BD67173NUX-E2 [ROHM]

Three-Phase Full-Wave Fan Motor Driver;


型号：	BD67173NUX-E2
厂家：	ROHM
描述：	Three-Phase Full-Wave Fan Motor Driver
文件：	总30页 (文件大小：2557K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

DC Brushless Fan Motor Drivers

Three-Phase Full-Wave

Fan Motor Driver

BD67173NUX

General Description

Key Specifications

BD67173NUX is a three-phase sensorless fan motor

driver used to cool off notebook PCs. It is controlled by a

variable speed provided through the PWM input signal.

Its feature is sensorless drive which doesn’t require a

hall device as a location detection sensor and motor

downsizing can be achieved by limiting the number of

external components as much as possible.



Operating Supply Voltage Range: 2.2V to 5.5V

Operating Temperature Range: -25°C to +95°C

Package(s)

VSON010X3030

W(Typ) x D(Typ) x H(Max)

3.00mm x 3.00mm x 0.60mm

Furthermore, introducing a direct PWM soft switched

driving mechanism achieves silent operations and low

vibrations.

Features

 Speed controllable by PWM input signal

 Sensorless drive

 Soft switched drive Quick start

 Power save function

 Internal RNF resistance

 Quick start function

VSON010X3030

Applications

 Small fan motor for notebook PCs etc.

Typical Application Circuit(s)

VCC

10kohm

1pin

PWM

TOSC

GND

PWM

SIG

COM

2200pF

VCC

＋

VCC

Ｗ

10kohm

1uF~4.7uF

―

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Contents

General Description ......................................................................................................................................................1

Features........................................................................................................................................................................1

Applications...................................................................................................................................................................1

Key Specifications.........................................................................................................................................................1

Package(s)

W(Typ) x D(Typ) x H(Max).....................................................................................................1

Typical Application Circuit(s).........................................................................................................................................1

Pin Configuration(s) ......................................................................................................................................................3

Pin Description(s) .........................................................................................................................................................3

Block Diagram(s) ..........................................................................................................................................................3

Absolute Maximum Ratings (Ta = 25°C).......................................................................................................................4

Recommended Operating Conditions (Ta= -25°C to +95°C)........................................................................................4

Electrical Characteristics (Unless otherwise specified V_CC=5V Ta=25°C)....................................................................5

Typical Performance Curves.........................................................................................................................................6

Application circuit example (Constant values are for reference) ................................................................................10

Power Dissipation .......................................................................................................................................................21

Operational Notes.......................................................................................................................................................23

Marking Diagrams.......................................................................................................................................................26

Physical Dimension, Tape and Reel Information........................................................................................................27

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Pin Configuration

(TOP VIEW)

PWM

TOSC

GND

COM

VCC

Figure 1. Pin Configuration

Pin Description(s)

Pin No.

Pin Name

Function

FG output pin

COM

VCC

Coil midpoint pin

Power supply pin

U phase output pin

Motor rotation direction select pin

W phase output pin

V phase output pin

GND pin

GND

TOSC

PWM

Start-up oscillation pin

PWM signal input pin

Block Diagram

TSD

UVLO

OSC

VREG

PWM

SIGNAL

OUTPUT

DUTY

CONTROL

BEMF

COMP.

CONTROL

LOGIC

TOSC

COM

TOSC

GND

COMP.

VCS

VCC

PRE-

DRIVER

Figure 2. Block Diagram

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Absolute Maximum Ratings (Ta = 25°C)

Parameter

Supply voltage

Symbol

VCC

Limit

Unit

0.58 *1

–25 to +95

–55 to +150

Power dissipation

Operating temperature

Storage temperature

Output voltage

Topr

Tstg

°C

Vomax

Iomax

VFG

IFG

Output current

700*2

FG signal output voltage

FG signal output current

Junction temperature

°C

150

Reduce by 4.64mW/°C over Ta=25°C. (On 74.2mm×74.2mm×1.6mm glass epoxy board)

