BD92111F [ROHM]
BD92111F是PFC直接连接的电流共振型LED驱动器。LED电流通过频率控制。应用可直接连接PFC,可使用半桥结构。因此可减少外接部件的数量。BD92111F中内置了应对异常状态的几种保护功能。过电压保护 (OVP : over voltage protection), LED开路检测 (IS Low检测) 等。;型号: | BD92111F |
厂家: | ROHM |
描述: | BD92111F是PFC直接连接的电流共振型LED驱动器。LED电流通过频率控制。应用可直接连接PFC,可使用半桥结构。因此可减少外接部件的数量。BD92111F中内置了应对异常状态的几种保护功能。过电压保护 (OVP : over voltage protection), LED开路检测 (IS Low检测) 等。 驱动 功率因数校正 驱动器 |
文件: | 总27页 (文件大小:2834K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
PFC Direct current resonance type
White LED Driver for Large LCD
BD92111F
General Description
Key Specifications
BD92111F is a current resonance type LED Driver with
frequency-controlled LED current. It can connect to PFC
directly and can use half-bridge structure reducing the
number of external components.
Operating Power Supply Voltage Range:
8.0V to 18.0V
Minimum Oscillator Frequency:
65.8kHz
(RRT=22kΩ,RADJ=36kΩ,VFB=3.2V)
It incorporates some protection functions against fault
conditions such as Over-Voltage Protection and LED
Open Detection (IS Low Detection).
Operating Current:
Operating Temperature Range:
2.3mA (Typ)
-40°C to +85°C
Package
W(Typ) x D(Typ) x H(Max)
11.20mm x 7.80mm x 2.01mm
Features
SOP18
20V High Rating Process
Pin pitch
1.27mm
1 Channel Push-pull Control
Current and Voltage Feedback by Driving
Frequency
Adjustable Soft Start
Adjustable Timer Latch
Under-Voltage Detection for IC’s Power Line
Output Over-Voltage Protection
Output Error Signal from FAIL Terminal
Shift to Save Mode by STB Terminal
Burst Control by External PWM Signal
Applications
TV, Computer Display, LCD Backlighting.
Figure. 1 SOP18
Typical Application Circuit
< Primary Side >
VCC
VCC
GND
GND
PDIM
STB
PDIM
PVIN
ON/OFF
PWMIN
GND
PWM
ERR
FAIL
T1
CSS CSDON
CFBVS
CFBIS
RFBVS
RFBIS
RADJ
RRT
RS
CCP
< Secondary Side >
Figure. 2 Typical Application Circuit(s)
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD92111F
Contents
General Description....................................................................................................................................................1
Features.......................................................................................................................................................................1
Applications ................................................................................................................................................................1
Key Specifications......................................................................................................................................................1
Package .......................................................................................................................................................................1
Typical Application Circuit.........................................................................................................................................1
Absolute Maximum Ratings.......................................................................................................................................3
Recommended Operating Conditions......................................................................................................................3
External Components Recommended Range..........................................................................................................3
Pin Configuration........................................................................................................................................................3
Physical Dimension and Marking Diagram..............................................................................................................3
Electrical Characteristics...........................................................................................................................................4
Pin Description............................................................................................................................................................6
I/O Equivalent Circuits................................................................................................................................................7
Block Diagram.............................................................................................................................................................8
Typical Performance Curves .....................................................................................................................................9
Pin Function Description .........................................................................................................................................10
Detection Condition List of the Protection Functions ..........................................................................................15
Behavior List of the Protect Function ....................................................................................................................15
Application Example ................................................................................................................................................16
Timing Chart..............................................................................................................................................................17
Operational Notes.....................................................................................................................................................20
Ordering Information................................................................................................................................................22
Marking Diagrams.....................................................................................................................................................22
Physical Dimension, Tape and Reel Information...................................................................................................23
Revision History .......................................................................................................................................................24
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BD92111F
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
VCC
Rating
20
Unit
V
Supply Voltage
STB, N2, N1
Terminal Voltage
VSTB,VN2,VN1
20
V
RT,FB,IS,VS,PWMCMP,CP,
PWMIN,SS,FAIL,COMP,SDON,
COMPSD Terminal Voltage
VRT,VFB,VIS,VVS,VPWMCMP,
VCP,VPWMIN,VADIM,VSS
,
5.5
V
VFAIL,VCOMP,VSDON,VCOMPSD
Power Dissipation
Pd
Topr
Tjmax
Tstg
0.69 (Note 1)
-40 to +85
150
W
°C
°C
°C
Operating Temperature Range
Junction Temperature
Storage Temperature Range
-55 to +150
(Note 1) Derating in done 5.5 mW/°C for operating above Ta≥25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Symbol
Range
Unit
V
Power Supply Voltage
VCC
8.0 to 18.0
60 to 500
30 to 200
PWMIN Input Frequency Range
Oscillation Frequency
fPWMIN
fOUT
Hz
kHz
External Components Recommended Range (Ta= -40°C to +85°C)
Parameter
Symbol
Range
Unit
RT Connection Resistance
RRT
24 to 160
kΩ
Set up Resistance for operation
frequency range
RADJ
51 ~ OPEN
kΩ
CP Connection Capacitance
SS Connection Capacitance
SDON Connection Capacitance
CCP
CSS
0.01 to 2.2 (Note 2)
0.01 to 0.1 (Note 2)
0.01 to 2.2 (Note 2)
µF
µF
µF
CSDON
(Note 2) Please set connection capacitance above Min value of Recommended Range according to temperature characteristic and DC bias characteristic.
