BD9E304FP4-LBZ [ROHM]
本产品是能够保证向工业设备市场长期供应的产品，而且是非常适用于这些应用领域的产品。BD9E304FP4-LBZ是一款内置低导通电阻功率MOSFET的单通道同步整流降压型DC-DC转换器。利用轻负载模式控制，可提高轻负载时的效率，因此非常适用于需要降低待机功耗的设备。该产品采用电流模式控制方式，相位补偿设置简单，负载响应性能出色。还通过采用小型封装，实现了高功率密度，并可缩小PCB上的Footprint尺寸。;
| 型号： | BD9E304FP4-LBZ |
| 厂家： | 
ROHM |
| 描述： | 本产品是能够保证向工业设备市场长期供应的产品，而且是非常适用于这些应用领域的产品。BD9E304FP4-LBZ是一款内置低导通电阻功率MOSFET的单通道同步整流降压型DC-DC转换器。利用轻负载模式控制，可提高轻负载时的效率，因此非常适用于需要降低待机功耗的设备。该产品采用电流模式控制方式，相位补偿设置简单，负载响应性能出色。还通过采用小型封装，实现了高功率密度，并可缩小PCB上的Footprint尺寸。 PC DC-DC转换器 |
| 文件： | 总46页 (文件大小：2520K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
4.5 V to 36 V Input, 3.0 A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
BD9E304FP4-LBZ
General Description
This is the product guarantees long time support in
Industrial market.
Key Specifications
◼ Input Voltage Range:
◼ Output Voltage Range:
◼ Output Current:
4.5 V to 36.0 V
VINx0.1 or 0.7 V to VINx0.8 V
3 A (Max)
BD9E304FP4-LBZ is a single synchronous buck DC/DC
converter with built-in low on-resistance power MOSFETs.
The Light Load Mode control provides excellent efficiency
characteristics in light-load conditions which make the
product ideal for equipment, and devices that demand
minimal standby power consumption. BD9E304FP4-LBZ is
a current mode control and features good transient
response. Phase compensation can also be set easily. It
achieves the high power density and offers a small footprint
on the PCB by employing small package.
◼ Switching Frequency:
300 kHz (Typ)
◼ High Side FET ON Resistance:
◼ Low Side FET ON Resistance:
◼ Shutdown Current:
100 mΩ (Typ)
60 mΩ (Typ)
3 μA (Typ)
◼ Operating Quiescent Current:
45 μA (Typ)
Package
TSOT23-8L
W (Typ) x D (Typ) x H (Max)
2.8 mm x 2.92 mm x 0.95 mm
Features
◼ Long Time Support Product for Industrial Applications
◼ Single Synchronous Buck DC/DC Converter
◼ Light Load Mode Control
◼ Efficiency = 80 % (@IOUT = 10 mA,VIN = 32 V, VOUT = 5 V)
◼ Output Capacitor Discharge Function
◼ Over Voltage Protection (OVP)
TSOT23-8L
◼ Over Current Protection (OCP)
◼ Short Circuit Protection (SCP)
◼ Thermal Shutdown Protection (TSD)
◼ Under Voltage Lockout Protection (UVLO)
◼ TSOT23-8L Package
Applications
◼ Industrial Equipment
◼ Secondary Power Supply and Adapter Equipment
◼ Telecommunication Devices
Typical Application Circuit
BD9E304FP4
VEN
VIN
EN
VIN
BOOT
SW
0.1
F
CIN
μ
VOUT
L
COMP
SS
RFB2
CFB
RCMP
CCMP
COUT
FB
CSS
RFB1
GND
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Pin Configuration
(TOP VIEW)
EN
VIN
1
2
3
4
8
7
6
5
BOOT
SW
GND
FB
SS
COMP
Pin Description
Pin No. Pin Name
Function
Enable pin. The device starts up with setting VENH to 1.2 V (Typ) or more. The device enters
the shutdown mode with setting VENL to 1.1 V (Typ) or less. This pin must be terminated.
1
2
EN
Power supply pin. Connecting 0.1 µF (Typ) and 10 µF (Typ) ceramic capacitors is
recommended. The detail of a selection is described in Selection of Components Externally
Connected 1. Input Capacitor.
VIN
3
4
GND
FB
Ground pin.
Output voltage feedback pin. See Selection of Components Externally Connected 3. Output
Voltage Setting, FB Capacitor for the output voltage setting.
Output pin for the error amplifier and input pin for PWM comparator. See Selection of
Components Externally Connected 4. Phase Compensation for how to calculate phase
compensation components.
5
6
COMP
SS
Pin for setting the soft start time of output voltage. The soft start time is 2.5 ms (Typ) when
the SS pin is open. A ceramic capacitor connected to the SS pin makes the soft start time
more than 2.5 ms. See Selection of Components Externally Connected 5. Soft Start Capacitor
for how to calculate the capacitance.
Switch pin. This pin is connected to the source of the High Side FET and the drain of the Low
Side FET. Connect a bootstrap capacitor of 0.1 µF between this pin and the BOOT pin. In
addition, connect an inductor considering the direct current superimposition characteristic.
7
8
SW
Pin for bootstrap. Connect a bootstrap capacitor of 0.1 µF between this pin and the SW pin.
The voltage of this pin is the gate drive voltage of the High Side FET.
BOOT
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Block Diagram
VIN
VIN
BOOT
EN
BOOTREG
8
1
REG
SCP
OVP
VIN
UVLO
TSD
OSC
VIN
2
7
HOCP
LOCP
On-time
Comparator
Reference
Compensation
VOUT
SW
On-time
Circuit
DRIVER
LOGIC
SW
FB
4
5
Current Sense
Compensation
ERRAMP
COMP
GND
Current Sense
Comparator
LS MOSFET
Current Limit
3
SOFT
START
6
SS
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Description of Blocks
1. REG
This block generates the internal regulator voltage.
2. SOFT START
The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the
prevention of output voltage overshoot and inrush current. The internal soft start time is 2.5 ms (Typ) when the SS pin is
open. A capacitor connected to the SS pin makes the rising time more than 2.5 ms.
3. ERRAMP
This is the error amplifier. This block compares the FB voltage and the internal reference voltage. The COMP pin controls
the switching duty and requires phase compensation components. The output voltage is set by the FB external resistors.
4. On-time Comparator
The On-time Comparator compares the Error Amplifier output voltage and the reference voltage compensated by On-
time. When the Error Amplifier output voltage becomes higher than the reference voltage compensated, the output turns
low and reports to the On-time Circuit that the output voltage has dropped below the control voltage.
5. On-time Circuit
This block generates the High Side FET on-time signal. Generates an on-time signal determined by the On-time
comparator output, OSC signal, and Current Sense Comparator output.
6. Current Sense Comparator
This is a comparator that compares the ERRAMP signal with the current sense signal compensated by ramp signal.
7. UVLO
The UVLO block is for under voltage lockout protection. The device is shutdown when input voltage (VIN) falls to 3.9 V
(Typ) or less. The threshold voltage has the 350 mV (Typ) hysteresis.
