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BD93941EFV_15 [ROHM]

White LED Driver for large LCD Panels (DCDC Converter type);
BD93941EFV_15
型号： BD93941EFV_15
厂家： ROHM    ROHM
描述：

White LED Driver for large LCD Panels (DCDC Converter type)

CD
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Datasheet  
LED Drivers for LCD Backlights  
White LED Driver for large LCD  
Panels (DCDC Converter type)  
BD93941EFV BD93941FP  
General Description  
Features  
BD93941EFV and BD93941FP is a high efficiency driver  
for white LEDs and designed for large LCDs. These ICs  
are built-in a boost DCDC converters that employ an  
array of LEDs as the light source. BD93941EFV and  
BD93941FP have some protect function against fault  
conditions, such as the over-voltage protection (OVP),  
the over current limit protection of DCDC (OCP), the  
short circuit protection (SCP), the open detection of LED  
string. Therefore BD93941EFV and BD93941FP are  
available for the fail-safe design over a wide range  
output voltage.  
4ch LED constant current driver and DC/DC converter  
Maximum LED Current: 200mA  
LED Feedback Voltage: 0.37V (@ADIM=2.5V)  
so lower heat. Adjustable Feed Back Voltage  
by following LED Current setting.  
2% LED current accuracy (ADIM=2.5V,  
when each LED is set to 100mA)  
Analog current (Linear) dimming at ADIM pin  
LED pin rating 60V  
Individual detection and individual LED OFF for both  
open and short circuits  
Built-in ISET pin short-circuit protection circuit  
Set Soft-Start time by external capacitor.  
FET’s Gate (N pin) is driven by 5.8V swing  
Built-in Vout discharge circuit for shutdown  
Built-in Vout overvoltage protection (OVP) /  
reduced voltage protection (SCP) circuit  
HTSSOP-B20 and HSOP20 package with high heat  
radiation efficiency  
Key Specification  
Operating power supply voltage range: 9.0V to 35.0V  
LED minimum current  
LED maximum current:  
Oscillator frequency:  
Operating Current:  
30mA  
200mA  
150kHz (RT=100kΩ)  
4.5mA (Typ.)  
Operating temperature range:  
-40°C to +85°C  
Applications  
TV, Computer Display, Notebook, LCD Backlighting  
Package  
W(Typ.) x D(Typ.) x H(Max.)  
6.50mm x 6.40mm x 1.00mm  
14.90mm x 7.80mm x 2.10mm  
HTSSOP-B20  
HSOP20  
Figure 1(b). HSOP20  
(BD93941FP)  
Figure 1(a). HTSSOP-B20  
(BD93941EFV)  
Typical Application Circuit  
VIN  
Inductor  
Diode  
VIN  
CIN  
COUT  
EXPOSED  
PAD  
REG58  
CREG  
RN2  
FET  
ON/OFF  
REG58  
N
STB  
RVCC  
VCC  
RCS  
DN RN1  
CVCC  
DCDC_GND  
PGND  
AGND  
LED4  
LED3  
CS  
CLED4  
CLED3  
RRT  
RT  
ROVP1  
ROVP2  
COVP  
OVP  
FB  
LED_GND  
LED2  
RFB CFB1  
CLED2  
CLED1  
CFB2  
LED1  
PWM  
SS  
PWM  
CSS  
AGND  
ISET  
AUTO  
ADIM  
RISET  
CAUTO  
ADIM  
Figure 2. Typical Application Circuit  
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays  
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Absolute maximum ratings (Ta=25°C)  
Parameter  
Symbol  
VCC  
Ratings  
36  
Unit  
V
Power supply voltage  
STB, ADIM, OVP, PWM terminal voltage  
LED1 to 4 terminal voltage  
STB, ADIM, OVP, PWM  
LED1 to 4  
36  
V
60  
V
AUTO, REG58, CS, N, ISET, SS, FB, RT terminal  
voltage  
AUTO, REG58, CS, N,  
ISET, SS, FB, RT  
7
V
Power dissipation (HTSSOP-B20)  
(HSOP20)  
Pd1  
Pd2  
3.20 *1  
2.18 *2  
W
Operating temperature range  
Storage temperature range  
Junction temperature  
Topr  
Tstg  
-40 to +85  
-55 to +150  
150  
°C  
°C  
°C  
Tjmax  
*1 Ta = 25°C or more, diminished at -25.6mW/°C in the case of HTSSOP-B20  
(when 4-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mounted)  
*2 Ta = 25°C or more, diminished at -17.4mW/°C in the case of HSOP20  
(when 4-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mounted)  
Operating Ratings  
Parameter  
Symbol  
VCC  
Limits  
9.0 to 35.0  
30  
Unit  
V
VCC supply voltage  
Min. output current of LED1 to 4  
Max. output current of LED1 to 4  
ILED_MIN  
mA *1  
mA  
*1,2  
ILED_MAX  
VADIM1  
200  
0.2 to 2.7 (normal op.)  
1.0 to 2.7 (start up)  
ADIM input voltage1 (use ADIM function)  
V *3  
ADIM input voltage1 (don’t use ADIM function)  
DC/DC oscillation frequency  
VADIM2  
Fsw  
REG58 to 35.0  
100 to 800  
30  
V
kHz  
μs  
Min. on-duty time for PWM light modulation  
*1 The amount of current per channel.  
PWM_MIN  
*2 If LED makes significant variations in its reference voltage, the driver will increase power dissipation, resulting in a rise  
in package temperature.  
To avoid this problem, design the board with thorough consideration given to heat radiation measures.  
*3 To avoid unused LED pin’s misdetection, set ADIM within 1.0V to 2.7V at start up stage. After unused LED pin’s  
detection, set ADIM within 0.2V to 2.7V in normal operation.  
Pin Configuration  
HSOP20  
HTSSOP-B20  
1
2
3
4
5
20  
19  
18  
17  
16  
VCC  
ADIM  
RT  
AUTO  
REG58  
CS  
FB  
SS  
N
DCDC_GND  
6
7
15  
14  
13  
12  
11  
OVP  
STB  
LED1  
ISET  
PWM  
LED4  
LED3  
N.C.  
