BD8316GWL [ROHM]
BD8316GWL是搭载了升压、反转2个信道的二极管整流型电流模式控制的开关稳压器。内置SW用FET和带软启动功能的升压负载SW，可减少外接部件。此外，各信道还可独立控制，因此可轻松构建非动作信道的低功耗序列。;
| 型号： | BD8316GWL |
| 厂家： | 
ROHM |
| 描述： | BD8316GWL是搭载了升压、反转2个信道的二极管整流型电流模式控制的开关稳压器。内置SW用FET和带软启动功能的升压负载SW，可减少外接部件。此外，各信道还可独立控制，因此可轻松构建非动作信道的低功耗序列。 开关 软启动 二极管 稳压器 |
| 文件： | 总23页 (文件大小：1314K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Single-chip Type with Built-in FET Switching Regulator Series
Step-up and inverted
2-channel DC/DC converter
with Built-in Power MOSFET
BD8316GWL
●Description
The BD8316GWL is step-up and inverted 2-channel
●Important Specifications
■
■
■
■
■
■
■
■
Input voltage range
Output boost voltage
Output inverted voltage
Maximum current
Operating frequency
Nch FET ON resistance
Pch FET ON resistance
Standby current
2.5～5.5 [V]
Input voltage(max)~18 [V]
-9.0～-1.0 [V]
switching regulator with integrated internal high-side
MOSFET. With wide input range from 2.5~5.5V ,it
suitable for application of portable item. In addition,The
small package design is ideal for miniaturizing the
power supply.
1[A](max)
1.6 [MHz] (typ.)
230[mΩ]
230[mΩ]
1[μA](max)
●Features
Wide input voltage range of 2.5V to 5.5 V
■
■
■
●Package
UCSP50L1 (WLCSP)
1.8mm×1.5mm×0.5mm, 4×3glid,11pin,
High frequency operation 1.6MHz
Incorporates Nch FET of 230mΩ/22V and Pch
Pow FET of 230mΩ/15V
■
■
■
■
Incorporates Soft Start (4.2msec(typ))and hight
side switch of boost channel
Independent ON/OFF signal(STB). Built-in
discharge SW for step up channel
Small package UCSP50L1( 1.8mm×1.5mm, 4×
3 grid, 11pin, WLCSP)
Circuits protection OCP,SCP,UVLO,TSD
●Application
LCD battery
■
■
CCD battery
■
Portable items that are represented by mobile phone
and DSC
●Typical Application Input: 2.5 to 5.5 V, ch1 output: 5.6 V / 200m A, ch2 output:5.6V/200mA
0.1uF/10V
10kΩ
56kΩ
Vout1: -5.6V/200mA
4.7uF/10V
4.7uH
VREF
VDD
NON1
LX1
Vin→
2.5～5.5V
4.7uF/10V
DIS1
EN CH1→
EN CH２→
STB1
STB2
HS2L
LX2
4.7uH
Vout2: 5.6V/200mA
GND
INV2
4.7uF/10V
180kΩ
30kΩ
Fig.1 Application schematic
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●Pin Description
C
B
A
3
4
1
2
Fig.2 Pin assignment (Bottom view)
Pin No.
A-1
Pin Name
Function
VDD
HS2L
LX2
Power input voltage pin. Connect to input ceramic capacitor bigger than 0.47uF.
Load SW output pin .Connect to inductor
A-2
A-3
Boost channel drain Nch Power MOS. Connect to diode and inductor.
Ground connection
A-4
GND
LX1
B-1
PchPowerMOS drain of boost channel. Connect to diode and inductor
Enable pin of inverted channel.
B-3
B-4
C-1
C-2
STB1
STB2
DIS1
ON threshold set to 1.5V. Integrated pull down resistance (800kΩ(typ))
Enable pin of boost channel.
ON threshold set to 1.5V. Integrated pull down resistance (800kΩ(typ))
Discharge SW of inverted channel. Connect to output of inverted channel.