This value is not to exceed Pd

Recommended Operating Conditions (Ta= -25°C to +95°C)

Min

Typ

Max

Unit

Parameter

Symbol

2.2

5.5

Operating supply voltage range

Input voltage range(PWM, FR )

V_CC

V_IN

VCC

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Electrical Characteristics (Unless otherwise specified V_CC=5V Ta=25°C)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Ref. Data

Circuit current STB

Circuit current

I_CST

I_CC

FR=Open

Fig. 3

Fig. 4

1.8

4.2

6.6

<PWM>

PWM input H level

PWM input L level

PWM input current H

PWM input current L

Input frequency

<FR>

V_PH

V_PL

I_PH

2.5

VCC

0.7

kHz

PWM=VCC

PWM=GND

Fig. 5

Fig. 6

I_PL

-30

-15

F_PWM

FR input H level

FR input L level

FR input current H

FR input current L

<TOSC >

V_FRH

V_FRL

I_FRH

I_FRL

2.5

VCC

0.5

FR=H : Normal rotation

FR=L; Reverse rotation

FR=VCC

Fig. 7

Fig. 8

-50

-25

FR=GND

TOSC frequency

TOSC charge current

TOSC discharge current

<FG>

F_TOSC

I_CTOSC

I_DTOSC

-125

-75

125

kHz TOSC-GND 2200pF

-100

100

TOSC=0.5V

TOSC=1.0V

Fig. 9

Fig. 10

FG low voltage

V_FGL

0.12

0.3

IFG＝5mA

Fig.11 12

Fig.13 14

Fig.15 16

Output voltage

V_O

t_POFF

t_ON

0.25

0.325

Io＝250mA (H.L. total)

PWM off time

0.5

0.7

3.3

1.0

5.0

2.0

1.3

8.3

Lock protection det. Time

Lock protection rel. time

Fig. 17

Fig 18

t_OFF

About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation.

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Typical Performance Curves

95°C

25°C

–25°C

95°C

25°C

–25°C

Operating range

Supply voltage: Vcc[V]

Figure 3 Circuit current STB

Figure 4 Circuit current

-2

0.10

0.08

0.06

-4

0.04

-6

95°C

25°C

–25°C

0.02

-8

0.00

-10

-12

-14

-16

-18

95°C

25°C

–25°C

-0.02

-0.04

-0.06

-0.08

-0.10

Figure 5 PWM input Current H

Supply voltage: Vcc[V]

Figure 6 PWM input Current L

Supply voltage: Vcc[V]

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Typical Performance Curves2

0.10

0.08

-5

0.06

0.04

-10

-15

-20

-25

-30

0.02

0.00

95°C

25°C

–25°C

-0.02

-0.04

-0.06

-0.08

-0.10

–25°C

25°C

95°C

Supply voltage: Vcc[V]

Figure 7 FR input Current H

Figure 8 FR input Current L

120

-80.0

-90.0

110

100

–25°C

25°C

95°C

–25°C

25°C

95°C

-100.0

-110.0

-120.0

Operating range

Supply voltage: [V]

Figure 10 TOSC discharge current

Figure 9 TOSC charge current

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Typical Performance Curves3

0.3

0.2

0.1

0.0

0.3

0.2

0.1

0.0

95°C

25°C

2.2V

–25°C

Output sink current: Ifg[mA]

Figure 11 FG output low voltage (Vcc=5V)

Output sink current: Ifg[mA]

Figure 12 FG output low voltage (Ta=25°C)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

95°C

2.2V

25°C

–25°C

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

Output sink current: Io[A]

Figure 13 Output Low voltage (Ta=25°C)

Figure 14 Output Low voltage (Vcc=5V)

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Typical Performance Curves4

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

95°C

25°C

2.2V

–25°C

5.5V

0.0

0.1

0.2

Output source current: Ifg[mA]

Figure 15 Output high voltage (Vcc=5V)