8
9
LED2  
10  
LED_GND  
Figure 3. Pin Configuration  
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Marking diagram and physical dimension  
HTSSOP-B20  
HSOP20  
LOT No.  
BD93941FP  
D93941  
LOT No.  
Figure 4. Physical Dimension  
Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)  
Limit  
Parameter  
[Whole Device]  
Symbol  
Unit  
Condition  
Min.  
Typ.  
Max.  
STB=3V,PWM=3V,  
RT=100kΩ  
Circuit current while in operation  
ICC  
-
-
4.5  
40  
9
mA  
Circuit current while in standby  
[REG58 Block]  
ISTB  
80  
μA  
STB=0V  
REG58 Output Voltage  
REG58 available current  
[UVLO Block]  
REG58  
IREG58  
5.742  
15  
5.8  
-
5.858  
-
V
IO=0mA  
mA  
UVLO release voltage  
UVLO hysteresis voltage  
[DC/DC Block]  
VUVLO_VCC  
VUHYS_VCC  
6.5  
7.5  
8.5  
V
VCC=SWEEP UP  
150  
300  
600  
mV  
VCC=SWEEP DOWN  
Error amp. Reference voltage  
Oscillation frequency  
VLED  
fsw  
0.35  
142.5  
83  
0.37  
150.0  
90  
0.39  
157.5  
97  
V
kHz  
%
ISET=75kΩ, ADIM=2.5V  
RT=100kΩ  
Max. duty cycle per output of N pin  
On resistance on N pin source side  
On resistance on N pin sink side  
SS pin source current  
DMAX  
RT=100kΩ  
RONH  
-
-
4
3
8
6
Ω
Ω
ION=-10mA  
ION=10mA  
SS=2V  
RONL  
ISSSO  
-4  
3.3  
-2  
3.7  
-1  
4.1  
uA  
V
Soft start completion voltage  
FB sink current  
VSS_END  
IFBSINK  
IFBSOURCE  
VCS  
SS=SWEEP UP  
50  
100  
-100  
0.45  
150  
-50  
μA  
μA  
V
LED=2.0V, FB=1.0V  
LED=0V, FB=1.0V  
CS=SWEEP UP  
FB source current  
-150  
0.40  
Over current detection voltage  
0.50  
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BD93941EFV BD93941FP  
Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)  
Limit  
Parameter  
Symbol  
Unit  
Condition  
Min.  
Typ.  
Max.  
[DC/DC Protection Block]  
Overvoltage protection detection  
voltage  
Overvoltage protection detection  
hysteresis voltage  
Short circuit protection detection  
voltage  
VOVP  
VOVP_HYS  
VSCP  
2.7  
50  
3.00  
100  
3.3  
200  
0.25  
V
mV  
V
OVP=SWEEP UP  
OVP=SWEEP DOWN  
OVP=SWEEP DOWN  
0.04  
0.10  
[LED Driver Block]  
ILED=100mA,  
(ADIM=2.5V,ISET=75kΩ)  
ILED=70mA,  
(ADIM=1.75V,ISET=75kΩ)  
ILED=50mA,  
LED pin current accuracy 1  
dILED1  
dILED2  
dILED3  
dILED4  
dILED5  
-2  
-3.2  
-4.6  
-8  
-
-
-
-
-
2
3.2  
4.6  
8
%
%
%
%
%
LED pin current accuracy 2  
LED pin current accuracy 3  
LED pin current accuracy 4  
LED pin current accuracy 5  
(ADIM=1.25V,ISET=75kΩ)  
ILED=30mA,  
(ADIM=0.75V,ISET=75kΩ)  
ILED=100mA,  
(ADIM=7V,ISET=75kΩ)  
-3  
3
LED pin Leakage Current  
LED open detection voltage  
LED short detection voltage  
ADIM pin Input Current  
[STB Block]  
ILLED  
VOPEN  
VSHORT  
ILADIM  
-2.5  
0.05  
4
-
0.2  
5
2.5  
0.285  
6
μA  
V
LED=60V  
LED=SWEEP DOWN  
LED=SWEEP UP  
ADIM=3V  
V
-2.5  
-
2.5  
μA  
STB pin high-level voltage  
STB pin low-level voltage  
STB pin pull-down resistance  
[PWM Block]  
STBH  
STBL  
RSTB  
2
-
-
35  
0.8  
V
V
STB=SWEEP UP  
STB=SWEEP DOWN  
STB=3.0V  
-0.3  
500  
1000  
1500  
kΩ  
PWM pin high-level voltage  
PWM pin low-level voltage  
PWM pin pull-down resistance  
PWMH  
PWML  
RPWM  
2
-
-
35  
0.8  
420  
V
V
PWM=SWEEP UP  
PWM= SWEEP DOWN  
PWM=3.0V  
-0.3  
180  
300  
kΩ  
[Failure Indication Block (Open Drain)]  
AUTO pin source current  
AUTO pin Detection Voltage  
Abnormal Detection Timer  
IAUTO  
-2  
-1  
4.0  
20  
-0.5  
4.4  
μA  
V
AUTO=2V  
VAUTO  
tCP  
3.6  
AUTO=SWEEP UP  
RT=75kΩ  
ms  
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Pin Descriptions (BD93941EFV)  
Pin No  
1
Pin Name  
In/Out  
Out  
Out  
In  
Function  
Rating [V]  
-0.3 to 7  
-0.3 to 7  
-0.3 to 7  
-0.3 to 7  
-
AUTO  
REG58  
CS  
Auto-restart time setting pin  
Power supply for N pin  
2
3
DC/DC output current detection and OCP detection pin  
DC/DC switching output pin  
4
Out  
-
N
5
DCDC_GND  
OVP  
Power GND pin  
6
In  
-0.3 to 36  
-0.3 to 36  
-0.3 to 60  
-0.3 to 60  
-
Overvoltage protection detection pin  
Enable pin  
7
STB  
In  
8
Out  
Out  
-
LED1  
LED2  
LED_GND  
LED3  
LED4  
PWM  
ISET  
Output pin 1 for LED  
9
Output pin 2 for LED  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Ground pin for LED  
Out  
Out  
In  
Output pin 3 for LED  
-0.3 to 60  
-0.3 to 60  
-0.3 to 36  
-0.3 to 7  
-
Output pin 4 for LED  
External PWM light modulation signal input pin for LED1-4  
LED current setting resistor connection pin  
Analog GND pin  
Out  
-
GND  
SS  
Out  
In/Out  
Out  
In  
Soft start pin / LED protection masking time setting pin.  