8. TSD
The TSD block is for thermal protection. The device is shutdown when the junction temperature Tj reaches to 175 °C
(Typ) or more. The device is automatically restored to normal operation with a hysteresis of 25 °C (Typ) when the Tj goes
down.
9. OVP
The OVP block is for over voltage protection. When the FB voltage (VFB) exceeds 120 % (Typ) or more of FB threshold
voltage VFBTH, the SW pin is pulled down with 400 Ω (Typ). After VFB falls 115 % (Typ) or less of VFBTH, the device is
returned to normal operation condition.
10. HOCP
This block is for over current protection of the High Side FET. When the current that flows through the High Side FET
reaches the value of over current limit, it turns off the High Side FET and turns on the Low Side FET.
11. LOCP
This block is for over current protection of the Low Side FET. While the current that flows through the Low Side FET over
the value of over current limit, the condition that being turned on the Low Side FET is continued.
12. SCP
This block is for short circuit protection. After soft start is completed and in condition where VFB is 70 % (Typ) of 0.6 V or
less and remained there for 0.9 ms (Typ), the device is shutdown for 100 ms (Typ) and subsequently initiates a restart.
13. LS MOSFET Current Limit
This circuit is a comparator that monitors the inductor current. When inductor current falls below 0 A (Typ) while the Low
Side FET is on, it turns off the Low Side FET.
14. Driver Logic
The Driver Logic controls the switching operation and protection function operation.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Input Voltage
VIN
VSW
-0.3 to +39
-0.3 to VIN+0.3
-3
V
V
SW Voltage
SW Voltage (30 ns pulse width)
Voltage from GND to BOOT
Voltage from SW to BOOT
FB Voltage
VSWAC
VBOOT
ΔVBOOT
VFB
V
-0.3 to +45
-0.3 to +7
-0.3 to +3
-0.3 to +3
-0.3 to +39
-0.3 to +3
3
V
V
V
COMP Voltage
VCOMP
VEN
V
EN Voltage
V
SS Voltage
VSS
V
Output Current
IOUT
A
Maximum Junction Temperature
Tjmax
150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
TSOT23-8L
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
182.4
25
82.8
22
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A (Still-Air). The chip of BD9E304 has been measured.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Material
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Measurement Board
4 Layers
FR-4
Top
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Copper Pattern
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Input Voltage
VIN
Topr
IOUT
4.5
-40
0
-
-
-
-
36.0
+85
V
°C
A
Operating Temperature(Note 1)
Output Current(Note 1)
Output Voltage Setting(Note 2)
3
VOUT
0.7
VINx0.8
V
(Note 1) Tj must be 125 °C or less under the actual operating environment. Lifetime is derated at junction temperature greater than 125 °C.
(Note 2) Please use within the range of VOUT ≥ VIN × 0.1 [V].
Electrical Characteristics (Unless otherwise specified Ta = 25 °C, VIN = 12 V, VEN = 3 V)
Parameter
Input Supply
Symbol
Min
Typ
Max
Unit
Conditions
Shutdown Current
ISDN
IQ
VUVLO1
VUVLO2
-
-
3
15
90
µA
µA
VEN = 0 V
IOUT = 0 A,
No switching
Operating Quiescent Current
45
UVLO Detection Threshold Voltage
UVLO Release Threshold Voltage
UVLO Hysteresis Voltage
Enable
3.7
4.05
300
3.9
4.25
350
4.1
4.45
400
V
V
VIN falling
VIN rising
VUVLOHYS
mV
EN Threshold Voltage High
EN Threshold Voltage Low
EN Hysteresis Voltage
EN Input Current
VENH
VENL
1.1
1.0
50
-
1.2
1.1
100
0
1.3
1.2
200
3
V
V
VEN rising
VEN falling
VENHYS
IEN
mV
µA
VEN = 3 V
Reference Voltage, Error Amplifier, Soft Start
FB Threshold Voltage
FB Input Current
VFBTH
IFB
0.591
0.600
-
0.609
100
15
V
-
5
nA
µA
µA
ms
µA
VFB = 0.6 V
COMP Source Current
COMP Sink Current
Soft Start Time
ICOMPSO
ICOMPSI
tSS
10
5
10
15
1.75
2.0
2.50
2.5
3.25
3.0
The SS pin is open.
Soft Start Charge Current
SW (MOSFET)
ISS
Switching Frequency
Maximum Duty Ratio
High Side FET ON Resistance
Low Side FET ON Resistance
Protection
fSW
255
80
300
-
345
-
kHz
%
DMAX
RONH
RONL
50
100
60
150
90
mΩ
mΩ
VBOOT - VSW = 5 V
30
High Side Over Current Limit(Note 3)
Low Side Over Current Limit(Note 3)
IHOCP
ILOCP
4.5
3.0
5.0
3.5
5.5
4.0
A
A
(Note 3) No tested on outgoing inspection.
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Typical Performance Curves
Figure 1. Shutdown Current vs Temperature
Figure 2. Operating Quiescent Current vs Temperature
4.5
4.4
4.3
4.2
4.1
4.0
3.9
3.8
3.7
1.30
VIN rising
VIN falling
VEN rising
VEN falling
1.25
1.20
1.15
1.10
1.05
1.00
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 3. UVLO Threshold Voltage vs Temperature
Figure 4. EN Threshold Voltage vs Temperature
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Typical Performance Curves – continued
Figure 5. EN Input Current vs Temperature
Figure 6. FB Threshold Voltage vs Temperature
Figure 7. FB Input Current vs Temperature
Figure 8. Soft Start Time vs Temperature
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Typical Performance Curves – continued
200
180
160
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Figure 9. Soft Start Charge Current vs Temperature
Figure 10. High Side FET ON Resistance vs Temperature
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Figure 11. Low Side FET ON Resistance vs Temperature
Figure 12. Switching Frequency vs Temperature
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Typical Performance Curves – continued
Figure 13. COMP Source Current vs Temperature
Figure 14. COMP Sink Current vs Temperature
6.5
6.0
5.5
5.0
4.5
4.0
3.5
5
4
4
3
3
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 15. High Side Over Current Limit vs Temperature
Figure 16. Low Side Over Current Limit vs Temperature
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Typical Performance Curves – continued
Figure 17. Maximum Duty Ratio vs Temperature
Figure 18. Output Voltage vs Output Current
Figure 19. Efficiency vs Output Current 1
Figure 20. Efficiency vs Output Current 2
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Typical Performance Curves – continued
Time: 1 ms/div
VIN: 10 V/div
Time: 20 ms/div
VIN: 10 V/div
VEN: 2 V/div
VEN: 2 V/div
VOUT: 2 V/div
VSS: 2 V/div
VOUT: 2 V/div
VSS: 2 V/div
Figure 21. Start-up at No load: VEN = 0 V to 3 V
(VIN = 12 V, VOUT = 5 V, CSS = OPEN)
Figure 22. Shutdown at No Load VEN = 3 V to 0 V
(VIN = 12 V, VOUT = 5 V, CSS = OPEN)
Time: 0.2 ms/div
Time: 1 ms/div
VIN: 10 V/div
VIN: 10 V/div
VEN: 2 V/div
VEN: 2 V/div
VOUT: 2 V/div
VSS: 2 V/div
VOUT: 2 V/div
VPGD: 2 V/div
Figure 23. Start-up at RLOAD = 1.66 Ω: VEN = 0 V to 3 V
(VIN = 12 V, VOUT = 5 V, CSS = OPEN)
Figure 24. Shutdown at RLOAD = 1.66 Ω: VEN = 3 V to 0 V
(VIN = 12 V, VOUT = 5 V, CSS = OPEN)
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Typical Performance Curves – continued
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 25. Output Current vs Temperature(Note 1)
Figure 26. Output Current vs Temperature(Note 1)
Operating Range: Tj < 125 °C (VIN = 7 V, VOUT = 0.7 V)
Operating Range: Tj < 125 °C (VIN = 12 V, VOUT = 1.2 V)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 27. Output Current vs Temperature(Note 1)
Figure 28. Output Current vs Temperature(Note 1)
Operating Range: Tj < 125 °C (VIN = 18 V, VOUT = 1.8 V)
Operating Range: Tj < 125 °C (VIN = 32 V, VOUT = 3.3 V)
(Note 1) Measured on FR-4 board 85 mm x 85 mm, Copper Thickness: Top and Bottom 70 μm, 2 Internal Layers 35 μm.