0.3

0.4

0.5

0.6

0.7

0.0

0.1

0.2

Output source current: Ifg[mA]

Figure 16 Out high voltage (Ta=25°C)

0.3

0.4

0.5

0.6

0.7

1.4

1.2

1.0

0.8

0.6

0.4

7.0

6.0

5.0

4.0

3.0

95°C

–25°C

25°C

95°C

–25°C

25°C

Supply voltage: Vcc[V]

Figure 17 Lock protection det. Time

Supply voltage: Vcc[V]

Figure 18 Lock protection rel. time

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Application circuit example (Constant values are for reference)

VCC pull-up resistance

VCC

Protection of FG open-drain

TSD

UVLO

OSC

VREG

10kΩ

PWM

SIGNAL

OUTPUT

DUTY

CONTROL

SIG

PWM

0Ω to

BEMF

COMP.

CONTROL

LOGIC

TOSC

The capacitor set the start-

up frequency.

Start up synchronized time

is 200ms at 2200pF

COM

VCC

TOSC

GND

So bypass capacitor,

arrangement near to VCC

terminal as much as

possible.

COMP.

VCS

2200pF

＋

PRE-

DRIVER

1uF

Measure against back BEMF

4.7uF

VCC

10kΩ

－

Noise measures

of substrate.

Noise measures

of substrate.

Noise measures

of substrate.

Figure 19. PWM Controllable 4 Wires Type (FG) Motor Application Circuit

・

The wiring patterns from the VCC terminal and GND terminal to the bypass capacitor must be routed as short as

possible. Because full PMW driving becomes the factor of the noise in BD67173NUX , the value of bypass capacitor

set to 4.7uF,2.2uF or 1uF. With respect to the wiring pattern, It has been confirmed that 0.03Ω for 4.7uF,2.2uF or 1uF

at the bypass capacitor doesn’t cause problems under our operation environment. This can be used as a reference

value to check for validity.

・

When it is noisy, Capacitance should be inserted between U-COM, V-COM, and W-COM.

Connect a capacitor between TOSC terminal and GND. Start-up frequency can be adjusted.

When TOSC terminal is opened and is connected to GND, start –up operation becomes unstable.

Substrate design note

a) IC power, motor outputs, and motor ground lines are made as fat as possible.

b) IC ground (signal ground) line arranged near to (–) land.

c) The bypass capacitor is arrangement near to VCC terminal.

d) When substrates of outputs are noisy, add capacitor as needed.

e) When back EMF is large, add zener diode as needed.

TOSC = pull-down

Connect to capacitor

TOSC = Open

TOSC

Figure 20. TOSC Function Setting

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Description of Function Operation

1. State Transition

VCC ON

Stand-by mode

@ PWM = input L

level

Rotation judgment50ms

Forward rotation logic

9timesdetect

Others

Each State

Forward

rotation

Stop

Synchronized Start

Sequence (120°drive)

Forward rotation logic

detect(9times)

Forward rotation logic

No detect ( between 1sec)

Normal driving (150°drive)

Lessthan 100rpm

More than 100000rpm

OutputOFF: 5s

Lock mode (Output OFF)

Figure 21. Flow chart

VCC ON -> Normal driving

Normal driving -> Lock mode -> Re-Start

CH1:FG

(10V/div)

CH2:U

(10V/div)

CH2:U

(5V/div)

CH3:V

(5V/div)

CH3:V

(5V/div)

CH4:W

(5V/div)

2s/div

100ms/div

Normal driving -> Lock mode

LOCK -> TON -> LOCK

TOFF -> Re-Start

CH1:FG

(10V/div)

CH2:U

(5V/div)

CH3:V

(5V/div)

LOCK

CH4:W

Normal driving

Motor LOCK

TON

Re-Start

(5V/div)

by hand

50ms/div

200ms/div

50ms/div

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2. Sensorless Drive

BD67173NUX is a motor driver IC for driving a three-phase brushless DC motor without a hall sensor. Detecting

a rotor location firstly at startup, an appropriate logic for the rotation direction is obtained using this information

and given to each phase to rotate the motor. Then, the rotation of the motor induces electromotive

voltage in each phase wiring and the logic based on the induced electromotive voltage is applied to the each

phase to continue rotating.