Error amp output pin  
-0.3 to 7  
-0.3 to 7  
-0.3 to 7  
-0.3 to 36  
-0.3 to 36  
FB  
RT  
DC/DC drive frequency setting resistor connection pin.  
Analog dimming DC voltage input pin  
Power supply pin  
ADIM  
VCC  
In  
Pin Descriptions (BD93941FP)  
Pin No  
1
Pin Name  
In/Out  
Out  
Out  
In  
Function  
Rating [V]  
-0.3 ~ 7  
-0.3 ~ 7  
-0.3 ~ 7  
-0.3 ~ 7  
-
AUTO  
REG58  
CS  
Auto-restart time setting pin  
Power supply for N pin  
2
3
DC/DC output current detection and OCP detection pin  
DC/DC switching output pin  
Power GND pin  
4
In  
N
5
-
DCDC_GND  
GND  
OVP  
FIN1  
6
-
-
In  
-0.3 ~ 36  
-0.3 ~ 36  
-0.3 ~ 60  
-0.3 ~ 60  
-
Overvoltage protection detection pin  
Enable pin  
7
STB  
In  
8
Out  
Out  
-
LED1  
LED2  
LED_GND  
N.C.  
Output pin 1 for LED  
9
Output pin 2 for LED  
10  
11  
12  
13  
14  
15  
FIN2  
16  
17  
18  
19  
20  
Ground pin for LED  
-
Non connection pin  
-
LED3  
LED4  
PWM  
ISET  
GND  
SS  
Out  
Out  
In  
Output pin 3 for LED  
-0.3 ~ 60  
-0.3 ~ 60  
-0.3 ~ 36  
-0.3 ~ 7  
-
Output pin 4 for LED  
External PWM light modulation signal input pin for LED1-4  
LED current setting resistor connection pin  
Analog GND pin  
Out  
-
Out  
In/Out  
Out  
In  
Soft start pin / LED protection masking time setting pin.  
Error amp output pin  
-0.3 ~ 7  
-0.3 ~ 7  
-0.3 ~ 7  
-0.3 ~ 36  
-0.3 ~ 36  
FB  
RT  
DC/DC drive frequency setting resistor connection pin.  
Analog dimming DC voltage input pin  
Power supply pin  
ADIM  
VCC  
In  
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Pin ESD Type  
REG58 / N / DCDC_GND / CS  
ADIM  
FB  
ADIM  
100k  
LED1~4, LED_GND  
RT  
SS  
PWM  
ISET  
STB  
OVP  
AUTO  
Figure 5. Pin ESD Type  
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Block Diagram  
VIN  
IN  
C
+
CREG58  
COUT  
REG58  
OSDET  
OVP  
OVP  
VCC  
CVCC STB  
VCC  
UVLO  
(VCC)  
TSD  
SCP  
REGULATOR  
AUTO  
FILTER  
REG58  
CAUTO  
PWM COMP  
+
-
-
+
RT  
N
Control  
Logic  
OSC  
DRIVER  
CS  
Current  
Sense  
SS  
SS  
Timer  
CSS  
DCDC_GND  
ERR AMP  
GND  
FB  
-
-
-
-
+
RFB  
CFB  
LED1  
LED2  
Current driver  
LED3  
LED4  
PWM  
ADIM  
ISET  
DC  
ISET  
LED_GND  
Open-Short  
Detect  
LSP(5V fixed)  
OSDET  
Figure 6. Block Diagram  
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Typical Performance Curve  
1000  
100  
10  
8
7
6
5
4
3
2
1
0
VCC=24V  
Ta=25°C  
STB=3V,  
PWM=3V,  
RT=100kΩ  
10  
100  
R_RT [kΩ]  
1000  
8
12  
16  
20  
VCC [V]  
24  
28  
32  
36  
Figure 8. N Frequency [MHz] vs. R_RT [kΩ]  
Figure 7. Operating Current (ICC) [mA] vs. VCC[V]  
140  
200  
180  
160  
140  
120  
100  
80  
VCC=24V  
VCC=24V  
Ta=25°C  
120  
100  
80  
Ta=25°C  
RISET=75kΩ  
RISET=75kΩ  
ADIM=2.5V  
60  
60  
40  
40  
20  
20  
0
0
-40 -20  
0
20 40 60 80 100 120 140  
Temp [℃]  
0
0.5  
1
1.5 2  
ADIM [V]  
2.5  
3
3.5  
Figure 9. LED Current (ILED) [mA] vs. Temp [oC]  
Figure 10. LED Current (ILED) [mA] vs. ADIM[V],  
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BD93941EFV BD93941FP  
Pin Function  
○AUTO (1pin)  
This sets up time till auto-restart time from the point of abnormal detection. Having 1μA constant current charge at external  
capacitor connected to AUTO pin, it will start again when it becomes over 4.0V (The auto pin is shorted to GND, this IC’s  
protection function operates latched off mode).  
○Auto-restart period vs. AUTO capacitance (Ideal)  
4.0[V ]C AUTO  
1.0 10 6 [A]  
TAUTO  
4.0 10 6 C AUTO [sec]  
○REG58 (2pin)  
The REG58 pin is used in the DC/DC converter driver block to output 5.8V power. The maximum operating current is 15mA.  
Using the REG58 pin at a current higher than 15mA can affect the N pin output pulse, causing the IC to malfunction and  
leading to heat generation of the IC itself. To avoid this problem, it is recommended to make load setting to the minimum  
level.  
Please place the ceramic capacitor connected to REG58 pin (2.2μF～10μF) closest to REG58-GND pin.  
○CS (3pin)  
The CS pin has the following two functions:  
1. DC/DC current mode current feedback function  
Current flowing through the inductor is converted into voltage by the current sensing resistor RCS connected to the CS pin  
and this voltage is compared with voltage set with the error amplifier to control the DC/DC output voltage.  