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Typical Performance Curves – continued
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 29. Output Current vs Temperature(Note 1)
Figure 30. Output Current vs Temperature(Note 1)
Operating Range: Tj < 125 °C (VIN = 36 V, VOUT = 5 V)
Operating Range: Tj < 125 °C (VIN = 36 V, VOUT = 12 V)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-60 -40 -20
0
20 40 60 80 100
Temperature : Ta [°C]
Figure 31. Output Current vs Temperature(Note 1)
Operating Range: Tj < 125 °C (VIN = 36 V, VOUT = 24 V)
(Note 1) Measured on FR-4 board 85 mm x 85 mm, Copper Thickness: Top and Bottom 70 μm, 2 Internal Layers 35 μm.
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Function Explanation
1. Basic Operation
(1) DC/DC Converter Operation
BD9E304FP4-LBZ is a synchronous rectifying step-down switching regulator that achieves faster transient response
by employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode
for heavier load, while it utilizes Light Load Mode control for lighter load to improve efficiency.
Light Load Mode Control
PWM Control
Fixed PWM Mode Control
Output Current [A]
Figure 32. Efficiency Image between Light Load Mode Control and PWM Mode Control
(2) Enable Control
The startup and shutdown can be controlled by the EN voltage (VEN). When VEN becomes 1.2 V (Typ) or more, the
internal circuit is activated and the device starts up. When VEN becomes 1.1 V (Typ) or less, the device is shutdown. In
this shutdown mode, the High Side FET and the Low Side FET are turned off and the SW pin is connected to GND
through an internal resistor 400 Ω (Typ) to discharge the output. The startup with VEN must be at the same time of the
input voltage VIN (VIN = VEN) or after supplying VIN.
VIN
0 V
VEN
VENH
VENL
0 V
VOUT
0 V
Startup
Shutdown
Figure 33. Startup and Shutdown with Enable Control Timing Chart
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1. Basic Operation – continued
(3) Soft Start
When VEN goes high, soft start function operates and output voltage gradually rises. This soft start function can prevent
overshoot of the output voltage and excessive inrush current. The soft start time tSS is 2.5 ms (Typ) when the SS pin is
left floating. A capacitor connected to the SS pin makes tSS more than 2.5 ms. See Selection of Components Externally
Connected 4. Soft Start Capacitor for how to set the soft start time.
VIN
0 V
VEN
0 V
VOUT
0 V
VFBTH x 90 %
0.6 V
(Typ)
VFB
0 V
tSS
Figure 34. Soft Start Timing Chart
(4) Output Capacitor Discharge Function
When even one of the following conditions is satisfied, output is discharged with 400 Ω (Typ) internal resistor through
the SW pin.
• Shutdown: VEN ≤ 1.1 V (Typ)
• UVLO: VIN ≤ 3.9 V (Typ)
• TSD: Tj ≥ 175 °C (Typ)
• OVP: VFB / VFBTH ≥ 120 % (Typ)
When all of the above conditions are released, output discharge is stopped.
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Function Explanation – continued
2. Protection
The protection circuits are intended for prevention of damage caused by unexpected accidents. Do not use the
continuous protection.
(1) Over Current Protection (OCP) / Short Circuit Protection (SCP)
Over Current Protection (OCP) restricts the flowing current through the Low Side FET and the High Side FET for every
switching period. If the inductor current exceeds the Low Side OCP ILOCP = 3.5 A (Typ) while the Low Side FET is on,
the Low Side FET remains on even with FB voltage VFB falls to VFBTH = 0.6 V (Typ) or less. If the inductor current
becomes less than ILOCP, the High Side FET is able to be turned on. When the inductor current becomes the High Side
OCP IHOCP = 5 A (Typ) or more, while the High Side FET is on, the High Side FET is turned off. Output voltage may
decrease by changing frequency and duty due to the OCP operation.
Short Circuit Protection (SCP) function is a Hiccup mode. When Low Side OCP remains at 0.9ms duration while VFB is
VFBTH x 70 % or less, the device stops the switching operation for 100ms. After that, the device restarts. SCP does not
operate during the soft start even if the device is in the SCP conditions. Do not exceed the maximum junction
temperature (Tjmax = 150 °C) during OCP and SCP operation.
VEN
VFB
Start-up
OCP
SCP
≤ VFBTH x 70 % (Typ)
> VFBTH x 70 % (Typ)
≤ VFBTH x 70 % (Typ)
-
During Soft Start
Enable
Enable
Enable
Disable
Disable
Disable
Enable
Disable
≥ 1.2 V (Typ)
≤ 1.1 V (Typ)
Complete Soft Start
Shutdown
Table 1. The Operating Condition of OCP and SCP
Figure 35. OCP and SCP Timing Chart
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2. Protection – continued
(2) Under Voltage Lockout Protection (UVLO)
When input voltage VIN falls to 3.9 V (Typ) or less, the device is shutdown. When VIN becomes 4.25 V (Typ) or more,
the device starts up. The hysteresis is 350 mV (Typ).
