BM2P016-Z [ROHM]
本系列产品是AC/DC用PWM方式DC/DC转换器，可以为各种带插座的产品提供适合的电源系统。可支持绝缘和非绝缘型，容易设计各种类型的低功耗转换器。内置650V耐压启动电路，有助于降低功耗。通过外部连接开关用电流检测电阻器，可实现自由度高的电源设计。由于使用电流模式控制方式，并对每个回路进行电流限制，实现卓越的带宽和瞬态响应性能。采用固定频率方式，开关频率为65kHz。轻负载时，降低频率，实现高效率。内置跳频功能，有助于降低EMI。内置650V耐压MOSFET，设计容易。;
| 型号： | BM2P016-Z |
| 厂家： | 
ROHM |
| 描述： | 本系列产品是AC/DC用PWM方式DC/DC转换器，可以为各种带插座的产品提供适合的电源系统。可支持绝缘和非绝缘型，容易设计各种类型的低功耗转换器。内置650V耐压启动电路，有助于降低功耗。通过外部连接开关用电流检测电阻器，可实现自由度高的电源设计。由于使用电流模式控制方式，并对每个回路进行电流限制，实现卓越的带宽和瞬态响应性能。采用固定频率方式，开关频率为65kHz。轻负载时，降低频率，实现高效率。内置跳频功能，有助于降低EMI。内置650V耐压MOSFET，设计容易。 开关 光电二极管 插座 转换器 电阻器 |
| 文件： | 总24页 (文件大小：1028K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
AC/DC Drivers
PWM type DC/DC converter IC
Included a Switching MOSFET
BM2P015-Z BM2P016-Z
General Description
The PWM type DC/DC converter BM2P015-Z
Basic specifications
◼Operating Power Supply Voltage Range:
and BM2P016-Z for AC/DC provides an optimal system
for all products that include an electrical outlet.
This IC supports both isolated and non
-isolated devices, enabling simpler design of various
types of low-power electrical converters.
VCC:
DRAIN:
8.9V to 26.0V
to 650V
■ Normal Operating Current:
■Burst Operating Current:
◼Oscillation Frequency:
◼Operating Ambient Temperature:
◼MOSFET ON Resistance:
0.950mA (Typ.)
0.30mA(Typ.)
65kHz(Typ.)
- 40C to +105C
1.4Ω (Typ.)
The built-in 650V HV starter circuit contributes
to low-power consumption.
A higher degree of design freedom can be
achieved with current detection resistors as external
devices. Current is restricted in each cycle and
excellent performance is demonstrated in bandwidth
and transient response since current mode control is
utilized. The switching frequency is 65 kHz. At light
load, the switching frequency is reduced and high
efficiency is achieved. A frequency hopping function
that contributes to low EMI is also included on chip.
Design can be easily implemented because
includes a 650V switching MOSFET.
Package
DIP7K
W (Typ) x D (Typ) x H (Max)
9.27 mm x 6.35 mm x 8.63 mm
pitch 2.54 mm
9.35mm x 6.35mm x 8.10mm
Pitch 2.54mm
DIP7WF
Features
◼ PWM frequency : 65kHz
◼ PWM current mode control
◼ Burst operation when load is light
◼ Frequency reduction function
◼ Built-in 650V starter circuit
Applications
For AC adapters and household appliances (vacuum
cleaners, humidifiers, air cleaners, air conditioners, IH
cooking heaters, rice cookers, etc.)
◼ Built-in 650V switching MOSFET
◼ VCC pin Under-Voltage protection
◼ VCC pin Over-Voltage protection
◼ SOURCE pin Open Protection
◼ SOURCE pin Short Protection
◼ SOURCE pin Leading Edge Blanking function
◼ Per-cycle Over-Current Protection Circuit
◼ Soft start
Lineup
Product name
BM2P015-Z
BM2P016-Z
VCC OVP
Latch
Auto Restart
◼ Secondary Over-Current Protection Circuit
Application Circuit
+
FUSE
-
Diode
Bridge
AC
Filter
85–265Vac
6
5
7
DRAIN
DRAIN
VCC
ERROR
AMP
SOURCE
1
GND
3
FB
4
FADJ
2
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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© 2012 ROHM Co., Ltd. All rights reserved.
