BD9300FV-E2_技术文档

TECHNICAL NOTE

Large Current External FET Controller Type Switching Regulators

Single-output Step-up, Negative Voltage,

Step-down Switching Regulators (Controller type)

BD9300F/BD9300FV

Description

The BD9300F/FV 1-channel DC/DC Step-up, step-down, and inverting converter controller.

This IC has a wide input voltage range of 3.6 to 35 V, providing for a variety of applications. The pin assignment is similar to

that of the BA9700, facilitating a space-saving application.

Features

1) 1-channel PWM control DC/DC converter controller

2) High voltage input of 3.6 to 35 V

3) Reference voltage accuracy of ±1%

4) Oscillation frequency variable in the range of 20 to 800 kHz

5) Built-in UVLO (Under Voltage Lock Out) circuit and SCP (Short Circuit Prevention) circuit

6) Current in standby mode: 0 μA (typ.)

7) Switching external synchronization available (Slave operation)

8) SSOP-B14 Package (for BD9300FV) or SOP14 Package (for BD9300F)

Applications

.

TV, power supply for liquid crystal display TV, and backlight

DSC, DVD, printer, DVD/DVD recorder, and other consumer products

Input

Step-up

voltage

output

Step-down

voltage

output

Inverting

voltage

output

Step-up voltage application

Inverting voltage application

Step-down voltage application

Sep. 2008

Absolute maximum ratings(Ta=25˚C)

Item

Power supply voltage

Power dissipation

Symbol

Vcc

Rating

36

Unit

V

*

Pd

400

mW

˚C

Operating temperature

Storage temperature

Output current

Topr

Tstg

Io

–40 to +85

–55 to +125

100

˚C

**

mA

V

Output voltage

Vo

36

Maximum junction temperature

Tjmax

125

˚C

* Reduce by 4 mW/˚C over 25˚C, when mounted on a glass epoxy PCB of 70mmX70mmX1.6mm)

** Should not exceed Pd-value.

Recommended operating range (Ta=25˚C)

Limits

Item

Symbol

Unit

Min

3.6

–

Typ

12

–

Max

35

Power supply voltage

Output sink current

Vcc

I^O

V

30

mA

Output voltage

V^O

–

35

V

Timing capacitance

C

33

1000

pF

T

Timing resistance

RT

5

–

100

800

kΩ

Oscillation frequency

Fosc

20

kHz

Electrical characteristics (Unless otherwise specified, Ta=25˚C, V^CC=12V, CT=200pF, RT=20kΩ)

Limits

T

yp

Item

Symbol

Unit

Conditions

Min

Max

[Reference voltage block]

Reference voltage

V^REF

V^DLI

2.475 2.500 2.525

V

IREF=1mA

Vcc=3.6 to 35V

IREF=1mA

Input stability

Load stability

–

1.5

0.5

20

mV

VDLD

mV IREF=0 ~ 1mA

V

1/2 reference voltage

1/2V^REF

1.212 1.25 1.288

[Triangular wave oscillator block]

Oscillation frequency

F^OSC

165

–

220

275

–

kHz

V

+

Charge mode threshold voltage

Discharge mode threshold voltage

Frequency variation

V^OSC

1.95

1.45

1

–

V^OSC

V

–

F^DVO

%

Vcc=3.6 to 35V

[Protection circuit block]

Threshold voltage

V^IT

1.5

–

1.8

7

2.1

11

V

Charge current

Iscp

μA

[

]

Rest period adjustment circuit block

Upper limit threshold voltage

Lower limit threshold voltage

Input bias current

Vt^H

2.05

–

V

Duty Cycle=0%

Vt^L

Ibd

Idtc

–

1.35

1

V

Duty Cycle=100%

DTC=1.5V

0.1

500

μA

Latch mode charge current

200

–

DTC=0V

[

]

Under voltage lock out block

Threshold voltage

V^UT

–

2.8

–

V

Not designed to be radiation-resistant.