VIN
(=VEN
)
Hysteresis
VUVLOHYS = 350 mV (Typ)
VOUT
UVLO Release
VUVLO2 = 4.25 V (Typ)
UVLO Detection
VUVLO1 = 3.9 V (Typ)
0 V
VOUT
0 V
tSS
Figure 36. UVLO Timing Chart
(3) Thermal Shutdown Protection (TSD)
Thermal shutdown circuit prevents heat damage to the IC. The device should always operate within the IC’s maximum
junction temperature rating (Tjmax = 150 °C). However, if it continues exceeding the rating and the junction temperature
Tj rises to 175 °C (Typ), the TSD circuit is activated and it turns the output MOSFETs off. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation. The TSD threshold has a hysteresis of 25 °C
(Typ). Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings. Therefore, under
no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
(4) Over Voltage Protection (OVP)
When the FB voltage VFB exceeds VFBTH x 120 % (Typ) or more, output is discharged with 400 Ω (Typ) resister through
the SW pin to prevent the increase in the output voltage. After the VFB falls VFBTH x 115 % (Typ) or less, the output
MOSFETs are returned to normal operation condition. Switching operation restarts after VFB falls below VFBTH (Typ).
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BD9E304FP4-LBZ
Application Examples
1. VIN = 5 V to 12 V, VOUT = 1.2 V
Table 2. Specification of Application
Parameter
Input Voltage
Symbol
Specification Value
5 V to 12 V (Typ)
1.2 V (Typ)
3 A
VIN
VOUT
IOUTMAX
Ta
Output Voltage
Maximum Output Current
Temperature
25 °C
BD9E304FP4
VIN
VIN
BOOT
SW
CBOOT
L
CIN2
CIN1
VOUT
GND
R0
EN
EN
R1A
COUT1
COUT2
COMP
CFB
R1B
R2
RCOMP
FB
SS
CSS
CCOMP
Figure 37. Application Circuit
Table 3. Recommended Component Values
Size Code
Part No.
Value
3.3 μH
0.1 μF (50 V, X5R, ±15 %)
Part Name
Manufacturer
(mm)
L
DEM8045C
8080
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
-
(Note 1)
CIN1
GRM155R61H104KE14
1005
3225
1005
3216
3216
0603
0603
-
(Note 2)
CIN2
10 μF (100 V, X7S, ±22 %) GRM32EC72A106KE05
(Note 3)
CBOOT
0.1 μF (50 V, X5R, ±15 %)
47 μF (16 V, X5R, ±15 %)
47 μF (16 V, X5R, ±15 %)
120 pF (50 V, C0G, ±5 %)
680 pF (25 V, C0G, ±5 %)
-
GRM155R61H104KE14
GRM31CR61C476ME44
GRM31CR61C476ME44
GRM0335C1H121JA01
GRM0335C1E681JA01
-
(Note 4)
COUT1
(Note 4)
COUT2
CFB
(Note 5)
CCOMP
CSS
(Note 5)
RCOMP
51 kΩ (1 %, 1/16 W)
Short
MCR01MZPF5102
-
1005
-
ROHM
-
R1A
R1B
R2
100 kΩ (1 %, 1/16 W)
100 kΩ (1 %, 1/16 W)
Short
MCR01MZPF1003
MCR01MZPF1003
-
1005
1005
-
ROHM
ROHM
-
(Note 6)
R0
(Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the GND pin.
(Note 2) For the input capacitor CIN2, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no less
than 3.0 μF.
(Note 3) For the bootstrap capacitor CBOOT, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no
less than 0.022 μF.
(Note 4) In case of changing the actual capacitance value due to temperature characteristics, DC bias characteristics, etc. of the output capacitor COUT1 and COUT2
the loop response characteristics may change. Confirm the actual application.
,
(Note 5) See Selection of Components Externally Connected 4. Phase Compensation for how to calculate phase compensation components.
(Note 6) R0 is an option, used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response
(phase margin) using a FRA and so on. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.
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1. VIN = 5 V to 12 V, VOUT = 1.2 V – continued
Time: 4 µs/div
VOUT: 10 mV/div
VSW: 2 V/div
Figure 38. Efficiency vs Output Current
Figure 39. Output Ripple Voltage (VIN = 5 V, IOUT = 3 A)
Time: 1.0 ms/div
VOUT: 200 mV/div
IOUT: 1 A/div
Figure 40. Frequency Characteristics (VIN = 5 V, IOUT = 3 A)
Figure 41. Load Transient Response
(VIN = 5 V, IOUT = 0.75 A to 2.25 A)
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Application Examples – continued
2. VIN = 5 V to 18 V, VOUT = 1.8 V
Table 4. Specification of Application
Parameter
Input Voltage
Symbol
Specification Value
5 V to 18 V (Typ)
1.8 V (Typ)
3 A
VIN
VOUT
IOUTMAX
Ta
Output Voltage
Maximum Output Current
Temperature
25 °C
BD9E304FP4
VIN
VIN
BOOT
SW
CBOOT
L
CIN2
CIN1
VOUT
GND
R0
EN
EN
R1A
COUT1
COUT2
COMP
CFB
R1B
R2
RCOMP
FB
SS
CSS
CCOMP
Figure 42. Application Circuit
Table 5. Recommended Component Values
Size Code
Part No.
Value
Part Name
Manufacturer
(mm)
L
10 μH
DEM8045C
8080
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
-
(Note 1)
CIN1
0.1 μF (50 V, X5R, ±15 %)
GRM155R61H104KE14
1005
3225
1005
3216
3216
0603
0603
-
(Note 2)
CIN2
10 μF (100 V, X7S, ±22 %) GRM32EC72A106KE05
(Note 3)
CBOOT
0.1 μF (50 V, X5R, ±15 %)
47 μF (16 V, X5R, ±15 %)
47 μF (16 V, X5R, ±15 %)
120 pF (50 V, C0G, ±5 %)
680 pF (25 V, C0G, ±5 %)
-
GRM155R61H104KE14
GRM31CR61C476ME44
GRM31CR61C476ME44
GRM0335C1H121JA01
GRM0335C1E681JA01
-
(Note 4)
COUT1
(Note 4)
COUT2
CFB
(Note 5)
CCOMP
CSS
(Note 5)
RCOMP
91 kΩ (1 %, 1/16 W)
43 kΩ (1 %, 1/16 W)
43 kΩ (1 %, 1/16 W)
43 kΩ (1 %, 1/16 W)
Short
MCR01MZPF9102
MCR01MZPF4302
MCR01MZPF4302
MCR01MZPF4302
-
1005
1005
1005
1005
-
ROHM
ROHM
ROHM
ROHM
-
R1A
R1B
R2
(Note 6)
R0
(Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the GND pin.
(Note 2) For the input capacitor CIN2, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no less
than 3.0 μF.
(Note 3) For the bootstrap capacitor CBOOT, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no
less than 0.022 μF.
(Note 4) In case of changing the actual capacitance value due to temperature characteristics, DC bias characteristics, etc. of the output capacitor COUT1 and COUT2
the loop response characteristics may change. Confirm the actual application.
,
(Note 5) See Selection of Components Externally Connected 4. Phase Compensation for how to calculate phase compensation components.
(Note 6) R0 is an option, used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response
(phase margin) using a FRA and so on. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.
