BD9394FP-E2 [ROHM]
White LED Driver for large LCD Panels (DCDC Converter type);
| 型号： | BD9394FP-E2 |
| 厂家： | 
ROHM |
| 描述： | White LED Driver for large LCD Panels (DCDC Converter type) 驱动 CD 接口集成电路 |
| 文件： | 总32页 (文件大小：1105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
LED Drivers for LCD Backlights
White LED Driver for large LCD
Panels (DCDC Converter type)
BD9394FP, BD9394EFV
●General Description
●Features
BD9394FP, BD9394EFV is a high efficiency driver for
white LEDs and designed for large LCDs. This IC is
built-in a boost DCDC converters that employ an array of
LEDs as the light source. BD9394FP, BD9394EFV has
some protect function against fault conditions, such as
the over-voltage protection (OVP), the over current limit
protection of DCDC (OCP), the short circuit protection
(SCP), the open detection of LED string. Therefore
BD9394FP, BD9394EFV is available for the fail-safe
design over a wide range output voltage.
4ch LED constant current driver and DC/DC converter
Maximum LED Current: 150mA
LED Feedback Voltage: 0.37V (@NADIM=2.62V),
so lower heat. Adjustable Feed Back Voltage
by following LED Current setting.
2% LED current accuracy (NADIM=2.62V,
when each LED is set to 100mA)
Analog current (Linear) dimming at NADIM pin
LED pin rating 60V
Individual detection and individual LED OFF for both
open and short circuits
●Key Specification
Built-in ISET pin short-circuit protection circuit
Set Soft-Start time by external capacitor.
FET’s Gate (N pin) is driven by 5.8V swing
Built-in Vout discharge circuit for shutdown
Built-in Vout overvoltage protection (OVP) /
reduced voltage protection (SCP) circuit
Adjustable LED Short Protection Voltage
by LSP terminal
Operating power supply voltage range: 9.0V to 35.0V
LED minimum current
LED maximum current:
Oscillator frequency:
Operating Current:
30mA
150mA
150kHz (RT=100kΩ)
4.5mA (Typ.)
Operating temperature range:
-40℃ to +85℃
●Applications
HSOP20, HTSSOP-B24 package with high heat
radiation efficiency
TV, Computer Display, Notebook, LCD Backlighting
●Package
W(Typ.) x D(Typ.) x H(Max.)
14.90mm x 7.80mm x 2.10mm
7.80mm x 7.60mm x 1.00mm
HSOP20
HTSSOP-B24
● Typical Application Circuit (4 light with PWM)
Fig.1(a) HSOP20
Fig.1(b) HTSSOP-B24
VIN
Inductor
VIN
Diode
CIN
COUT
REG58
CREG
FIN1, 2
RN2
FET
ON/OFF
REG58
N
STB
RVCC
VCC
RCS
DN RN1
CVCC
DCDC_GND
CS
DCDC_GND
LED4
CLED4
RRT
RT
LED3
GND
ROVP1
ROVP2
CLED3
COVP
OVP
FB
LED_GND
RFB CFB1
LED2
LED1
REG58
CLED2
CLED1
RLSP1
RLSP2
CFB2
LSP
CLSP
CSS
PWM
SS
PWM
GND
ISET
AUTO
NADIM
RISET
CAUTO
NADIM
Fig.2 Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
VCC
Ratings
36
Unit
V
Power supply voltage
STB, NADIM, OVP, PWM terminal voltage
LED1 to 4 terminal voltage
STB, NADIM, OVP, PWM
LED1~4
VCC
60
V
V
AUTO, REG58, CS, N, LSP, ISET, SS, FB, RT
terminal voltage
AUTO, REG58, CS, N, LSP,
ISET, SS, FB, RT
7
V
Power dissipation 1(HSOP20)
Power dissipation 2(HTSSOP-B24)
Operating temperature range
Storage temperature range
Junction temperature
Pd1
Pd2
2.18 *1
4.00 *2
W
W
℃
℃
℃
Topr
Tstg
-40~+85
-55~+150
150
Tjmax
*1
*2
Ta = 25°C or more, diminished at -17.4mW/°C in the case of HSOP20 (when 4-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mounted)
Ta = 25°C or more, diminished at -32.0mW/°C in the case of HTSSOP-B24 (when 4-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mounted)
●Operating Ratings (Ta = 25℃)
Parameter
Symbol
VCC
Limits
9.0~35.0
30
Unit
V
VCC supply voltage
Min. output current of LED1 to 4
ILED_MIN
mA *1
mA
Max. output current of LED1 to 4
ILED_MAX
150
*1,2
Min. output current of LED1 to 4
Max. output current of LED1 to 4
DC/DC oscillation frequency
VNADIM1
VNADIM2
VLSP
0~5.0 *3
7.0~35.0
0.8～3.0
100~800
30
V
V
V
DC/DC oscillation frequency
Fsw
kHz
us
Min. on-duty time for PWM light modulation
PWM_MIN
*1
*2
The amount of current per channel.
If LED makes significant variations in its reference voltage, the driver will increase power dissipation, resulting in a rise in package temperature.
To avoid this problem, design the board with thorough consideration given to heat radiation measures.
The range which the LED current changes with linearity is from 1.5V to 5V.
*3
●Pin Configuration
HSOP20
1
20
19
18
17
16
VCC
NADIM
RT
AUTO
HTSSOP-B24
2
3
4
5
REG58
CS
FB
SS
N
DCDC_GND
6
7
15
14
13
12
11
LSP
ISET
PWM
LED4
LED3
STB
OVP
8
LED1
9
LED2
10
LED_GND
Fig.3 Pin Configuration
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●Marking diagram and physical dimension
HSOP20
HTSSOP-B24
LOT No.
BD9394FP
D9394EFV
LOT No.
