BD63843EFV_12 [ROHM]
Stepping Motor Driver series Micro step 36V Stepping Motor Drivers; 步进电机驱动器系列微步36V步进电机驱动器
| 型号： | BD63843EFV_12 |
| 厂家： | 
ROHM |
| 描述： | Stepping Motor Driver series Micro step 36V Stepping Motor Drivers |
| 文件： | 总9页 (文件大小：261K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Stepping Motor Driver series
Micro step 36V
Stepping Motor Drivers
BD63843EFV, BD63847EFV
No.12009EAT08
●Description
BD63843EFV / BD63847EFV are stepping motor drivers of 1/16 micro step(sixteenth step) drive. As for its basic function, it
is a low power consumption bipolar PWM constant current-drive driver with power supply rated voltage of 36V and rated
output current (DC) of 1.0A, 2.0A. The input interface is CLK-IN type.
There are step modes of Full step & Half step, Eighth step, Sixteenth step mode by internal DAC (D-A converter), and for
current decay mode, the ratio of FAST DECAY & SLOW DECAY can be freely set, so the optimum control conditions for
every motor can be realized. In addition, being able to drive with one system of power supply makes contribution to the set
design’s getting easy.
●Feature
1) Single power supply input (rated voltage of 36V)
2) Rated output current:(DC) 1.0A, 2.0A
3) Low ON resistance DMOS output
4) CLK-IN drive mode
5) PWM constant current control (other oscillation)
6) Built-in spike noise cancel function (external noise filter is unnecessary)
7) Full step, Half step, Eighth step, Sixteenth step drive
8) Timing free for changing step modes
9) Current decay mode switching function (linearly variable FAST/SLOW DECAY ratio)
10) Normal rotation & reverse rotation switching function
11) Power save function
12) Built-in logic input pull-down resistor
13) Power-on reset function
14) Thermal shutdown circuit (TSD)
15) Over current protection circuit (OCP)
16) Under voltage lock out circuit (UVLO)
17) Over voltage lock out circuit (OVLO)
18) Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
19) Electrostatic discharge: 8kV (HBM specification)
20) Adjacent pins short protection
21) Inverted mounting protection
22) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP-B28 package
23) Pin-compatible line-up (In addition, pin-compatible to BD6387□EFV series)
●Application
PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo
printer, FAX, scanner, mini printer, toy, and robot etc.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
1/8
Technical Note
BD63843EFV, BD63847EFV
●Absolute maximum ratings (Ta=25°C)
Item
Supply voltage
Symbol
BD63847EFV
BD63843EFV
Unit
VCC1,2
-0.3~+36.0
V
1
1.45※
W
Power dissipation
Pd
2
4.70※
W
Input voltage for control pin
RNF voltage
VIN
VRNF
IOUT
-0.3~+7.0
0.7
V
V
3
3
Output current
Output current (peak)※
2.0※
2.5※
1.0※
1.5※
A/phase
A/phase
°C
4
3
3
IOUTPEAK
Topr
Operating temperature range
Storage temperature range
Junction temperature
-25~+85
-55~+150
+150
Tstg
°C
Tjmax
°C
※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C.
※2 4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C.
※3 Do not, however exceed Pd, ASO and Tjmax=150°C.
※4 Pulse width tw≦1ms, duty20%.
●Operating conditions (Ta= -25~+85°C)
Item
Supply voltage
Input voltage for control pin
Symbol
VCC1,2
VIN
BD63847EFV
BD63843EFV
Unit
V
V
19~28
0~5.5
5
5
Output current
IOUT
1.7※
0.7※
A/相
※5 Do not, however exceed Pd, ASO.
●Electrical characteristics (Unless otherwise specified Ta=25°C, VCC1,2=24V)
Limit
Item
Symbol
Unit
Condition
Min.
Typ.
Max.
Whole
Circuit current at standby
Circuit current
ICCST
ICC
-
-
1.0
2.5
2.5
5.0
mA
mA
PS=L
PS=H, VREF=3V
Control input (CLK, CW_CCW, MODE0, MODE1, ENABLE, PS)
H level input voltage
VINH
VINL
IINH
IINL
2.0
-
-
-
-
0.8
100
-
V
V
L level input voltage
H level input current
35
-10
50
0
µA
µA
VIN=5V
VIN=0V
L level input current
Output (OUT1A, OUT1B, OUT2A, OUT2B)
IOUT=1.5A,
Sum of upper and lower
IOUT=0.5A,
Sum of upper and lower
Output ON resistance (BD63847EFV)
Output ON resistance (BD63843EFV)
RON
-
0.85
1.10
Ω
RON
-
-
1.90
-
2.47
10
Ω
Output leak current
Current control
ILEAK
µA
RNFXS input current
RNFX input current
IRNFS
IRNF
-2.0
-40
-0.1
-20
-
-
µA
µA
µA
V
RNFXS=0V
RNFX=0V
VREF=0V
VREF input current
IVREF
VREF
IMTH
-2.0
0
-0.1
-
-
VREF input voltage range
MTH input current
3.0
-
-2.0
0
-0.1
-
µA
V
MTH=0V
MTH input voltage range
Minimum on time (Blank time)
Comparator threshold 1
Comparator threshold 2
Comparator threshold 3
VMTH
tONMIN
VCTH1
VCTH2
VCTH3
3.5
1.5
0.630
0.445
0.264
0.3
0.8
µs
V
C=1000pF, R=39kΩ
VREF=3V, 100%
VREF=3V, 70.71%
VREF=3V, 38.27%
0.570
0.403
0.196
0.600
0.424
0.230
V
V
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
2/8
Technical Note
BD63843EFV, BD63847EFV
●Terminal function and Application circuit diagram
Pin No.