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2. VIN = 5 V to 18 V, VOUT = 1.8 V – continued
Time: 4 µs/div
VOUT: 10 mV/div
VSW: 5 V/div
Figure 43. Efficiency vs Output Current
Figure 44. Output Ripple Voltage (VIN = 12 V, IOUT = 3 A)
Time: 1.0 ms/div
VOUT: 200 mV/div
IOUT: 1 A/div
Figure 45. Frequency Characteristics (VIN = 12 V, IOUT = 3 A)
Figure 46. Load Transient Response
(VIN = 12 V, IOUT = 0.75 A to 2.25 A)
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Application Examples – continued
3. VIN = 12 V to 24 V, VOUT = 3.3 V
Table 6. Specification of Application
Parameter
Input Voltage
Symbol
Specification Value
12 V to 24 V (Typ)
3.3 V (Typ)
3 A
VIN
VOUT
IOUTMAX
Ta
Output Voltage
Maximum Output Current
Temperature
25 °C
BD9E304FP4
VIN
VIN
BOOT
SW
CBOOT
L
CIN2
CIN1
VOUT
GND
R0
EN
EN
R1A
COUT1
COUT2
COMP
CFB
R1B
R2
RCOMP
FB
SS
CSS
CCOMP
Figure 47. Application Circuit
Table 7. Recommended Component Values
Size Code
Part No.
Value
Part Name
Manufacturer
(mm)
L
10 μH
DEM8045C
8080
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
-
(Note 1)
CIN1
0.1 μF (50 V, X5R, ±15 %)
GRM155R61H104KE14
1005
3225
1005
3216
3216
0603
0603
-
(Note 2)
CIN2
10 μF (100 V, X7S, ±22 %) GRM32EC72A106KE05
(Note 3)
CBOOT
0.1 μF (50 V, X5R, ±15 %)
47 μF (16 V, X5R, ±15 %)
47 μF (16 V, X5R, ±15 %)
120 pF (50 V, C0G, ±5 %)
680 pF (25 V, C0G, ±5 %)
-
GRM155R61H104KE14
GRM31CR61C476ME44
GRM31CR61C476ME44
GRM0335C1H121JA01
GRM0335C1E681JA01
-
(Note 4)
COUT1
(Note 4)
COUT2
CFB
(Note 5)
CCOMP
CSS
(Note 5)
RCOMP
47 kΩ (1 %, 1/16 W)
13 kΩ (1 %, 1/16 W)
180 kΩ (1 %, 1/16 W)
43 kΩ (1 %, 1/16 W)
Short
MCR01MZPF4702
MCR01MZPF1302
MCR01MZPF1803
MCR01MZPF4302
-
1005
1005
1005
1005
-
ROHM
ROHM
ROHM
ROHM
-
R1A
R1B
R2
(Note 6)
R0
(Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the GND pin.
(Note 2) For the input capacitor CIN2, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no less
than 3.0 μF.
(Note 3) For the bootstrap capacitor CBOOT, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no
less than 0.022 μF.
(Note 4) In case of changing the actual capacitance value due to temperature characteristics, DC bias characteristics, etc. of the output capacitor COUT1 and COUT2
the loop response characteristics may change. Confirm the actual application.
,
(Note 5) See Selection of Components Externally Connected 4. Phase Compensation for how to calculate phase compensation components.
(Note 6) R0 is an option, used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response
(phase margin) using a FRA and so on. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.
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3. VIN = 12 V to 24 V, VOUT = 3.3 V – continued
Time: 4 µs/div
VOUT: 10 mV/div
VSW: 5 V/div
Figure 48. Efficiency vs Output Current
Figure 49. Output Ripple Voltage (VIN = 12 V, IOUT = 3 A)
Time: 1.0 ms/div
VOUT: 200 mV/div
IOUT: 1 A/div
Figure 50. Frequency Characteristics (VIN = 12 V, IOUT = 3 A)
Figure 51. Load Transient Response
(VIN = 12 V, IOUT = 0.75 A to 2.25 A)
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Application Examples – continued
4. VIN = 12 V to 24 V, VOUT = 5 V
Table 8. Specification of Application
Parameter
Input Voltage
Symbol
Specification Value
12 V to 24 V (Typ)
5 V (Typ)
VIN
VOUT
IOUTMAX
Ta
Output Voltage
Maximum Output Current
Temperature
3 A
25 °C
BD9E304FP4
VIN
VIN
BOOT
SW
CBOOT
L
CIN2
CIN1
VOUT
GND
R0
EN
EN
R1A
COUT1
COUT2
COMP
CFB
R1B
R2
RCOMP
FB
SS
CSS
CCOMP
Figure 52. Application Circuit
Table 9. Recommended Component Values
Size Code
Part No.
Value
Part Name
Manufacturer
(mm)
L
15 μH
DEM8045C
8080
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
-
(Note 1)
CIN1
0.1 μF (50 V, X5R, ±15 %)
GRM155R61H104KE14
1005
3225
1005
3216
3216
0603
0603
-
(Note 2)
CIN2
10 μF (100 V, X7S, ±22 %) GRM32EC72A106KE05
(Note 3)
CBOOT
0.1 μF (50 V, X5R, ±15 %)
47 μF (16 V, X5R, ±15 %)
47 μF (16 V, X5R, ±15 %)
120 pF (50 V, C0G, ±5 %)
680 pF (25 V, C0G, ±5 %)
-
GRM155R61H104KE14
GRM31CR61C476ME44
GRM31CR61C476ME44
GRM0335C1H121JA01
GRM0335C1E681JA01
-
(Note 4)
COUT1
(Note 4)
COUT2
CFB
(Note 5)
CCOMP
CSS
(Note 5)
RCOMP
33 kΩ (1 %, 1/16 W)
15 kΩ (1 %, 1/16 W)
300 kΩ (1 %, 1/16 W)
43 kΩ (1 %, 1/16 W)
Short
MCR01MZPF3302
MCR01MZPF1502
MCR01MZPF3003
MCR01MZPF4302
-
1005
1005
1005
1005
-
ROHM
ROHM
ROHM
ROHM
-
R1A
R1B
R2
(Note 6)
R0
(Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the GND pin.
(Note 2) For the input capacitor CIN2, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no less
than 3.0 μF.
(Note 3) For the bootstrap capacitor CBOOT, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no
less than 0.022 μF.
(Note 4) In case of changing the actual capacitance value due to temperature characteristics, DC bias characteristics, etc. of the output capacitor COUT1 and COUT2
the loop response characteristics may change. Confirm the actual application.
,
(Note 5) See Selection of Components Externally Connected 4. Phase Compensation for how to calculate phase compensation components.
(Note 6) R0 is an option, used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response
(phase margin) using a FRA and so on. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.
