BD9107FVM-E2 [ROHM]

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型号：	BD9107FVM-E2
厂家：	ROHM
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Synchronous Buck Converter

Integrated FET

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

●General Description

●Key Specifications

 Input voltage range

BD9120HFN:

ROHM’s high efficiency step-down switching regulators

(BD9106FVM,BD9107FVM,BD9109FVM,BD9110NV,B

D9120HFN) are the power supply designed to produce

a low voltage including 1 volts from 5/3.3 volts power

supply line. Offers high efficiency with our original pulse

skip control technology and synchronous rectifier.

Employs a current mode control system to provide

faster transient response to sudden change in load.

2.7V to 4.5V

4.0V to 5.5V

4.5V to 5.5V

BD9106FVM,BD9107FVM:

BD9109FVM,BD9110NV:

 Output voltage range

BD9109FVM:

3.30V ± 2%

1.0V to 1.5V

1.0V to 1.8V

1.0V to 2.5V

BD9120HFN:

BD9107FVM:

BD9106FVM,BD9110NV:

 Output current

BD9106FVM, BD9109FVM,

BD9120HFN:

BD9107FVM:

BD9110NV:

 Switching frequency:

 FET ON resistance

●Features

 Offers fast transient response with current mode

PWM control system.

0.8A(Max.)

1.2A(Max.)

2.0A(Max.)

1MHz(Typ.)

 Offers highly efficiency for all load range with

synchronous rectifier (Nch/Pch FET)

and SLLM^TM(Simple Light Load Mode)

Incorporates soft-start function.

 Incorporates thermal protection and ULVO

functions.

 Incorporates short-current protection circuit with

time delay function.

 Incorporates shutdown function

Pch(Typ.) / Nch(Typ.)

BD9110NV:

200mΩ

350mΩ

150mΩ

250mΩ

BD9106FVM,BD9107FVM:

BD9120HFN,BD9109FVM:

 Standby current:

0μA(Typ.)

 Operating temperature range

●Application

BD9110NV:

BD9120HFN,BD9106FVM:

BD9107FVM,BD9109FVM:

-25℃ to +105℃

-25℃ to +85℃

Power supply for LSI including DSP, Micro computer

and ASIC

●Packages

HSON8

(Typ.)

(Max.)

2.90mm x 3.00mm x 0.60mm

2.90mm x 4.00mm x 0.90mm

5.00mm x 6.00mm x 1.00mm

MSOP8

SON008V5060

●Typical Application Circuit

Cin

VCC

VCC,PVCC

VOUT

ITH

ESR

HSON8

GND,PGND

RITH

CITH

SON008V5060

MSOP8

Fig.1 Typical Application Circuit

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

●Pin Configurations

(Top View)

ADJ

ITH

VCC

VOUT

ITH

VCC

PVCC

GND

PGND

GND

PGND

Fig.3 BD9109FVM

(Top View)

Fig.2 BD9106FVM, BD9107FVM

(Top View)

ADJ

ITH

VCC

ADJ 1

PVCC

VCC 2

ITH 3

PVCC

GND

PGND

Fig.5 BD9120HFN

GND 4

PGND

Fig.4 BD9110NV

●Pin Descriptions

【BD9106FVM, BD9107FVM, BD9109FVM】

Pin No.

Pin name

ADJ/VOUT

ITH

PIN function

Output voltage detect pin/ ADJ for BD9106･07FVM

GmAmp output pin/Connected phase compensation capacitor

Enable pin(Active High)

GND

Ground

PGND

PVCC

VCC

Nch FET source pin

Pch/Nch FET drain output pin

Pch FET source pin

VCC power supply input pin

【BD9110NV】

Pin No.

Pin name

ADJ

PIN function

Output voltage adjust pin

VCC

ITH

VCC power supply input pin

GmAmp output pin/Connected phase compensation capacitor

Ground

Nch FET source pin

Pch/Nch FET drain output pin

Pch FET source pin

GND

PGND

PVCC

Enable pin(Active High)

【BD9120HFN】

Pin No.

Pin name

ADJ

PIN function

Output voltage adjust pin

GmAmp output pin/Connected phase compensation capacitor

Enable pin(Active High)

Ground

Nch FET source pin

Pch/Nch FET drain output pin

Pch FET source pin

VCC power supply input pin

ITH

GND

PGND

PVCC

VCC

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

●Ordering Information

x x

B D

Part Number

Package

Packaging and forming specification

E2: Embossed tape and reel

TR: Embossed tape and reel

NV:SON008V5060

HFN:HSON8

FVM:MSOP8

●Lineup

UVLO

Output

Current

（Max.）

Operating

Temperature

Range

Output

voltage

range

Threshold

Package

voltage

（Typ．）

Input voltage

range

Orderable

Part Number

Adjustable

(1.0 to 2.5V)

Adjustable

0.8A

3.4V

MSOP8 Reel of 3000 BD9106FVM-TR

4.0V to 5.5V

1.2A

0.8A

2.7V

3.8V

2.5V

MSOP8 Reel of 3000 BD9107FVM-TR

MSOP8 Reel of 3000 BD9109FVM-TR

HSON8 Reel of 3000 BD9120HFN-TR

-25℃ to +85℃

(1.0 to 1.8V)

4.5V to 5.5V

2.7V to 4.5V

3.30±2%

Adjustable

(1.0 to 1.5V)