STB1 disable , Output pin voltage is discharged by 100Ω(typ)
Reference voltage of inverted channel.
VREF
1.0V(typ) is included in error amp offset
Feedback pin of inverted channel. Connect to feedback resistance and set output voltage.
The method of output voltage setting is P16/20.
C-3
C-4
NON1
INV2
When inverted cannel is disable , the pin is discharged by integrated resistance (150Ω(typ))
Feedback pin of boost channel. Connect to feedback resistance and set output voltage.
The method of output voltage setting is P16/20.
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●Block Diagram
Fig.3 Block diagram
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●Function blacks description
1.Voltage Reference
This block generates ERROR AMP reference voltage.
The reference voltage of CH1 is 1.0V, The reference voltage of CH2 is 0.8V.
2.UVLO
Circuit for preventing malfunction at low voltage input.
This circuit prevents malfunction at the start of DC/DC converter and low input voltage .The function monitors VCC pin
voltage and if VCC voltage is lower than 2.2V, function turns off all output of FETs and DC/DC converter , and reset the
timer latch of the internal SCP circuit and soft-start circuit.
3.SCP
Short-circuit protection function based on timer latch system.
When the voltage of NON1 pin is higher than 0V or INV2 pin voltage is lower than 0.8V, the internal SCP circuit starts
counting.
SCP circuit detects output of Error AMP. Since internal Error AMP has highly gain as high as 80dB or more, if input
erroramp voltage cross reference voltage ,the output voltage of Error AMP goes high and detects SCP .
The internal counter is in synch with OSC, the latch circuit activates after the counter counts oscillations to turn off DC/DC
converter output (about 40.9 msec ).
To reset the latch circuit, turn off the STB pin once. Then, turn it on again or turn on the power supply voltage again.
4.OSC
This function determine oscillation frequency . Oscillation frequency of DC/DC converter set at 1.6MHz.
5.ERROR AMP
Error amplifier watch output voltage and output PWM control signals.
The internal reference voltage for Error AMP of ch1 is set at 0V.
The internal reference voltage for Error AMP of ch2 is set at 0.8V.
6.Timing Control
Voltage-pulse width converter for controlling output voltage corresponding to input voltage.
Comparing the internal SLOPE waveform with the ERROR AMP output voltage, PWM COMP controls the pulse width
and outputs to the driver.
Max Duties of ch1 and ch2 are set at 86%.
7.SOFT START
Circuit for preventing in-rush current at the start of DC/DC converter by bringing the output voltage.
Soft-start time is in synch with the internal OSC, and the output voltage of the DC/DC converter reaches the set voltage
after about 4.2m sec.
8.OCP
Circuit for preventing malfunction at over current.
Under input current over electrical characteristics , it supply minimum duty to DC/DC converter and IC stop safety by SCP
detected.
9.TSD
Circuit for preventing malfunction at high Temperature .
When it detects an abnormal temperature exceeding Maximum Junction Temperature (Tj=150℃), it turns OFF all Output
FET, and turns OFF DC/DC Comparator Output.
10. ON/OFF
Voltage applied on STB pin to control ON/OFF channel of each channel.
Turned ON when a voltage of 1.5 V or higher is applied and turned OFF when the terminal is open or 0 V is applied.
Incorporates approximately 800 kΩ pull-down resistance.
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○Absolute maximum ratings(T=25℃)
Parameter
Symbol
VDD
Rating
－0.3～7
－0.3～7
1.0
Unit
V
Maximum power supply voltage
STB1,STB2
IHS2L
ILX1
V
A
Maximum input current
1.0
A
ILX2
1.0
A
VDD-LX1
LX2
15
V
22
V
Maximum input voltage
NON1
INV2
-0.3～7
-0.3～7
-9～0.3
730
V
V
DIS1
V
Power dissipation
Operating temperature range
Storage temperature range
Junction temperature
Pd
mW
℃
℃
℃
Topr
－35～+85
－55～+150
+150
Tstg
Tjmax
((*1) When mounted on 74.2×74.2×1.6mm and operated over 25℃ Pd reduces by 4.96mW/℃.