Fig.4 Physical Dimension
●Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)
Limit
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
[Whole Device]
Circuit current while in operation
Circuit current while in standby
[REG58 Block]
-
-
4.5
40
9
mA
ICC
STB=3V,PWM=3V,RT=100kΩ
80
μA
STB=0V
ISTB
REG58 Output Voltage
5.742
15
5.8
-
5.858
-
V
IO=0mA
REG58
IREG58
Soft start completion voltage
[UVLO Block]
mA
UVLO release voltage
VUVLO_VCC
VUHYS_VCC
6.5
7.5
8.5
V
VCC=SWEEP UP
UVLO hysteresis voltage
150
300
600
mV
VCC=SWEEP DOWN
[DC/DC Block]
Error amp. Reference voltage
Oscillation frequency
VLED
fsw
ISET=75kΩ, NADIM=2.62V
RT=100kohm
0.35
142.5
83
0.37
150.0
90
0.39
157.5
97
V
kHz
%
DMAX
Max. duty cycle per output of N pin
On resistance on N pin source side
On resistance on N pin sink side
SS pin source current
RT=100kohm
RONH
-
-
4
3
8
6
Ω
Ω
ION=-10mA
ION=10mA
VSS=2V
RONL
ISSSO
-4
3.3
-2
3.7
-1
4.1
uA
V
VSS_END
IFBSINK
IFBSOURCE
VCS
Soft start completion voltage
FB sink current
SS=SWEEP UP
50
100
-100
0.45
150
-50
μA
μA
V
LED=2.0V, VFB=1.0V
LED=0V, VFB=1.0V
CS=SWEEP UP
FB source current
-150
0.40
Over current detection voltage
0.50
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●Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)
Limit
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
[DC/DC Protection Block]
Overvoltage protection detection
voltage
Overvoltage protection detection
hysteresis voltage
Short circuit protection detection
voltage
VOVP
VOVP_HYS
VSCP
2.7
50
3.00
100
3.3
200
0.25
V
mV
V
VOVP=SWEEP UP
VOVP=SWEEP DOWN
VOVP=SWEEP DOWN
0.04
0.10
[LED Driver Block]
ILED=100mA,
LED pin current accuracy 1
dILED1
dILED2
-2
-3
-
-
2
3
%
%
(VNADIM=2.62V,RISET=75kΩ)
ILED=100mA,
LED pin current accuracy 2
(VNADIM=7V,RISET=75kΩ)
ILLED
-2.5
-
2.5
uA
V
VLED=60V
LED pin Leakage Current
LED open detection voltage
VOPEN
0.05
0.2
0.285
VLED=SWEEP DOWN
VLED=SWEEP UP,
VLSP=OPEN
LED short detection voltage
VSHORT
RULSP
4
5
6
V
LSP pin resistive divider upper side
resistance
1000
2000
3000
kΩ
VLSP=0V
LSP pin resistive divider lower side
resistance
RDLSP
500
-2.5
1000
-
1500
2.5
kΩ
VLSP=3V
ILNADIM
uA
VNADIM=5V
NADIM pin Input Current
[STB Block]
STB pin high-level voltage
STB pin low-level voltage
STB pin pull-down resistance
[PWM Block]
STBH
STBL
RSTB
2
-
-
35
0.8
V
V
STB=SWEEP UP
STB=SWEEP DOWN
VSTB=3.0V
-0.3
500
1000
1500
kΩ
PWM pin high-level voltage
PWM pin low-level voltage
PWM pin pull-down resistance
PWMH
PWML
RPWM
2
-
-
35
0.8
420
V
V
PWM=SWEEP UP
PWM= SWEEP DOWN
PWM=3.0V
-0.3
180
300
kΩ
[Failure Indication Block (Open Drain)]
AUTO pin source current
IAUTO
-2
-1
4.0
20
-0.5
4.4
μA
V
VAUTO=2V
AUTO pin Detection Voltage
Abnormal Detection Timer
VAUTO
tCP
3.6
VAUTO=SWEEP UP
RT=75kΩ
ms
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BD9394FP, BD9394EFV
●Pin Descriptions (BD9394FP)
Pin No
1
Pin Name
AUTO
REG58
CS
In/Out
Out
Out
In
Function
Rating [V]
-0.3 ~ 7
-0.3 ~ 7
-0.3 ~ 7
-0.3 ~ 7
-
Auto-restart time setting pin
Power supply for N pin
2
3
DC/DC output current detection and OCP detection pin
DC/DC switching output pin
4
In
N
5
-
DCDC_GND
GND
Power GND pin
FIN1
6
-
-
Analog GND pin
In
-0.3 ~ 7
-0.3 ~ 36
-0.3 ~ 60
-0.3 ~ 60
-
LSP
LED Short detection voltage setting resistor connection pin
Overvoltage protection detection pin
Output pin 1 for LED
7
In
OVP
8
Out
Out
-
LED1
LED2
LED_GND
STB
9
Output pin 2 for LED
10
11
12
13
14
15
FIN2
16
17
18
19
20
Ground pin for LED
In
Enable pin
-0.3 ~ 36
-0.3 ~ 60
-0.3 ~ 60
-0.3 ~ 36
-0.3 ~ 7
-
LED3
LED4
PWM
ISET
Out
Out
In
Output pin 3 for LED
Output pin 4 for LED
External PWM light modulation signal input pin for LED1-4
LED current setting resistor connection pin
Analog GND pin
Out
-
GND
SS
Out
In/Out
Out
In
Soft start pin / LED protection masking time setting pin.
Error amp output pin
-0.3 ~ 7
-0.3 ~ 7
-0.3 ~ 7
-0.3 ~ 36
-0.3 ~ 36
FB
RT
DC/DC drive frequency setting resistor connection pin.
Analog dimming DC voltage input pin
Power supply pin
NADIM
VCC
In
●Pin Descriptions (BD9394EFV)
Pin No
1
Pin Name
AUTO
REG58
CS
In/Out
Out
Out
In
Function
Auto-restart time setting pin
Rating [V]
-0.3 ~ 7
-0.3 ~ 7
-0.3 ~ 7
-0.3 ~ 7
-
2
Power supply for N pin
3
DC/DC output current detection and OCP detection pin
DC/DC switching output pin
4
In
N
5
-
DCDC_GND
LSP
Power GND pin
6
In
-0.3 ~ 7
-0.3 ~ 36
-0.3 ~ 60
-0.3 ~ 60
-
LED Short detection voltage setting resistor connection pin
Overvoltage protection detection pin
Output pin 1 for LED
7
In
OVP
8
Out
Out
-
LED1
LED2
N.C.
9
Output pin 2 for LED
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Unconnected pin.
-
Ground pin for LED
-
LED_GND
N.C.