Adjustable

SON00

-25℃ to +105℃

4.5V to 5.5V

2.0A

3.7V

Reel of 2000 BD9110NV-E2

8V5060

(1.0 to 2.5V)

●Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol

VCC voltage

PVCC voltage

EN voltage

Limits

Unit

BD910xFVM

-0.3 to +7 ^*1

-0.3 to +7

387.5^*2

BD9110NV

BD9120HFN

-0.3 to +7 ^*1

-0.3 to +7

1350^*6

VCC

PVCC

-0.3 to +7 ^*1

-0.3 to +7

900^*4

SW,ITH voltage

SW,ITH

Pd1

Pd2

Topr

Tstg

Power dissipation 1

Power dissipation 2

Operating temperature range

Storage temperature range

℃

587.4^*3

3900^*5

1750^*7

-25 to +85

-55 to +150

-25 to +105

-55 to +150

-25 to +85

-55 to +150

℃

Maximum junction temperature

Tjmax

+150

*1 Pd should not be exceeded.

*2 Derating in done 3.1mW/℃ for temperatures above Ta=25℃.

*3 Derating in done 4.7mW/℃ for temperatures above Ta=25℃, Mounted on 70mm×70mm×1.6mm Glass Epoxy PCB.

*4 Derating in done 7.2mW/℃ for temperatures above Ta=25℃, Mounted on 70mm×70mm×1.6mm Glass Epoxy PCB

which has 1 layer (3%) of copper on the back side).

*5 Derating in done 31.2mW/℃ for temperatures above Ta=25℃, Mounted on a board according to JESD51-7.

*6 Derating in done 10.8mW/℃ for temperatures above Ta=25℃, Mounted on 70mm×70mm×1.6mm Glass Epoxy PCB

which has 1 layer (7%) of copper on the back side).

*7 Derating in done 14mW/℃ for temperatures above Ta=25℃, Mounted on 70mm×70mm×1.6mm Glass Epoxy PCB

which has 1 layer (6.5%) of copper on the back side).

●Recommended Operating Ratings (Ta=25℃)

BD9106FVM BD9107FVM BD9109FVM

BD9110NV

BD9120HFN

Parameter

Symbol

Unit

Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

VCC voltage

VCC

4.0

5.5

4.0

5.5

4.5

5.5

4.5

5.5

2.7

4.5

PVCC voltage

EN voltage

PVCC

VCC

0.8

VCC

1.2

VCC

0.8

VCC

2.0

VCC

0.8

SW average output current

Isw ^*8

*8 Pd should not be exceeded.

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

●Electrical Characteristics

◎BD9106FVM (Ta=25℃, VCC=5V, EN=VCC, R1=20kΩ, R2=10kΩ unless otherwise specified.)

Parameter

Standby current

Bias current

EN Low voltage

EN High voltage

Symbol

ISTB

ICC

VENL

VENH

IEN

FOSC

RONP

RONN

VADJ

VOUT

ITHSI

ITHSO

VUVLOTh

VUVLOHys

TSS

Min.

Typ.

250

GND

VCC

Max.

400

0.8

Unit

μA

Conditions

EN=GND

Standby mode

Active mode

VEN=5V

2.0

0.8

EN input current

μA

MHz

Oscillation frequency

Pch FET ON resistance ^*9

Nch FET ON resistance ^*9

ADJ Voltage

Output voltage

ITH SInk current

ITH Source Current

UVLO threshold voltage

UVLO hysteresis voltage

Soft start time

1.2

0.60

0.50

0.820

0.35

0.25

0.800

1.200

PVCC=5V

0.780

3.2

1.5

0.5

μA

ADJ=H

ADJ=L

VCC=H→L

3.4

100

3.6

200

Timer latch time

TLATCH

*9 Outgoing inspection is not done on all products

◎BD9107FVM (Ta=25℃, VCC=5V, EN=VCC, R1=20kΩ, R2=10kΩ unless otherwise specified.)

Parameter

Standby current

Bias current

EN Low voltage

EN High voltage

Symbol

ISTB

ICC

VENL

VENH

IEN

FOSC

RONP

RONN

VADJ

VOUT

ITHSI

ITHSO

VUVLOTh

VUVLOHys

TSS

Min.

Typ.

250

GND

VCC

Max.

400

0.8

Unit

μA

Conditions

EN=GND

Standby mode

Active mode

VEN=5V

2.0

0.8

EN input current

μA

MHz

Oscillation frequency

Pch FET ON resistance ^*9

Nch FET ON resistance ^*9

ADJ Voltage

Output voltage

ITH SInk current

ITH Source Current

UVLO threshold voltage

UVLO hysteresis voltage

Soft start time

1.2

0.60

0.50

0.820

0.35

0.25

0.800

1.200

PVCC=5V

0.780

2.6

150

0.5

μA

VOUT =H

VOUT =L

VCC=H→L

2.7

300

2.8

600

Timer latch time

TLATCH

*9 Outgoing inspection is not done on all products

◎BD9109FVM (Ta=25℃, VCC=PVCC=5V, EN= VCC unless otherwise specified.)

Parameter

Standby current

Bias current

EN Low voltage

EN High voltage

Symbol

ISTB

ICC

Min.

Typ.

250

GND

VCC

Max.