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4. VIN = 12 V to 24 V, VOUT = 5 V – continued
Time: 4 µs/div
VOUT: 10 mV/div
VSW: 5 V/div
Figure 53. Efficiency vs Output Current
Figure 54. Output Ripple Voltage (VIN = 12 V, IOUT = 3 A)
Time: 1.0 ms/div
VOUT: 200 mV/div
IOUT: 1 A/div
Figure 55. Frequency Characteristics (VIN = 12 V, IOUT = 3 A)
Figure 56. Load Transient Response
(VIN = 12 V, IOUT = 0.75 A to 2.25 A)
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Application Examples – continued
5. VIN = 24 V to 36 V, VOUT = 12 V
Table 10. Specification of Application
Parameter
Input Voltage
Symbol
Specification Value
24 V to 36 V (Typ)
12 V (Typ)
VIN
VOUT
IOUTMAX
Ta
Output Voltage
Maximum Output Current
Temperature
3 A
25 °C
BD9E304FP4
VIN
VIN
BOOT
SW
CBOOT
L
CIN2
CIN1
VOUT
GND
R0
EN
EN
R1A
COUT1
COUT2
COMP
CFB
R1B
R2
RCOMP
FB
SS
CSS
CCOMP
Figure 57. Application Circuit
Table 11. Recommended Component Values
Size Code
Part No.
Value
Part Name
Manufacturer
(mm)
L
22 μH
DEM10050C
100100
Murata
Murata
Murata
Murata
TAIYO YUDEN
TAIYO YUDEN
Murata
Murata
-
(Note 1)
CIN1
0.1 μF (50 V, X5R, ±15 %)
GRM155R61H104KE14
1005
3225
1005
3225
3225
0603
0603
-
(Note 2)
CIN2
10 μF (100 V, X7S, ±22 %) GRM32EC72A106KE05
(Note 3)
CBOOT
0.1 μF (50 V, X5R, ±15 %)
47 μF (25 V, X5R, ±20 %)
47 μF (25 V, X5R, ±20 %)
120 pF (50 V, C0G, ±5 %)
680 pF (25 V, C0G, ±5 %)
-
GRM155R61H104KE14
TMK325ABJ476MM-P
TMK325ABJ476MM-P
GRM0335C1H121JA01
GRM0335C1E681JA01
-
(Note 4)
COUT1
(Note 4)
COUT2
CFB
(Note 5)
CCOMP
CSS
(Note 5)
RCOMP
30 kΩ (1 %, 1/16 W)
43 kΩ (1 %, 1/16 W)
470 kΩ (1 %, 1/16 W)
27 kΩ (1 %, 1/16 W)
Short
MCR01MZPF3002
MCR01MZPF4302
MCR01MZPF4703
MCR01MZPF2702
-
1005
1005
1005
1005
-
ROHM
ROHM
ROHM
ROHM
-
R1A
R1B
R2
(Note 6)
R0
(Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the GND pin.
(Note 2) For the input capacitor CIN2, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no less
than 3.0 μF.
(Note 3) For the bootstrap capacitor CBOOT, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no
less than 0.022 μF.
(Note 4) In case of changing the actual capacitance value due to temperature characteristics, DC bias characteristics, etc. of the output capacitor COUT1 and COUT2
the loop response characteristics may change. Confirm the actual application.
,
(Note 5) See Selection of Components Externally Connected 4. Phase Compensation for how to calculate phase compensation components.
(Note 6) R0 is an option, used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response
(phase margin) using a FRA and so on. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.
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5. VIN = 24 V to 36 V, VOUT = 12 V – continued
Time: 4 µs/div
VOUT: 20 mV/div
VSW: 10 V/div
Figure 58. Efficiency vs Output Current
Figure 59. Output Ripple Voltage (VIN = 24 V, IOUT = 3 A)
Time: 1.0 ms/div
VOUT: 500 mV/div
IOUT: 1 A/div
Figure 60. Frequency Characteristics (VIN = 24 V, IOUT = 3 A)
Figure 61. Load Transient Response
(VIN = 24 V, IOUT = 0.75 A to 2.25 A)
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Application Examples – continued
6. VIN = 32 V to 36 V, VOUT = 24 V
Table 12. Specification of Application
Parameter
Input Voltage
Symbol
Specification Value
32 V to 36 V (Typ)
24 V (Typ)
VIN
VOUT
IOUTMAX
Ta
Output Voltage
Maximum Output Current
Temperature
3 A
25 °C
BD9E304FP4
VIN
VIN
BOOT
SW
CBOOT
L
CIN2
CIN1
VOUT
GND
R0
EN
EN
R1A
COUT1
COUT2
COMP
CFB
R1B
R2
RCOMP
FB
SS
CSS
CCOMP
Figure 62. Application Circuit
Table 13. Recommended Component Values
Size Code
Part No.
Value
Part Name
Manufacturer
(mm)
L
22 μH
DEM10050C
100100
Murata
Murata
Murata
Murata
TAIYO YUDEN
TAIYO YUDEN
Murata
Murata
-
(Note 1)
CIN1
0.1 μF (50 V, X5R, ±15 %)
GRM155R61H104KE14
1005
3225
1005
3225
3225
0603
0603
-
(Note 2)
CIN2
10 μF (100 V, X7S, ±22 %) GRM32EC72A106KE05
(Note 3)
CBOOT
0.1 μF (50 V, X5R, ±15 %)
47 μF (25 V, X5R, ±20 %)
47 μF (25 V, X5R, ±20 %)
120 pF (50 V, C0G, ±5 %)
680 pF (25 V, C0G, ±5 %)
-
GRM155R61H104KE14
TMK325ABJ476MM-P
TMK325ABJ476MM-P
GRM0335C1H121JA01
GRM0335C1E681JA01
-
(Note 4)
COUT1
(Note 4)
COUT2
CFB
(Note 5)
CCOMP
CSS
(Note 5)
RCOMP
27 kΩ (1 %, 1/16 W)
Short
MCR01MZPF2702
-
1005
-
ROHM
-
R1A
R1B
R2
390 kΩ (1 %, 1/16 W)
10 kΩ (1 %, 1/16 W)
Short
MCR01MZPF3903
MCR01MZPF1002
-
1005
1005
-
ROHM
ROHM
-
(Note 6)
R0
(Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the GND pin.
(Note 2) For the input capacitor CIN2, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no less
than 3.0 μF.
(Note 3) For the bootstrap capacitor CBOOT, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no
less than 0.022 μF.
(Note 4) In case of changing the actual capacitance value due to temperature characteristics, DC bias characteristics, etc. of the output capacitor COUT1 and COUT2
the loop response characteristics may change. Confirm the actual application.
,
(Note 5) See Selection of Components Externally Connected 4. Phase Compensation for how to calculate phase compensation components.
(Note 6) R0 is an option, used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response
(phase margin) using a FRA and so on. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.
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6. VIN = 32 V to 36 V, VOUT = 24 V – continued
Time: 4 µs/div
VOUT: 50 mV/div
VSW: 10 V/div
Figure 63. Efficiency vs Output Current
Figure 64. Output Ripple Voltage (VIN = 36 V, IOUT = 3 A)
Time: 1.0 ms/div
VOUT: 500 mV/div
IOUT: 1 A/div
Figure 65. Frequency Characteristics (VIN = 36 V, IOUT = 3 A)
Figure 66. Load Transient Response
(VIN = 36 V, IOUT = 0.75 A to 2.25 A)
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Selection of Components Externally Connected
Contact us if not use the recommended component values in Application Examples.