2. Inductor current limit function  
The CS pin also incorporates the over current protection (OCP) function. If the CS pin voltage reaches 0.45V (Typ.) or more,  
switching operation will be forcedly stopped.  
○N (4pin)  
The N pin is used to output power to the external NMOS gate driver for the DC/DC converter in the amplitude range of  
approx. 0 to REG58. ON resistances is 4.0Ω(typ.) in sorrce (H side), 3.0Ω(typ.) in sink (L side).  
Frequency setting can be made with a resistor connected to the RT pin. For details of frequency setting, refer to the  
description of the RT pin.  
○DCDC_GND (5pin)  
The PGND pin is a power ground pin for the driver block of the output pin N.  
○OVP (6pin)  
The OVP pin is an input pin for over-voltage protection and short circuit protection of DC/DC output voltage. If over-voltage  
is detected, the OVP pin will stop the DC/DC converter conducting step-up operation. When the short circuit protection  
(SCP) function is activated, the DC/DC converter will stop operation, and then the timer will start counting. When the timer  
completes counting the preset period of time, the LED drivers are stopped.  
The OVP pin is of the high impedance type and involves no pull-down resistor, resulting in unstable potential in the  
open-circuited state. To avoid this problem, be sure to make input voltage setting with the use of a resistive divider or  
otherwise.  
○STB (7pin)  
The STB pin is used to make setting of turning ON and OFF the IC and allowed for use to reset the IC from shutdown.  
Note: The IC state is switched (i.e., the IC is switched between ON and OFF state) according to voltages input in the STB  
pin. Avoid using the STB pin between two states (0.8 to 2.0V).  
○LED1 – LED4 (8,9,11,12pin)  
The LED1 to 4 pins are used to output constant current to LED drivers. Current value setting can be made by connecting a  
resistor to the ISET pin. For the current value setting procedure, refer to the description of “ISET pin”.  
If any of the LED pins is put in an erroneous state (e.g. short circuit mode, open circuit mode, or ground short circuit mode),  
the relevant protection function will be activated.  
○LED_GND (10pin)  
The LED_GND pin is a power ground pin used for the LED driver block.  
○PWM (13pin)  
The PWM pin is used to turn ON and OFF LED drivers. Light can be modulated by changing the duty cycle through the  
direct input of a PWM light modulation signal. The high and low voltage levels of PWM pin is as listed in the table below:  
State  
LED ON state  
LED OFF state  
PWM Voltage  
PWM= 2.0V to 35V  
PWM= -0.3V to 0.8V  
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○ISET (14pin)  
The ISET pin is an output current setting resistor. Output current ILED varies in inverse proportion to resistance.  
The relation between output current ILED and the resistance of ISET pin connection resistor RISET is given by the following  
equation:  
3000  
(ADIM=0.2V to2.7V)  
ILED [mA]   
VADIM [V ]  
R
ISET [kΩ]  
(ADIM>4V to 35V)  
7500  
ILED [mA]   
R
ISET [kΩ]  
Output current setting should be made in the range of 30 to 200mA.  
It prepares automatically to suitable LED feedback voltage that can output LED current set by ISET pin.  
In short LED feedback voltage is dropped when the LED current is small and the IC heating is held automatically.  
In case of a large current is needed, raise the LED pin feedback voltage. And it adjusts automatically to LED pin voltage  
that can be flow large LED current.  
The calculation is as below.  
VLED 3.7 ILED [A] [V ]  
ꢀ
The LED feedback voltage (VLED) is clamped to 0.3V (typ.) when the LED current (ILED) is less than 81.1mA.  
ADIM input range is from 0V to 35V. And the range which the LED currents change with linearity is from 0.2V to 2.7V.  
When it reaches under VISET×0.90V(typ.), the LED current is off to prevent from passing a large current to the LED pin  
when the RISET is shorted and the ISET pin is shorted to the GND. And as the ISET pin returns to a normal state, the LED  
current returns.  
○GND (15pin)  
The GND pin is an internal analog circuit ground of the IC.  
○SS (16pin)  
The SS pin is used to make setting of soft start time and duty for soft start. It performs constant current charge of 2.0 uA to  
the external capacitor connected with SS terminal, which enables soft-start of DC/DC converter.  
Since the LED protection function (OPEN/SHORT detection) works when the SS terminal voltage reaches 3.7 V (typ.) or  
higher, it must be set to bring stability to conditions such as DC/DC output voltage and LED constant current drive operation,  
etc. before the voltage of 3.7 V is detected.  
○FB (17pin)  
The FB pin is an output pin used for DC/DC current mode control error amplifier. In other words, the FB pin detects the  
voltages of LED pins (1 to 4) and controls inductor current so that the pin voltage of the LED located in the row with the  
highest Vf will come to 0.37V (ADIM=2.5V, ILED=100mA). As a result, the pin voltages of other LEDs become higher by Vf  
variation. After completion of soft start, the FB pin is put into the high-impedance state with the PWM signal being in the low  
state, thus maintaining the FB voltage.  
○RT (18pin)  
The RT pin is used to connect a DC/DC frequency setting resistor. DC/DC drive frequency is determined by connecting the  
RT resistor.  
Drive frequency vs. RT resistance (Ideal)  
15000  
RRT  
[k]  
fSW [kHz]  
When RT is 100kΩ, Fsw is 150kHz(typ.). However, drive frequency setting should be made in the range of 100 kHz to 800  
kHz.  
○ADIM (19pin)  
ADIM pin is for analog dimming. Output current is proportionality with input voltage. Basically, ADIM pin assumes the  
voltage inputted externally using high accuracy of resistive divider and etc., IC internally is in OPEN (High impedance)  
condition. Cannot use in an OPEN condition.  
If you don't use analog dimming, please connect pull-up resistor to over 5V (for example REG58).  
○VCC (20pin)  
The VCC pin is used to supply power for the IC in the range of 9 to 35V.  
If the VCC pin voltage reaches 7.5V (Typ.) or more, the IC will initiate operation. If it reaches 7.2V (Typ.) or less, the IC will  
be shut down.  