400

0.8

Unit

μA

Conditions

EN=GND

VENL

VENH

IEN

FOSC

RONP

RONN

VOUT

ITHSI

ITHSO

VUVLO1

VUVLO2

TSS

TLATCH

Standby mode

Active mode

VEN=5V

2.0

0.8

EN input current

μA

MHz

μA

Oscillation frequency

Pch FET ON resistance ^*9

Nch FET ON resistance ^*9

Output voltage

ITH SInk current

ITH Source Current

UVLO threshold voltage

UVLO hysteresis voltage

Soft start time

1.2

0.60

0.50

3.366

0.35

0.25

3.300

PVCC=5V

3.234

3.6

3.65

0.5

VOUT =H

VOUT =L

VCC=H→L

3.8

3.9

4.0

4.2

VCC=L→H

Timer latch time

SCP/TSD operated

Output Short circuit

Threshold Voltage

VSCP

2.7

VOUT =H→L

*9 Outgoing inspection is not done on all products

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

◎BD9110NV (Ta=25℃, VCC=PVCC=5V, EN=VCC, R1=10kΩ,R2=5kΩ unless otherwise specified.)

Parameter

Standby current

Bias current

EN Low voltage

EN High voltage

Symbol

ISTB

ICC

VENL

VENH

IEN

FOSC

RONP

RONN

VADJ

VOUT

ITHSI

ITHSO

VUVLOTh

VUVLOHys

TSS

Min.

Typ.

250

GND

VCC

Max.

350

0.8

Unit

μA

Conditions

EN=GND

Standby mode

Active mode

VEN=5V

2.0

0.8

EN input current

μA

MHz

mΩ

Oscillation frequency

Pch FET ON resistance ^*9

Nch FET ON resistance ^*9

ADJ Voltage

Output voltage

ITH SInk current

ITH Source Current

UVLO threshold voltage

UVLO hysteresis voltage

Soft start time

1.2

320

270

0.820

200

150

0.800

1.200

PVCC=5V

0.780

3.5

2.5

0.5

μA

VOUT =H

VOUT =L

VCC=H→L

3.7

100

3.9

200

Timer latch time

TLATCH

*9 Outgoing inspection is not done on all products

◎BD9120HFN (Ta=25℃, VCC=PVCC=3.3V, EN=VCC, R1=20kΩ, R2=10kΩ unless otherwise specified.)

Parameter

Standby current

Bias current

EN Low voltage

EN High voltage

Symbol

ISTB

ICC

Min.

2.0

0.8

Typ.

200

GND

VCC

Max.

400

0.8

Unit

μA

Conditions

EN=GND

VENL

VENH

IEN

FOSC

RONP

RONN

VADJ

VOUT

ITHSI

ITHSO

VUVLO1

VUVLO2

TSS

Standby mode

Active mode

VEN=3.3V

EN input current

μA

MHz

Oscillation frequency

Pch FET ON resistance ^*9

Nch FET ON resistance ^*9

ADJ Voltage

Output voltage

ITH SInk current

ITH Source Current

UVLO threshold voltage

UVLO hysteresis voltage

Soft start time

1.2

0.60

0.50

0.820

0.35

0.25

0.800

1.200

PVCC=3.3V

0.780

μA

VOUT =H

VOUT =L

VCC=H→L

VCC=L→H

2.400

2.425

0.5

2.500

2.550

2.600

2.700

Timer latch time

TLATCH

SCP/TSD operated

Output Short circuit

Threshold Voltage

VSCP

VOUT×0.5

VOUT×0.7

VOUT =H→L

*9 Outgoing inspection is not done on all products

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

●Block Diagram

【BD9106FVM, BD9107FVM】

Fig.6 BD9106FVM, BD9107FVM Block Diagram

【BD9109FVM】

Fig.7 BD9109FVM Block Diagram

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

【BD9110NV】

Fig.8 BD9110NV Block Diagram

【BD9120HFN】

Fig.9 BD9120HFN Block Diagram

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

●Typical Performance Curves

【BD9106FVM】

Fig.10 Vcc-Vout

Fig.11 Ven-Vout

Fig.13 Ta-Vout

Fig.12 Iout-Vout

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.15 Ta-Fosc

Fig.14 Efficiency

Fig.16 Ta-Ronn, Ronp

Fig.17 Ta-Ven

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.19 Vcc-Fosc

Fig.18 Ta-Icc

Fig.21 SW waveform Io=10mA

Fig.20 Soft start waveform

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig. 23 Transient response

Io=100→600mA(10μs)

Fig.22 SW waveform Io=200mA

Fig.24 Transient response

Io=600→100mA(10μs)

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

【BD9107FVM】

Fig.25 Vcc-Vout

Fig.26 Ven-Vout

Fig.27 Iout-Vout

Fig.28 Ta-Vout

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.30 Ta-Fosc

Fig.29 Efficiency

Fig.32 Ta-VEN

Fig.31 Ta-RONN, RONP

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.33 Ta-ICC

Fig.34 Vcc-Fosc

Fig.36 SW waveform Io=10mA

Fig.35 Soft start waveform

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig. 38 Transient response

Io=100→600mA(10μs)

Fig.37 SW waveform Io=500mA

Fig.39 Transient response

Io=600→100mA(10μs)