1. Input Capacitor
Use ceramic type capacitor for the input capacitor. The input capacitor is used to reduce the input ripple noise and it is
effective by being placed as close as possible to the VIN pin. Set the capacitor value so that it does not fall to 3 μF
considering the capacitor value variances, temperature characteristics, DC bias characteristics, aging characteristics, and
etc. The PCB layout and the position of the capacitor may lead to IC malfunction. Refer to the notes on the PCB layout on
PCB Layout Design when designing PCB layout. In addition, the capacitor with value 0.1 μF can be connected as close as
possible to the VIN pin and the GND pin in order to reduce the high frequency noise.
2. Output LC Filter
In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the output
voltage. For recommended inductance, use the values listed in Table 14.
VIN
IL
Inductor saturation current > IOUTMAX + ∆IL/2
L
VOUT
Driver
∆IL
Maximum Output Current IOUTMAX
COUT
t
Figure 67. Waveform of Inductor Current
Figure 68. Output LC Filter Circuit
For example, given that VIN = 12 V, VOUT = 5 V, L = 15 μH, and the switching frequency fSW = 300 kHz, Inductor current
ΔIL can be represented by the following equation.
1
(
)
×
∆퐼퐿 = 푉푂푈푇 × 푉 − 푉푂푈푇
= 0.648 [A]
ꢀ푁
ꢁ
ꢂꢃ
×푓 ×퐿
푆푊
The rated current of the inductor (Inductor saturation current) must be larger than the sum of the maximum output current
IOUTMAX and 1/2 of the inductor ripple current ΔIL.
Use ceramic type capacitor for the output capacitor COUT. For recommended actual capacitance, use the values listed in
Table 16. COUT affects the output ripple voltage. Select COUT so that it must satisfy the required ripple voltage
characteristics.
The output ripple voltage can be estimated by the following equation.
1
∆푉푅푃퐿 = ∆퐼퐿 × ꢄꢅ퐸ꢆ푅
+
ꢋ [V]
푆푊
ꢇ×퐶
×푓
ꢈꢉꢊ
where:
ꢅ퐸ꢆ푅 is the Equivalent Series Resistance (ESR) of the output capacitor.
For example, given that COUT = 44 μF and RESR = 3 mΩ, ΔVRPL can be calculated as below.
1
∆푉푅푃퐿 = 0.648 퐴 × ꢄ3 푚훺 + ꢇ×ꢌꢌ 휇퐹×ꢍꢎꢎ 푘퐻푧ꢋ = 8.ꢏ [mV]
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2. Output LC Filter – continued
In addition, the total capacitance connected to VOUT needs to satisfy the value obtained by the following equation.
푡
∆ꢀ
ꢐ푂푈푇푀ꢑ푋
< +
푆푆ꢒꢂꢃ × (퐼푂푈푇푀ꢑ푋 ꢓ − 퐼푂푈푇ꢆꢆ) [F]
ꢁ 2
ꢈꢉꢊ
where:
ꢔꢆꢆ푀ꢀ푁 is the minimum soft start time.
푉푂푈푇 is the output voltage.
퐼푂푈푇푀ꢑ푋 is the maximum output current.
∆IL is the inductor current.
IOUTSS is the maximum output current during soft start.
For example, given that VIN = 12 V, VOUT = 5 V, L = 15 µH, fSW = 300 kHz (Typ), tSSMIN = 1.75 ms (CSS = OPEN), IOUTMAX
3 A, and IOUTSS = 3 A, COUTMAX can be calculated as below.
=
ꢐ푂푈푇푀ꢑ푋
<
1.75 ꢕ푠 × (3 퐴 + ꢎ.ꢖꢌꢇ ꢑ − 3 퐴) = ꢏꢏ3 [µF]
5.ꢎ ꢁ 2
If the total capacitance connected to VOUT is larger than COUTMAX, over current protection may be activated by the inrush
current at startup and prevented to turn on the output. Confirm this on the actual application.
Table 14. Recommended external parts value
(Note 1)
Inductor
L[μH]
3.3
COUT_EFF
[μF]
RCOMP
[kΩ]
51
91
47
33
30
27
CCOMP
[pF]
680
680
680
680
680
680
VIN [V]
VOUT [V]
R1 [kΩ]
R2 [kΩ]
CFB [pF]
100
86
193
315
513
390
100
43
43
43
27
10
120
120
120
120
120
120
5 to 12
5 to 18
12 to 32
12 to 36
24 to 36
32 to 36
1.2
1.8
3.3
5.0
12
44
10
10
15
22
22
44
44
44
22
22
24
(Note 1) COUT_EFF is the sum of actual output capacitance.
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Selection of Components Externally Connected – continued
3. Output Voltage Setting, FB Capacitor
The output voltage can be set by the feedback resistance ratio connected to the FB pin. For recommended R1, R2, and CFB
use the values listed in Table 14.
VOUT
The output voltage VOUT can be calculated as below.
CFB
R1
푅 ꢘ푅
ꢗ
ꢙ × 0.6 [V]
푅
ꢙ
Error Amplifier
푉푂푈푇
=
FB
R2
0.6 V
(Typ)
Figure 69. Feedback Resistor Circuit
4. Phase Compensation
A current mode control buck DC/DC converter is a two-pole, one-zero system. Two poles are formed by an error amplifier
and load and one zero point is added by phase compensation. The phase compensation resistor RCMP determines the
crossover frequency fCRS where the total loop gain of the DC/DC converter is 0 dB. High value for this crossover
frequency fCRS provides a good load transient response characteristic but inferior stability. Conversely, specifying a low
value for the crossover frequency fCRS greatly stabilizes the characteristics but the load transient response characteristic
is impaired. the total capacitance connected to VOUT needs to satisfy the value obtained by the following equation.
(1) Selection of Phase Compensation Resistor RCMP
The phase compensation resistance RCMP can be determined by using the following equation.
ꢚ휋 × 푉푂푈푇 × ꢛ × ꢐ푂푈푇
퐶푅ꢆ
ꢅ퐶푀푃
=
푉퐹퐵 × 퐺푀푃 × 퐺푀ꢑ
where:
VOUT is the output voltage.
fCRS is the crossover frequency.
COUT is the output capacitance.
VFB is the feedback reference voltage 0.6 V (Typ).
GMP is the current sense gain 11.76 A/V (Typ).
GMA is the error amplifier trans conductance 42 µA/V (Typ).
(2) Selection of Phase Compensation Capacitance CCMP
For stable operation of the DC/DC converter, inserting a zero point at 1/6 or less of the zero crossover frequency
cancels the phase delay due to the pole formed by the load often provides favorable characteristics.
The phase compensation capacitance CCMP can be determined by using the following equation.