-
Overvoltage protection detection pin.
Enable pin
-
STB
In
-0.3 ~ 36
-0.3 ~ 60
-
LED3
N.C.
Out
-
Output pin 3 for LED
DC/DC switching output pin.
LED4
PWM
ISET
Out
In
Output pin 4 for LED
-0.3 ~ 60
-0.3 ~ 36
-0.3 ~ 7
-
External PWM light modulation signal input pin for LED1-4
LED current setting resistor connection pin
Analog GND pin
Out
-
GND
SS
Out
In/Out
Out
In
Soft start pin / LED protection masking time setting pin.
Error amp output pin
-0.3 ~ 7
-0.3 ~ 7
-0.3 ~ 7
-0.3 ~ 36
-
FB
RT
DC/DC drive frequency setting resistor connection pin.
Analog dimming DC voltage input pin
Ground pin for analog block.
NADIM
GND
-
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●Pin ESD Type
REG58 / N / DCDC_GND / CS
NADIM
FB
FB
LED1~4, LED_GND
RT
SS
LED1-4
LED_GND
PWM
ISET
LSP
3V
LSP
1.8M
100k
5V
1.2M
STB
OVP
AUTO
AUTO
STB
100k
1M
5V
Fig. 5 Pin ESD Type
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●Block Diagram
Fig. 6 Block Diagram
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●Typical Performance Curve
10
1000
100
10
9
8
7
6
5
4
3
9
14
19
24
VCC[V]
29
34
10
100
RRT[kohm]
1000
Fig.8 N Frequency [MHz] vs. R_RT [MΩ]
Fig.7 Operating Current (ICC) [mA] vs. VCC[V]
110
108
106
104
102
100
98
140
120
100
80
60
40
20
0
96
VCC=24V
ISET=75kΩ
94
92
90
-40
-20
0
20
Temp[℃]
40
60
80
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
NADIM[V]
Fig.10 LED Current (ILED) [mA] vs. NADIM [V]
Fig.9 LED Current (ILED) [mA] vs. Temp [℃]
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●Pin Function
○AUTO (HSOP20:1pin / HTSSOP-B24：1pin)
This sets up time till auto-restart time from the point of abnormal detection. Having 1uA constant current charge at
external capacitor connected to AUTO pin, it will start again when it becomes over 4.0V (The auto pin is shorted to GND,
this IC’s protection function operates latched off mode).
○Auto-restart period vs. AUTO capacitance (Ideal)
4.0[V ] C AUTO
1.0 10 6 [A]
TAUTO
4.0 10 6 C AUTO [sec]
○REG58 (HSOP20:2pin / HTSSOP-B24：2pin)
The REG58 pin is used in the DC/DC converter driver block to output 5.8V power. The maximum operating current is
15mA. Using the REG58 pin at a current higher than 15mA can affect the N pin output pulse, causing the IC to
malfunction and leading to heat generation of the IC itself. To avoid this problem, it is recommended to make load setting
to the minimum level.
Please place the ceramic capacitor connected to REG58 pin (2.2uF～10uF) closest to REG58-GND pin.
○CS (HSOP20:3pin / HTSSOP-B24：3pin)
The CS pin has the following two functions:
1. DC/DC current mode current feedback function
Current flowing through the inductor is converted into voltage by the current sensing resistor RCS connected to the CS
pin and this voltage is compared with voltage set with the error amplifier to control the DC/DC output voltage.
2. Inductor current limit function
The CS pin also incorporates the over current protection (OCP) function. If the CS pin voltage reaches 0.45V (Typ.) or
more, switching operation will be forcedly stopped.
○N (HSOP20:4pin / HTSSOP-B24：4pin)
The N pin is used to output power to the external NMOS gate driver for the DC/DC converter in the amplitude range of
approx. 0 to REG58. ON resistances is 4.0Ω(typ.) in sorrce (H side), 3.0Ω(typ.) in sink (L side).
Frequency setting can be made with a resistor connected to the RT pin. For details of frequency setting, refer to the
description of the RT pin.
○DCDC_GND (HSOP20:5pin / HTSSOP-B24：5pin)
The PGND pin is a power ground pin for the driver block of the output pin N.
○GND (HSOP20:FIN1, FIN2 / HTSSOP-B24：19pin)
The GND pin is an internal analog circuit ground of the IC.
○LSP (HSOP20:6pin / HTSSOP-B24：6pin)
Terminal which sets LED SHORT detection voltage; the SHORT detection voltage is in a proportional relationship to LSP
set voltage and is set by the following equation:
LED
5 VLSP [V ]
SHORT
LEDSHORT：LED detection voltage、VLSP：LSP setting voltage
LSP setting voltage should be made in the range of 0.8 to 3.0V. Set at 5 V (typ.) when LSP = OPEN.
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○OVP (HSOP20:7pin / HTSSOP-B24：7pin)
The OVP pin is an input pin for over-voltage protection and short circuit protection of DC/DC output voltage. If
over-voltage is detected, the OVP pin will stop the DC/DC converter conducting step-up operation. When the short circuit
protection (SCP) function is activated, the DC/DC converter will stop operation, and then the timer will start counting.
When the timer completes counting the preset period of time, the LED drivers are stopped.
The OVP pin is of the high impedance type and involves no pull-down resistor, resulting in unstable potential in the
open-circuited state. To avoid this problem, be sure to make input voltage setting with the use of a resistive divider or
otherwise.
○LED1 – LED4 (HSOP20:8,9,12,13pin / HTSSOP-B24：8,9,14,16pin)
The LED1 to 4 pins are used to output constant current to LED drivers. Current value setting can be made by connecting
a resistor to the ISET pin.
For the current value setting procedure, refer to the description of “ISET pin”.
If any of the LED pins is put in an erroneous state (e.g. short circuit mode, open circuit mode, or ground short circuit
mode), the relevant protection function will be activated.
○LED_GND (HSOP20:10pin / HTSSOP-B24：11pin)
The LED_GND pin is a power ground pin used for the LED driver block.
○STB (HSOP20:11pin / HTSSOP-B24：13pin)
The STB pin is used to make setting of turning ON and OFF the IC and allowed for use to reset the IC from shutdown.