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

【BD9109FVM】

Fig.40 Vcc-Vout

Fig.41 Ven-Vout

Fig. 43 Ta-Vout

Fig.42 Iout-Vout

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.45 Ta-Fosc

Fig.44 Efficiency

Fig.46 Ta-Ronn, Ronp

Fig.47 Ta-Ven

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.48 Ta-Icc

Fig.49 Vcc-Fosc

Fig.50 Soft start waveform

Fig.51 SW waveform Io=10mA

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig. 53 Transient response

Io=100→600mA(10μs)

Fig.52 SW waveform Io=500mA

Fig.54 Transient response

Io=600→100mA(10μs)

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

【BD9110NV】

Fig.55 Vcc-Vout

Fig.56 Ven-Vout

Fig.57 Iout-Vout

Fig. 58 Ta-Vout

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.60 Ta-Fosc

Fig.59 Efficiency

Fig.62 Ta-Ven

Fig.61 Ta-Ronn, Ronp

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.64 Vcc-Fosc

Fig.63 Ta-Icc

Fig.65 Soft start waveform

Fig.66 SW waveform Io=10mA

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.67 SW waveform Io=500mA

Fig. 68 Transient response

Io=100→600mA(10μs)

Fig.69 Transient response

Io=600→100mA(10μs)

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

【BD9120HFN】

Fig.70 Vcc-Vout

Fig.71 Ven-Vout

Fig.72 Iout-Vout

Fig. 73 Ta-Vout

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.75 Ta-Fosc

Fig.74 Efficiency

Fig.76 Ta-Ronn, Ronp

Fig.77 Ta-Ven

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig.78 Ta-Icc

Fig.79 Vcc-Fosc

Fig.81 SW waveform Io=10mA

Fig.80 Soft start waveform

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Fig. 83 Transient response

Io=100→600mA(10μs)

Fig.82 SW waveform Io=200mA

Fig.84 Transient response

Io=600→100mA(10µs)

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

Application Information

●Operation

BD9106FVM,BD9107FVM,BD9109FVM,BD9110NV,BD9120HFN are

a synchronous rectifying step-down switching

regulator that achieves faster transient response by employing current mode PWM control system. It utilizes

switching operation in PWM (Pulse Width Modulation) mode for heavier load, while it utilizes SLLM^TM(Simple Light

Load Mode) operation for lighter load to improve efficiency.

○Synchronous rectifier

It does not require the power to be dissipated by a rectifier externally connected to a conventional DC/DC converter IC,

and its P.N junction shoot-through protection circuit limits the shoot-through current during operation, by which the power

dissipation of the set is reduced.

○Current mode PWM control

Synthesizes a PWM control signal with a inductor current feedback loop added to the voltage feedback.

・PWM (Pulse Width Modulation) control

The oscillation frequency for PWM is 1 MHz. SET signal form OSC turns ON a P-channel MOS FET (while a

N-channel MOS FET is turned OFF), and an inductor current I_Lincreases. The current comparator (Current Comp)

receives two signals, a current feedback control signal (SENSE: Voltage converted from I_L) and a voltage feedback

control signal (FB), and issues a RESET signal if both input signals are identical to each other, and turns OFF the

P-channel MOS FET (while a N-channel MOS FET is turned ON) for the rest of the fixed period. The PWM control

repeat this operation.

・SLLM^TM(Simple Light Load Mode) control

When the control mode is shifted from PWM for heavier load to the one for lighter load or vise versa, the switching

pulse is designed to turn OFF with the device held operated in normal PWM control loop, which allows linear operation

without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or

vise versa.

Although the PWM control loop continues to operate with a SET signal from OSC and a RESET signal from Current

Comp, it is so designed that the RESET signal is held issued if shifted to the light load mode, with which the switching

is tuned OFF and the switching pulses are thinned out under control. Activating the switching intermittently reduces

the switching dissipation and improves the efficiency.

SENSE

Current

Comp

VOUT

RESET

Level FB

Shift

SET

Driver

Logic

VOUT

Gm Amp.

Load

OSC

ITH

Fig.85 Diagram of current mode PWM control

PVCC

SENSE

PVCC

Current

Comp

Current

SENSE

Comp

SET

GND

RESET

GND

IL(AVE)

VOUT

VOUT(AVE)

Not switching

Fig.86 PWM switching timing chart

Fig.87 SLLM switching timing chart

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Datasheet

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●Description of Operations

・Soft-start function

EN terminal shifted to “High” activates a soft-starter to gradually establish the output voltage with the current limited

during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current.

・Shutdown function

With EN terminal shifted to “Low”, the device turns to Standby Mode, and all the function blocks including reference

voltage circuit, internal oscillator and drivers are turned to OFF. Circuit current during standby is 0 μA (Typ.).

・UVLO function

Detects whether the input voltage sufficient to secure the output voltage of this IC is supplied. And the hysteresis width of

50 to 300 mV (Typ.) is provided to prevent output chattering.

Hysteresis 50 to 300mV

VCC

VOUT

Tss

Soft start

Standby

mode

Standby

mode

Standby mode

Operating mode

Standby mode

UVLO

*Soft Start time(typ.)

Fig.88 Soft start, Shutdown, UVLO timing chart

BD9106FVM BD9107FVM BD9109FVM

BD9110NV

BD9120HFN

Unit

msec

Tss

・Short-current protection circuit with time delay function

Turns OFF the output to protect the IC from breakdown when the incorporated current limiter is activated continuously for the

fixed time(TLATCH) or more. The output thus held tuned OFF may be recovered by restarting EN or by re-unlocking UVLO.