2/16

Electrical characteristics (Unless otherwise specified, Ta=25˚C, Vcc=12 V, CT=200pF, RT=20 kΩ)

Limits

Item

[Error amplifier block]

Symbol

Unit

Conditions

Null AMP

Min

Typ

Max

Input bias current

I^IB

–

0.1

85

1

–

μA

Open loop gain

AV

dB

Maximum output voltage

Minimum output voltage

V^OH

V^OL

2.3

–

2.5

0.7

–

V

0.9

Output sink current

I^OI

0.1

40

1

–

mA

VFB=1.25V

Output source current

[Output block]

I^OO

70

μA

V^SAT

I^LEAK

–

1.0

–

1.4

10

V

Io=30mA

Saturation voltage

Leak current

μA

OUT=35V

[Control block]

CTL ON voltage

V^ON

V^OFF

I^CTL

2

–

V

CTL OFF voltage

CTL sink current

0.7

90

57

μA

VCTL=5V

[

]

Whole device

Standby current

I^STB

I^CC

–

0

10

μA

VCTL=0V

verage supply current

A

1.2

2.4

mA

RT=VREF

Not designed to be radiation-resistant.

Measurement circuit diagram

VCC

1kΩ

FM

A

OUT

A

VCC

V

+

-

Null

A

SCP

V

CTL

V

200pF

I^REF

1kΩ

V^REF

A

1kΩ

V

FB

NON

A

20kΩ

DTC

V

100kΩ

470pF

Fig. 1 Typical measurement circuit

3/16

Reference characteristics data (Unless otherwise specified, Ta=25˚C)

2.56

2.55

2.54

2.53

2.52

2.51

2.50

2.49

2.48

2.47

2.46

2.45

218

216

214

212

210

208

206

204

202

200

0.10

0.09

0.08

0.07

0.06

0.05

0.04

0.03

0.02

0.01

0.00

25˚C

85˚C

-40˚C

-40

-20

0

20

40

60

80

-40

-20

0

20

40

60

80

0

4

8

12 16 20 24

28 32 36

AMBIENT TEMPERATURE Ta [˚C ]

INPUT VOLTAGE Vcc [V]

Fig.2 Reference voltage vs.

Ambient temperature

Fig.3 Switching frequency vs.

Ambient temperature

Fig.4 Standby current

3.00

2.75

2.50

2.25

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0.25

0.00

3.00

2.75

2.50

2.25

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0.25

0.00

3.00

2.75

2.50

2.25

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0.25

0.00

25˚C

85˚C

-40˚C

25˚C

85˚C

25˚C

-40˚C

85˚C

-40˚C

85˚C

25˚C

-40˚C

0

4

8

12 16 20 24

28 32 36

0

4

8

12 16 20 24 28 32 36

0

2

4

6

8

10

12

14

INPUT VOLTAGE Vcc [V]

REFERENCE CURRENT IREF [mA]

Fig.5 Circuit current

Fig.6 Reference voltage

Fig.7 Reference voltage vs. Output current

3.00

2.75

2.50

2.25

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0.25

0.00

4.00

3.75

3.50

3.25

3.00

2.75

2.50

2.25

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0.25

0.00

80

75

70

65

60

55

50

25˚C

85˚C

45

-40˚C

40

35

30

25

20

15

10

5

25˚C

-40˚C

25˚C

-40˚C

85˚C

0

0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2

CONTROL VOLTAGE CTL [V]

0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.5

CONTROL VOLTAGE VCTL [V]

0

10 20 30 40 50 60 70 80 90 100

OUTPUT CURRENT OUT [mA]

Fig.8 Control threshold voltage

Fig.9 Output current capacitance

Fig.10 Control sink current

4/16

Pin assignment

Block diagram

1/2VREF

13

INV

12

VREF

11

CTL

10

SCP

9

Vcc

8

NON

14

2.5V

VREF

–

ERR

+

1.25V

TIMER

LATCH

–

+

PWM

OSC

1

2

3

4

5

6

7

DTC

RT

CT

FB

OUT

N.C.

GND

Fig. 11 Pin assignment / Block diagram

Pin assignment and function

Pin No.

Pin name

Function

1

2

DTC

RT

Rest period setting voltage input

External timing resistance

External timing capacitance

Error amplifier output

PWM output (open collector)

–

3

CT

4

FB

5

OUT

N.C.

