BD63940EFV-E_技术文档

Stepping Motor Driver Series

Standard 36V

Stepping Motor Drivers

BD63940EFV, BD63960EFV

No.12009EAT11

●Description

BD63940EFV,BD63960EFV are the ultra simple type that provides the minimum function for driving stepping motor and

various protection circuits.

As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power supply’s

rated voltage of 36V and rated output current of 1.2A, 1.5A, and each driver is pin-compatible so that replacement can be

done easily. Also it makes μ-STEP drive possible by inputting external DAC signal so that it provides wider application

area. There are excitation modes of FULL STEP & HALF STEP mode. This series contributes to reduction of mounting

area, cost down, safety design.

●Feature

1) Power supply: one system drive (rated voltage of 36V)

2) Rated output current: 1.2A, 1.5A

3) Low ON resistance DMOS output

4) Parallel IN drive mode

5) 2ch drive DC motor

6) PWM constant current control (self oscillation)

7) Built-in spike noise cancel function (external noise filter is unnecessary)

8) FULL STEP applicable to HALF STEP

9) Applicable to μstep drive

10) Forward/reverse break mode for DC motor

11) Power save function

12) Built-in logic input pull-down resistor

13) Power-on reset function

14) Thermal shutdown circuit (TSD)

15) Over current protection circuit (OCP)

16) Under voltage lock out circuit (UVLO)

17) Over voltage lock out circuit (OVLO)

18) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)

19) Electrostatic discharge: 4kV (HBM specification)

20) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package

21) Pin-compatible line-up

●Application

Laser beam printer, Scanner, Photo printer, FAX, Ink jet printer, Mini printer, Sewing machine, Toy, and Robot etc.

www.rohm.com

2012.02 - Rev.A

1/8

Technical Note

BD63940EFV, BD63960EFV

●Absolute maximum ratings(Ta=25℃)

Item

Symbol

V_CC1,2

BD63940EFV

BD63960EFV

Unit

V

Supply voltage

-0.2～+36.0

1

1.1^※

Power dissipation

Pd

W

2

4.0^※

Input voltage for control pin

RNF maximum voltage

V_IN

V_RNF

I_OUT

T_opr

-0.2～+5.5

V

0.5

V

A/phase

℃

3

Maximum output current

Operating temperature range

Storage temperature range

Junction temperature

1.2^※

1.5^※

-25～+85

-55～+150

+150

T_stg

℃

T_jmax

℃

※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃.

※2 4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃.

※3 Do not, however exceed Pd, ASO and Tjmax=150℃.

●Operating conditions(Ta= -25～+85℃)

Item

Supply voltage

Symbol

V_CC1,2

I_OUT

BD63940EFV

BD63960EFV

Unit

V

19～28

4

Output current (DC)

0.9^※

1.2^※

A/phase

※4 Do not however exceed Pd, ASO.

●Electrical characteristics

Applicable to all the series (Unless otherwise specified Ta=25℃, V_cc1,2=24V)

Limit

Item

Symbol

Unit

Condition

Min.

Typ.

Max.

Whole

Circuit current at standby

Circuit current

I_CCST

I_CC

-

0.6

2.7

2.0

7.0

mA

PS=L

PS=H, VREF=0.4V

Control input (IN1A, IN1B, IN2A, IN2B, PS)

H level input voltage

L level input voltage

V_INH

V_INL

2.0

-

V

0.8

Output (OUT1A, OUT1B, OUT2A, OUT2B)

Output ON resistance

R_ON

I_OUT=0.7A

-

1.4

1.8

Ω

(BD63940EFV)

Sum of upper and lower

Output ON resistance

R_ON

I_OUT=1.0A

-

1.1

-

1.4

10

Ω

(BD63960EFV)

Sum of upper and lower

Output leak current

Current control

I_LEAK

μA

RNFX input current

VREFX input current

VREFX input voltage range

Comparator offset

I_RNFX

I_VREF

-40

-2.0

0

-20

-0.1

-

μA

V

RNFX=0V

-

VREFX=0V

V_REF

0.4

20

1.2

V_COFS

T_ONMIN

-20

0.3

0

mV

μs

VREFX=0.4V

Minimum on time

0.7

R=39kΩ, C=1000pF

www.rohm.com

2012.02 - Rev.A

2/8

Technical Note

BD63940EFV, BD63960EFV

●Terminal function

1) BD63940EFV/BD63960EFV

No.

Pin name

No.