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Startup operation and soft start (SS) capacitance setting  
The following section describes the sequence for the startup of this IC.  
5V  
VOUT  
SS  
Q D  
PWM  
SLOPE  
SS  
COMP  
N
Css  
DRIVER  
OSC  
SS=FB  
Circuit  
LED  
LED_OK  
FB  
VLED  
PWM  
LED_DRIVER  
Figure 12. Circuit behavior at startup  
Figure 11. Startup waveform  
Description of startup seuence  
(1) Set the STB and PWpin to ON”.  
(2) Set sll systems to “ON”, SS charge will be initiated.  
At this time, a circuit in which SS pin voltage for soft start becomes equal to FB pin voltage operates to equalize the  
FB pin and SS pin voltages regardless of whether the PWM pin is set to Low or High level.  
(3) Since the FB pin and SS pin reach the lower limit of the internal sawtooth wave of the IC, the DC/DC converter  
operates to start VOUT voltage rising.  
(4) The Vout voltage continues rising to reach a voltage at which LED current starts flowing.  
(5) When the LED current reaches the set amount of current, isolate the FB circuit from the SS circuit. With this, the  
startup operation is completed.  
(6) After that, conduct normal operation following the feedback operation sequence with the LED pins.  
If the SS pin voltage reaches 3.7V or more, the LED protection function will be activated to forcedly end the SS and  
FB equalizing circuit.  
SS capacitance setting procedure  
As aforementioned, this IC stops DC/DC converter when the PWM pin is set to Low level and conducts step-up operation  
only in the section in which the PWM pin is maintained at High level. Consequently, setting the PWM duty cycle to the  
minimum will extend the startup time. The startup time also varies with application settings of output capacitance, LED  
current, output voltage, and others.  
Startup time at minimum duty cycle can be approximated according to the following method:  
Make maeasurement of VOUT startup time with a 100% duty cycle, first. Take this value as “Trise100”.  
The startup time “Trise_min” for the relevant application with the minimum duty cycle is given by the following equation.  
Trise_100[Sec]  
Trise_min  
[Sec]  
Min_ Duty[ratio]  
However, since this calculation method is just for approximation, use it only as a guide.  
Make setting of time during which the SS pin voltage reaches the FB pin voltage longer than this startup time.  
Assuming that the FB pin voltage is VFB, the time is given by the following equation:  
Css[F]VFB[V]  
Tss   
[Sec]  
2[A]  
As a result, it is recommended to make SS capacitance setting so that “Tss” will be greater than “Trise_min”  
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About unused LED terminal automatic detecting function  
This IC is detected automatically that it is an unused channel by asssuming the LED terminal to be OPEN at starting. It  
explains the sequence.  
Figure 14. Block diagram  
Sequence;  
① STB=ON  
② All systems are ON at initial timing of PWM=H. SS starts charging.  
③ When the output voltage is boosted enough, and enough current flows through the LED, LED_OK signal is switched  
in the IC. PWM=L from the Rise timing of this signal for about 20us  
④ During this PWM=L period, LED pins with LED connections' output voltage becomes 0.2V and above, where as  
unused LED pins are below 0.2V.  
⑤ During this time, determination on whether the LED pins are 0.2V above/below is done.  
⑥ After the determination, unused LED pins are pulled up to 5V.  
⑦The AUTO signal remains “L” level.  
In addition, automatic determination of the OPEN decision will only be in SS range, therefore, please set the application so  
that the step-up/boost be completed before SS> 3.7V.  
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LED current setting  
Setting of LED output current “ILED” can be made by connecting a resistor RISET to the ISET pin.  
RISET vs. ILED current relation equation  
7500  
(ADIM=2.5V)  
RISET  
[k] ꢀ  
I
LED [mA]  
However, LED current setting should be made in the range of 30mA to 200mA.  
[Setting example]  
To set ILED current to 100mA, RISET resistance is given by the following equation:  
7500  
7500  
RISET  
75 [k] ꢀ  
I
LED [mA] 100[mA]  
DC/DC converter drive frequency setting  
DC/DC converter drive frequency is determined by making RT resistance setting.  
Drive frequency vs. RT resistance (ideal) relation equation  
15000  
RRT  
[k]  
fSW [kHz ]  
where fsw DC/DC converter oscillation frequency [kHz]  
This equation has become an ideal equation without any correction item included.  
For accurate frequency settings, thorough verification should be performed on practical sets.  
[Setting example]  
To set DC/DC drive frequency “fsw” to 200 kHz, RRT is given by the following equation:  
15000  
15000  
RRT  
75 [k] ꢀ  
fsw[kHz] 200[kHz]  
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OVP/SCP Settings  
OVP pin is DC/DC output voltage’s over voltage protection and short circuit protection input pin.  
OVP pin is a high impedance pin with no pull down resistor. Thus, at OPEN state please set the voltage  
input settings using voltage dividing resistor and such.  
Respective OVP pin protection conditions are as below  
Protection  
Name  
Detection  
Pin  
Detection  
Condition  
Cancellation  
Condition  
Timer  
Operations  
Protection Type  
DCDC stops during  
detection  
No  
OVP  
SCP  
OVP  
OVP  
OVP>3.0V  
OVP<0.1V  
OVP<2.9V  
OVP>0.1V  
Yes  
All latch  
○OVP Detection Setting  
VOUT abnormally increase、voltage detected by OVP, VOVPDET,  
R1,R2 settings are as follows  
(VOVPDET[V]3.0[V])  
R1R2[k]  
[k]  
3.0[V]  
○OVP Cancellation Setting  
R1,R2 set from above equation,  
OVP cancellation voltage VOVPCAN equals to  
(R1[k]R2[k])  
VOVP 2.9V   
[V]  
CAN  
Figure 15. OVP/SCP setting example  
R2[k]  
○SCP Detection Setting  
When R1,R2 are set using values obtained above, SCP voltage setting is VSCPDET is as follows  
(R1[k]R2[k])  
VSCP 0.1V   
[V]  
DET  
R2[k]  
【Setting Example】  
VOUT at normal operation 56V、OVP detection voltage VOVPDET=68V、R2=10k, R1 is as follows  
(VOVPDET [V] 3.0[V])  
3.0[V]  
(68[V] 3[V])  
3[V]  
R1R2[k]  
10[k]  
216.7 [k]  
When R1, R2 are set at these values, OVP cancellation voltage, VOVPCAN  
(R1[k]R2[k])  
R2[k]  
10[k]216.7[k]  
10[k]  
VOVP 2.9[V]  
2.9[V]  
[V]ꢀ65.7 [V]  
CAN  
In addition, at this R1, R2, SCP detection voltage  
(R1[k] R2[k])  
10[k] 216.7[k]  
10[k]  
VSCP 0.1[V]  
0.1[V]  
[V]ꢀ2.27 [V]  
DET  
R2[k]  
To select DC/DC components, give consideration to IC variations as well as individual component variations,  
and then conduct thorough verification on practical systems.  