Note: The IC state is switched (i.e., the IC is switched between ON and OFF state) according to voltages input in the
STB pin. Avoid using the STB pin between two states (0.8 to 2.0V).
○PWM (HSOP20:14pin / HTSSOP-B24：17pin)
The PWM pin is used to turn ON and OFF LED drivers. Light can be modulated by changing the duty cycle through the
direct input of a PWM light modulation signal
The high and low voltage levels of PWM pin is as listed in the table below:
State
LED ON 状態
LED OFF 状態
PWM Voltage
PWM= 2.0V~35V
PWM= －0.3V～0.8V
○ISET (HSOP20:15pin / HTSSOP-B24：18pin)
The ISET pin is an output current setting resistor. Output current ILED varies in inverse proportion to resistance.
The relation between output current ILED and the resistance of ISET pin connection resistor RISET is given by the
following equation:
7.12 VNADIM [V ]
5000
(NADIM=0~5V)
ILED [mA]
RISET [kΩ]
3
(NADIM>7V~35V)
7500
ILED [mA]
R
ISET [kΩ]
Output current setting should be made in the range of 30 to 150mA.
It prepares automatically to suitable LED feedback voltage that can output LED current set by ISET pin.
In short LED feedback voltage is dropped when the LED current is small and the IC heating is held automatically.
In case of a large current is needed, raise the LED pin feedback voltage. And it adjusts automatically to LED pin voltage
that can be flow large LED current.
The calculation is as below.
VLED 3.7 ILED [A] [V ]
ꢀ
The LED feedback voltage (VLED) is clamped to 0.3V (typ.) when the LED current (ILED) is less than 81.1mA.
NADIM input range is from 0V to 5V. And the range which the LED currents change with linearity is from 1.5V to 5.0V.
When it reaches under VISET×0.90V(typ), the LED current is off to prevent from passing a large current to the LED pin
when the RISET is shorted and the ISET pin is shorted to the GND. And as the ISET pin returns to a normal state, the
LED current returns.
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○SS (HSOP20:16pin / HTSSOP-B24：20pin)
The SS pin is used to make setting of soft start time and duty for soft start. It performs constant current charge of 2.0 uA
to the external capacitor connected with SS terminal, which enables soft-start of DC/DC converter.
Since the LED protection function (OPEN/SHORT detection) works when the SS terminal voltage reaches 3.7 V (typ.) or
higher, it must be set to bring stability to conditions such as DC/DC output voltage and LED constant current drive
operation, etc. before the voltage of 3.7 V is detected.
○FB (HSOP20:17pin / HTSSOP-B24：21pin)
The FB pin is an output pin used for DC/DC current mode control error amplifier. In other words, the FB pin detects the
voltages of LED pins (1 to 4) and controls inductor current so that the pin voltage of the LED located in the row with the
highest Vf will come to 0.37V (NADIM=(2.62)V, ILED=100mA). As a result, the pin voltages of other LEDs become higher
by Vf variation. After completion of soft start, the FB pin is put into the high-impedance state with the PWM signal being in
the low state, thus maintaining the FB voltage.
○RT (HSOP20:18pin / HTSSOP-B24：22pin)
The RT pin is used to connect a DC/DC frequency setting resistor. DC/DC drive frequency is determined by connecting
the RT resistor.
Drive frequency vs. RT resistance (Ideal)
15000
RRT
[k]
fSW [kHz ]
When RT is 100kΩ, Fsw is 150kHz(typ.). However, drive frequency setting should be made in the range of 100 kHz to
800 kHz.
○NADIM (HSOP20:19pin / HTSSOP-B24：23pin)
NADIM pin is for analog dimming. Output current is proportionality with input voltage (negative). Basically, NADIM pin
assumes the voltage inputted externally using high accuracy of resistive divider and etc., IC internally is in OPEN (High
impedance) condition.
Please be sure to apply externally for Resistive divider and etc. from REG58 output. Cannot use in an OPEN condition.
○VCC (HSOP20:20pin / HTSSOP-B24：24pin)
The VCC pin is used to supply power for the IC in the range of 9 to 35V.
If the VCC pin voltage reaches 7.5V (Typ.) or more, the IC will initiate operation. If it reaches 7.2V (Typ.) or less, the IC
will be shut down.
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●Startup operation and soft start (SS) capacitance setting
The following section describes the sequence for the startup of this IC.
5V
VOUT
SS
SLOPE
SS
Q D
PWM
COMP
N
Css
DRIVER
OSC
SS=FB
Circuit
LED
LED_OK
FB
0.8V
PWM
LED_DRIVER
Description of startup seuence
(1) Set the STB and PWpin to ON”.
(2) Set sll systems to “ON”, SS charge will be initiated.
At this time, a circuit in which SS pin voltage for soft start becomes equal to FB pin voltage operates to equalize the
FB pin and SS pin voltages regardless of whether the PWM pin is et to Low or High level.
(3) Since the FB pin and SS pin reach the lower limit of the internal sawtooth wave of the IC, the DC/DC converter
operates to start VOUT voltage rising.
(4) The Vout voltage continues rising to reach a voltage at which LED current starts flowing.
(5) When the LED current reaches the set amount of current, isolate the FB circuit from the SS circuit. With this, the
startup operation is completed.
(6) After that, conduct normal operation following the feedback operation sequence with the LED pins.
If the SS pin voltage reaches 3.7V or more, the LED protection function will be activated to forcedly end the SS and
FB equalizing circuit.
SS capacitance setting procedure
As aforementioned, this IC stops DC/DC converter when the PWM pin is set to Low level and conducts step-up operation
only in the section in which the PWM pin is maintained at High level. Consequently, setting the PWM duty cycle to the
minimum will extend the startup time. The startup time also varies with application settings of output capacitance, LED
current, output voltage, and others.
Startup time at minimum duty cycle can be approximated according to the following method:
Make maeasurement of VOUT startup time with a 100% duty cycle, first. Take this value as “Trise100”.
The startup time “Trise_min” for the relevant application with the minimum duty cycle is given by the following equation.
Trise_100[Sec]
Trise_min
[Sec]
Min_ Duty[ratio]
However, since this calculation method is just for approximation, use it only as a guide.
Make setting of time during which the SS pin voltage reaches the FB pin voltage longer than this startup time.