2.1 Motor Drive Output Voltage and Current U, V, and W

The timing charts of the output signals from the U, V and W output is shown (Figure 6.).

The detection of the BEMF voltage does with output U, V, and W (for rise and fall zero-cross) and detects the position of

the motor rotation.

[deg]

120

180

240

300

360

120

180

240

300

360

Position

Output

Voltage

Output

Current

Output

Current

Soft switching of PMW operation

Figure 22. Motor Drive Output Timing Chart

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2.2 BEMF Detection Driving Mechanism (Synchronized Start-up Mechanism)

BD67173NUX’s start mechanism is synchronized start-up mechanism. BD67173NUX as BEMF detection driving starts

by set output logic and monitors BEMF voltage of motor. Driving mechanism changes to BEMF detection driving after

detect BEMF signal. When BEMF signal isn’t detected for constant time at start-up, synchronized start-up mechanism

outputs output logic forcibly by using standard synchronized signal (sync signal) and makes motor forward drive. This

assistance of motor start-up as constant cycle is synchronized driving mechanism. Synchronized frequency is standard

synchronized signal. Figure 23, the timing chart (outline) is shown. “Motor start-up frequency setting” generation of

synchronized period is shown.

Start

BEMF detect start

Output voltage U

Output voltage V

Output voltage W

(Internal BEMF signal)

FG signal

Sync period

120° drive

Normal drive (150°drive)

BEMF detect 9times

⇒start sequence→ 150°drive

Figure 23. Synchronized Start-up Output Timing Chart

PWM=100% / TOSC=2200pF / FR=Open

CH1:FG

BEMF Detect

Start

(10V/div)

CH2:U

(5V/div)

CH3:V

(5V/div)

CH4:W

(5V/div)

100ms/div

1. VCC ON

2. Rotation

Judgment

4. Normal

Drive

3. Synchronized

Start Sequence

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Number of BEMF detection (from start-up)

Until BEMF detection

9 times successively

after BEMF detection

9 times successively

Start-up

Synchronized time

8000 × TOSＣ

PWM duty

PWM = fixed 100%

120°drive

PWM = same as external PWM duty

Electrify angle

150°drive

*Disagree with above timing chart

Table 1. Setting of Electrify Angle and Output Duty While Start-up

2.3 Synchronized Start-up Frequency Setting (TOSC capacitor)

The TOSC terminal starts a self-oscillation by connecting a capacitor between the TOSC terminal and GND. It becomes

a start-up frequency, and synchronized time. Synchronized time can be adjusted by changing external capacitor. When

the capacitor value is small, synchronized time becomes short. It is necessary to choose the best capacitor value for

optimum start-up operation. For example external capacitor is 2200pF, synchronized time is 200ms (typ.). 2200pF is

recommended for setting value at first. Relationship between external capacitor and synchronized time is shown in below.

When connect TOSC terminal to GND, synchronized time is fixed and synchronized time is same as 2200pF.

Diagram of Relationship between TOSC terminal and synchronized time

TOSC signal

Sync signal

TOSC

oscillator

Divider

(X8000)

C_TOSC

Synchronized time = 8000 x TOSC period

Charge current ：100uA

discharge current ：100uA

Example

C_TOSC= 2200pF

TOSC frequency = 40kHz (typ.). TOSC period = 25usec.

Synchronized time = 200msec.

External capacitor

Synchronized time

300ms

3300pF

Equation

2200pF

(Recommendation)

200ms

90ms

C_TOSCV_TSOC

Tosc  2x

1000pF

Ctosc: Tosc terminal capacitor value.

Vtosc: Tosc terminal Hi voltage – Lo voltage= 0.57V (typ.).