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Timer Latch Time Setting  
This IC has a built-in timer latch counter. Timer latch time is set by counting the clock frequency which is  
set at the RT pin. After  
Timer Latch Time  
When various abnormal conditions happen, counting starts from the timing, latch occurs after below time has passed.  
Furthermore, even if PWM=L, if abnormal condition continues, timer count will not reset.  
RRT  
1.51010  
RRT [k]  
1.5107  
LATCHTIME 212   
4096  
[s]  
Here, LATCHTIME = time until latch condition occurs  
RRT = Resistor value connected to RT pin  
Figure 16. Example of LED Short protection timing chart  
【Setting Example】  
Timer latch time when RT=75kohm  
RRT [k]  
1.5107  
75[k]  
LATCHTIME 4096  
4096  
0.02[s]ꢀ  
1.5107  
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OCP Settings/DCDC Components’ Current Capacity Selection Method  
One of the function of CS pin - when its pin voltage>0.45 it stops the DCDC. Thus, RCS resistor value  
need to be checked after the peak current flow through the inductor is calculated. Furthermore, DCDC external  
components’ current capacity needs to be greater than peak current flowing through this inductor.  
（Inductor peak current Ipeak calculation method）  
Firstly, ripple voltage which occurs at the CS pin is decided depending on the DCDC application conditions.  
The conditions when made as below;  
Output voltage=VOUT[V]  
LED total current=IOUT[A]  
DCDC input voltage=VIN[V]  
DCDC efficiency =η[%]  
Total required average input current IIN:  
V
OUT [V]IOUT [A]  
VIN [V][%]  
IIN  
[A]  
Inductor ripple current IL[A] which occurs at inductor L[H] during  
DCDC drive operation with switching frequency=fsw[Hz] is as follows  
(VOUT [V ] VIN [V ]) VIN [V ]  
L[H ]VOUT [V ]fSW [Hz]  
ΔIL   
[A]  
Figure 17. DC/DC convertor application circuit  
Therefore, IL’s peak current Ipeak can be calculated using below equation  
IL[A]  
Ipeak IIN [A]  
[A](1)  
2
(Resistor RCS connected to CS pin selection method)  
This Ipeak flows in RCS and generates voltage. (refer to time chart  
diagram on the right). This voltage value, VCSpeak can be calculated as below  
VCS peak Rcs Ipeak [V ]  
This VCSpeak when reach 0.45V, will stop the DCDC output.  
Thus when selecting RCS value, below condition needs to be met.  
Rcs[]Ipeak[A] 0.45[V ]  
(DCDC Components’ Current Capacity Selection Method)  
When OCP reach detection voltage CS=0.45V, Iocp current  
0.45[V ]  
Figure 18. Inductor current waveform  
IOCP  
[A](2)  
Rcs[]  
Ipeak current (1)、IOCP current (2)、and components’ MAX current capacity needs to satisfy the following  
I peak IOCP Rated current of components  
Above condition needs to be satisfied when selecting DCDC application parts eg. FET, inductor, diode etc.  
Furthermore, continuous mode is recommended for normal DCDC applications. Inductor’s ripple current MIN limit value,  
lmin becoming  
IL[A]  
Im in IIN [A]   
[A] 0  
2
Is a condition to be met. If this is not met, it is called discontinuous mode.  
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【Setting Example】  
Output voltage=VOUT[V]=56V  
LED total current=IOUT[A]=100mA×4ch=0.40A  
DCDC input voltage=VIN[V]=14V  
DCDC efficiency=η[%]=90%  
Total required average input current IIN:  
VOUT [V]IOUT [A]  
VIN [V][%]  
56[V]0.40[A]  
14[V]90[%]  
IIN [A]   
ꢀ  
1.78 [A]  
When, DCDC switching frequency =fsw[Hz]=200kHz  
Inductor L[H]=33uH,  
Inductor ripple current ΔIL[A]:  
(VOUT [V ] VIN [V ]) VIN [V ]  
L[H ]VOUT [V ]fSW [Hz]  
(56[V ] 14[V ]) 14[V ]  
33106 [H ]56[V ]200 103[Hz]  
ΔIL   
ꢀ  
1.59 [A]  
Thus, IL peak current Ipeak becomes  
…Peak current calculation result  
IL[A]  
1.59[A]  
Ipeak IIN [A]   
[ꢀA] 1.78[A]   
2.58 [A]  
2
2
RCS resistor value when set at 0.1ohm  
VCS  
Rcs Ipeak 0.10[]2.58[ A] 0.258 [V ] 0.45V  
…RCS resistor consideration  
peak  
and satisfy the condition.  
In addition、OCP detection current IOCP at this time is  
0.45[V ]  
IOCP  
4.5 [A]  
0.1[]  
If parts used (FET,INDUCTOR、DIODE etc)’s current capacity<5A,  
Rated current of components  
I peak IOCP  
2.58[A] 4.5[A] 5[A]  
…DCDC current capacity consideration  
Thus, there is no problem of parts selection as the above condition is satisfied.  
In addition、IL ripple current minimum limit Imin is  
IL[A]  
Im in IIN [A]   
[A] 1.78[A] 0.795[A] 0.985[A] 0ꢀ  
2
Thus、will not become discontinuous mode。  
To select DC/DC components, give consideration to IC variations as well as individual component variations, and  
then conduct thorough verification on practical systems.  