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Absolute Maximum Ratings (Ta=25C)
Parameter
Maximum applied voltage 1
Maximum applied voltage 2
Symbol
Vmax1
Vmax2
Rating
-0.3 to 32.0
-0.3 to 6.5
Unit
V
V
Conditions
VCC
SOURCE, FB, FADJ
Maximum applied voltage 3
Vmax3
650
V
DRAIN
Drain current pulse
Allowable dissipation
Operating ambient
temperature range
IDP
Pd
10.40
1.00
A
W
PW=10us, Duty cycle=1%
When implemented
Topr
Tjmax
Tstr
-40 to +105
150
oC
oC
oC
MAX junction temperature
Storage
temperature range
-55 to +150
(Note1): When mounted (on 74.2 mm × 74.2 mm, 1.6 mm thick, glass epoxy on single-layer substrate).
Reduce to 8 mW/C when Ta = 25C or above.
Operating Conditions (Ta=25C)
Parameter
Power supply voltage range 1
Power supply voltage range 2
Symbol
VCC
VDRAIN
Rating
8.9 to 26.0
650
Unit
V
V
Conditions
VCC pin voltage
DRAIN pin voltage
Electrical Characteristics of MOSFET (unless otherwise noted, Ta = 25C, VCC = 15V)
Specifications
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
[MOSFET Block]
Between drain and
source voltage
ID=1mA / VGS=0V
V(BR)DDS
650
-
-
V
Drain leak current
On resistance
IDSS
RDS(ON)
-
-
-
100
2.0
uA
Ω
VDS=650V / VGS=0V
ID=0.25A / VGS=10V
1.4
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Electrical Characteristics (unless otherwise noted, Ta = 25C, VCC = 15 V)
Specifications
Parameter
[Circuit Current]
Symbol
Unit
Conditions
Min
Typ
Max
Circuit current (ON) 1
ION1
ION2
700
200
950
300
1200
400
μA
μA
FB=2.0(at pulse operation)
FB=0.0V(at burst operation)
Circuit current (ON) 2
[VCC Protection Function]
VCC UVLO voltage 1
VCC UVLO voltage 2
VCC UVLO hysteresis
VCC OVP voltage 1
VCC OVP voltage 2
VCC OVP hysteresis
Latch released VCC voltage
VUVLO1
VUVLO2
VUVLO3
VOVP1
VOVP2
VOVP3
VLATCH
12.50
7.50
-
26.0
22.0
-
13.50
8.20
5.30
27.5
23.5
4.0
14.50
8.90
-
29.0
25.0
-
V
V
V
V
V
V
V
VCC rise
VCC fall
VUVLO3= VUVLO1- VUVLO2
VCC rise
BM2P016-Z VCC fall
BM2P016-Z
7.0
7.7
8.4
VCC recharge start voltage
VCHG1
7.70
8.70
9.70
V
VCC recharge stop voltage
Latch mask time
Thermal shut down temperature1
Thermal shut down temperature2
VCHG2
12.00
50
120
90
13.00
100
145
14.00
150
170
V
tL
ATCH
us
C
C
TSD1
TSD2
Control IC, temp rise
Control IC, temp fall
115
140
[PWM Type DCDC Driver Block]
Oscillation frequency 1
Oscillation frequency 2
Frequency hopping width 1
Hopping fluctuation frequency
FADJ source current
FADJ comparator voltage
FADJ max burst frequency
Soft start time 1
Soft start time 2
Soft start time 3
Soft start time 4
Maximum duty
FSW1
FSW2
FDEL1
FCH
60
20
-
65
25
4.0
70
30
-
KHz
KHz
KHz
Hz
uA
V
KHz
ms
ms
ms
ms
%
FB=2.00V
FB=0.30V
FB=2.0V
75
125
175
1.20
1.27
-
0.70
1.40
2.80
11.20
82.0
650
37
IBST
0.80
1.13
-
0.30
0.60
1.20
4.80
68.0
150
23
1.00
1.20
0.833
0.50
1.00
2.00
8.00
75.0
400
FADJ=0.0V
VBST
FBST
tSS1
tSS2
tSS3
CFADJ=1000pF
tSS4
Dmax
Tmin
RFB
Gain
VBST1
VBST2
VBST3
Minimum ON time
ns
FB pin pull-up resistance
ΔFB / ΔSOURCE gain
FB burst voltage 1
FB burst voltage 2
FB burst hysteresis
30
kΩ
V/V
V
V
V
-
4.00
0.280
0.320
0.040
-
0.220
0.260
-
0.340
0.380
-
FB fall
FB rise