Assuming that the FB pin voltage is VFB, the time is given by the following equation:
Css[F]VFB[V]
Tss
[Sec]
2[A]
As a result, it is recommended to make SS capacitance setting so that “Tss” will be greater than “Trise_min”
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About unused LED terminal automatic detecting function
This IC is detected automatically that it is an unused channel by asssuming the LED terminal to be OPEN at starting. It
explains the sequence.
Sequence;
① STB=ON
② All systems are ON at initial timing of PWM=H. SS starts charging.
③ When the output voltage is boosted enough, and enough current flows through the LED, LED_OK signal is switched
in the IC. PWM=L from the Rise timing of this signal for about 20us
④ During this PWM=L period, LED pins with LED connections' output voltage becomes 0.2V and above, where as
unused LED pins are below 0.2V.
⑤ During this time, determination on whether the LED pins are 0.2V above/below is done.
⑥ After the determination, unused LED pins are pulled up to 5V.
⑦The AUTO signal remains “L” level.
In addition, automatic determination of the OPEN decision will only be in SS range, therefore, please set the application so
that the step-up/boost be completed before SS> 3.7V.
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●LED current setting
Setting of LED output current “ILED” can be made by connecting a resistor RISET to the ISET pin.
RISET vs. ILED current relation equation
7500
(NADIM=7~35V)
RISET
[k] ꢀ
I
LED [mA]
However, LED current setting should be made in the range of 30mA to 150mA.
[Setting example]
To set ILED current to 100mA, RISET resistance is given by the following equation:
7500
7500
RISET
75 [k] ꢀ
I
LED [mA] 100[mA]
●DC/DC converter drive frequency setting
DC/DC converter drive frequency is determined by making RT resistance setting.
Drive frequency vs. RT resistance (ideal) relation equation
15000
RRT
[k]
fSW [kHz ]
where fsw DC/DC converter oscillation frequency [kHz]
This equation has become an ideal equation without any correction item included.
For accurate frequency settings, thorough verification should be performed on practical sets.
[Setting example]
To set DC/DC drive frequency “fsw” to 200 kHz, RRT is given by the following equation:
15000
15000
RRT
75 [k] ꢀ
fsw[kHz] 200[kHz]
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●LSP setting procedure
Making a change to the LSP pin input voltage will allow the threshold for LED short circuit protection to be changed.
The LED short circuit detection voltage is set to 6V (Typ.) with the LSP pin being in the open-circuited state.LSP pin
input voltage setting should be made in the range of 0.8V to 3V.
The relation between the LSP pin voltage and the LED short circuit protection detection voltage is given by the following
equation.
LED
5 VLSP [V ]
SHORT
Since the LSP pin divides 3V within the IC using resistive dividers (see the circuit diagram shown below), connecting an
external resistor to the LSP pin will produce resistance combined with the internal IC resistance.
Consequently, to make LSP pin voltage setting using external resistive dividers, it is recommended to connect them
having resistance little affected by the internal resistance. (Smaller resistance makes the LSP pin increasingly less likely
to be affected by the internal resistance, but this results in more power consumption. Careful attention should be paid to
this matter.)
LSP detection voltage setting equation
If the setting of LSP detection voltage VLSP is made by dividing the REG58 voltage by the use of resistive dividers R1
and R2, VLSP will be given by the following equation:
R2[k]
(R1[k] R2[k]
LEDSHORT REG58[V]
5 [V]ꢀ(1)
However, this equation includes no internal IC resistance. If internal resistance is taken into account, the detection
voltage VLSP will be given by the following equation:
R2[k]R4[k]
REG58[V]R3 REF[V]R1[k]
LEDSHORT
5 [V]ꢀ(2)
(R1[k]R3[k] R2 R4
R2[k]R4[k] R1[k] R3[k]
Make setting of R1 and R2 resistance so that a difference between resistance values found by Equations (1) and (2)
will come to approximately 2% or less as a guide.
[Setting example]
Assuming that LSP is approximated by Equation (1) in order to set LSP detection voltage to 6V, R1 comes to 38.3k
and R2 comes to 10k.
When calculating LSP detection voltage taking into account internal IC resistance by Equation (2), it will be given as:
10[k]1000[k]
5.8[V] 2000[k] 3[V]38.3[k]
VLSP
5 5.992[V]
(38.3[k] 2000[k] 10[k] 1000[k]
10[k]1000[k] 38.3[k] 2000[k]
The difference is given as:
5.992[V] 6[V] / 6[V]100 0.13%
As a result, this setting will be little affected by internal impedance.
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●OVP/SCP Settings
OVP pin is DC/DC output voltage’s over voltage protection and short circuit protection input pin.
OVP pin is a high impedance pin with no pull down resistor. Thus, at OPEN state please set the voltage
input settings using voltage dividing resistor and such.
Respective OVP pin protection conditions are as below
Protection
Name
Detection
Pin
Detection
Condition
Cancellation
Condition
Timer
Operations
Protection Type
DCDC stops during detection
All latch
No
OVP
SCP
OVP
OVP
OVP>3.0V
OVP<0.1V
OVP<2.9V
OVP>0.1V
Yes
○OVP Detection Setting
VOUT abnormally increase、voltage detected by OVP, VOVPDET,
R1,R2 settings are as follows
(VOVPDET[V]3.0[V])
R1 R2[k]
[k]
3.0[V]
○OVP Cancellation Setting
R1,R2 set from above equation,
OVP cancellation voltage VOVPCAN equals to
(R1[k] R2[k])
VOVP 2.9V
[V]
CAN
R2[k]
○SCP Detection Setting
When R1,R2 are set using values obtained above, SCP voltage setting is VSCPDET is as follows
(R1[k] R2[k])
VSCP 0.1V
[V]
DET
R2[k]
【Setting Example】
VOUT at normal operation 56V、OVP detection voltage VOVPDET=68V、R2=10k, R1 is as follows
(VOVPDET [V] 3.0[V])
3.0[V]
(68[V] 3[V])
3[V]
R1 R2[k]
10[k]
216.7 [k]
When R1, R2 are set at these values, OVP cancellation voltage, VOVPCAN
(R1[k] R2[k])
R2[k]
10[k] 216.7[k]
10[k]
VOVP 2.9[V]
2.9[V]
[V]ꢀ 65.7 [V]
CAN
In addition, at this R1, R2, SCP detection voltage
(R1[k] R2[k])
10[k] 216.7[k]
10[k]
VSCP 0.1[V]
0.1[V]
[V]ꢀ 2.27 [V]
DET
R2[k]
To select DC/DC components, give consideration to IC variations as well as individual component variations,
and then conduct thorough verification on practical systems.