I: Tosc terminal charge and discharge current.

TOSC=1000pF

TOSC=2200pF or GND

TOSC=3300pF

CH1:FG

(10V/div)

CH2:U

(5V/div)

CH3:V

(5V/div)

CH4:W

(5V/div)

100ms/div

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*Setting of Appropriate Capacitor Value

Appropriate value of synchronized time is differ with characteristic and parameter of motor. Appropriate value decided by

start-up confirmation with various capacitor value. At first confirm start-up with 2200pF, next is

2400,2700,3000,3300pF･･･,and 2000,1800,1600,1500,1300pF･･･etc. Appropriate capacitor value is decided after

confirm maximum start-up NG value and minimum start-up NG value. For example, small BEMF voltage motor tends to

small capacitor value. Set capacitor value after confirm sufficiently.

* About the Final Decision that Considers Each Dispersion

Please consider this dispersion before decision of optimal value of capacitor by start-up confirmation. (Figure 24.)

It is necessary to think about the dispersion of ±25% from TOSC external capacitor (±10%)and IC characteristics.

Moreover, Lock ON detect time (page 5.) becomes a restriction of start-up confirmation. It is necessary to think about the

dispersion of TON (0.7s: min). If necessary, it is possible to provide the evaluation samples and boards for the TON

dispersion evaluation.

Start-up OK zone by each

Start-up evaluation

Selection of TOSC

Capacitor

1000pF

2200pF

Dispersion ≒750pF～1250pF

3300pF

Dispersion ≒1650pF～2750pF

Dispersion ≒2475pF～4125pF

*This dispersion value includes IC characteristics

Figure 24. The Final Decision that Considers Each Dispersion

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2.4 Motor Drive Output U, V, W and FG Output Signals

In Figure 25, the timing charts of the output signals from the U, V and W phases as well as the FG terminal is shown.

Assuming that a three-slot tetrode motor is used, two pulse outputs of FG are produced for one motor cycle. The three

phases are excited in the order of U, V and W phases.

STAGE

①

②

③

④

⑤

⑥

①

②

③

④

⑤

⑥

120

180

240

300

360

120

180

240

300

360

Position

[deg]

Output

voltage U

Output

voltage V

Output

voltage W

FG signal

Soft switching of PMW operation

Figure 25 Timing Chart of U, V, W and FG Output (FR = Hi or No Connect)

Motor output

Output pattern

Motor output U

Motor output V

Motor output W

①

②

③

④

⑤

⑥

Hi-Z

* About the output pattern, It changes in the flow of “1→2→3 ～ 6→1”.

H; High, L; Low, Hi-Z; High impedance

Table 2. Truth Table

PWM=100%

CH1:FG

(10V/div)

CH2:U

(5V/div)

CH3:V

(5V/div)

CH4:W

(5V/div)

2ms/div

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2.5 Variable speed operation

About Rotational speed, it changes by PWM terminal input DUTY of the output of the lower side and upper side.

(Upper and lower PWM control drive method Figure 26)

STAGE

①

②

③

④

⑤

⑥

①

②

③

④

⑤

⑥

Position

[deg]

120

180

240

300

360

120

180

240

300

360

Output

voltage U

Output

voltage V

Output

voltage W

Soft switching of PWM operation

PWM operation for external PWM control

Fig.26 Timing Chart of U, V and W Output (With PWM Control)

Motor output

Output pattern

Motor output U

Motor output V

Motor output W

①

②

③

④

⑤

⑥

PWM

Hi-Z

PWM

Hi-Z

PWM

Hi-Z

PWM

Hi-Z

PWM

Hi-Z

PWM

* About the output pattern, It changes in the flow of “1→2→3 ～ 6→1”.

H; High, L; Low, Hi-Z; High impedance

Table 3. Truth Table

PWM=50%

CH1:FG

(10V/div)

CH2:U

(5V/div)

CH3:V

(5V/div)

CH4:W

(5V/div)

2ms/div

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2.6 FG signal mask operation at start-up

FG signal is masked between synchronized start sequence and until 100ms at Normal driving.