VBST3= VBST2- VBST1
FB voltage of
VDLT
1.100
1.250
1.400
V
starting frequency reduction mode
FB OLP voltage 1a
FB OLP voltage 1b
VFOLP1A
VFOLP1B
2.60
2.40
2.80
2.60
3.00
2.80
V
V
Overload is detected (FB rise)
Overload is detected (FB fall)
FB OLP ON time
FB OLP OFF time
TFOLP1
TFOLP2
80
128
512
176
692
ms
ms
332
[Over Current Detection Block]
Over-current detection voltage
VSOURCE
VS_SS1
VS_SS2
VS_SS3
VS_SS4
0.375
0.050
0.080
0.130
0.230
0.400
0.100
0.150
0.200
0.300
0.425
0.150
0.220
0.270
0.370
V
V
V
V
V
Ton=0us
Over-current detection voltage SS1
Over-current detection voltage SS2
Over-current detection voltage SS3
Over-current detection voltage SS4
0[ms] to Tss1 [ms]
TSS1 [ms] to TSS2 [ms]
TSS2 [ms] to TSS3 [ms]
TSS3 [ms] to TSS4 [ms]
Leading edge blanking time
tLEB
KSOURCE
VSHT
(120)
12
250
20
(380)
28
ns
mV/us
V
Design assurance
Over current detection AC voltage
compensation factor
SOURCE pin short protection voltage
SOURCE pin short protection time
0.020
1.80
0.050
3.00
0.080
4.20
TSOURCESHT
us
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© 2012 ROHM Co., Ltd. All rights reserved.
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BM2P015-Z BM2P016-Z
Specifications
Typ
Parameter
Symbol
Unit
Conditions
Min
Max
[Circuit Current]
Start current 1
ISTART1
ISTART2
0.100
1.000
0.500
3.000
1.000
6.000
mA
mA
VCC= 0V
Start current 2
VCC=10V
Inflow current from Drain pin after
UVLO is released and when
MOSFET is OFF
OFF current
ISTART3
VSC
-
10
20
uA
V
Start current switching voltage
0.800
1.500
2.100
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Pin Descriptions
Table 1. Pin Description
Function
ESD Diode
VCC GND
NO.
Pin Name
I/O
1
2
3
4
5
6
7
SOURCE
FADJ
GND
I/O
I
MOSFET SOURCE pin
MAX Burst Frequency setting pin
GND pin
✔
✔
✔
✔
✔
-
✔
-
I/O
I
FB
Feedback signal input pin
Power supply input pin
MOSFET DRAIN pin
✔
✔
-
VCC
I
DRAIN
DRAIN
I/O
I/O
-
MOSFET DRAIN pin
-
-
I/O Equivalent Circuit Diagram
3
SOURCE
1
FADJ
4
FB
GND
2
Internal Reg
RFB
VCC
VREF
VREF
FADJ
SOURCE
FB
GND
7
5
VCC
-
-
6
DRAIN
DRAIN
DRAIN
DRAIN
VCC
Internal
Circuit
Internal
Circuit
-
Internal MOSFET
Internal MOSFET
SOURCE
SOURCE
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Block Diagram
FUSE
Diode
Bridge
AC
Filter
VCC
DRAIN
5
6,7
VCC UVLO
+
-
13.5V
Starter
4.0V
Line Reg
/ 8.2V
VCC OVP
100us
Filter
+
-
10uA
12V Clamp
Circuit
27.5V
Internal Block
FADJ
Burst
Frequency
Control
S
R
2
Q
DRIVER
PWM Control
+
4.0V
Burst Control
4.0V
30k
OLP
FB
128
1M
-
+
4
Current
Limiter
Leading Edge
Blanking
SOURCE
+
-
1
(typ=250ns)
Rs
AC Input
Compensation
Soft Start
PWM
Comparator
MAX
-
+
DUTY
GND
3
Frequency
Hopping
OSC
(65kHz)
+
Slope
Compensation
FeedBack
With
Isolation
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Block Description
(1) Start circuit (DRAIN: Pin 6,7)
This IC has a built-in start circuit. It enables low standby mode electricity and high speed start.
After start up, consumption power is determined by idling current ISTART3 (Typ=10uA) only.
Reference values of starting time are shown in Figure 3. When Cvcc=10uF it can start in less than 0.1 sec.