○Recommended operating conditions
Standard value
Parameter
Symbol
Units
MIN
2.5
TYP
－
－
-
MAX
5.5
Power supply voltage
Inverted output voltage
Step up output voltage
VDD
VO1
VO2
V
V
V
-9.0
VCC
-1.0
18
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○Electrical characteristics（Ta=25℃, VDD=3.6V）
Standard value
TYP
Parameter
Symbol
Unit
Conditions
MIN
MAX
【Low voltage input malfunction preventing circuit】
Detect threshold voltage
Hysteresis voltage
【Oscillator】
VUV
-
2.2
2.35
150
V
VDD sweep down
ΔVUVhy
50
100
mV
Oscillating frequency
LX1 Max Duty
Fosc
1.44
82
1.6
86
86
1.76
90
MHz
Dmax1
Dmax2
%
%
LX2 Max Duty
82
90
【Error AMP, VREF】
NON1 feedback resistance
20kΩ, 120kΩ
CH1output voltage
VO1
-6.072
-6.000
-5.928
V
VREF line regulation
INV threshold voltage
NON1 input bias current
INV2 input bias current
CH1 Soft start time
CH2 Soft start time
【Internal FET】
DVLi
VINV
INON1
IINV2
TSS1
TSS2
-
0.792
-50
-50
3.7
4.0
0.800
0
12.5
0.808
50
mV
V
VDD=2.5～5.5V
nA
nA
ms
ms
STB1=3.6V, NON1=-0.2V
INV2=1.2V
0
50
4.2
4.2
4.7
3.7
4.7
LX1 PMOS ON resistance
DIS1discharge resistance
NON1 discharge resistance
LX2HighsideSW ON resistance
LX2 NMOS ON resistance
LX1 OCP threshold
LX2 OCP threshold
HS2L leak current
RON1p
RDIS1
-
-
300
100
150
150
300
2.4
2.4
0
480
160
240
240
480
-
mΩ
Ω
VSTB1=0V, IDIS1=-1mA
VSTB1=0V, INON1=1mA
RNON1
RON2p
RON2n
Iocp1
-
Ω
-
mΩ
mΩ
A
-
1.2
1.2
-1
-1
-1
Iocp2
-
A
IleakH1
I leak1
I leak2
1
uA
uA
uA
LX1 leak current
0
1
LX2 leak current
0
1
【STB】
Active
VSTBH
VSTBL
RSTB1
1.5
-0.3
500
-
-
5.5
0.3
V
V
STB pin
Control voltage
Non-active
STB pin pull down resistance
【Circuit current】
800
1400
kΩ
Standby current
ISTB
IDD
-
-
-
1
uA
uA
STB1=STB2=3.6V
Circuit current of operation VDD
450
650
NON1=-0.2V, INV2=1.2V
◎This product is not designed for normal operation within a radioactive environment.