Output OFF

latch

VOUT

Limit

1msec

Standby

mode

Standby

mode

Operating mode

Timer latch

*Timer Latch time (typ.)

Fig.89 Short-current protection circuit with time delay timing chart

BD9106FVM

BD9107FVM

BD9109FVM

BD9110NV

BD9120HFN

Unit

msec

TLATCH

※

In addition to current limit circuit, output short detect circuit is built in on BD9109FVM and BD9120HFN. If output voltage fall below

2V(typ, BD9109FVM) or Vout×0.5(typ,BD9120HFN), output voltage will hold turned OFF.

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●Information on Advantages

Advantage 1：Offers fast transient response with current mode control system.

Conventional product (VOUT of which is 3.3 volts)

BD9109FVM (Load response IO=100mA→600mA)

VOUT

228mV

IOUT

Voltage drop due to sudden change in load was reduced by about 40%.

Fig.90 Comparison of transient response

Advantage 2： Offers high efficiency for all load range.

・For lighter load:

Utilizes the current mode control mode called SLLM^TMfor lighter load, which reduces various dissipation such as

switching dissipation (PSW), gate charge/discharge dissipation, ESR dissipation of output capacitor (PESR) and

on-resistance dissipation (PRON) that may otherwise cause degradation in efficiency for lighter load.

Achieves efficiency improvement for lighter load.

・For heavier load:

100

SLLM^TM

②

Utilizes the synchronous rectifying mode and the low on-resistance

MOS FETs incorporated as power transistor.

①

PWM

①inprovement by SLLM system

②improvement by synchronous rectifier

ON resistance of P-channel MOS FET: 0.2 to 0.35 Ω (Typ.)

ON resistance of N-channel MOS FET: 0.15 to 0.25 Ω (Typ.)

0.001

0.01

0.1

Output current Io[A]

Fig.91 Efficiency

Achieves efficiency improvement for heavier load.

Offers high efficiency for all load range with the improvements mentioned above.

Advantage 3：・Supplied in smaller package due to small-sized power MOS FET incorporated.

(3 package like MOSP8, HSON8, SON008V5060)

・Allows reduction in size of application products

・Output capacitor Co required for current mode control: 10 μF ceramic capacitor

・Inductance L required for the operating frequency of 1 MHz: 4.7 μH inductor

(BD9110NV:Co=22µF, L=2.2µH)

Reduces a mounting area required.

VCC

15mm

CIN

Cin

RITH

CITH

DC/DC

Convertor

Controller

VOUT

10mm

RITH

CITH

Fig.92 Example application

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●Switching Regulator Efficency

Efficiency ŋ may be expressed by the equation shown below:

VOUT×IOUT

Vin×Iin

POUT

η=

×100[%]=

×100[%]

POUT+PDα

Efficiency may be improved by reducing the switching regulator power dissipation factors P_Dα as follows:

Dissipation factors:

1) ON resistance dissipation of inductor and FET：PD(I²R)

2) Gate charge/discharge dissipation：PD(Gate)

3) Switching dissipation：PD(SW)

4) ESR dissipation of capacitor：PD(ESR)

5) Operating current dissipation of IC：PD(IC)

1)PD(I²R)=IOUT ×(RCOIL+RON) (RCOIL[Ω]：DC resistance of inductor, RON[Ω]：ON resistance of FETIOUT[A]：Output current.)

2)PD(Gate)=Cgs×f×V²(Cgs[F]：Gate capacitance of FET,f[H]：Switching frequency,V[V]：Gate driving voltage of FET)

Vin²×CRSS×IOUT×f

3)PD(SW)=

(CRSS[F]：Reverse transfer capacitance of FET、IDRIVE[A]：Peak current of gate.)

IDRIVE

4)PD(ESR)=IRMS ×ESR (IRMS[A]：Ripple current of capacitor,ESR[Ω]：Equivalent series resistance.)

5)PD(IC)=Vin×ICC (ICC[A]：Circuit current.)

●Consideration on Permissible Dissipation and Heat Generation

As this IC functions with high efficiency without significant heat generation in most applications, no special consideration is

needed on permissible dissipation or heat generation. In case of extreme conditions, however, including lower input

voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation

must be carefully considered.

For dissipation, only conduction losses due to DC resistance of inductor and ON resistance of FET are considered.

Because the conduction losses are considered to play the leading role among other dissipation mentioned above including

gate charge/discharge dissipation and switching dissipation.