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●・Timer Latch Time Setting
This IC has a built-in timer latch counter. Timer latch time is set by counting the clock frequency which is
set at the RT pin.
●Timer Latch Time
When various abnormal conditions happen, counting starts from the timing, latch occurs after below time has passed.
Furthermore, even if PWM=L, if abnormal condition continues, timer count will not reset.
RRT
1.51010
RRT [k]
1.5107
LATCHTIME 212
4096
[s]
Here, LATCHTIME = time until latch condition occurs
RRT = Resistor value connected to RT pin
Example of LED Short protection timing chart
【Setting Example】
Timer latch time when RT=75kohm
RRT [k]
1.5107
75[k]
LATCHTIME 4096
4096
0.02[s]ꢀ
1.5107
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●・OCP Settings/DCDC Components’ Current Capacity Selection Method
One of the function of CS pin - when its pin voltage>0.45 it stops the DCDC. Thus, RCS resistor value
need to be checked after the peak current flow through the inductor is calculated. Furthermore, DCDC external
components’ current capacity needs to be greater than peak current flowing through this inductor.
（Inductor peak current Ipeak calculation method）
Firstly, ripple voltage which occurs at the CS pin is decided depending on the DCDC application conditions.
The conditions when made as below;
Output voltage=VOUT[V]
LED total current=IOUT[A]
DCDC input voltage=VIN[V]
DCDC efficiency =η[%]
Total required average input current IIN:
VOUT [V] IOUT [A]
IIN
[A]
V [V][%]
Inductor ripple current IL[A] which occurs at inductor L[H] during
IN
DCDC drive operation with switching frequency=fsw[Hz] is as follows
(VOUT [V ] VIN [V ]) VIN [V ]
ΔIL
[A]
L[H ]V [V ] f [Hz]
Therefore, IL’s peak current Ipeak can be calculated using below equation
OUT
SW
IL[A]
Ipeak IIN [A]
[A](1)
2
(Resistor RCS connected to CS pin selection method)
This Ipeak flows in RCS and generates voltage. (refer to time chart
diagram on the right). This voltage value, VCSpeak can be calculated as below
VCS peak Rcs Ipeak [V ]
This VCSpeak when reach 0.45V, will stop the DCDC output.
Thus when selecting RCS value, below condition needs to be met.
Rcs[] Ipeak[A] 0.45[V ]
(DCDC Components’ Current Capacity Selection Method)
When OCP reach detection voltage CS=0.45V, Iocp current
0.45[V ]
IOCP
[A](2)
Rcs[]
Ipeak current (1)、IOCP current (2)、and components’ MAX current capacity needs to satisfy the following
Rated current of components
I peak IOCP
Above condition needs to be satisfied when selecting DCDC application parts eg. FET, inductor, diode etc.
Furthermore, continuous mode is recommended for normal DCDC applications. Inductor’s ripple current MIN limit value,
lmin becoming
IL[A]
Im in IIN [A]
[A] 0
2
Is a condition to be met. If this is not met, it is called discontinuous mode.
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【Setting Example】
Output voltage=VOUT[V]=56V
LED total current=IOUT[A]=100mA×4ch=0.40A
DCDC input voltage=VIN[V]=14V
DCDC efficiency=η[%]=90%
Total required average input current IIN:
V
OUT [V] IOUT [A]
VIN [V][%]
56[V]0.40[A]
14[V]90[%]
IIN [A]
ꢀ
1.78 [A]
When, DCDC switching frequency =fsw[Hz]=200kHz
Inductor L[H]=33uH,
Inductor ripple current ΔIL[A]:
(VOUT [V ] VIN [V ]) VIN [V ]
L[H ]VOUT [V ] fSW [Hz]
(56[V ] 14[V ]) 14[V ]
33106 [H ] 56[V ] 200 103[Hz]
ΔIL
ꢀ
1.59 [A]
Thus, IL peak current Ipeak becomes
…Peak current calculation result
IL[A]
1.59[A]
Ipeak IIN [A]
[ꢀA] 1.78[A]
2.58 [A]
2
2
RCS resistor value when set at 0.1ohm
VCS
Rcs Ipeak 0.10[] 2.58[ A] 0.258 [V ] 0.45V
…RCS resistor consideration
peak
and satisfy the condition.
In addition、OCP detection current IOCP at this time is
0.45[V ]
IOCP
4.5 [A]
0.1[]
If parts used (FET,INDUCTOR、DIODE etc)’s current capacity<5A,
Rated current of components
I peak IOCP
2.58[A] 4.5[A] 5[A]
…DCDC current capacity consideration
Thus, there is no problem of parts selection as the above condition is satisfied.
In addition、IL ripple current minimum limit Imin is
IL[A]
Im in IIN [A]
[A] 1.78[A] 0.795[A] 0.985[A] 0ꢀ
2
Thus、will not become discontinuous mode。
To select DC/DC components, give consideration to IC variations as well as individual component variations, and
then conduct thorough verification on practical systems.
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●Selection of inductor L
The value of inductor has significant influence on the input ripple current. As
shown by Equation (1), the larger the inductor and the higher the switching
frequency, the inductor ripple current ∆IL becomes increasingly lower.
ΔIL
(VOUT VIN ) VIN
L VOUT fSW
ΔIL
[ꢀA]ꢀꢀꢀꢀ・・・・・ꢀ ꢀ(1)
Expressing efficiency as shown by Equation (2), peak input current is given
as Equation (3).
V
IN
VOUT IOUT
VIN IIN
ꢀꢀꢀꢀꢀ・・・・・ꢀꢀ(2)
IL
L
VOUT IOUT
VIN
ΔIL
ΔIL
ILMAX IIN
ꢀꢀ ꢀꢀ ꢀ・・・・・ꢀ(ꢀ3)
2
2
VOUT
where, L: Reactance value [H],
VOUT : DC/DC output voltage [V],
VIN: Input voltage [V],
I
OUT: Output load current (total output current) [A],
IIN: Input current [A], and
SW: Oscillation frequency [Hz]
F
R
CS
COUT
Upper: Fig.15 Inductor current waveform
Lower: Fig.16 DC/DC Convertor application Circuit (b)
.