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Selection of inductor L  
The value of inductor has significant influence on the input ripple current. As  
shown by Equation (1), the larger the inductor and the higher the switching  
frequency, the inductor ripple current ∆IL becomes increasingly lower.  
(VOUT VIN ) VIN  
ΔIL  
ΔIL   
[ꢀA]ꢀꢀꢀꢀ・・・・・ꢀꢀ(1)  
L VOUT fSW  
V
Expressing efficiency as shown by Equation (2), peak input current is given  
as Equation (3).  
IN  
VOUT IOUT  
VIN IIN  
  
ꢀꢀꢀꢀꢀ・・・・・ꢀꢀ(2)  
IL  
L
VOUT IOUT  
VIN  
ΔIL  
ΔIL  
ILMAX IIN  
ꢀꢀꢀꢀ ꢀ・・・・・ꢀ(ꢀ3)  
2
2
VOUT  
where, L: Reactance value [H],  
VOUT : DC/DC output voltage [V],  
VIN: Input voltage [V],  
IOUT: Output load current (total output current) [A],  
IIN: Input current [A], and  
FSW: Oscillation frequency [Hz]  
R
CS  
COUT  
.
Figure 19. Inductor current waveform and diagram  
Note: If a current in excess of the rated current of the inductor applies to the coil, the inductor will cause magnetic  
saturation, resulting in efficiency degradation.  
Select an inductor with an adequate margin so that peak current will not exceed the rated current of the  
inductor.  
Note: To reduce power dissipation from and increase efficiency of inductor, select an inductor with low resistance  
component (DCR or ACR).  
Selection of output capacitor COUT  
Select a capacitor on the output side taking into account the stability region  
of output voltage and equivalent series resistance necessary to smooth  
ripple voltage. Note that higher output ripple voltage may result in a drop in  
LED pin voltage, making it impossible to supply set LED current.  
The output ripple voltage ∆VOUT is given by Equation (4).  
V
IN  
IL  
IOUT  
1
1
L
ΔVOUT ILMAX RESR  
[ꢀV]ꢀ・・・・・ꢀ(ꢀ4)  
COUT  
fSW  
VOUT  
where RESR Equivalent series resistance of COUT  
.
Note: Select capacitor ratings with an adequate margin for output voltage.  
Note: To use an electrolytic capacitor, an adequate margin should be  
provided for permissible current. Particularly to apply PWM light modulation  
to LED, note that a current higher than the set LED current transiently flows.  
R
ESR  
R
CS  
COUT  
Figure 20. Output capacitor diagram,  
Selection of switching MOSFET transistors  
There will be no problem for switching MOSFET transistors having absolute maximum rating higher than rated current of the  
inductor L and VF higher than “COUT breakdown voltage Rectifier diode”. However, to achieve high-speed switching, select  
transistors with small gate capacity (injected charge amount).  
Note: Rated current larger than over current protection setting current is recommended.  
Note: Selecting transistors with low on resistance can obtain high efficiency.  
Selection of rectifier diodes  
Select Schottky barrier diodes having current capability higher than the rated current of the inductor L and inverse  
breakdown voltage higher that COUT breakdown voltage, particularly having low forward voltage VF.  
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Phase Compensation Setting Procedure  
DC/DC converter application for current mode control includes one each of pole fp (phase delay) by CR filer consisting of output  
capacitor and output resistor (i.e., LED current) and zero (phase lead) fZ by the output capacitor and capacitor ESR.  
Furthermore, the step-up DC/DC converter includes RHP zero “fZRHP” as the second zero. Since the RHP zero has phase delay  
(90) characteristics like the pole, the crossover frequency fc should be set to not more than RHP zero  
VOUT  
VIN  
ILED  
L
VOUT  
-
gm  
FB  
RESR  
COUT  
+
RFB1  
CFB1  
RCS  
CFB2  
Figure 21. Output stage and error amplifier diagram  
i. Find pole fp and RHP zero fZRHP of DC/DC converter.  
VOUT (1D)2  
2LILED  
ILED  
fp   
ꢀ[Hz] ꢀ  
fZRHP  
[ꢀHz]ꢀꢀ  
2VOUT COUT  
VOUT VIN  
Where  
Total LED current [A],  
ILEDꢀ  
D   
ꢀ
VOUT  
ii. Find phase compensation to be inserted in the error amplifier. (Set fc to 1/5 of fZRHP.)  
fRHZP RCS ILED  
5f p gmVOUT (1D)  
RFB1  
[ꢀ] ꢀ  
1
5
CFB1  
ꢀ  
[F] ꢀ  
2RFB1 fC  
2RFB1 fZRHP  
where  
gm 4.0104[S]ꢀ  
iii. Find zero used to compensate ESR (RESR) of COUT (electrolytic capacitor).  
RESR COUT  
CFB2  
[ꢀF] ꢀ  
RFB1  
Note: Even if a ceramic capacitor (RESR of the order of milliohms) for COUT, it is recommended to insert CFB2 for  
stable operation.  
To improve transient response, it is necessary to increase RFB1 and reduce CFB1. However, this improvement reduces a phase  
margin. To avoid this problem, conduct thorough verification, including variations in external components, on practical  
systems.  