1.5

1000

800

1.5

①mounted on glass epoxy PCB

θj-a=212.8℃/W

②Using an IC alone

θj-a=322.6℃/W

① mounted on glass epoxy PCB

θj-a=133.0℃/W

② Using an IC alone

θj-a=195.3℃/W

① for SON008V5060

ROHM standard 1layer board

θj-a=138.9℃/W

② Using an IC alone

θj-a=195.3℃/W

①1.15W

②0.63W

①0.90W

②0.64W

1.0

①587.4mW

②387.5mW

600

400

200

0.5

75 85 100

125

150

75 85 100

125

150

100105 125

150

Ambient temperature:Ta [℃]

Fig.93 Thermal derating curve

(MSOP8)

Ambient temperature:Ta [℃]

Fig.94 Thermal derating curve

(HSON8)

Fig.95 Thermal derating curve

(SON008V5060)

P=IOUT ×(RCOIL+RON)

If VCC=5V, VOUT=3.3V, RCOIL=0.15Ω, RONP=0.35Ω, RONN=0.25Ω

IOUT=0.8A, for example,

RON=D×RONP+(1-D)×RONN

D=VOUT/VCC=3.3/5=0.66

RON=0.66×0.35+(1-0.66)×0.25

=0.231+0.085

D：ON duty (=VOUT/VCC)

RCOIL：DC resistance of coil

RONP：ON resistance of P-channel MOS FET

RONN：ON resistance of N-channel MOS FET

IOUT：Output current

=0.316[Ω]

P=0.8²×(0.15+0.316)

≒298[mV]

As RONP is greater than RONN in this IC, the dissipation increases as the ON duty becomes greater. With the

consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed.

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Datasheet

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●Selection of Components Externally Connected

1. Selection of inductor (L)

The inductance significantly depends on output ripple current.

As seen in the equation (1), the ripple current decreases as the

inductor and/or switching frequency increases.

ΔIL

(VCC-VOUT)×VOUT

VCC

ΔIL=

[A]・・・(1)

L×VCC×f

Appropriate ripple current at output should be 30% more or less of

the maximum output current.

VOUT

ΔIL=0.3×IOUTmax. [A]・・・(2)

(VCC-VOUT)×VOUT

[H]・・・(3)

ΔIL×VCC×f

(ΔIL: Output ripple current, and f: Switching frequency)

Fig.96 Output ripple current

* Current exceeding the current rating of the inductor results in magnetic saturation of the inductor, which decreases efficiency.

The inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating.

If VCC=5V, VOUT=3.3V, f=1MHz, ΔIL=0.3×0.8A=0.24A, for example,(BD9109FVM)

(5-3.3)×3.3

=4.675μ → 4.7[μH]

0.24×5×1M

* Select the inductor of low resistance component (such as DCR and ACR) to minimize dissipation in the inductor for

better efficiency.

2. Selection of output capacitor (CO)

VCC

Output capacitor should be selected with the consideration on the stability

region and the equivalent series resistance required to smooth ripple voltage.

Output ripple voltage is determined by the equation (4)：

VOUT

ΔVOUT=ΔIL×ESR [V]・・・(4)

ESR

(ΔIL: Output ripple current, ESR: Equivalent series resistance of output capacitor)

*Rating of the capacitor should be determined allowing sufficient margin

against output voltage. Less ESR allows reduction in output ripple voltage.

Fig.97 Output capacitor

As the output rise time must be designed to fall within the soft-start time, the capacitance of output capacitor should be

determined with consideration on the requirements of equation (5):

TSS×(Ilimit-IOUT)

Tss: Soft-start time

Ilimit: Over current detection level, 2A(Typ)

Co≦

・・・(5)

VOUT

In case of BD9109FVM, for instance, and if VOUT=3.3V, IOUT=0.8A, and TSS=1ms,

1m×(2-0.8)

Co≦

≒364 [μF]

3.3

Inappropriate capacitance may cause problem in startup. A 10 μF to 100 μF ceramic capacitor is recommended.

3. Selection of input capacitor (Cin)

Input capacitor to select must be a low ESR capacitor of the capacitance

sufficient to cope with high ripple current to prevent high transient voltage. The

ripple current IRMS is given by the equation (6):

√

VCC

Cin

VOUT(VCC-VOUT)

IRMS=IOUT×

[A]・・・(6)

VOUT

VCC

< Worst case > IRMS(max.)

IOUT

When VCC is twice the Vout,

IRMS=

If VCC=5V, VOUT=3.3V, and IOUTmax.=0.8A, (BD9109FVM)

√

Fig.98 Input capacitor

3.3(5-3.3)

IRMS=0.8×

=0.38[ARMS]

A low ESR 10μF/10V ceramic capacitor is recommended to reduce ESR dissipation of input capacitor for better efficiency.

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4. Determination of RITH, CITH that works as a phase compensator

As the Current Mode Control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area

due to a CR filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high

frequency area due to the output capacitor and its ESR. So, the phases are easily compensated by adding a zero to the

power amplifier output with C and R as described below to cancel a pole at the power amplifier.

fp(Min.)

fp=

fp(Max.)

2π×RO×CO

Gain

[dB]

fz(ESR)

fz(ESR)=

2π×ESR×CO

IOUTMin.

IOUTMax.

Pole at power amplifier

When the output current decreases, the load resistance Ro

increases and the pole frequency lowers.

Phase

[deg]

-90

fp(Min.)=

[Hz]←with lighter load

[Hz]←with heavier load

2π×ROMax.×CO

Fig.99 Open loop gain characteristics

fp(Max.)=

2π×ROMin.×CO

fz(Amp.)

Gain

[dB]

Zero at power amplifier

Increasing capacitance of the output capacitor lowers the

pole frequency while the zero frequency does not change.

(This is because when the capacitance is doubled, the

capacitor ESR reduces to half.)