Note: If a current in excess of the rated current of the inductor applies to the coil, the inductor will cause magnetic
saturation, resulting in efficiency degradation.
Select an inductor with an adequate margin so that peak current will not exceed the rated current of the
inductor.
Note: To reduce power dissipation from and increase efficiency of inductor, select an inductor with low resistance
component (DCR or ACR).
●Selection of output capacitor COUT
Select a capacitor on the output side taking into account the stability region
of output voltage and equivalent series resistance necessary to smooth
ripple voltage. Note that higher output ripple voltage may result in a drop in
LED pin voltage, making it impossible to supply set LED current.
The output ripple voltage ∆VOUT is given by Equation (4).
V
IN
IL
IOUT
1
1
L
ΔVOUT ILMAX RESR
[ꢀV]ꢀ・・・・・ꢀ(ꢀ4)
COUT
fSW
VOUT
where RESR Equivalent series resistance of COUT
.
Note: Select capacitor ratings with an adequate margin for output voltage.
Note: To use an electrolytic capacitor, an adequate margin should be
provided for permissible current. Particularly to apply PWM light modulation
to LED, note that a current higher than the set LED current transiently flows.
R
ESR
R
CS
COUT
Fig.17 DC/DC converter application circuit (c)
●Selection of switching MOSFET transistors
There will be no problem for switching MOSFET transistors having absolute maximum rating higher than rated current of the
inductor L and VF higher than “COUT breakdown voltage Rectifier diode”. However, to achieve high-speed switching, select
transistors with small gate capacity (injected charge amount).
Note: Rated current larger than ꢀ overcurrent protection setting current is recommended.
Note: Selecting transistors with low on resistance can obtain high efficiency.
●Selection of rectifier diodes
Select Schottky barrier diodes having current capability higher than the rated current of the inductor L and inverse
breakdown voltage higher that COUT breakdown voltage, particularly having low forward voltage VF.
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●Phase Compensation Setting Procedure
DC/DC converter application for current mode control includes one each of pole fp (phase delay) by CR filer consisting of
output capacitor and output resistor (i.e., LED current) and zero (phase lead) fZ by the output capacitor and capacitor ESR.
Furthermore, the step-up DC/DC converter includes RHP zero “fZRHP” as the second zero. Since the RHP zero has phase
delay (90) characteristics like the pole, the crossover frequency fc should be set to not more than RHP zero
VOUT
VIN
ILED
L
VOUT
-
gm
FB
RESR
COUT
+
RFB1
CFB1
RCS
CFB2
Output Block
Error Amplifier Block
i.
Find pole fp and RHP zero fZRHP of DC/DC converter.
VOUT (1 D)2
2 L ILED
ILED
fp
[ꢀHz] ꢀ
fZRHP
[ꢀHz]ꢀꢀ
2 VOUT COUT
VOUT VIN
Where
Total LED current [A],
ILEDꢀ
D
ꢀ
VOUT
ii. Find phase compensation to be inserted in the error amplifier. (Set fc to 1/5 of fZRHP.)
1
fRHZP RCS ILED
5 f p gmVOUT (1 D)
CFB1
[ꢀF]ꢀꢀ
RFB1
[ꢀ] ꢀ
2 RFB1 f p
gm 4.0104[S]ꢀ
where
iii. Find zero used to compensate ESR (RESR) of COUT (electrolytic capacitor).
RESR COUT
CFB2
ꢀ[F] ꢀ
RFB1
Note: Even if a ceramic capacitor (RESR of the order of milliohms) for COUT, it is recommended to insert CFB2 for
stable operation.
To improve transient response, it is necessary to increase RFB1 and reduce CFB1. However, this improvement reduces a phase
margin. To avoid this problem, conduct thorough verification, including variations in external components, on practical
systems.
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●Timing Chart
VCC
7.5V
2.0V
STB
0.8V
REG58
2.6V
2.4V
ISET
RT
3.7V
SS
SS=FB or LED
feed-back
LED
feed-back
FB
VOUT
PWM
ILEDｘ
2.0V
LED_OPEN
LED_SHORT
Disable
Enable
Disable
Disable
Disable
Disable
ISET_GND_SHORT
Enable
Enable
Enable
Disable
Disable
Disable
REG58_UVLO
VCC_UVLO
OVP
SCP
FB OVER SHOOT
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●List of Protect Function (typ condition)
Detection Conditions
Protection
Name
Detection
Pin
Cancellation
Conditions
Protection Type
Detection pin
PWM
SS
Immediately Auto-Restart after
detection
(Judge periodically whether normal or
not)
SS>3.7V
LED OPEN
LEDSHORT
LEDｘ
LEDx < 0.2V
H
LEDx > 0.2V
LEDx > 5V
LEDx < 5V
Immediately Auto-Restart after
detection
(Judge periodically whether normal or
not)
SS>3.7V
LEDｘ
H
-
(LSP=OPEN)
(LSP=OPEN)
Under
Above
ISET GND
SHORT
ISET
-
Auto-Restart
ISET×90%
REG58<2.4V
VCC<7.3V
OVP>3.0V
ISET×90%
REG58>2.6V
VCC>7.5V
OVP<2.9V
REG58 UVLO
VCC UVLO
OVP
REG58
VCC
-
-
-
-
-
-
Auto-Restart
Auto-Restart
Auto-Restart
OVP
Immediately Auto-Restart after
detection
SCP
OVP
OVP<0.1V
-
-
OVP>0.1V
(Judge periodically whether normal or
not)
Immediately Auto-Restart after
detection
FB OVER SHOOT
OCP
FB
CS
FB>4V
-
-
-
-
FB<3.6V
-
(Judge periodically whether normal or
not)
OCP>0.45V
Pulse-by-Pulse
To clear the latch type, STB should be set to “L” once, and then to “H”.