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Timing Chart  
VCC  
7.5V  
2.0V  
STB  
0.8V  
REG58  
2.6V  
2.4V  
ISET  
RT  
3.7V  
SS  
SS=FB or LED  
feed-back  
LED  
feed-back  
FB  
VOUT  
PWM  
ILEDｘ  
2.0V  
LED_OPEN  
LED_SHORT  
Disable  
Enable  
Disable  
Disable  
Disable  
Disable  
ISET_GND_SHORT  
Enable  
Enable  
Enable  
Disable  
Disable  
Disable  
REG58_UVLO  
VCC_UVLO  
OVP  
SCP  
FB OVER SHOOT  
Figure 22. Timing chart  
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List of Protect Function (typ condition)  
Detection Conditions  
Protection  
Name  
Detection  
Pin  
Cancellation  
Conditions  
Protection Type  
Detection pin  
PWM  
SS  
Immediately Auto-Restart  
after detection  
(Judge periodically  
whether normal or not)  
Immediately Auto-Restart  
after detection  
LED OPEN  
LEDSHORT  
LEDｘ  
LEDx < 0.2V  
LEDx > 5V  
H
SS>3.7V  
LEDx > 0.2V  
LEDx < 5V  
LEDｘ  
H
-
SS>3.7V  
-
(Judge periodically  
whether normal or not)  
Under  
Above  
ISET GND  
SHORT  
ISET  
Auto-Restart  
ISET×90%  
REG58<2.4V  
VCC<7.3V  
OVP>3.0V  
ISET×90%  
REG58>2.6V  
VCC>7.5V  
OVP<2.9V  
REG58 UVLO  
VCC UVLO  
OVP  
REG58  
VCC  
-
-
-
-
-
-
Auto-Restart  
Auto-Restart  
Auto-Restart  
OVP  
Immediately Auto-Restart  
after detection  
(Judge periodically  
whether normal or not)  
Immediately Auto-Restart  
after detection  
SCP  
OVP  
OVP<0.1V  
-
-
OVP>0.1V  
FB OVER  
SHOOT  
FB  
CS  
FB>4V  
-
-
-
-
FB<3.6V  
-
(Judge periodically  
whether normal or not)  
OCP  
OCP>0.45V  
Pulse-by-Pulse  
To clear the latch type, STB should be set to “L” once, and then to “H”.  
Operation after the protection function detected  
Protection Function  
LED OPEN  
DC/DC  
LED Driver  
Soft-start  
Only detects LED,  
stops after CP1 count  
Continue to operate  
Continue to operate  
Only detects LED,  
stops after CP1 count  
LEDSHORT  
ISET GND SHORT  
STB  
Continue to operate  
Stop immediately  
Stop immediately  
Continue to operate  
Continue to operate  
Discharge immediately  
Stop immediately  
Stop  
(and when REG58<2.4V)  
REG58 UVLO  
VCC UVLO  
Stop immediately  
Stop immediately  
Stop immediately  
Stop immediately  
Discharge immediately  
Discharge immediately  
Stop immediately  
(N pin only)  
Stop immediately  
(N pin only)  
OVP  
SCP  
Continue to operate  
Stop after CP1 count  
Continue to operate  
Discharge after CP1 count  
FB OVER SHOOT  
OCP  
Stop after CP2 count  
N pin limits DUTY  
Stop after CP2 count  
Continue to operate  
Continue to operate  
Continue to operate  
* CP1 = 20ms (RT=75KΩ) , CP2=1.31s (RT=75KΩ)  
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© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ22111・15・001  
TSZ02201-0F1F0C100270-1-2  
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Operational Notes  
1.  
2.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply terminals.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3.  
4.  
Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
Thermal Consideration  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when  
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum  
rating, increase the board size and copper area to prevent exceeding the Pd rating.  
6.  
7.  
Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
Rush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush  
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC  
has more than one power supply. Therefore, give special consideration to power coupling capacitance,  
power wiring, width of ground wiring, and routing of connections.  
8.  
9.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
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© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ22111・15・001  
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Operational Notes – continued  
10. Unused Input Terminals  
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance  
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to  
the power supply or ground line.  
11. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should  
be avoided.  
Figure 23. Example of hic IC structure  
12. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
13. Area of Safe Operation (ASO)  
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe  
Operation (ASO).  
14. Thermal Shutdown Circuit(TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction  
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below  
the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from  
heat damage.  
15. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
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TSZ02201-0F1F0C100270-1-2  
12.Aug.2015 Rev.003  
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Ordering Information  
B D 9 3 9 4 1  
F
P -  
E 2  
Part Number  
Package  
EFV: HTSSOP-B20  
Packaging and forming specification  
E2: Embossed tape and reel  
FP : HSOP20  
Marking Diagrams  
HSOP20 (TOP VIEW)  
HTSSOP-B20 (TOP VIEW)  
Part Number Marking  
LOT Number  
Part Number Marking  
LOT Number  
BD93941FP  
D 9 3 9 4 1  
1PIN MARK  
1PIN MARK  
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TSZ02201-0F1F0C100270-1-2  
12.Aug.2015 Rev.003  
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24/27  
TSZ22111・15・001  
Daattaasshheeeett  
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Physical Dimension, Tape and Reel Information 1  
Package Name  
HTSSOP-B20  
<Tape and Reel information>  
Tape  
Embossed carrier tape (with dry pack)  
Quantity  
2000pcs  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
Direction of feed  
1pin  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
∗
www.rohm.com  
TSZ02201-0F1F0C100270-1-2  
12.Aug.2015 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
25/27  
TSZ22111・15・001  
Daattaasshheeeett  
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Physical Dimension, Tape and Reel Information 2  
Package Name  
HSOP20  
Max. 15.25 ( include. BURR )  
Drawing No.  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
2000pcs  
Quantity  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
Direction of feed  
1pin  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
∗
www.rohm.com  
TSZ02201-0F1F0C100270-1-2  
12.Aug.2015 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
26/27  
TSZ22111・15・001  
Daattaasshheeeett  
BD93941EFV BD93941FP  
Revision History  
Date  
Revision  
001  
Changes  
10.Oct.2013  
24.Dec.2014  
Draft Version  
P.2 ADIM input voltage1 (use ADIM function)  
Add ADIM range at start up and add note *3  
002  
p.3 [REG58 Block]  
Soft start completion voltage -> REG58 available current  
12.Aug.2015  
003  
www.rohm.com  
TSZ02201-0F1F0C100270-1-2  
12.Aug.2015 Rev.003  
© 2013 ROHM Co., Ltd. All rights reserved.  
27/27  
TSZ22111・15・001  
Daattaasshheeeett  
Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASSⅢ  
CLASSⅣ  
CLASSⅡb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PGA-E  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Datasheet  
Buy  
BD93941FP - Web Page  
Distribution Inventory  
Part Number  
Package  
Unit Quantity  
BD93941FP  
HSOP20  
2000  
Minimum Package Quantity  
Packing Type  
Constitution Materials List  
RoHS  
2000  
Taping  
inquiry  
Yes  

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