+
FUSE
AC
Diode
Brdi ge
85-265Vac
-
DRAIN
Starter
SW1
VCC
Cvcc
+
-
VCCUVLO
Figure 1. Block Diagram of Start Circuit
1.0
0.9
0.8
0.7
0.6
ISTART2
0.5
0.4
0.3
0.2
0.1
0.0
ISTART1
ISTART3
0
5
10
15
20
25
30
35
40
45
50
Cvcc [uF]
0
Vsc
VUVLO1
10V
VCC Voltage[V]
Figure 2. Start Current vs VCC Voltage
* Start current flows from the DRAIN pin
Figure 3. Start Time (reference value)
Ex) Consumption power of start circuit only when Vac=100V
PVH=100V*√2*10uA=1.41mW
Ex) Consumption power of start circuit only when Vac=240V
PVH=240V*√2*10uA=3.38mW
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(2) Start sequences
(Soft start operation, light load operation, and auto recovery operation during overload protection)
Start sequences are shown in Figure 4. See the sections below for detailed descriptions.
VH
VCC=13.5V
VCC(1pin)
FB(8pin)
VCC=8.2V
Within
128ms
Within
128ms
Within
128ms
Internal REF
Pull Up
Vout
Iout
Over Load
Normal Load
Light LOAD
Burst mode
Switching
stop
Switching
Soft Start
GH
I J
C
E
F
K
A
B
D
Figure 4. Start Sequences Timing Chart
A:
B:
Input voltage VH is applied.
This IC starts operating when VCC > VUVLO1 (13.5 V Typ).
Switching function starts when other protection functions are judged as normal.
When the secondary output voltage becomes constant, VCC pin current causes the VCC voltage to drop. As a result, IC
should be set to start switching until VCC<VUVLO2 (8.2V Typ).
C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.
D: When the switching operation starts, VOUT rises.
Once the output voltage starts, set the rated voltage within the TFOLP period (128ms Typ).
E: When there is a light load, it makes FB voltage < VBST (0.3V Typ). Burst operation is used to keep power consumption down.
During burst operation, it operates at low-power consumption mode.
F:
When the FB pin Voltage>VFOLP1A(2.8V Typ), it overloads.
G: When the FB pin voltage keeps VFOLP1A (= 2.8V Typ) at or goes above T FOLP (128ms Typ), the overload protection function is
triggered and the switching stops. During the TFOLP period (128ms Typ), if the FB pin voltage becomes <VFOLP1B even once,
the IC’s internal timer is reset.
H: If the VCC voltage drops to < VUVLO2 (7.7V Typ) or below, restart is executed.
I:
The IC’s circuit current is reduced and the VCC pin value rises. (same as B)
J:
K:
Same as F
Same as G
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(3) VCC pin protection function
These ICs have a built-in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage
protection function VCCOVP (Over Voltage Protection), and a VCC recharge function that operates in case of a drop
in VCC voltage.
VCC charge function stabilizes the secondary output voltage, charged from high voltage lines by the start circuit when
VCC voltage drops.
(3-1) VCC UVLO / VCC OVP function
VCCUVLO is an auto recovery comparator. And VCCOVP is a latch type (BM2P015-Z) or auto restart type
(BM2P016-Z) comparator.
VCCOVP operates in case of continuing VCC pin voltage > VOVP (Typ=27.5V).
This function has a built-in mask time TLATCH(Typ=100us). Through this function, the IC is protected from pin
generated surge, etc. Figure 5 is showed about VCC OVP auto recovery type.
VH
Vovp1=27.5Vtyp
Vovp1=23.5Vtyp
VCC
VCCuvlo1=13.5Vtyp
Vchg1=13.0Vtyp
Vchg2= 8.7Vtyp
VCCuvlo2 8.2Vtyp
Time
ON
ON
OFF
VCC UVLO
VCC OVP
ON
OFF
OFF
ON
ON
VCC Charge
Function
OFF
ON
OUT
Switching
OFF
OFF
Time
A
I
J
A
B
C
D
F
E
G
H
Figure 5. VCC UVLO / OVP Timing Chart
A:
DRAIN voltage input, VCC pin voltage starts rising.
VCC>Vuvlo1, DC/DC operation starts.
B:
C:
D:
E:
F:
G:
H:
I:
VCC< VCHG1, VCC charge function operates and the VCC voltage rises.
VCC > VCHG2, VCC charge function stops.
VCC > VOVP1, TLATCH (Typ =100us) continues, switching is stopped by the VCCOVP function.
VCC < VOVP2, DC/DC operation restarts by auto recovery.
VH is OPEN. VCC Voltage falls.
Same as C
Same as D
J:
VCC<Vuvlo2, DC/DC operation stops.
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(3-2) VCC charge function
This IC has the recharge function.