GND

Vcc

6

7

Ground

8

Power supply

9

SCP

CTL

External timer latch setting capacitance (Ground if not used)

Control input

10

11

12

13

14

VREF

INV

Reference voltage output

Inverting input for error amplifier

1/2 reference voltage output

1/2VREF

NON

Non-inverting input for error amplifier

5/16

Description of operations

30kΩ

500Ω

VCC

100μF

33μH

Vo

1/2

100μF

100pF

INV

12

SCP

9

Vcc

8

VREF CTL

NON VREF

500Ω

0.1μF

90kΩ

30kΩ

33kΩ

14

13

1

10

1

20kΩ

0.1μF

VREF

100pF

51kΩ

2.5V

1.25V

–

+

ERR

TIMER

LATCH

1000pF

–

+

PWM

OSC

2

3

6

1

4

5

7

DTC

RT

CT

220pF

FB

OUT

GND

N.C.

20kΩ

Fig. 12 Typical application circuit

VREF block

The VREF block is a block to output a reference voltage of 2.5 V (TYP), which is used as the operating power supply for all the

Internal. The CTL pin is used to turn ON/OFF the reference voltage. Furthermore, this reference voltage has a current

capacitance of 1 mA (MIN) or more, from which a high-accuracy reference voltage can be generated through dividing

resistance.

ERRAMP block

The ERRAMP block is an error amplifier to amplify potential between the NON and the INV pins and then output a voltage.

The FB pin output voltage determines the output pulse Duty. When the FB voltage reaches 1.95 V (TYP) or more, switching

will be OFF (Duty=0%). When the FB voltage reaches 1.45 V (TYP) or less, the output NPN Tr will be FULL ON (Duty=100%).

OSC block

The OSC block is a block to determine the switching frequency through the RT and the CT pins. RT and CT voltages determine

the triangular waveform.

TIMER LATCH block

The TIMER LATCH block is an output short circuit protection circuit to detect output short circuit when the output voltage from

the FB pin of the error amplifier reaches 1 V (TYP) or less. When the FB voltage reaches 1 V (TYP) or less, the TIMER will

starts operating to charge the SCP pin at a current capacitance of 7 μA (TYP). When the SCP voltage reaches 1.8 V (TYP),

the LATCH will be activated to shut down the circuit.

PWM/Driver block

The PWM/Driver block is a PWM comparator to determine Duty value differences between output from the error amplifier

and the oscillator triangular wave. The DTC voltage determines the maximum duty ratio. When the DTC voltage reaches

1.95 V (TYP), the switching OFF is activated. FULL ON will be activated when the DTC voltage reaches 1.45 V (TYP).

The DTC voltage setting should be made through dividing resistance with the VREF block.

6/16

Timing chart

.

Basic operation

OSC

[V]

2

1

DT

FB

0

5

VCC

[V]

0

VREF

[V]

2.5

0

5

CTL

[V]

0

5

0

OUT

[V]

NON

[V]

2.5

0

Fig. 13 Basic operation

.

When the short circuit protection is activated

5

VO

[V]

0

2.5

NON

[V]

1.25

0

FB

[V]

2.5

FB

DTC

1.5

0

DTC

[V]

1.8

SCP

[V]

0

Fig. 14 Timing when the short circuit protection is activated

7/16

External component setting procedure

(1) Design of feedback resistance constant

Set step-down, step-up, and inverting feedback resistance as shown below. Set resistance in the range of 1 kΩ to

330 kΩ. Setting the resistance to 1 kΩ or less will result in degraded power efficiency, while setting it to 330 kΩ or

more will increase the offset voltage due to the input bias current of 0.1μA (TYP) of the error amplifier.

.

Vo

Step-down voltage

Vo

Inverting voltage

Vo (Negative)

Step-up voltage

Reference voltage: 1.25 V

R8

R9

R8

R9

R8

R9

12

14

12

14

12

14

+

–

ERR

+

11 VREF

Fig. 15 Step-down voltage

R8+R9

Fig.16 Step-up voltage

X1.25 [V]

Fig. 17 Inverting voltage

R8

R8+R9

Vo =

X1.25 [V]

Vo =

Vo = 1.25 1–

[V]

(

)

R9

(2) Setting of oscillation frequency

Connecting a resistor and capacitor to the RT pin (pin 2) and the CT pin (pin 3) will set the triangular wave oscillation

frequency. The RT determines the charge/discharge current to the capacitor. Referring to Fig. 18, set RT resistor and

the CT capacitor. Recommended setting ranges are 5 to 100 kΩ for the CT resistor, 33 to 1000 pF for the CT capacitor,

and 20 kHz to 800 kHz for the oscillation frequency. Any setting outside of these ranges may turn OFF switching,

thus impairing the operation guarantee.