Pin name
Function
Pin No.
Pin name
Function
Clock input terminal for advancing the
electrical angle.
Ground terminal
1
2
3
GND
OUT1B
RNF1
15
16
17
CLK
CW_CCW
TEST
H bridge output terminal
Motor rotating direction setting terminal
Connection terminal of resistor for
output current detection
Terminal for testing
(Used by connecting with GND)
Input
comparator
terminal
of
current
limit
Motor excitation mode setting terminal
4
RNF1S
18
MODE0
H bridge output terminal
Non connection
Motor excitation mode setting terminal
Output enable terminal
Non connection
5
6
7
8
9
OUT1A
NC
19
20
21
22
23
MODE1
ENABLE
NC
Power supply terminal
Non connection
VCC1
NC
Power supply terminal
Non connection
VCC2
NC
Ground terminal
GND
Connection terminal of CR for setting
chopping frequency
H bridge output terminal
10
11
12
CR
NC
24
25
26
OUT2A
RNF2S
RNF2
Input terminal of current limit
comparator
Non connection
Connection terminal of resistor for
output current detection
Current decay mode setting terminal
MTH
Output current value setting terminal
Power save terminal
H bridge output terminal
Non connection
13
14
VREF
PS
27
28
OUT2B
NC
Logic input terminal.
Refer to P.5 for detail.
Power save terminal
Refer to P.5 for detail.
Regulator
15
16
18
19
20
CLK
GND
9
CW_CCW
MODE0
Translator
14
PS
RESET
MODE1
UVLO
OVLO
TSD
ENABLE
Bypass capacitor.
Setting range is
＋
－
VREF 13
100uF~470uF(electrolytic)
0.01uF~0.1uF(multilayer ceramic etc.)
Refer to P.6 for detail.
4bit DAC
OCP
Set the output currenet.
Input by resistor divison.
Refer to P.6 for detail.
Be sure to short VCC1 & VCC2.
VCC1
7
OUT1A
＋
－
5
2
RNF1S
RNF2S
Set the chopping frequency.
Setting range is
OUT1B
RNF1
3
4
C:470pF~1500pF
R:10kΩ~200kΩ
＋
－
0.2Ω
100µF
0.1µF
Refer to P.7, 8 for detail.
RNF1S
VCC2
Blank time
PWM control
22
OUT2A
CR
10
24
27
Resistor for current. detecting.
Setting range is
0.1Ω~0.3Ω.
OSC
39kΩ
1000pF
OUT2B
RNF2
26
25
Refer to P.6 for detail.
Mix decay
control
0.2Ω
MTH 12
RNF2S
GND
Set the current decay mode.
①SLOW DECAY
⇒Connect to GND.
TEST
17
1
②MIX DECAY
⇒Input by resistor divison.
Refer to P.7, 9 for detail.
Resistor for current. detecting.
Setting range is
0.1Ω~0.3Ω.
Terminal for testing.
Connect to GND.
Refer to P.6 for detail.
Fig.1 Block diagram & Application circuit diagram
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
3/8
Technical Note
BD63843EFV, BD63847EFV
●Points to notice for terminal description
○CLK/Clock input terminal for advancing the electrical angle
CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input.Motor’s misstep will occur if
noise is picked up at the CLK terminal, so please design the pattern in such a way that there is no noise plunging.
○MODE0,MODE1/Motor excitation mode setting terminal
Set the step mode.
MODE0
MODE1
Step mode
Full step
Half step
1/8 step
L
H
L
L
L
H
H
H
1/16 step
○CW_CCW /Motor rotating direction setting terminal
Set the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the change in
setting
CW_CCW
Rotating direction
L
Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)
Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s current)
H
○ENABLE/Output enable terminal
Turn off forcibly all the output transistors (motor output is open).
At ENABLE=L, electrical angle or operating mode is maintained even if CLK is inputted.
If step modes are changed during ENABLE=L, new step mode is carried out at ENABLE=L to H
ENABLE
Motor output
OPEN (electrical angle maintained)
ACTIVE
L
H
○PS/Power save terminal
PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized)
and electrical angle is initialized.