VCC charge function operates once the VCC pin >VUVLO1 and when the DC/DC operation starts. The VCC pin
voltage then drops to <VCHG1. At that time the VCC pin is charged from the DRAIN pin through the start circuit.
Through this operation, these series prevent failure.
VCC pin voltage rises until VCC >VCHG2. The operation is shown in figure 6.
VH
VUVLO1
VCHG2
VCC
VCHG1
VUVLO2
Switching
VH charge
charge
charge
charge
charge
OUTPUT
voltage
A
B C D E
F G H
Figure 6. VCC Pin Charge Operation
A: DRAIN pin voltage rises, charges VCC pin through the VCC charge function.
B: VCC > VUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.
C: When the DC/DC operation starts, the VCC voltage drops.
D: VCC < VCHG1, VCC recharge function operates.
E: VCC > VCHG2, VCC recharge function stops.
F: VCC < VCHG1, VCC recharge function operates.
G: VCC > VCHG2, VCC recharge function stops.
H: After the output voltage is finished rising, VCC is charged by the auxiliary winding, and VCC pin stabilizes.
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(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)
This IC has a current mode PWM control.
An internal oscillator sets a fixed switching frequency (65 kHz Typ).
This IC has an integrated switching frequency hopping function, which causes the switching frequency to fluctuate as
shown in Figure 7 below.
The fluctuation cycle is 125 Hz (Typ).
Switching Frequency
[kHz]
500us
69
68
67
66
65
64
63
62
61
125 Hz(8ms)
Time
Figure 7. Frequency Hopping Function
Maximum duty cycle is fixed at 75% (Typ) and minimum pulse width is fixed at 400 ns (Typ).
In current mode control, sub-harmonic oscillation may occur when the duty cycle exceeds 50%.
As a countermeasure, this IC has built-in slope compensation circuits.
This IC has built-in burst mode and frequency reduction circuits to achieve lower power consumption when the load is
light. FB pin is pulled up by RFB (30 kΩ Typ). FB pin voltage is changed by secondary output voltage (secondary load
power).FB pin is monitored, burst mode operation and frequency detection start.
Figure 8 shows the FB voltage, and the DCDC switching frequency operation.
mode1 : Burst operation
mode2 : Frequency reduction operation (operates at max frequency)
mode3 : Fixed frequency operation (operates at max frequency)
mode4 : Overload operation (detects the overload state and stops the pulse operation)
Y
mode2
mode1
mode3
mode4
65kHz
25kHz
Pulse OFF
X
0.30V
1.25V
2.00V
2.80V
FB [V]
Figure 8. Switching Operation State Changes by FB Pin Voltage
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(4-1) MAX Burst frequency setting
This IC can reduce a burst sound to fix a burst frequency.
This IC has two clocks, so this IC can fix the burst frequency.
Frequency
[kHz]
Frequency
[kHz]
Burst
Mode
Frequency
Reduction Mode
Normal
Mode
Burst
Mode
Frequency
Reduction Mode
Normal
Mode
65kHz
25kHz
65kHz
Switching
frequency
Switching
frequency
25kHz
FADJ
[Region of sound]
[Region of sound]
Burst frequency
Output Power[W]
Burst frequency
Output Power[W]
Figure 9-1. No setting
Figure 9-2. setting
Setting external capacitor of FADJ pin, the burst frequency is fixed.
It is showed an example of max burst frequency setting using FADJ pin
This frequency is decided by FADJ source current, FADJ comparator voltage and external capacitor.
100000
10000
1000
100
10
10
100
1000
10000
C_FADJ[pF]
Figure 10. Example of max burst frequency setting using FADJ pin
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(5) Over Current limiter
This IC has a built-in over current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching stops. It
also has a built-in AC voltage compensation function. With this function, the over current limiter level is high until the
time the AC voltage is compensated.
Shown in figure-11, 12, and 13.
65kHz(15.3us)
65kHz(15.3us)
ON
ON
[DC/DC]
@AC100V
[DC/DC]
@AC100V
OFF
OFF
OFF
OFF
ON
ON
[DC/DC]
@AC240V
OFF
[DC/DC]
@AC100V
OFF
OFF
OFF
Iepak(AC)@Vin=240V
Iepak(AC)@Vin=240V
Iepak(AC)@Vin=100V
Iepak(AC)@Vin=100V
Iepak(DC)= included conpensation
Iepak(DC)＝Constant
Tdelay
Tdelay
Tdelay
Tdelay
Primary Peak Current
Primary Peak Current
Figure 11. No AC Voltage Compensation Function
Figure12. Built-in AC Compensation Voltage
Primary peak current is calculated using the formula below.