Pin Configuration
Physical Dimension and Marking Diagram
Product Name
(Max 11.55 (include.BURR))
BD92111F
BD92111F
(TOP VIEW)
Lot No.
Figure. 3 Pin Configuration
(UNIT : mm)
PKG : SOP18
Drawing No. : EX115-5001
SOP18(Unit:mm)
Figure. 4 Physical Dimension and Marking Diagram
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Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V)
Limit
Parameter
【Whole Device】
Symbol
Unit
Conditions
Min
Typ
Max
fOUT=60kHz,
VPWMCOMP=0V
VSTB=0V
Circuit Current
ICC1
ICC2
-
-
2.3
0
5.0
20
mA
µA
Circuit Current at Stand-by
【STB Block】
VSTH
VSTL
2.0
VCC
V
V
System ON
System OFF
STB Pin High Voltage
STB Pin Low Voltage
-
-
-0.3
+0.8
【VCC UVLO Block】
VCC Operation Voltage
VCC UVLO Hysteresis
VVCCUVP
6.17
0.37
6.50
0.50
6.83
0.63
V
V
⊿VVCCUVP
【OSC Block】
RT Terminal voltage
VRT
1.05
1.50
1.95
V
【PWMIN Block】
PWMIN Pin High Voltage
PWMIN Pin Low Voltage
VPWMINH
VPWMINL
2.0
-
-
5.0
V
V
-0.3
+0.8
【Soft Start Block】
ISS
1.5
2.8
2.0
3.0
2.5
3.2
µA
V
Setting Current for Soft Start Timer
Soft Start Ended Voltage
【Feed Back Block】
IS Threshold Voltage
VSSEND
VIS
VVS
1.225
1.212
-
1.250
1.250
-
1.275
1.288
0.9
V
V
VS Threshold Voltage
IS Source Current 1
IIS1
µA
µA
µA
V
VPWMIN=2.5V
IS Source Current 2
IIS2
40
50
60
VPWMIN=0V, VIS=1.0V
VS Source Voltage
IVS
-
0.606
-
0.625
0.9
IS COMP Detection Voltage
VISCOMP
0.644
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Electrical Characteristics – continued (Unless otherwise specified Ta=25°C, VCC= 12V)
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Min
【Output Block】
1.5
4.5
3.0
9.0
6.0
18.0
6.0
N1 Output Sink Resistance
N1Output Source Resistance
N2 Output Sink Resistance
N2 Output Source Resistance
MAX DUTY
RN1SI
RN1SO
Ω
Ω
1.5
3.0
RN2SI
Ω
4.5
9.0
18.0
47.0
400
RN2SO
Ω
MAX DUTY
tOFF
43.0
100
45.0
200
%
ns
fOUT=60kHz
N1-N2,N2-N1Dead Time
Output Frequency
(minimum frequency setting)
【Timer Block】
RRT=22kΩ,RADJ=36kΩ,
VFB=3.2V
fOUTMIN
59.3
65.8
72.3
kHz
VCP
ICP
1.90
0.85
2.00
1.00
2.10
1.15
V
Setting Voltage for CP Time
µA
Setting Current for CP Time
【COMP Block】
Over voltage Detection level of
COMP
VCOMP
3.88
4.00
4.12
V
⊿VCOMP
0.15
3.88
0.20
4.00
0.25
4.12
V
V
Hysteresis width (COMP)
COMPSD Detection Voltage
【FAIL Block】
VCOMPSD
RFAIL
-
100
200
Ω
FAIL Pin ON-Resistance
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BD92111F
Pin Description
Pin No.