Please be careful because there is a delay of 40µs(max.) before it is returned from standby state to normal state and the
motor output becomes ACTIVE
PS
State
Standby state (RESET)
ACTIVE
L
H
The electrical angle (initial electrical angle) of each step mode immediately after RESET is as follows
Step mode
Full step
Half step
1/8 step
Initial electrical angle
45°
45°
45°
45°
1/16 step
●Protection Circuits
○Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175°C
(Typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150°C (Typ.), it automatically returns
to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive
can lead to destruction.
○Over Current Protection (OCP)
This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted
each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition
when the regulated threshold current flows for 4µs (Typ.). It returns with power reactivation or a reset of the PS terminal.
The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor
output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to
take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power
reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly and the IC may generate heat
or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over current has
flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there
is a possibility of destruction. Also, when current which is over the output current rating and under the OCP detection
current flows, the IC can heat up to over Tjmax=150°C and can deteriorate, so current which exceeds the output rating
should not be applied.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
4/8
Technical Note
BD63843EFV, BD63847EFV
○Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under
voltage. When the applied voltage to the VCC terminal goes under 15V (Typ.), the motor output is set to OPEN. This
switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this circuit does
not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates during CLK-IN drive
mode.
○Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage.
When the applied voltage to the VCC terminal goes over 32V (Typ.), the motor output is set to OPEN. This switching
voltage has a 1V (Typ.) hysteresis and a 4µs (Typ.) mask time to prevent false operation by noise etc. Although this over
voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power supply
voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be aware that this circuit does
not operate during power save mode.
○Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
If a signal (logic input, VREF, MTH) is input when there is no power supplied to this IC, there is a function which prevents
the false operation by voltage supplied via the electrostatic destruction prevention diode from these input terminals to the
VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even when voltage is
supplied to these input terminals while there is no power supply.
●Thermal derating curve
HTSSOP-B28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the
back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power
dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a
possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation
efficiency.
Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
Board size：70mm*70mm*1.6mm
(With through holes on the board)
The exposed metal of the backside is connected to the board with solder.
5.0
4.70W
3.30W
4
3
Board①：1-layer board (Copper foil on the back 0mm)
Board②：2-layer board (Copper foil on the back 15mm*15mm)
Board③：2-layer board (Copper foil on the back 70mm*70mm)
Board④：4-layer board (Copper foil on the back 70mm*70mm)
4.0
3.0
2.0
1.0
Board①：θja=86.2°C W
Board②：θja=67.6°C W
Board③：θja=37.9°C W
Board④：θja=26.6°C W
1.85W
1.45W
2
1
0
25
50
75 85 100
125
150
Ambient temperature:Ta[C]
Fig.2 HTSSOP-B28 Thermal derating curve
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
5/8
Technical Note
BD63843EFV, BD63847EFV
●Usage Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
(3) Power supply Lines
As return of current regenerated by back EMF of FET output happens, take steps such as putting capacitor between
power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each
property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the
connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage
on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute
maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp
diode between the power supply and GND pins.
(4) GND Potential
The potential of GND pin must be minimum potential in all operating conditions.
(5) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that
there is a possibility of malfunction or destruction if it is shorted with any potential other than GND.
(6) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
This IC exposes the metal on the backside of package. Note that this part is assumed to use after providing heat
dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation
pattern not only on the board surface but also the backside.
(7) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
(8) Operation in a strong electric field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(9) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(10) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.
TSD on temperature [°C] (Typ.)
175
Hysteresis temperature [°C] (Typ.)
25
(11) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
6/8
Technical Note
BD63843EFV, BD63847EFV
(12) Input terminal of IC
This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.
This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 3,
○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),
the P-N junction operates as a parasitic diode.
○Also, when GND＞(Terminal B) at the transistor (NPN)
The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned
parasitic diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The
operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.
Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage
that is lower than the GND (P substrate) to the input terminal.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
C
B
E
Pin A
C
E
B
N
N
P+
N
P+
P
P
N
P+
N
P+
N
Parasitic
element
Parasitic
element
P substrate
P substrate
GND
GND
GND
GND
Parasitic element
Parasitic element
Other adjacent elements
Fig. 3 Pattern diagram of parasitic element
(13) Ground Wiring Pattern
When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components, either.
(14) TEST pin
Be sure to connect TEST pin to GND.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
7/8
Technical Note
BD63843EFV, BD63847EFV
●Ordering part number
E
F
V
B D 6
3
8
4
3
-
E 2
パッケージ
EFV=HTSSOP-B28
包装、フォーミング仕様
形名
E2: リール状エンボステーピング
HTSSOP-B28
<Tape and Reel information>
9.7 0.1
(MAX 10.05 include BURR)
Tape
Embossed carrier tape (with dry pack)
(5.5)
+
6
−4
°
°
Quantity
2500pcs
4°
28
15
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
14
+0.05
1PIN MARK
0.625
0.17
-
0.03
S
0.08
S
M
0.65
+0.05
Direction of feed
1pin
0.24
-
0.04
0.08
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
8/8
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-
controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2012 ROHM Co., Ltd. All rights reserved.
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A
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