Operation after the protection function detected
Protection Function
DC/DC
LED Driver
Soft-start
Only detects LED,
LED OPEN
LEDSHORT
Continue to operate
Continue to operate
Continue to operate
stops after CP count
Only detects LED,
stops after CP count
Continue to operate
ISET GND SHORT
STB
Stop immediately
Stop immediately
Stop immediately
Stop(and when REG58<2.4V)
Stop immediately
Continue to operate
Discharge immediately
Discharge immediately
Discharge immediately
Continue to operate
REG58 UVLO
VCC UVLO
OVP
Stop immediately
Stop immediately
Stop immediately
Stop immediately (N pin only)
Stop immediately (N pin only)
Stop after CP count
N pin limits DUTY
Continue to operate
Stop after CP count
Stop after CP count
Stop immediately
SCP
Discharge after CP count
Continue to operate
FB OVER SHOOT
OCP
Continue to operate
* CP = 20msec (RT=75Kohm)
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TSZ02201-0F1F0C100180-1-2
09.May.2014 Rev.003
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BD9394FP, BD9394EFV
●Operational Notes
1) We pay utmost attention to the quality control of this product. However, if it exceeds the absolute maximum ratings
including applied voltage and operating temperature range, it may lead to its deterioration or breakdown. Further, this
makes it impossible to assume a breakdown state such as short or open circuit mode. If any special mode to exceed the
absolute maximum ratings is assumed, consider adding physical safety measures such as fuses.
2) Making a reverse connection of the power supply connector can cause the IC to break down. To protect the IC form
breakdown due to reverse connection, take preventive measures such as inserting a diode between the external power
supply and the power supply pin of the IC.
3) Since current regenerated by back electromotive force flows back, take preventive measures such as inserting a capacitor
between the power supply and the ground as a path of the regenerative current and fully ensure that capacitance presents
no problems with characteristics such as lack of capacitance of electrolytic capacitors causes at low temperatures, and
then determine the power supply line. Provide thermal design having an adequate margin in consideration of power
dissipation (Pd) in the practical operating conditions.
4) The potential of the GND pin should be maintained at the minimum level in any operating state.
5) Provide thermal design having an adequate margin in consideration of power dissipation (Pd) in the practical operating
conditions.
6) To mount the IC on a printed circuit board, pay utmost attention to the direction and displacement of the IC. Furthermore,
the IC may get damaged if it is mounted in an erroneous manner or if a short circuit is established due to foreign matters
entered between output pins or between output pin and power supply GND pin.
7) Note that using this IC in strong magnetic field may cause it to malfunction.
8) This IC has a built-in thermal-protection circuit (TSD circuit), which is designed to be activated if the IC junction
temperature reached 150C to 200C and deactivated with hysteresis of 10C or more. The thermal-protection circuit (TSD
circuit) is a circuit absolutely intended to protect the IC from thermal runaway, not intended to protect or guarantee the IC.
Consequently, do not use the IC based on the activation of this TSD circuit for subsequent continuous use and operation of
the IC.
9) When testing the IC on a set board with a capacitor connected to the pin, the IC can be subjected to stress. In this case,
be sure to discharge the capacitor for each process. In addition, to connect the IC to a jig up to the testing process, be sure
to turn OFF the power supply prior to connection, and disconnect the jig only after turning OFF the power supply.
10) This monolithic IC contains P Isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersections of these P layers and the N layers of other elements, thus making up different
types of parasitic elements.
For example, if a resistor and a transistor is connected with pins respectively as shown in Fig.
When GND(Pin A) for the resistor, or when GND(Pin B) for the transistor (NPN), P-N junctions operate as a parasitic
diode.
When GND(Pin B) for the transistor (NPN), the parasitic NPN transistor operates by the N layer of other element
adjacent to the parasitic diode aforementioned.
Due to the structure of the IC, parasitic elements are inevitably formed depending on the relationships of potential. The
operation of parasitic diodes can result in interferences in circuit operation, leading to malfunctions and eventually
breakdown of the IC. Consequently, pay utmost attention not to use the IC for any applications by which the parasitic
elements are operated, such as applying a voltage lower than that of GND (P substrate) to the input pin.
Transistor (NPN)
B
Resistor
(Pin A)
E
C
(Pin B)
GND
N
N
P
P
P
P
N
N
N
N
N
P substrate
P substrate
GND
Parasitic element
GND
Parasitic element
(Pin B)
C
E
(Pin A)
B
Parasitic element
ＧＮＤ
Adjacent other elements
GND
Parasitic
Fig18. Example of Simple Structure of Monolithic IC
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
www.rohm.com
TSZ02201-0F1F0C100180-1-2
09.May.2014 Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
24/28
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BD9394FP, BD9394EFV
●Ordering Information
B D 9 3 9 4 F P
-
E 2
Part Number
Package
FP: HSOP20
EFV: HTSSOP-B24
Packaging and forming specification
E2: Embossed tape and reel
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-0F1F0C100180-1-2
09.May.2014 Rev.003
25/28
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BD9394FP, BD9394EFV
●Physical Dimension Tape and Reel Information (HSOP20)
Max. 15.25 ( include. BURR )
Drawing No.
<Tape and Reel information>
Tape
Embossed carrier tape
2000pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
Direction of feed
1pin
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
www.rohm.com
TSZ02201-0F1F0C100180-1-2
09.May.2014 Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
26/28
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Daattaasshheeeett
BD9394FP, BD9394EFV
●Physical Dimension Tape and Reel Information (HTSSOP-B24)
<Tape and Reel information>
Tape
Embossed carrier tape (with dry pack)
2000pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
Direction of feed
1pin
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
www.rohm.com
TSZ02201-0F1F0C100180-1-2
09.May.2014 Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
27/28
TSZ22111・15・001
Daattaasshheeeett
BD9394FP, BD9394EFV
●Revision History
Date
Revision
001
Changes
12.Oct.2012
09.Nov.2012
09.May.2014
New Release
002
Page. 10: Add ISET pin function
003
Page. 1, 9: Revise pin name (AGND→GND)
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TSZ02201-0F1F0C100180-1-2
09.May.2014 Rev.003
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
Datasheet
Buy
BD9394EFV - Web Page
Distribution Inventory
Part Number
Package
Unit Quantity
BD9394EFV
HTSSOP-B24
2000
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
2000
Taping
inquiry
Yes
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