Pin Name
VCC
IN/OUT
IN
Function
Rating [V]
-0.3 to +20
1
2
3
Power Supply Pin for IC (Built-In UVLO Function)
Power ON/OFF Control Pin for IC
Power OFF when STB=L and Power ON when STB=H.
STB
IN
IN
-0.3 to +20
-
GND
Ground Pin for Internal Signal in IC
Drive Frequency Setting Pin
Basic Frequency is set by the resistor between RT and
GND and Drive Frequency Modulation Range is set by
the resistor between RT and FB.
4
RT
OUT
-0.3 to +5.5
Error Amplifier Output pin for LED Current feedback and
LED Voltage feedback
5
FB
OUT
-0.3 to +5.5
6
7
IS
IN
IN
Error Amplifier Input pin for LED Current feedback
-0.3 to +5.5
-0.3 to +5.5
VS
Error Amplifier Input pin for LED Open Voltage feedback
PWM Comparator Input Pin which controls PWM
operation during brightness adjustment.
N1 and N2 output stop when PWMCMP=L, and they
output Max Duty when PWMCMP=H
8
PWMCMP
IN
-0.3 to +5.5
Timer Latch Setting Pin
In abnormal case, 1µA (Typ) will be charged to the
capacitor connected to CP, and IC becomes latch status
after output operation stops at CP>2V(Typ)
9
CP
OUT
IN
-0.3 to +5.5
-0.3 to +5.5
-0.3 to +5.5
10
11
PWMIN
SDON
PWM Signal Input Pin for burst brightness adjustment
Enable COMPSD inputs over voltage detection
When start up, 1µA(Typ) will be charged to connected
capacitor. When SDON>2.0V(Typ), it will be possible to
detect over voltage.
OUT
Soft Start timer and COMPSD timer Setting Pin
During start-up, 2µA (Typ) will be charged to connected
capacitor. At SS>2.0V(typ), COMPSD can start to
detect. At SS>2.5V (typ), CP can accept charge
operation.
12
SS
OUT
-0.3 to +5.5
Error Indication Signal Output Pin
Normal : L, Error : Open
Quickly Over Voltage Detection Pin
When detecting abnormality, output operation stops and
IC becomes latch status after 2 clocks.
13
14
FAIL
OUT
IN
-0.3 to +5.5
-0.3 to +5.5
COMPSD
15
16
17
18
COMP
PGND
N2
IN
IN
Detection pin for over voltage
-0.3 to +5.5
-
Power Ground for external MOSFET drive
Output pin for external FET drive circuit (Channel N2)
Output pin for external FET drive circuit (Channel N1)
OUT
OUT
-0.3 to +20
-0.3 to +20
N1
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I/O Equivalent Circuits
STB
RT
FB
REF
REF
VCC
REF
VCC
10KΩ
160KΩ
300KΩ
20Ω
STB
FB
RT
130KΩ
50KΩ
GND
GNDGND
GND
GND
GND
GND
GND
GND
GND
IS
VS
PWMCMP
REF
REF
REF
REF
REF
REF
REF
REF
VCC
PWMCMP
20Ω
100KΩ
1KΩ
VS
100kΩ
10KΩ
IS
10KΩ
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
CP
PWMIN
SDON
REF
VCC
REF
VCC
REF
VCC
350Ω
SDON
350Ω
100KΩ
PWMIN
CP
GND
GND
GND
GND
GND
GND
GND
GND
GND
SS
FAIL
COMPSD
REF
REF
REF
VCC
50Ω
350Ω
100KΩ
FAIL
COMPSD
SS
GND
GND
GND
GND
GND
GND
GND
GND
COMP
N2
N1
REF
VCC
VCC
VCC
VCC
100KΩ
COMP
N2
N1
90KΩ
90KΩ
PGND PGND PGND
PGND PGND PGND
GND
GND
GND
Figure. 5 I/O equivalent circuit
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BD92111F
Block Diagram
RT
VCC
PWMIN
VCC
UVLO
BLOCK
OSC
BLOCK
PWM
BLOCK
SYSTEMꢀ
ON/OFF
STB
BLOCK
STB
FB
CT
VCC
IS
N1
Feedback
BLOCK
VS
LOGIC
DRV
BLOCK
BLOCK
PWM
BLOCK
SS
CT
N2
PWMCOMP
PGND
GND
PROTECT
BLOCK
COMP
COMPSD
SDON
CP
FAIL
Figure. 6 Block Diagram
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BD92111F
Typical Performance Curves
5
70
68
66
64
62
60
58
56
54
52
50
VCC=12V
RRT=100kΩ
RADJ=none
Ta=25°C
4
3
2
1
0
8
10
12
14
CC
16
18
-40 -20
0
20
40
60
80 100
Temperature : Ta [°C]
Supply Voltage : V [V]
Figure 8. Output Frequency vs Temperature
Figure 7. Operating Current vs Power Supply Voltage
50
48
46
44
42
40
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VCC=12V
VCC=12V
RRT=100kΩ
VPWMCMP=OPEN
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature : Ta [°C]
Temprature : Ta [°C]
Figure 9. MAX DUTY vs Temperature
Figure. 10 CP time setting current vs Temperature
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BD92111F
Pin Function Description
PIN.1 VCC
This is power supply pin for the IC. Normal operation range (Typ) is from 9V to 18V. Please place ceramic
capacitor bigger than 0.1µF as bypass capacitor between VCC and GND. It is for noise elimination.