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●Reference data
(unless otherwise specified Ta=25℃, VCC=3.6V)
0.850
0.840
0.830
0.820
0.810
0.800
0.790
0.780
0.770
0.760
0.750
1.030
1.020
1.010
VCC=2.5V
VCC=5.5V
VCC=3.6V
1.000
0.990
0.980
0.970
VCC=2.5V
VCC=3.6V
VCC=5.5V
TEMPERATURE[℃]
50 100
TEMPERATURE[℃]
50 100
-50
0
150
-50
0
150
Fig.4 VREF vs temp
Fig.5 INV2 threshold vs temp
1.700
2.400
2.300
2.200
2.100
2.000
VCC=5.5V
VCC=3.6V
1.600
1.500
1.400
1.300
Detect threshold
Reset threshold
VCC=2.5V
0
2
4
6
8
-50
0
50
100
150
VCC[V]
TEMPERATURE[℃]
Fig.6 Oscillation frequency vs temp
Fig.7 UVLO detect threshold
Vs temp
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1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.4
1.2
1.0
VCC=7.0V
VCC=7.0V
VCC=2.5V
VCC=5.5V
VCC=3.6V
0.8
0.6
0.4
0.2
0.0
VCC=2.5V
VCC=5.5V
VCC=3.6V
-50
0
50
100
150
-50
0
50
100
150
TEMPERATURE[℃]
TEMPERATURE[℃]
Fig.8 STB ON threshold voltage
vs temp
Fig.9 STB OFF threshold voltage
vs temp
500
450
400
350
300
250
200
150
100
50
500
450
400
350
300
250
200
150
100
50
Ta=150deg
Ta=25deg
Ta=-60deg
Ta=150deg
Ta=25deg
Ta=-60deg
0
0
0
2
4
6
8
0
2
4
6
8
VCC[V]
VCC[V]
Fig.11 LX2 high side FET ON
registance vs VCC
Fig.10 LX1 high side FET ON
registance vs VCC
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300
250
200
150
100
50
500
450
400
350
300
250
200
150
100
50
Ta=150deg
Ta=25deg
Ta=-60deg
Ta=150deg
Ta=25deg
Ta=-60deg
0
0
0
2
4
6
8
0
2
4
6
8
VCC[V]
VCC[V]
Fig.13 DIS1 discharge SW ON
registance vs VCC
Fig.12 HS2L high side FET ON
registance vs VCC
1,000
900
800
700
600
500
400
300
200
100
0
300
250
200
150
100
50
Ta=25deg
Ta=150deg
Ta=25deg
Ta=-60deg
0
0
1
2
3
4
5
0
2
4
6
8
VCC[V]
VCC[V]
Fig.15 VCC input current vs VCC
(STB ON)
Fig.14 NON1 discharge SW ON
registance vs VCC
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20
15
10
5
VCC=5.5V
VCC=3.6V
VCC=2.5V
0
-60 -40 -20
0
20 40 60 80 100 120 140
TEMPURTURE[℃]
Fig.16 VCC input current vs Temp
(STB OFF)
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●Example of Application1 Input: 2.5 to 5.5 V, ch1 output: 5.6 V / 200m A, ch2 output:5.6V/200mA
4.7μF/10V
(GRM21BB31A475K)
0.1μF/10V
(GRM155B11A104K)
56kΩ
10kΩ
180kΩ
30kΩ
30V/1A
(RSX101VA-30)
4.7μH
(NR3015T4R7M)
4.7μH
(NR3015T4R7M)
30V/1A
1μF/10V
(RSX101VA-30)
4.7μF/10V
(GRM188B11A105K)
(GRM21BB31A475K)
Fig.17 Example of Application1
●Example of Application2
Input: :2.5~5.5 V
ch1 output: -9V / 30mA
ch2output :
18V/ 30mA
430kΩ
20kΩ
180kΩ
4.7μF/25V
20kΩ
0.1μF/10V
30V/1A
4.7μH
1μF/10V
30V/1A
4.7μH
4.7μF/16V
Fig.18 Example of Application2
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●Example of Board Layout
ROHM SMD Evaluation Board
Fig.19 Assembly Layer
Fig.20 Bottom Layer
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●Typical Performance Characteristic
(Unless otherwise specified, Ta = 25°C, VCC = 3.6V)
(Example of application 1)
100
90
80
70
60
50
40
30
20
10
0
100
90
Vin=3.6V
80
70
Vin=2.5V
60
Vin=2.5V
50
Vin=4.5V
Vin=3.6V
40
30
Vin=4.5V
20
10
0
1
10
100
1000
1
10
100
1000
Output Current [mA]
Output Current[mA]
Fig.21 CH1 Power conversion
efficiency vs output current
Fig.22 CH2 Power conversion
efficiency vs output current
‐5.400
‐5.450
‐5.500
‐5.550
‐5.600
‐5.650
‐5.700
‐5.750
‐5.800
5.800
5.750
5.700
5.650