10000

Ta=25˚C

Vcc=12V

1000

100

10

1

CT=33pF

CT=100pF

CT=200pF

CT=470pF

CT=1000pF

2

10

100

200

RT [kΩ]

Fig. 18 RT/CT vs. Frequency

(3) Setting of DTC voltage

Applying the VDTC voltage to the DTC pin (pin 1) will fix the maximum duty ratio.This will serve to prevent the power

transistor (FET) from being FULL ON. Fig. 19 shows the relationship between the DTC voltage and the maximum duty

ratio. Referring to this Figure, set the DTC voltage.Next, generate the VDTC by dividing the VREF voltage with resistance

and then input the VDTC in the DTC pin.

120

Ta=25˚C

Vcc=12V

Fosc=220kHz

100

80

60

40

20

0

-20

1.4

1.5

1.6

1.7

1.8

1.9

2

VDTC [V]

Fig. 19 DTC voltage vs. Maximum duty

Furthermore, the maximum duty ratio should be designed so as not to become a maximum duty for the normal use. The

following section shows ranges for the normal use.

.

Step-down voltage

ONDutyMAX =

Step-up voltage

ONDutyMAX =

nverting voltage

ONDutyMAX =

VOMAX

VCCMIN

VOMAX – VOMIN

VOMAX

VOMAX – VCCMIN

8/16

(4) Setting of soft start time

Adding a capacitor to the DTC resistance divider will enable the soft start function activation.

The soft start function will be required to prevent an excessive increase in the coil current and overshoot of the output voltage,

while in startup operation. Fig. 20 shows the relationship between the capacitor and the soft start time. Referring to this Figure,

set the capacitor. It is recommended to set the capacitance value in the range of 0.01 to 10 μF. Setting the capacitance value to

0.01 μF or less, may cause overshoot to the output voltage, while setting it to 10 μF or more may cause an inverse current

in the internal parasitic diode when the power supply is grounded, thus resulting in damage to the internal element.

the internal element.

1.00E+02

Ta=25˚C

Vcc=12V

Vo=5V

Fosc=220kHz

L=33 μH

1.00E+01

1.00E+00

1.00E–01

COUT=100μF

R1=20k

R2=33k

1.00E–09

1.00E–08

1.00E–07

CDTC [F]

1.00E–06

1.00E–05

Fig. 20 Soft start capacitance vs. Delay time

Vcc

C5

Q1

R6

Q2

D1

L

R7

C6

D2

C7

OUT

Fig. 21 ON/OFF peak circuit

Since the PNP Tr is generally slow in switching, in terms of the sat characteristics , the ON/OFF peak circuit is used as

an acceleration circuit. The D1 and the C7 generate an ON peak current, while the Q1 and the C7 forms an OFF peak

circuit.Set pull-up resistance to 510 Ω as a guide at VCC=12 V. It is recommended to set this resistance in the range of

100 kΩ to 10 kΩ. In order to make adjustment of the R6 and R7, however, pay attention of the points listed in table below.

NO.

1

Item

To reduce R6

Degraded

To reduce R7

Degraded

Efficiency

2

Tr Turn ON / Turn OFF

Switching frequency

Load current capacitance

Faster Turn OFF

Increasable

Degraded

Faster Turn OFF

Increasable

Degraded

3

4

Take 1000 pF as a guide for the C7 setting. If the ON/OFF peak currents are inadequate, increase the C7 capacitance

value. It is recommended to set capacitance values in the range of 100 pF to 10000 pF. Setting the capacitance value

to 10000 pF or more may increase the peak current and degrade the power efficiency.

9/16

(6) Phase compensation

Phase compensation setting procedure

The phase compensation setting procedure varies with the selection of output capacitors used for DC/DC converter

application. In this connection, the following section describes the procedure by classifying into the two types.

Furthermore, the application stability conditions are described in the Description section.

1. Application stability conditions

2. For output capacitors having high ESR, such as electrolytic capacitor

3. For output capacitors having low ESR, such as ceramic capacitor or OS-CON

1. Application stability conditions

The following section shows the stability conditions of negative feedback system.