PIN.2 STB
This PIN is for setting of ON/OFF. It is possible to use as reset when shutting down.
Please set the STB terminal voltage below VCC voltage. In addition, please set below 4V if the voltage is applied
earlier than VCC.
Depending on input voltage to STB pin, the status of IC might be switched (ON/OFF). Please avoid using between
the two status (0.8V to 2.0V)
PIN.3 GND
This is signal system GND for IC inside. Please make it independent from PGND as much as possible (We
recommend this because it has less influence with switching noise which comes from short circuit of PGND and
GND at connector close to GND pin.
Vin
GND_PIN
PGND
GND
Figure. 11
PIN.4 RT
Set up the charge/discharge current by frequency of IC inside.
By changing the resistance value of resistor between RT pin and GND, it is possible to set up basic drive
frequency as following formula;
Basic frequency means output N1, N2 frequency which is determined only with resistor between RT pin and GND.
5
1.217 (3.32 10 RRT[k])
fOUT
[kHz]
4
4
(2.4948 10 ) (2.537110 RRT[k])
1,000
100
10
BD92111F
Error Amp
OSC
FB
IS
VS
RT
CFBIS
CFBVS
RFBIS
RFBVS
RRT
1
10
100
1000
RRT [kΩ]
Figure. 13 RRT Resistor connection method
Figure. 12 RT Resistance vs Output Frequency
There is a discrepancy between theoretical formula and actual device. For frequency setting, please thoroughly
verify it with actual application. In addition, frequency may change upon resistor RADJ which is placed between
RT and FB pins
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BD92111F
PIN.5 FB
This is output pin for LED current feedback (IS pin) error amplifier and open LED voltage feedback (VS pin) error
amplifier. The capacitance between FB and IS (1500pF to 0.01µF) also determines start up time of LED current
necessary during phase compensation and brightness adjustment. Capacitance between FB and VS (1500pF to
0.01µF) is for phase compensation of error amplifier.
BD92111F
OSC
Error Amp
Figure. 14 RRT and RADJ Resistor connection method
FB
IS
VS
RT
CFBIS
CFBVS
RFBIS
RFBVS
RADJ
RRT
As shown by left graph, by changing resistor RADJ
between FB and RT, it is possible to determine the
modulation width of frequency.
Modulation width of frequency determined by the
resistor between FB and RT resistor (Theoretical
formula : Example)
When RADJ=100kΩ , Δ fOUT=84.46kHz
.
Figure. 15 Modulation width of Output Frequency vs RADJ Resistance
Output Frequency vs FB Voltage
Modulation width of frequency determined by the
resistor between FB and RT resistor (Theoretical
formula : Example)
When RADJ=100kΩ , Δ fOUT=84.46kHz
FB voltage Vin [V]
Figure. 16 Output Frequency vs FB Voltage
The basic drive frequency is determined by resistor RRT which is connected from RT pin to GND. The basic
frequency is the one at VFB=1.5V, and operation frequency range will be fixed with frequency modulation width that
is determined by RADJ under this condition.
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BD92111F
PIN.6 IS
This is input pin of LED current feedback (IS pin) error amplifier. Please set up as normal voltage 1.25V. When IS
pin voltage becomes less than 0.625V(Typ), the output will be stopped and latched.
50uA
FB
R2
100kΩ
IS
_
+
R1
Error Amp
1.25V
Figure. 17 IS Block Diagram
50µA (Typ) current flows from IS pin to external resistor during OFF period of burst brightness adjustment.