Phase

[deg]

fz(Amp.)=

-90

2π×RITH.×CITH

Fig.100 Error amp phase compensation characteristics

Cin

VCC

VCC,PVCC

VOUT

ITH

ESR

GND,PGND

RITH

CITH

Fig.101 Typical application

Stable feedback loop may be achieved by canceling the pole fp (Min.) produced by the output capacitor and the load

resistance with CR zero correction by the error amplifier.

fz(Amp.)= fp(Min.)

2π×RITH×CITH

2π×ROMax.×CO

5. Determination of output voltage

The output voltage VOUT is determined by the equation (7):

VOUT=(R2/R1+1)×VADJ・・・(7) VADJ: Voltage at ADJ terminal (0.8V Typ.)

With R1 and R2 adjusted, the output voltage may be determined as required.

Adjustable output voltage range： 1.0V to 1.5V/ BD9107FVM, BD9120HFN

1.0V to 2.5V/BD106FVM, BD9110NV

Output

Use 1 kΩ to 100 kΩ resistor for R1. If a resistor of the resistance higher than

100 kΩ is used, check the assembled set carefully for ripple voltage etc.

ADJ

Fig.102 Determination of output voltage

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●Cautions on PC Board layout

BD9106FVM, BD9107FVM, BD9109FVM, BD9120HFN

VOUT/ADJ

ITH

VCC

PVCC

VCC

RITH

CIN

①

VOUT

CITH

GND

PGND

GND

②

③

Fig.103 Layout diagram

BD9110NV Cautions on PC Board layout

VCC

ADJ

VCC

ITH

PVCC

①

VOUT

RITH

③

CIN

GND

PGND

②

CITH

GND

Fig.104 Layout diagram

For the sections drawn with heavy line, use thick conductor pattern as short as possible.

①

②

Lay out the input ceramic capacitor CIN closer to the pins PVCC and PGND, and the output capacitor Co closer to

the pin PGND.

③

Lay out CITH and RITH between the pins ITH and GND as neat as possible with least necessary wiring.

※

The package of HSON8 (BD9120HFN) and SON008V5050 (BD9110NV) has thermal FIN on the reverse of the package.

The package thermal performance may be enhanced by bonding the FIN to GND plane which take a large area of PCB.

●Recommended components Lists on above application

Table1. [BD9106FVM]

Symbol

Part

Value

Manufacturer

Sumida

TDK

Series

CMD6D11B

Coil

4.7μH

VLF5014AT-4R7M1R1

CM316X5R106K10A

GRM18series

Ceramic capacitor

CIN

10μF

Kyocera

murata

ROHM

CITH

750pF

VOUT=1.0V

18kΩ

22kΩ

27kΩ

36kΩ

MCR10 1802

VOUT=1.2V

VOUT=1.5V

VOUT=1.8V

VOUT=2.5V

ROHM

MCR10 2202

RITH

Resistance

ROHM

MCR10 2202

ROHM

MCR10 2702

ROHM

MCR10 3602

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Table2. [BD9107FVM]

Symbol

Part

Value

Manufacturer

Sumida

TDK

Series

CMD6D11B

Coil

4.7μH

VLF5014AT-4R7M1R1

CM316X5R106K10A

GRM18series

Ceramic capacitor

CIN

10μF

Kyocera

murata

ROHM

CITH

1000pF

VOUT=1.0V

4.3kΩ

6.8kΩ

9.1kΩ

12kΩ

MCR10 4301

VOUT=1.2V

VOUT=1.5V

VOUT=1.8V

ROHM

MCR10 6801

RITH

Resistance

ROHM

MCR10 9101

ROHM

MCR10 1202

Table3. [BD9109VM]

Symbol

Part

Value

Manufacturer

Sumida

TDK

Series

CMD6D11B

Coil

4.7μH

VLF5014AT-4R7M1R1

CM316X5R106K10A

GRM18series

Ceramic capacitor

CIN

10μF

330pF

30kΩ

Kyocera

murata

CITH

RITH

Resistance

ROHM

MCR10 3002

Table4. [BD9110NV]

Symbol

Part

Coil

Value

2.2μH

10μF

Manufacturer

TDK

Series

LTF5022T-2R2N3R2

CM316X5R106K10A

CM316B226K06A

GRM18series

CIN

Ceramic capacitor

Kyocera

murata

22μF

CITH

1000pF

VOUT=1.0V

VOUT=1.2V

VOUT=1.5V

VOUT=1.8V

VOUT=2.5V

RITH

Resistance

12kΩ

ROHM

MCR10 1202

Table5. [BD9120HFN]

Symbol

Part

Coil

Value

Manufacturer

Sumida

TDK

Series

CMD6D11B

4.7μH

VLF5014AT-4R7M1R1

CM316X5R106K10A

GRM18series

CIN

Ceramic capacitor

10μF

Kyocera

murata

CITH

680pF

VOUT=1.0V

8.2kΩ

4.7kΩ

ROHM

MCR10 8201

RITH

Resistance

VOUT=1.2V

ROHM

MCR10 8201

VOUT=1.5V

ROHM

MCR10 4701

*The parts list presented above is an example of recommended parts. Although the parts are sound, actual circuit characteristics should be checked on

your application carefully before use. Be sure to allow sufficient margins to accommodate variations between external devices and this IC when employing

the depicted circuit with other circuit constants modified. Both static and transient characteristics should be considered in establishing these margins. When

switching noise is substantial and may impact the system, a low pass filter should be inserted between the VCC and PVCC pins, and a schottky barrier diode

established between the SW and PGND pins.