Function

Pin name

Function

1

2

3

PGND

IN2B

Ground terminal

13

14

15

IN1A

PGND

VCC1

Logic input terminal

Ground terminal

VREF2

Output current value setting terminal

Power supply terminal

Connection terminal of CR for setting

PWM frequency

H bridge output terminal

4

5

CR2

NC

16

17

OUT1A

RNF1

Connection terminal of resistor for output

current detection

Non connection

Terminal for testing

H bridge output terminal

6

7

8

TEST

GND

PS

18

19

20

OUT1B

OUT2B

RNF2

(used by connecting with GND)

Ground terminal

H bridge output terminal

Connection terminal of resistor for output

current detection

Power save terminal

Connection terminal of CR for setting

PWM frequency

H bridge output terminal

9

CR1

21

OUT2A

10

11

12

VREF1

IN1B

NC

Output current value setting terminal

Logic input terminal

22

23

24

VCC2

NC

Power supply terminal

Non connection

IN2A

Logic input terminal

●Block diagram･Application circuit diagram･Input output equivalent circuit diagram

Set the PWM frequency.

Setting range is

Resistor for current detection.

Setting range is

C:470pF～4700pF

R:10kΩ～100kΩ

0.2Ω～0.5Ω(BD63940EFV)

0.2Ω～0.4Ω(BD63960EFV)

VCC1

15

13

IN1A

OUT1A

16

18

IN1B 11

LOGIC

Predriver

CR1

9

ONE

OUT1B

RNF1

39kΩ

1000pF

17

SHOT

0.3Ω

OCP

Be sure to short VCC1 & VCC2.

VREF1

10

Current

Limit

Comp.

VCC2

22

24

2

IN2A

0.1uF

100uF

OUT2A

21

19

IN2B

CR2

LOGIC

Predriver

4

ONE

OUT2B

RNF2

39kΩ

1000pF

Bypass capacitor.

Setting range is

SHOT

20

0.3Ω

100uF～470uF(electrolytic)

0.01uF～0.1uF(multilayer ceramic etc.)

OCP

VREF2

3

Current

Limit

Set the PWM frequency.

Setting range is

C:470pF～4700pF

R:10kΩ～100kΩ

Comp.

TEST

PS

6

8

PGND

GND

1

14

7

RESET

Regulator

Resistor for current detection.

Setting range is

0.2Ω～0.5Ω(BD63940EFV)

0.2Ω～0.4Ω(BD63960EFV)

TSD

UVLO

OVLO

Terminal for testing.

Please connect to GND.

Fig.1 Block diagram & Application circuit diagram

www.rohm.com

2012.02 - Rev.A

3/8

Technical Note

BD63940EFV, BD63960EFV

●Points to notice for terminal description

○PS／Power save terminal

PS can make circuit standby state and make motor output OPEN. Please be careful because there is a delay of

40μs(max.) before it is returned from standby state to normal state and the motor output becomes ACTIVE.

PS

State

Standby state (RESET)

ACTIVE

L

H

○IN1A, IN1B, IN2A, IN2B／Control logic input terminal

These terminals decide output state.

Input

Output

IN1A

IN2A

IN1B

IN2B

OUT1A

OUT2A

OUT1B

OUT2B

PS

L

Stand by

X

OPEN

(All circuits)

H

L

H

L

OPEN

Stand by

Forward

Reverse

H

L

H

L

H

Brake

X: H or L

●Protection Circuits

○Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above

175℃ (Typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (Typ.), it

automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added

externally, heat overdrive can lead to destruction.

○Over Current Protection (OCP)

This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are

shorted each other or Vcc-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN

condition when the regulated threshold current flows for 4μs (Typ.). It returns with power reactivation or a reset of the

PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations

such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should

not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues and

the return by power reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates repeatedly

and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being

long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values

may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output

current rating and under the OCP detection current flows, the IC can heat up to over T_jmax=150℃ and can deteriorate,

so current which exceeds the output rating should not be applied.

○Under Voltage Lock Out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply

under voltage. When the applied voltage to the Vcc terminal goes under 15V (Typ.), the motor output is set to OPEN.

This switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this

circuit does not operate during power save mode.

○Over Voltage Lock Out (OVLO)

This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over

voltage. When the applied voltage to the VCC terminal goes over 32V (Typ.), the motor output is set to OPEN. This

switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc.

Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum

value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be

aware that this circuit does not operate during power save mode.

○False operation prevention function in no power supply (Ghost Supply Prevention)

If a logic control signal is input when there is no power supplied to this IC, there is a function which prevents the false

operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to

the Vcc, to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even when voltage is

supplied to the logic control input terminal while there is no power supply.

www.rohm.com

2012.02 - Rev.A

4/8

Technical Note

BD63940EFV, BD63960EFV

●Power dissipation

○HTSSOP-B24 Package (BD63940EFV/BD63960EFV))

HTSSOP-B24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the

back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power

dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a

possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is

recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this

product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation

efficiency.