Considering Min value of IS source current during burst brightness adjustment, please set that total resistance
from IS Pin to GND is more than 32kΩ. When R2 is 100kΩ in above diagram, please set R1 + R2 > 32KΩ.
PIN.7 VS
This is input pin of Open LED voltage feedback (VS pin) error amplifier. It has to be 1.25V during LED is open.
When LED is ON, it will be 0.5V to 1.0V. When VS pin becomes over 1.25V, protection circuit will start operation,
and if it becomes more than CP timer set up time (Timer Latch), it will shut down.
Connector
8
7
6
5
FB
R1
Error Amp
_
VS
R2
R3
+
1.25 V
Figure. 18 VS Block Diagram
Please set C1, C2, R1, R2, and R3 value to input 1.25V to VS pin during LED bar’s connector disconnects.
PIN.8 PWMCMP
PWMCOMP pin voltage is fixed by DUTY of drive output N1, N2 in comparison with a saw wave of IC inside. This
pin has 100µA sink/source current capability and when external capacitor is connected between PWMCMP and
GND, IC will operate PWM at brightness start up stage. When N1 and N2 only drive at MaxDuty, please set
PWMCMP=open.
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BD92111F
PIN.9 CP
This pin sets up the time from the point of abnormal detection till shut down (Timer Latch). Having 1µA constant
current charges at external capacitor connected to CP pin, it will shut down when it becomes over 2.0V. During soft
start, there is no charge to CP external capacitor even fulfilling CP pin charge condition (timer latch). External
capacitor is set around 0.01µF to 2.2µF).
VCP CCP 2.0
TCP CCP
2.0106 CCP [sec]
ICP 1.0106
Timer Latch Time TCP
100
10
1uA
Timer latch
Shut-down
1
CCP
2.0V
0.1
0.01
Timer Start
0.001
0.001
0.01
0.1
1
10
CP Capacitance CCP[µF]
Figure. 19 CP Block Diagram
Figure. 20 Timer Latch Time vs CP Capacitance
PIN.10 PWMIN
By inputting PWM pulse signal at PWMIN pin, it is possible to adjust burst brightness. (High level: over 2.0V, Low
level: below 0.8V).
condition
LED condition
Turn On
PWMIN : 2.0V to 5.0V
PWMIN : -0.3V to 0.8V
Turn Off
PIN.11 SDON
This is for the set up of time till COMPSD starts operation when start up. After STB starts to become ON, there will
be 1µA constant current charging at external capacitor that is connected to SDON pin. Then if it becomes over
2.0V, it is possible to detect COMPSD. When it is below 2.0V, immediately latch protection current will no operate.
External capacitor is around 0.01µF to 2.2µF.
1uA
COMPSD
Enable to detect
C
sdon
2.0V
Power On
Figure. 21 IS SDON block diagram
VSDON CSDON 2.0
ISDON
TSDON CSDON
2.0106 CSDON [sec]
1.0106
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BD92111F
PIN.12 SS
This is soft start time and SDON time set up pin. Constant current 2.0µA(Typ) is charged to external capacitor
(0.01µF to 0.1µF). When soft start is under operation (SS pin voltage is less than 3.0V), timer latch protection
circuit by CP charge will not operate.
2uA
Finish Soft
Start
ss
Css
3.0V
Where:
CSS is the capacitance of SS pin
POWER ON
Figure. 22 SS Block Diagram
VSSEND CSS 3.0
ISS
TSSEND CSS
1.5106 CSS [sec]
2.0106
PIN.13 FAIL
This is fail signal output pin of IC. At normal situation, it outputs GND Level and it becomes Open after timer latch
in case any abnormality is detected. The pull up voltage during Open must be set less than rated voltage 5.5V of
FAIL pin. Please connect about 0.1uF capacitor for noise reduction to FAIL pin.
Condition
FAILOutput
GND Level
Open
Normal operation
Abnormal operation
FAIL
Figure. 23 FAIL Block Diagram
PIN.14 COMPSD
This is input pin for shut down detection comparator. When SDON pin voltage is over 2.0V(Typ) and COMPSD is
4.0V(Typ), it will latch after the next clock.
PIN.15 COMP
This is input pin for over voltage protection comparator. The detection voltage of comparator is 4.0V(Typ) and will
start charging to CP pin after over voltage detection. After CP is charged, it will shut down by timer latch.