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●I/O Equivalence Circuit

【BD9106FVM, BD9107FVM, BD9109FVM】

PVCC

・SW pin

・EN pin

VCC

10kΩ

・VOUT pin (BD9109FVM)

・ADJ pin (BD9106FVM, BD9107FVM)

VCC

10kΩ

VOUT

ADJ

・ITH pin

VCC

ITH

【BD9110NV, BD9120HFN】

・EN pin

・SW pin

PVCC

10kΩ

・ITH pin (BD9120HFN)

・ITH pin (BD9110NV)

VCC

ITH

10kΩ

ADJ

Fig.105 I/O equivalence circuit

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●Operational Notes

1. Absolute Maximum Ratings

While utmost care is taken to quality control of this product, any application that may exceed some of the absolute

maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken,

short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed

the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses.

2. Electrical potential at GND

GND must be designed to have the lowest electrical potential In any operating conditions.

3. Short-circuiting between terminals, and mismounting

When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may

result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between output and

power supply or GND may also cause breakdown.

4.Operation in Strong electromagnetic field}

Be noted that using the IC in the strong electromagnetic radiation can cause operation failures.

5. Thermal shutdown protection circuit

Thermal shutdown protection circuit is the circuit designed to isolate the IC from thermal runaway, and not intended to

protect and guarantee the IC. So, the IC the thermal shutdown protection circuit of which is once activated should not

be used thereafter for any operation originally intended.

6. Inspection with the IC set to a pc board

If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the

capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper

grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the

inspection process, be sure to turn OFF the power supply before it is connected and removed.

7. Input to IC terminals

This is a monolithic IC with P⁺isolation between P-substrate and each element as illustrated below. This P-layer and

the N-layer of each element form a P-N junction, and various parasitic element are formed.

If a resistor is joined to a transistor terminal as shown in Fig 106:

○P-N junction works as a parasitic diode if the following relationship is satisfied; GND>Terminal A (at resistor side), or

GND>Terminal B (at transistor side); and

○if GND>Terminal B (at NPN transistor side),

a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode.

The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits,

and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such

manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in

activation of parasitic elements.

Fig.106 Simplified structure of monorisic IC

8. Ground wiring pattern

If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND

pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that

resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the

small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

●Physical Dimensions Tape and Reel information

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

●Marking Diagrams

BD9106FVM

MSOP8(TOP VIEW)

BD9107FVM

MSOP8(TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

D 9 1

LOT Number

1PIN MARK

BD9109FVM

MSOP8(TOP VIEW)

BD9110NV

SON008V5060 (TOP VIEW)

Part Number Marking

LOT Number

D 9 1

B D 9 11 0

LOT Number

1PIN MARK

BD9120HFN

HSON8 (TOP VIEW)

Part Number Marking

LOT Number

D 9 1

2 0

1PIN MARK

www.rohm.com

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Datasheet

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN

●Revision History

Date

Revision

001

Changes

17.Jan.2012

New Release

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Daattaasshheeeett

Notice

●Precaution for circuit design

1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA

equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be

used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft,

nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose

malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the

ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life,

sufficient fail-safe measures must be taken, including the following:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits in the case of single-circuit failure

2) The products are designed for use in a standard environment and not in any special environments. Application of the

products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of

product performance, prior to use, is recommended if used under the following conditions:

[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents

[b] Use outdoors where the products are exposed to direct sunlight, or in dusty places

[c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2,

and NO2

[d] Use in places where the products are exposed to static electricity or electromagnetic waves

[e] Use in proximity to heat-producing components, plastic cords, or other flammable items

[f] Use involving sealing or coating the products with resin or other coating materials

[g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering

[h] Use of the products in places subject to dew condensation

3) The products are not radiation resistant.

4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.

5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta).

When used in sealed area, confirm the actual ambient temperature.

7) Confirm that operation temperature is within the specified range described in product specification.

8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed.

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect

product performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

Company in advance.

Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics

of the products and external components, including transient characteristics, as well as static characteristics.

2) The application examples, their constants, and other types of information contained herein are applicable only when

the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient

consideration to external conditions must be made.

Notice - Rev.001

Daattaasshheeeett

●Precaution for Electrostatic

This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper

caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products.

Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from

charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the products are stored in the following places:

[a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] Where the temperature or humidity exceeds those recommended by the Company

[c] Storage in direct sunshine or condensation

[d] Storage in high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is

exceeding recommended storage time period .

3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may

occur due to excessive stress applied when dropping of a carton.

4) Use products within the specified time after opening a dry bag.

●Precaution for product label

QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a

internal part number that is inconsistent with an product part number.

●Precaution for disposition

When disposing products please dispose them properly with a industry waste company.

●Precaution for Foreign exchange and Foreign trade act

Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act,

please consult with ROHM in case of export.

●Prohibitions Regarding Industrial Property

1) Information and data on products, including application examples, contained in these specifications are simply for

reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other

rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:

[a] infringement of the intellectual property rights of a third party

[b] any problems incurred by the use of the products listed herein.

2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial

property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use,

sell, or dispose of the products.

Notice - Rev.001

BD9107FVM-E2 [ROHM]

相关型号：

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BD9109FVM-E2

BD9109FVM-LB

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