푽푺푶푼푹푪푬 푽풅풄
푰풑풆풂풌 =
+
× 풕풅풆풍풂풚
푹풔
푳풑
Where:
푽푺푶푼푹푪푬 is the over current limiter voltage (internal).
푹풔 is the current detection resistance.
푽풅풄 is the input DC voltage.
푳풑 is the primary inductance.
풕풅풆풍풂풚 is the delay time after detection of over current limiter.
Y
CS Limitter[V]
0.704V
+20mV/us
0.552V
0.400V
X
0.0
Time [us]
15.3us
7.6us
Figure 13. Over Current Limiter Voltage
(6) L. E. B. Blanking Period
When the MOSFET driver is turned ON, surge current flows through each capacitor component and drive current is
generated. Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current
limiter circuit. To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for
250ns by the on-chip LEB (Leading Edge Blanking) function.
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(7) SOURCE pin (pin 1) short protection function
When the SOURCE pin (pin 1) is shorted, this IC overheats.
This IC has a built-in short protection function to prevent destruction.
(8) SOURCE pin (pin 1) open protection
If the SOURCE pin becomes OPEN, this IC may be damaged.
To prevent it from being damaged, this IC has a built-in OPEN protection circuit (auto recovery protection).
(9) Output over load protection function (FB OLP Comparator)
The output overload protection function monitors the secondary output load status at the FB pin and stops switching
whenever overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to
the photo coupler, so the FB pin voltage rises.
When the FB pin voltage > VFOLP1A (2.8 V Typ) continuously for the period TFOLP (128ms Typ), it is judged as an overload
and switching stops.
When the FB pin > VFOLP1A (2.8 V Typ), if the voltage goes lower than VFOLP1B (2.6V Typ) during the period TFOLP (128ms
Typ), the overload protection timer is reset. The switching operation is performed during this period TFOLP (128ms Typ).
At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of VFOLP1A (2.8 V Typ)
or above. Therefore, at startup the FB voltage must be set to VFOLP1B (2.6 V Typ) or below during the period TFOLP
(128ms Typ), and the secondary output voltage’s start time must be set within the period TFOLP (128ms Typ) following
startup of the IC.
Recovery is after the period TFOLP2(512 ms Typ), from the detection of FBOLP.
Operation mode of protection circuit
Operation mode of protection functions are shown in Table 2.
Table 2. Operation Mode of Protection Circuit
Function
Operation mode
VCC Under Voltage Locked Out
VCC Over Voltage Protection
Auto recovery
BM2P015-Z: Latch(with 100us timer)
BM2P016-Z: Auto recovery
TSD
Auto recovery
FB Over Limited Protection
Auto recovery (with 128ms timer)
SOURCE Short Protection
SOURCE Open Protection
Auto recovery
Auto recovery
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Thermal loss
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 105C or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 74.2 mm × 74.2mm × 1.6 mm, mounted on glass epoxy on single-layer substrate)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
Ta[℃]
Figure 14. Thermal Abatement Characteristics
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Ordering Information
B M 2 P 0
1
x
-
x
VCC OVP
5: Latch
Outsourced Package
Z: DIP7K
6: Auto Restart
ZA: DIP7WF
Making Diagram
DIP7K (TOP VIEW)
Part Number Marking
LOT Number
DIP7WF (TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
Product Name
VCC OVP
BM2P015
BM2P016
BM2P015-Z
BM2P016-Z
Latch
Auto Restart
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Physical Dimension and Packing Information
Package Name
DIP7K
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Physical Dimension and Packing Information
Package Name
DIP7WF
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Operational Notes
1. Reverse Connection of Power Suppl
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 15. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation
should always be within the IC’s power dissipation rating. If however the rating is exceeded for a
continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn
OFF all output pins. The IC should be powered down and turned ON again to resume normal operation
because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the TSD
threshold.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Revision History
Date
Rev.
001
Changes
01.Dec.2013
New Release
P1
P16
Modify the size of package
Modify the physical dimension and packing information
18.Mar.2019
13.Dec.2019
13.Jul.2020
002
003
004
Revise Japanese datasheet.
P.2
P.9
Modify the I/O Equivalent Circuit Diagram
Modify the sentence from latch to auto recovery
P.13
Modify the Numerical formula format and description of the Lp
P1 Add the package variation
P16 Add the package variation
P18 Add the physical dimension
26.Oct.2021
005
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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