State Transition

Synchronized

Start (120°drive)

Normal driving (150°drive)

Normal driving

After 100ms

Start

Until 100ms

FG Output

(pull up)

Hi-Z

(Hi)

Hi-Z

(Hi)

Hi-Z

(Hi)

FG signal

Table 4. Truth Table

PWM=100% / TOSC=2200pF / FG=10kohm pull up

CH1:FG

(10V/div)

FG=High

FG signal

CH2:U

(5V/div)

CH3:V

(5V/div)

CH4:W

(5V/div)

100ms

100ms/div

Synchronized Start

VCC ON

Sequence

Normal driving

3. Lock Protection Function (Automatic Re-Start)

3.1 At Start-up Lock Detect

To prevent passing a coil current on any phase when a motor is locked, it is provided with a function which can turn OFF

the output for a certain period of time and then automatically restore itself to the normal operation. During the motor

rotation, an appropriate logic based on the induced electromotive voltage can be continuously given to each phase, on

the other hand, when the motor is locked at no induced electromotive voltage is obtained. Utilizing this phenomenon to

take a protective against locking, when the induced electromotive voltage is not detected for a predetermined period of

time (TON: 1.0s), it is judged that the motor is locked and the output is turned OFF for a predetermined period of time

(TOFF: 5.0s).

Moreover, If Synchronized driving doesn't change into rotational speed monitor section between TON (1.0s) at start-up, it is

judged that the motor is locked.

PWM=100% / TOSC=2200pF

CH1:FG

TON=1.0s

(10V/div)

CH2:U

(5V/div)

CH3:V

(5V/div)

CH4:W

(5V/div)

Motor LOCK

by hand

200ms/div

VCC ON

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3.2 Normal Drive Lock Detect

When you stop motor in BD67173NUX normal driving, the motor settles to the high rotation speed.

Lock detect judgment of normal driving is set 2patterns (Table.4).

・Max Rotation Judgment: Motor Rotation Speed ≧ 100000rpm(typ.)

・Minimum Rotation Judgment : Motor Rotation speed ≦100rpm(typ.) ( or BEMF period ≧TOSC*8000 )

Typ

Worst

Max Rotation Judgement

Min Rotation Judgment

≧100000rpm

≦100rpm

≧60000rpm

≦133rpm

Table 5. Lock Judgment Table

Normal driving -> Lock mode -> Re-Start

CH1:FG

(10V/div)

CH2:U

(5V/div)

CH3:V

(5V/div)

CH4:W

(5V/div)

2s/div

Normal driving -> Lock mode

LOCK -> TON -> LOCK

TOFF -> Re-Start

CH1:FG

(10V/div)

CH2:U

(5V/div)

CH3:V

(5V/div)

LOCK

CH4:W

Normal driving

Motor LOCK

TON

Re-Start

(5V/div)

by hand

50ms/div

200ms/div

50ms/div

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4. Power Saving Function / Speed control by PWM input

The power saving function is controlled by an input logic of the PWM terminal.

4.1 Operate mode when the PWM terminal is High

PWM terminal is OPEN, PWM=100% operating mode, too. (Internal circuit is 360kΩpull up setting.)

4.2 Standby mode when the PWM terminal is Low for a time period of 1ms (typ.)

Input logic of the PWM terminal is set at Low and then the Standby mode becomes effective 1ms (typ.) (Figure 27). In the

Standby mode, the lock protection function is deactivated and the lock protection is not effective. Therefore, this device

can start up instantly even from the stop state when the input logic of the PWM terminal is set at High.