5.600
5.550
5.500
5.450
5.400
Vin=2.5V
Vin=2.5V
Vin=4.5V
Vin=3.6V
Vin=4.5V
Vin=3.6V
0
50
100
150
200
0
50
100
150
200
Output Current [A]
Output Current [A]
Fig.23 CH1 Output voltage
vs Output Current
Fig.24 CH2 Output voltage
vs Output Current
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‐5.4
‐5.45
‐5.5
5.8
5.75
5.7
‐5.55
‐5.6
5.65
5.6
‐5.65
‐5.7
Io=10mA
5.55
5.5
Io=10mA
‐5.75
5.45
5.4
‐5.8
2.5
3.5
4.5
5.5
2.5
3.5
4.5
5.5
Input Voltage[V]
Input Voltage[V]
Fig.25 CH1 Output voltage
vs Input voltage
Fig.26 CH2 Output voltage
vs Input voltage
5msec/div
5msec/div
Vo1=100mV/div
Io=100mA/div
Vo2=100mV/div
Io=100mA/div
Fig.27 CH1 Output current response
Fig.28 CH2 Output current response
(output current : 10mA ⇔ 100mA)
(output current : 10mA ⇔ 100mA)
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1msec/div
1msec/div
STB1=2V/div
Vo1=2V/div
STB=2V/div
Vo2=2V/div
Fig.30 CH2 Soft start waveform
Fig.29 CH1 Soft start waveform
500usec/div
STB1=2V/div
Vo1=2V/div
Fig.31 CH1 Discharge waveform [500usec/div]
(STB1:High → Low)
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●Selection of Parts for Applications
(1)Output inductor
A shielded inductor that satisfies the current rating (current value, Ipeak as shown in the drawing below) and has a low
DCR (direct current resistance component) is recommended.
Inductor values affect output ripple current greatly.
Ripple current can be reduced as the inductor L value becomes larger and the
switching frequency becomes higher as the equations shown below.
ΔIL
Vin −Vout +Vf
Vin × (−Vout +Vf )
1
2
I peak
=
=
× Iout
+
×
ꢀ
(Inverted channel)
Vin
L × f × (Vin −Vout +Vf )
Fig. 32 Ripple current
Iout ×Vout
Vin ×η
Vin × (Vout −Vin )
L × f ×Vout
1
2
I peak
+
×
ꢀ
(Boost channel)
η: Efficiency(<0.92), f: Switching frequency(1.6MHz), L: inductance,
The second terms of equations above are ripple current of the inductor(⊿IL of Fig.32) which should be
set at about 20 to 50% of the maximum output current.
＊Current over the inductor rating flowing in the inductor brings the inductor into magnetic saturation, which may lead to
lower efficiency or output bad oscillation. Select an inductor with an adequate margin so that the peak current does not
exceed the rated current of the inductor.
(2) Output capacitor
CH1
The reference voltage of CH1 is 1.0V and the internal reference voltage of the ERROR AMP is 0 V. Output voltage
should be obtained by referring to Equation (3) of Fig.33.
VREF
1.0 V
ERROR AMP
R1B
R1A
R1B
Vout = −
ꢀ・・・ꢀꢀ(3)
NON1
R1A
VOUT
Fig.33 CH1output setting
CH2
The internal reference voltage of the ERROR AMP is 0.8 V. Output voltage should be obtained by referring to Equation
(4) of Fig.34.
VOUT
R2A
INV2
(R2A + R2B)
Vout
=
× 0.8ꢀ・・・ꢀꢀ(4)
R2B
R2B
Inside reference voltage
0.8V
Fig.34 CH2 output setting
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(3) Output capacitor
A ceramic capacitor with low ESR is recommended for output in order to reduce output ripple.
There must be an adequate margin between the maximum rating and output voltage of the capacitor, taking the DC bias
property into consideration.
Output ripple voltage when ceramic capacitor is used is obtained by the following equation.
1
Vpp=⊿IL×
＋
⊿IL×RESR [V]
2π×f×Co
Co is set within the range of 1～20uF.