PIN.16 PGND
This is Power GND pin for output pin N1, N2 at driver part. Please make it independent from GND (Pin 3) pin on
inverter PCB. This pin is not connected to GND pin in IC inside.
PIN.17 N2
This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about
10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ.
PIN.18 N1
This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about
10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ.
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BD92111F
Detection Condition List of the Protection Functions (Typ Condition)
Detect Condition
Protect
Function
Detection
Pin
Timer
Operation
Protection
Type
Release Condition
Detection Condition
SS,SDON
LED OPEN
OVP
IS
VS
IS < 0.625V
VS > 1.25V
SDON>2.0V
SS>3.0V
IS > 0.625V
VS < 1.25V
2CLK
CP
Latch off
Latch off
COMP
COMP
COMP > 4.0V
SS>3.0V
COMP < 3.8V
CP
Latch off
Restart by
release
VCC UVLO
VCC
VCC < 6.0V
-
VCC > 6.5V
-
COMPSD
COMPSD
COMPSD > 4.0V
SDON>2.0V
COMPSD < 3.8V
2CLK
Latch off
To reset the latch type protection, please set STB logic to ‘L’ once. Otherwise the detection of VCCUVLO is required. The count number in the list is calculated
with double of output frequency.
Behavior List of the Protect Function
Operation of the Protect Function
Protect Function
N1,N2 Output
Stop after latch
Stop after latch
Stop after latch
Stop immediately
Stop after latch
SS pin
FAIL pin
LED OPEN
OVP
Low after latch
Low after latch
Low after latch
Low Immediately
Low after latch
High after latch
High after latch
High after latch
High Immediately
High after latch
COMP
VCC UVLO
COMPSD
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BD92111F
Application Example
Introduce an application example with BD92111F
Figure. 24 Application Example
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BD92111F
Timing Chart
When it Detects Quick Detection Type Error
2.0V
STB
( A )
3.0V
SS
2.0V
2.0V
SDON
FB
1.25V
1
IS
0.7V
0.625V
1.25V
0.625V
1.25V
VS
4.0V
4.0V
4.0V
COMP
2
COMSD
2.0V
CP
FAIL
Figure. 25 Timing Chart 1
[The explanation of quick abnormal detection]
Due to the timing of ① to② in the above chart, the IC detects malfunction and starts the output-mute latch without CP
Charge . For ① to②, the malfunction is detected according to the conditions in the table shown below.
No.
Content of Abnormal Detection
Abnormal LED current detection
Condition of Abnormal Detection
IS<0.625V
①
②
COMPSD Over Voltage detection
COMPSD≥ 4.0V
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BD92111F
When it Detects Timer Latch Type Error
2.0V
STB
( A )
( A )
3.0V
3.0V
SS
3.0V
3.0V
SDON
3.2V
FB
1.25V
IS
0.7V
0.625V
1.25V
3
1.25V
VS
4
4.0V
4.0V
1.80V
2.0V
COMP
COMSD
( E )
( F )
CP
FAIL
Figure. 26 Timing Chart 2
[The explanation of Time latch type error detection]
Due to the timing of③ and ④ in the above chart, the IC detects abnormal and starts the timer latch charging. For ③
and ④, the abnormal is detected according to the conditions in the table shown below.
No.
Content of Abnormal Detection
Abnormal LED voltage detection
Condition of Abnormal Detection
VS≥ 1.25V
③
Over voltage detection (multipurpose
protection function)
COMP≥ 4.0V
(release at COMP<3.8V)
④
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BD92111F
Output Timing Chart
BD92111F outputs the signal that operates the Push-Pull or Half-Bridge which is made up of Nch FET. The output
timing of drive signal is shown in the following chart
SYNC
_ OUT
CT _
’
(can t see it)
PWMIN
FB
FB=0.5V
FB=0.5V
Internal CT
PWMCOMP
’
(can t see it)
CT
N1
VCC
N2
VCC
Figure. 27 Output Timing Chart
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BD92111F
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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BD92111F
Operational Notes – continued
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure xx. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD92111F
Ordering Information
B D 9 2 1 1 1
F
-
E 2
Part Number
Package
F:SOP18
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SOP18(TOP VIEW)
Part Number Marking
LOT Number
B D 9 2 111 F
1PIN MARK
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BD92111F
Physical Dimension, Tape and Reel Information
Package Name
SOP18
(Max 11.55 (include.BURR))
(UNIT : mm)
PKG : SOP18
Drawing No. : EX115-5001
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BD92111F
Revision History
Revision No.
Date
Page
Changes
001
31.Jan.2016
All
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
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Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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