.

DSC, DVD, printer, DVD/DVD recorder, and other consumer productsAt a 1 (0-dB) gain,

the phase delay is 150˚ or less (i.e., the phase margin is 30˚ or more).

Furthermore, since the DC/DC converter application is sampled according to the switching frequency, GBW of the overall

system should be set to 1/10 or less of the switching frequency. The following section summarizes the targeted

characteristics of this application.

.

DSC, DVD, printer, DVD/DVD recorder, and other consumer productsAt a 1 (0-dB) gain, the phase delay is 150˚ or

less (i.e., the phase margin is 30˚ or more).

.

DSC, DVD, printer, DVD/DVD recorder, and other consumer productsThe GBW (i.e., frequency at 0-dB gain) for this

occasion is 1/10 or less of the switching frequency.

In other words, the responsiveness is determined with restrictions on the GBW. Consequently, in order to upgrade

the responsiveness, higher switching frequency should be provided.

In order to ensure the stability through the phase compensation, a secondary phase delay (–180˚) resulting from LC

resonance should be canceled with a secondary phase lead (i.e., through inserting two phase leads).

Furthermore, the GBW (i.e., frequency at 1-dB gain) is determined according to phase compensation capacitance to be

provided for the error amplifier. Consequently, in order to reduce the GBW, increase the capacitance value.

(1) Typical (sun) integrator (Low pass filter)

(2) Open loop characteristics of (mon) integrator

(a)

A

–20dB/decade

+

–

FB

Gain

[dB]

A

Feedback

R

GBW(b)

0

f

0

Phase

[˚]

C

–90˚

–90

Phase margin

–180˚

–180

f

(a) point

fa=

[Hz]

(b) point fb=GBW=

[Hz]

Fig. 22 Typical integrator characteristics

Since the error amplifier is provided with (sun) or (mon) phase compensation, the low pass filter is applied. In the case of

the DC/DC converter application, the R becomes a parallel resistance of the feedback resistance.

10/16

2. For output capacitors having high ESR, such as aluminum electrolytic capacitor

For output capacitors having high ESR (i.e., several ohms), the phase compensation setting procedure becomes

comparatively simple. Since the DC/DC converter application has a LC resonant circuit attached to the output,

a –180˚ phase-delay occurs in that area. If ESR component is present there, however, a +90˚ phase-lead occurs to shift

the phase delay to –90˚. Since the phase delay is desired to set within 150˚, this is a very effective method but has

a demerit to increase the ripple component of the output voltage.

(3) LC resonant circuit

(4) With ESR provided

Vcc

L

Vo

RESR

C

fz=

[Hz]

fz=

: Resonance point

[Hz]

At this resonance point, a -180˚

phase-delay occurs.

fESR=

[Hz]

: Phase lead

A –90˚ phase-delay occurs.

* Same for the phase compensation of inverting and step-up voltages

Fig. 23 DC/DC converter output application

According to changes in phase characteristics due to the ESR, only one phase lead should be inserted. For this phase

lead, select either of the methods shown below:

(5) Insert feedback resistance in the C.

(6) Insert the R3 in integrator.

Vo

R3

C1

C2

R1

R2

R1

–

FB

A

+

fz=

Phase lead:

[Hz]

Fig. 24 Typical phase compensation circuit

To cancel the LC resonance, phase lead frequency should be set close to the LC resonant frequency.

11/16

3. For output capacitors having low ESR, such as a ceramic capacitor or OS-CON

In order to use capacitors having low ESR (i.e., several tens of mW), two phase-leads should be inserted so that a

–180˚ phase-dela y, due to LC resonance, will be compensated. The following section shows a typical phase

compensation procedure.

.

Phase compensation with secondary phase lead

Vo

R3

fz

1

=

Phase lead:

[Hz]

C2

C1

R1

R2

FB

–

fz

2

INV

A

+

LC resonant frequency: fr=

[Hz]

Fig. 25 Typical circuit after secondary compensation circuit

For the settings of phase lead frequency, insert both of the phase leads close to the LC resonant frequency.

Phase compensation on the BD9300F/FV

For BD9300F/FV, since the error amplifier input is inverted to the normal input, the phase compensation procedure is

slightly different. (The BD9300F/FV returns feedback to the NON pin.)