Setting must be performed so that output ripple is within the allowable ripple voltage.
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●I/O Equivalence Circuit
VREF
NON1,INV2
VCC
VCC
VCC
VCC
VREF
NON1,INV2
STB1,STB2
VCC,LX1,DIS1,GND
VCC
VCC
LX1
STB1,STB2
GND
DIS1
HS2L
LX2
VCC
VCC
LX2
HS2L
Fig.35 I/O Equivalence Circuit
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○Operation Notes
１.) Absolute maximum ratings
This product is produced with strict quality control. However, the IC may be destroyed if operated beyond its absolute
maximum ratings. If the device is destroyed by exceeding the recommended maximum ratings, the failure mode will be difficult
to determine. (E.g. short mode, open mode) Therefore, physical protection counter-measures (like fuse) should be implemented
when operating conditions beyond the absolute maximum ratings anticipated.
２.) GND potential
Make sure GND is connected at lowest potential.
３.) Setting of heat
Make sure that power dissipation does not exceed maximum ratings.
４.) Pin short and mistake fitting
Avoid placing the IC near hot part of the PCB. This may cause damage to IC. Also make sure that the output-to-output and output
to GND condition will not happen because this may damage the IC.
５.) Actions in strong magnetic field
Exposing the IC within a strong magnetic field area may cause malfunction.
６.) Mutual impedance
Use short and wide wiring tracks for the main supply and ground to keep the mutual impedance as small as possible. Use inductor
and capacitor network to keep the ripple voltage minimum.
７.) Thermal shutdown circuit (TSD circuit)
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only
to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed.
８.)Rush current at the time of power supply injection.
An IC which has plural power supplies, or CMOS IC could have momentaly rush current at the time of power supply injection.
Because there exists inside logic uncertainty state. Please take care about power supply coupling capacity and width of power
Supply and GND pattern wiring.
９.)IC Terminal Input
This IC is a monolithic IC that has a P- board and P+ isolation for the purpose of keeping distance between elements. A P-N junction
is formed between the P-layer and the N-layer of each element, and various types of parasitic elements are then formed.
For example, an application where a resistor and a transistor are connected to a terminal (shown in Fig.36):
○When GND > (terminal A) at the resistor and GND > (terminal B) at the transistor (NPN), the P-N junction operates as
a parasitic diode.
○When GND > (terminal B) at the transistor (NPN), a parasitic NPN transistor operates as a result of the NHayers of other
elements in the proximity of the aforementioned parasitic diode.
Parasitic elements are structurally inevitable in the IC due to electric potential relationships. The operation of parasitic elements
Induces the interference of circuit operations, causing malfunctions and possibly the destruction of the IC. Please be careful not to
use the IC in a way that would cause parasitic elements to operate. For example, by applying a voltage that is lower than the
GND (P-board) to the input terminal.
Transistor (NPN)
Resistor
B
E
C
（Terminal A）
（Terminal B）
GND
（Terminal A）
N
P
P＋
P＋
P＋
P＋
P
N
Parasitic element
N
N
N
N
Ｎ
P-board
P-board
GND
Parasitic
element
GND
Parasitic
element
Fig.36 Simplified structure of a Bipolar IC
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●Ordering part number
B
D
8
3
1
6
G W L
-
E2
Part No.
Part No.
Package
Packaging and forming specification
E2: Embossed tape and reel
GWL: USCP50L1
●External information
1PIN MARK
Lot No.
8316
1.8±0.05
UCSP50L1
(BD8316GWL)
<Tape and Reel information>
1PIN MARK
Tape
Embossed carrier tape
3000pcs
Quantity
E2
Direction
of feed
1.8 0.05
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
S
0.08
S
φ
11- 0.2 0.05
A
0.05
A B
φ
(
B
C
B
A
0.15)INDEX POST
1
2
3
4
Direction of feed
1pin
0.3 0.05
P=0.4×3
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
∗
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
Rev.002
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
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