PWM

1ms

Powersaving

function

normal mode

standbyꢀmode

normal mode

OFF

Output

Lock protection

function

active

inactive

Figure 27. Power Saving Function

5. UVLO Function (Under Voltage Lock Out)

In the operation area under the guaranteed operating power supply voltage of 2.2V (typ.), the transistor

on the output can be turned OFF at a power supply voltage of 1.75V (typ.). A hysteresis width of 250mV is provided and

a normal operation can be performed at 1.95V (typ.). This function is installed to prevent unpredictable operations, such

as a large amount of current passing through the output, by means of intentionally turning OFF the output during an

operation at a very low power supply voltage which may cause an abnormal function in the internal circuit.

VCC input

UVLO

1.95V

1.75V

Output

0V to Sweep up

5V to Sweep down

OFF to ON

ON to OFF

Table 6. UVLO Judgment Table

6. Rotation Direction Select Function (FR select)

The FR select is Rotation direction select (Table .5).

FR input

High or Open

Low

Rotation

Forward

Reverse

Table 7. FR Select Table

7. Over Current Limit (Internal Current Detection Resistance)

A current passing through the motor coil can be detected on the internal current detection resistance to prohibit a current

flow large than a current limit value. The current limit value is determined by setting of the IC internal limit voltage 0.2V

(typ.) and the internal current detection resistance value (0.16Ω) using the following equation.

0.2V

内部のリミット電圧ꢀ(

)

Internal limit voltage (0.2V)

Current limit value (1.25A)

設定電流値（1.25A)ꢀ=

Internal current detection resistance(0.16Ω)

内部の検出抵抗ꢀ(0.16Ω )

The current limit is activated at above value.

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Power Dissipation

Permissible dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature).

IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The

temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and

consumable power is limited. Permissible dissipation is determined by the temperature allowed in IC chip (maximum

junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction

temperature is in general equal to the maximum value in the storage temperature range.

Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which

indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol

θja [C/W]. The temperature of IC inside the package can be estimated by this heat resistance. Below Figure shows the

model of heat resistance of the package.

Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the

equation below:

θja = (Tj－Ta) / P

[℃/W]

Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that

can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal

resistance θja.

Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,

wind velocity, etc even when the same package is used. Thermal derating curve indicates a reference value measured at

a specified condition. Below Figure shows a thermal derating curve. (Value when mounting FR4 glass epoxy board 74.2

[mm] x 74.2 [mm] x 1.6 [mm] (copper foil area below 3 [%]))

θja = (Tj-Ta) / P [℃/W]

Ambient temperature Ta [ºC]

Chip surface temperature Tj [ºC]]

Power consumption P[W]

Figure 28. Thermal resistance

＊1 Above Ta = 25ºC, derating by 4.64 mW/ºC

(When glass epoxy board (single layer) of 74.2 mm x 74.2 mm x 1.6 mm is mounted)

Figure 29. Thermal derating curve

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I/O equivalent circuit(s)

1) Power supply terminal,

and ground terminal

2) Output duty controllable

input terminal

3) Motor rotation direction

select input terminal

Vcc

VCC

190kΩ

360kΩ

10kΩ

PWM

10kΩ

GND

4) Start-up oscillation

control terminal

5) Speed pulse signal

output terminal

6) Motor coil midpoint

input terminal

VCC

1kΩ

COM

10Ω

1kΩ

TOSC

7) Motor output terminal

Vcc

51kΩ

30kΩ

0.16Ω

Figure 30. I/O equivalent circuits

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go

below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages

going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors

and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size

and copper area to prevent exceeding the Pd rating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

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BD67173NUX

Operational Notes – continued

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 31. Example of monolithic IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

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Operational Notes – continued

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

16. Disturbance light

In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due

to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip

from being exposed to light.

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Ordering Information

B D 6

N U X -

E 2

Part Number

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagrams

Part Number Marking

LOT Number

Part Number Marking

Package

Orderable Part Number

BD67173NUX

VSON010X3030 BD67173NUX-E2

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Physical Dimension, Tape and Reel Information

Package Name

VSON010X3030

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.001

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.001

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD67173NUX-E2 [ROHM]

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