSC

Refer to page 5 for detail.

Control logic input terminal.

Refer to page 5.

VCC

OUT1

100µF

0.1µF

M

Forward

Reverse

BRAKE

Open

Power save terminal

Refer to page 5 for detail.

OUT2

RNF

IN1

IN2

0.1Ω

RNFS

GND

Current detection setting resistor

0.05Ω to 0.14Ω

Refer to page 5, 6 for detail.

Terminal for testing

Connect to GND.

PS

TEST

TEST1

Figure 9. Application Circuit Diagram of Constant Voltage Control or External PWM Control

(a) Input/Output table

Input

Output

State

OUT1

OPEN

H

OUT2

OPEN

L

PS

L

IN1

X

IN2

X

POWER SAVE (STANDBY)

STOP

H

L

H

L

FORWARD

H

L

H

L

H

REVERSE

H

L

BRAKE

X: H or L

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I/O Equivalent Circuits

5kΩ

10kΩ

RNFS

VREF

Control

input

100kΩ

VCC

OUT2

OUT1

5kΩ

FAILA

5kΩ

RNF

Circuitry

Figure 10. I/O Equivalent Circuits

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Operation Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital

and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.

Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the

capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on

the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.

The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of

connections.

7. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always

be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent

damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

9. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power

supply or ground line.

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Operation Notes – continued

11. Regarding Input Pins of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode

or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 11. Example of Monolithic IC Structure

12. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

13. Over-Current Protection Circuit (OCP)

This IC has a built-in over-current protection circuit that activates when the output is accidentally shorted. However, it is

strongly advised not to subject the IC to prolonged shorting of the output.

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Ordering Information

A F M

B D 6 3 1 5 0

-

E 2

Part number

Package type

FM : HSOP-M36

Packaging and forming specification

E2: Reel-wound embossed taping

Marking Diagram

HSOP-M36 (TOP VIEW)

Part Number Marking

LOT Number

BD63150AFM

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

HSOP-M36

Max 18.75 (include. BURR)

1PIN MARK

(UNIT: mm)

PKG: HSOP-M36

Drawing: EX142-5001

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BD63150AFM

Revision History

Date

Revision

001

Changes

12.Oct.2017

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD63150AFM
厂家：	ROHM
描述：	本产品是能驱动1个DC有刷电机的H桥电机驱动器。通过直接PWM驱动或恒流PWM控制可实现高效率驱动。内置各种保护电路，可输出通知各种保护电路动作的支持Wired-Or的异常检出信号，有利于实现组件的高可靠性。电机驱动驱动器
文件：	总22页 (文件大小：1723K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63150AFM [ROHM]

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