1
ꢐ퐶푀푃
=
2ꢜ×푅
×푓
푍
ꢝꢒꢞ
where:
fZ is Zero point inserted
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4. Phase Compensation – continued
(3) Loop Stability
In order to ensure stability of DC/DC converter, confirm there is enough phase margin on actual equipment. Under
the worst condition, it is recommended to ensure phase margin is 45° or more. In fact, the characteristics may be
variable due to PCB layout, routing of wiring, types of used components and operating environments (temperature
etc.). Use gain-phase analyzer or FRA to confirm frequency characteristics on actual equipment. Please contact
each measuring instrument manufacture for the measuring method.
5. Soft Start Capacitor (Soft Start Time Setting)
The soft start time tSS depends on the value of the capacitor connected to the SS pin. The tSS is 2.5 ms (Typ) when the SS
pin is left floating. The CSS capacitor connected to the SS pin makes tSS more than 2.5 ms. The tSS and CSS can be calculated
using below equation. The CSS should be set in the range between 0.01 μF and 0.1 μF.
퐶
×ꢎ.ꢖ
푆푆
ꢔꢆꢆ =
[s]
ꢀ
푆푆
where:
퐼ꢆꢆ is the Soft Start Charge Current 2.5 µA (Typ).
With CSS = 0.022 μF, tSS can be calculated as below.
ꢎ.ꢎ22 휇퐹×ꢎ.ꢖ
ꢔꢆꢆ =
= ꢟ.ꢚ8 [ms]
2.5 휇ꢑ
6. Bootstrap Capacitor
The bootstrap capacitor 0.1 μF is recommended. Connect the capacitor between the SW pin and the BOOT pin. For the
capacitance, take temperature characteristics, DC bias characteristics, and etc. into consideration to set to the actual
capacitance of no less than 0.022 μF.
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PCB Layout Design
PCB layout design for DC/DC converter is very important. Appropriate layout can avoid various problems concerning power
supply. Figure 70-a to Figure 70-c show the current path in a buck DC/DC converter. The Loop 1 in Figure 70-a is a current
path when H-side switch is ON and L-side switch is OFF, the Loop 2 in Figure 70-b is when H-side switch is OFF and L-side
switch is ON. The thick line in Figure 70-c shows the difference between Loop1 and Loop2. The current in thick line change
sharply each time the switching element H-side and L-side switch change from OFF to ON, and vice versa. These sharp
changes induce a waveform with harmonics in this loop. Therefore, the loop area of thick line that is consisted by input
capacitor and IC should be as small as possible to minimize noise. For more details, refer to application note of switching
regulator series “PCB Layout Techniques of Buck Converter”.
Loop1
VIN
VOUT
L
High Side Switch
CIN
COUT
Low Side Switch
GND
GND
Figure 70-a. Current Path when H-side Switch = ON, L-side Switch = OFF
VIN
VOUT
L
High Side Switch
CIN
COUT
Loop2
Low Side Switch
GND
GND
Figure 70-b. Current Path when H-side Switch = OFF, L-side Switch = ON
VIN
VOUT
L
CIN
COUT
High Side FET
Low Side FET
GND
GND
Figure 70-c. Difference of Current and Critical Area in Layout
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PCB Layout Design – continued
When designing the PCB layout, pay attention to the following points:
•
•
Connect the input capacitor C1 and C2 as close as possible to the VIN pin and the GND pin on the same plane as the
IC.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the inductor pattern
L as thick and as short as possible.
•
•
•
The feedback line connected to the FB pin should be as far away from the SW nodes as possible.
Place the output capacitor C7 and C8 away from input capacitor C1 and C2 to avoid harmonics noise from the input.
R0 is provided for the measurement of feedback frequency characteristics (optional). By inserting a resistor into R0, it
is possible to measure the frequency characteristics of feedback (phase margin) using FRA etc. R0 is short-circuited
for normal use.
Figure 71. Application Circuit
Figure 72. Example of PCB Layout (Silkscreen Overlay)
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PCB Layout Design – continued
Top Layer
Inner 1 Layer
Inner 2 Layer
Bottom Layer
Figure 73. Example of PCB Layout
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I/O Equivalence Circuits
1. EN
4. FB
FB
EN
AGND
5. COMP
6. SS
VREG
VREG
10 kΩ
100 kΩ
8.2 kΩ
COMP
SS
AGND
AGND
AGND
7. SW
8. BOOT
VIN
BOOT
VREG
VIN
BOOT
SW
30 Ω
SW
350 Ω
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Operational Notes
1.
2.
3.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 74. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Ordering Information
B D 9 E 3
0
4
F
P
4
-
L B Z T L
Package
Product class
TSOT23-8L
LB: for Industrial applications
Packaging and forming specification
TL: Embossed tape and reel
Marking Diagram
Part Number Marking
LOT Number
TSOT23-8L (TOP VIEW)
A
B
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
TSOT23-8L
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Revision History
Date
Revision
001
Changes
29.Jan.2021
New Release
Page 19: Recommended Component Value
CCOMP Value and Part Name
390 pF
→ 680 pF
GRM0335C1E391JA01 → GRM0335C1E681JA01
RCOMP Value and Part Name
56 kΩ
→
51 kΩ
MCR01MZPF5602 → MCR01MZPF5102
Page 20: Update data
Figure 39: Output Ripple Voltage
Figure 40: Frequency Characteristics
Figure 41: Load Transient Response
Page 21: Recommended Component Value
CCOMP Value and Part Name
390 pF
→ 680 pF
GRM0335C1E391JA01 → GRM0335C1E681JA01
RCOMP Value and Part Name
120 kΩ
→
91 kΩ
MCR01MZPF1203 → MCR01MZPF9102
Page 22: Update data
Figure 44: Output Ripple Voltage
Figure 45: Frequency Characteristics
Figure 46: Load Transient Response
Page 24: Update data
Figure 49: Output Ripple Voltage
Figure 51: Load Transient Response
20.May.2022
002
Page 26: Update data
Figure 54: Output Ripple Voltage
Figure 56: Load Transient Response
Page 27: Recommended Component Value – L Part Name and Size Code
DEM8045C
8080 → 100100
→
DEM10050C
Page 28: Update data
Figure 59: Output Ripple Voltage
Figure 60: Frequency Characteristics
Figure 61. Load Transient Response
Page 29: Recommended Component Value – L Part Name and Size Code
DEM8045C
8080 → 100100
→
DEM10050C
Page 30: Update data
Figure 64: Output Ripple Voltage
Figure 65: Frequency Characteristics
Figure 66. Load Transient Response
Page 32: Recommended external parts value
Table 14: Update RCOMP and CCOMP values for VOUT = 1.2 V and VOUT = 1.8 V
Page 33: Output Voltage Setting, FB Capacitor
Correction of wording.
Page 6: 150 °C → 125 °C
Page 33: Change RCMP (R1) → RCMP, CCMP (C1) → CCMP
20.Dec.2022
003
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T7T0AJ01550-1-2
20.Dec.2022 Rev.003
43/43
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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