Vo

Internal REG

2.5V

The BD9300 returns feedback to the +

side of the error amplifier.

100kΩ

R1

FB

+

A

–

100

kΩ

R2

C

Fig. 26 Typical circuit after phase compensation on BD9300F/FV

The BD9300F/FV feeds back on the + side input and returns the phase compensation on the - side input. Consequently,

resistance of the resistance divider being used to determine the reference voltage has influence on the frequency

characteristics. (The BD9300F/FV has a 1/2 VREF pin to divide resistance by 100 kΩ.)

The following section shows the phase characteristics.

1

Primary phase delay: fp =

[Hz], where A is approximately 80 dB.

100kΩ

2

1

Phase lead:

fz =

[Hz]

100kΩ

2

As a result, inserting a phase compensation capacitor will cause phase lead component. If any further phase lead is

required, add a capacitor in parallel with the R1.

12/16

Equivalent circuit

(1) DTC

V^REF

VREF

1kΩ

100Ω

DTC

RT

(3) CT

(4) FB

V^REF

VREF

17.8kΩ

100Ω

500Ω

FB

CT

100kΩ

(5) OUT

(9) SCP

VREF

V^REF

OUT

500Ω

SCP

2kΩ

(10) CTL

(12) INV

VREF

V^REF

V^CC

1kΩ

CTL

INV

75kΩ

50kΩ

(13) 1/2VREF

(14) NON

VREF

100kΩ

1kΩ

1/2VREF

NON

100kΩ

13/16

Cautions on use

1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the

devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to

exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.

2) GND potential

Ground-GND potential should maintain at the minimum ground voltage level. Furthermore, no terminals should be lower than the GND

potential voltage including an electric transients.

3) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if

positive and ground power supply terminals are reversed. The IC may also be damaged if pins are shorted together or are shorted to other

circuitís power lines.

5) Operation in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.

6) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always

discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or removing it from a jig or

fixture, during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when

transporting and storing the IC.

7) IC pin input

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements to keep them isolated. PñN junctions are

formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the

relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the PñN junction operates as a parasitic diode.

r.

When Pin B > GND > Pin A, the PñN junction operates as a parasitic transisto

Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference among

circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is

lower than the GND (P substrate) voltage to an input pin, should not be used.

Resistor

Transistor (NPN)

B

(Pin A)

(Pin B)

C

E

GND

N

P

N

P

+

P

N

Parasitic element

Player

GND

Player

GND

Parasitic element

(Pin B)

(Pin A)

C

E

B

Parasitic element

GND

Parasitic element

Fig. 28 Typical simple construction of monolithic IC

8) Ground wiring pattern

The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage

on the power ground line may damage the device.

14/16

Derating curve

BD9300FV

BD9300F

PD

[mW]

PD

[mW]

(1) IC Only

(2)

(1)

(2)

(1)

400

(2) On 70 X 70 X 1.6mm Board

350

300

200

100

0

25

50

75

100

125

0

25

50

75

100

125

Ta [˚C ]

Ta [ ]

˚C

Fig. 29 Thermal derating characteristics

Selection of order type

–

B D 9 3 0 0 F V

E 2

Product name

Package

FV:SSOP-B14

F :SOP14

Package/Forming specifications

E2 : Embossed carrier tape

Package specifications

SOP14

Package style

Embossed carrier tape

2500pcs

Q’ty per package

Packaging direction E2

(When holding a reel by left hand and pulling out the tape by

right hand, No. 1 pin appears in the upper left of the reel.)

No. 1 pin

Pulling-out side

Reel

*Orders are available in complete units only.

SSOP-B14

Package style

Embossed carrier tape

2500pcs

Q’ty per package

Packaging direction E2

(When holding a reel by left hand and pulling out the tape by

right hand, No. 1 pin appears in the upper left of the reel.)

No. 1 pin

Pulling-out side

Reel

*Orders are available in complete units only.

15/16

Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD9300FV-E2
厂家：	ROHM
描述：	Switching Controller, Voltage-mode, 0.1A, 275kHz Switching Freq-Max, PDSO14, SSOP-14 开关光电二极管
文件：	总19页 (文件大小：1069K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD9300FV-E2 [ROHM]

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