BD82065FVJ [ROHM]
Silicon Monolithic IC; 硅单片IC
| 型号： | BD82065FVJ |
| 厂家： | 
ROHM |
| 描述： | Silicon Monolithic IC |
| 文件： | 总5页 (文件大小：156K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Structure
Products
Silicon Monolithic IC
High side switch IC
BD82065FVJ
Type
Features
Low on resistance 70mΩ MOSFET Switch
1A Continuous current load
Active “High” control logic
Soft start circuit
Over current detection
Thermal shutdown
Under voltage lockout
Open drain error flag output
Reverse-current protection when power switch off
TSSOP-B8J Package
ESD protection
◇Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
VIN
Rating
-0.3 ~ 6.0
-0.3 ~ 6.0
-0.3 ~ 6.0
~ 5
Unit
V
Supply voltage
Enable voltage
VEN
V
/OC voltage
V/OC
IS/OC
VOUT
TSTG
PD
V
/OC sink current
OUT voltage
mA
V
-0.3 ~ 6.0
-55 ~ 150
587.5 *1
Storage temperature
°C
mW
Power dissipation
*1 Mounted on 70mm*70mm*1.6mm glass-epoxy PCB. Derating : 4.7mW/°C above Ta=25°C.
This product is not designed for protection against radioactive rays.
＊
◇Operating conditions
Parameter
Symbol
VIN
Min.
2.7
Typ.
Max.
5.5
85
Unit
V
Operating voltage
-
-
-
Operating temperature
Continuous output current
TOPR
IOUT
-40
0.0
°C
A
1.0
REV. A
2/4
◇Electric characteristics
Unless otherwise specified VIN = 5.0V, Ta = 25°C
Parameter
Current consumption
Operating Current
Standby Current
I/O
Symbol
Min.
Typ.
Max.
Unit
Condition
IDD
-
-
110
160
1
μA
μA
VEN = 5V, VOUT = Open
VEN = 0V, VOUT = Open
ISTB
0.01
VEN
VEN
IEN
2.0
-
-
-
V
V
High input
EN input voltage
-
-1.0
-
0.8
1.0
0.5
1
Low input
EN input current
0.01
-
μA
V
VEN = 0V or 5V
I/OC = 0.5mA
V/OC = 5V
/OC output LOW voltage
/OC output leak current
/OC delay time
V/OC
IL/OC
T/OC
-
0.01
15
μA
ms
10
20
Power switch
ON resistance
RON
ITH
-
70
110
3.0
mΩ
IOUT = 500mA
Current Limit Threshold
1.5
2.4
A
VOUT = 0V, CL = 47μF
RMS
Short-circuit current
ISC
1.1
1.5
2.1
A
Output rise time
Output rise delay time
Output fall time
TON1
TON2
TOFF1
TOFF2
ILSW
-
-
-
-
-
-
0.8
1.1
5
10
20
ms
ms
μs
RL = 10Ω
RL = 10Ω
20
RL = 10Ω
Output fall delay time
Switch leak current
Reverse leak current
UVLO
10
-
40
μs
RL = 10Ω
1.0
1.0
μA
μA
VEN = 0V, VOUT = 0V
VOUT = 5.5V, VIN = 0V
ILREV
-
VTUVH
VTUVL
2.1
2.0
2.3
2.2
2.5
2.4
V
V
Increasing VIN
Decreasing VIN
UVLO
Threshold
◇Measurement circuit
◇Timing chart at output rise / fall time
TOFF1
TON1
VIN
A
VOUT
90%
90%
10%
TOFF2
10%
IN
OUT
A
RL
CL
IOUT
GND
TON2
VEN
EN
VEN
/OC
50%
50%
REV. A
3/4
◇Block diagram
GND
IN
OUT
OUT
OUT
/OC
Charge
Pump
UVLO
OCD
IN
Gate
Logic
EN
TSD
◇Pin description
Pin No.
Pin Name
Function
1
2,3
4
GND
IN
Ground
Power supply input. Input terminal to the power switch and power
supply input terminal of the internal circuit.
Enable input.
EN
Power switch on at High level.
Over current output.
5
/OC
Low level at over current, over temperature detection.
Open drain output.
6,7,8
OUT
Power switch output.
◇Package
D 8 2
0 6 5
Lot No.
TSSOP-B8J
(Unit : mm)
REV. A
4/4
●Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention
to the interference by common impedance of layout pattern when there are plural power supplies and GND lines.
Especially, when there are GND pattern for small signal and GND pattern for large current included the external
circuits, separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the
power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the
characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous
mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between
terminals or between the terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of
the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then
breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to
apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In
addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power
supply voltage or within the guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
When junction temperatures become 170°C (typ) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
REV. A
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
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More detail product informations and catalogs are available, please contact us.
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© 2009 ROHM Co., Ltd. All rights reserved.
R0039
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