Measurement machine：TH156（Kuwano Electric）

Measurement condition：ROHM board

Board size：70*70*1.6mm³

(With through holes on the board)

4.0W

4

3

4.0

3.0

The exposed metal of the backside is connected to the board with

solder.

Board①：1-layer board(Copper foil on the back 0mm²)

Board②：2-layer board(Copper foil on the back 15*15mm²)

Board③：2-layer board(Copper foil on the back 70*70mm²)

Board④：4-layer board(Copper foil on the back 70*70mm²)

2.8W

Board①：θ_ja=113.6℃/W

Board②：θ_ja=73.5℃/W

Board③：θ_ja=44.6℃/W

Board④：θ_ja=31.3℃/W

2.0

1.7W

1.1W

2

1

1.0

0

100

125

Ambient Temperature : Ta[℃]

Fig.2 HTSSOP-B24 Derating curve

www.rohm.com

2012.02 - Rev.A

5/8

Technical Note

BD63940EFV, BD63960EFV

●Usage Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If

any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,

such as fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply

lines. An external direction diode can be added.

(3) Power supply Lines

Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,

separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals

to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the

circuit, not that capacitance characteristic values are reduced at low temperatures.

(4) GND Potential

The potential of GND pin must be minimum potential in all operating conditions.

(5) Metal on the backside (Define the side where product markings are printed as front)

The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that

there is a possibility of malfunction or destruction if it is shorted with any potential other than GND.

(6) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

Users should be aware that this series has been designed to expose their frames at the back of the package, and should

be used with suitable heat dissipation treatment in this area to improve dissipation. As large a dissipation pattern should

be taken as possible, not only on the front of the baseboard but also on the back surface.

(7) Mounting errors and inter-pin shorts

When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper

attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be

caused by foreign matter entering between outputs or an output and the power supply or GND.

(8) Operation in a strong electric field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

(9) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(10) Thermal shutdown circuit

The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes T_jmax=150℃, and higher,

coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal

operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect

peripheral equipment.

TSD on temperature [℃] (Typ.)

Hysteresis Temperature [℃] (Typ.)

175

25

(11) Inspection of the application board

During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility

that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a

measure again electrostatic discharge, it should be earthed during the assembly process and special care should be

taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power

supply should first be turned off and then removed before the inspection.

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2012.02 - Rev.A

6/8

Technical Note

BD63940EFV, BD63960EFV

(12) Input terminal of IC

This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.

This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.

For example, when the resistance and transistor are connected to the terminal as shown in figure 3,

○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),

the P-N junction operates as a parasitic diode.

○Also, when GND＞(Terminal B) at the transistor (NPN)

The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned

parasitic diode.

Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The

operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.

Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage

that is lower than the GND (P substrate) to the input terminal.

Resistor

Transistor (NPN)

Pin A

Pin B

B

C

Pin A

E

C

E

B

N

P⁺

N

P

N

Parasitic

element

P substrate

Parasitic

element

P substrate

GND

Parasitic element

Other adjacent elements

Fig.3 Pattern Diagram of Parasitic Element

(13) Ground Wiring Patterns

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern potential of any external components, either.

(14) TEST Terminal

Be sure to connect TEST pin to GND.

www.rohm.com

2012.02 - Rev.A

7/8

Technical Note

BD63940EFV, BD63960EFV

●Ordering part number

E

F

V

B D 6

3

9

4

0

-

E 2

パッケージ

EFV=HTSSOP-B24

包装、フォーミング仕様

形名

E2: リール状エンボステーピング

HTSSOP-B24

7.8 0.1

(MAX 8.15 include BURR)

Tape

Embossed carrier tape (with dry pack)

+

6°

−4°

(5.0)

4°

Quantity

2000pcs

24

13

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

12

1PIN MARK

0.325

+0.05

0.17

-

0.03

S

0.65

0.08

S

+0.05

Direction of feed

1pin

M

0.24

0.08

-

0.04

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

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2012.02 - Rev.A

8/8

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1120

A


型号：	BD63940EFV-E
厂家：	ROHM
描述：	the ultra simple type that provides the minimum function for driving stepping motor and various protection circuits. 超简单类型，它提供的最小功能，用于驱动步进电机及各种保护电路。电机驱动
文件：	总9页 (文件大小：236K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63940EFV-E [ROHM]

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