BM6215FS-E2 [ROHM]

3-Phase Brushless Fan Motor Driver;


型号：	BM6215FS-E2
厂家：	ROHM
描述：	3-Phase Brushless Fan Motor Driver
文件：	总31页 (文件大小：1406K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

For Air-Conditioner Fan Motor

3-Phase Brushless Fan Motor

Driver

BM6213FS

General Description

Key Specifications

This motor driver IC adopts MOSFET as output, and put

in a small full molding package with the 120° square

wave commutation controller chip and the high voltage

gate driver chip. The protection circuits for overcurrent,

overheating, under voltage lock out and the high voltage

bootstrap diode with current regulation are built-in. It

provides optimum motor drive system and downsizing

the built-in PCB of the motor.

 Output MOSFET Voltage:

 Driver Output Current (DC):

 Driver Output Current (Pulse):

 Output MOSFET DC On Resistance:

 Duty Control Voltage Range:

250V

±2.0A (Max)

±4.0A (Max)

1.3Ω (Max)

2.1V to 5.4V

 Operating Case Temperature:

 Junction Temperature:

 Power Dissipation:

-20°C to +100°C

+150°C

3.00W

Features

Package

SSOP-A54_36

W (Typ) x D (Typ) x H (Max)

22.0 mm x 14.1 mm x 2.4 mm

 250V MOSFET built-in

 Output current 2.0A

 Bootstrap operation by floating high side driver

(including diode)

 120° square wave commutation logic

 PWM control

 Rotational direction switch

 FG signal output with pulse number switch (4 or 12)

 VREG output (5V/30mA)

 Protection circuits provided: CL, OCP, TSD, UVLO,

MLP and the external fault input

 Fault output (open drain)

Applications

 Air conditioners; air purifiers; water pumps;

dishwashers; washing machines

SSOP-A54_36

Typical Application Circuit

VDC

GND

VCC

C13

VSP

C2~C4

HW HV

VREG

C11

R11

R13

C14

R5 C10 R12

R10

C12

DTR

Figure 1. Application Circuit Example

Product structure : Semiconductor IC This product is not designed protection against radioactive rays

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Block Diagram and Pin Configuration

VCC

VDC

VCC

GND

VCC

VSP

VREG

VDC

VSP

TEST

LEVEL

SHIFT

GATE

DRIVER

VREG

HWN

HWP

HVN

HVP

HUN

HUP

HWN

HWP

HVN

HVP

HUN

HUP

PCT

LEVEL

SHIFT

GATE

DRIVER

PCT

LOGIC

V/I

VDC

TEST

CCW

FGS

VDC

VREG

LEVEL

SHIFT

GATE

DRIVER

CCW

FGS

FOB

SNS

VREG

PGND

GND

FOB

FIB

FAULT

PWM

VREG

FAULT

GND

SNS

GND

VCC

VSP

OSC

PGND

Figure 2. Block Diagram

Pin Descriptions (NC: No Connection)

Figure 3. Pin Configuration

Name

VCC

GND

VCC

VSP

VREG

Function

Name

VDC

Function

Low voltage power supply

Ground

High voltage power supply

Ground

Low voltage power supply

Duty control voltage input pin

Regulator output

Phase U floating power supply

Phase U output

HWN

HWP

HVN

HVP

HUN

HUP

PCT

Hall input pin phase W-

Hall input pin phase W+

Hall input pin phase V-

Hall input pin phase V+

Hall input pin phase U-

Hall input pin phase U+

VSP offset voltage output pin

PWM switching arm setting pin

Direction switch (H:CCW)

FG pulse # switch (H:12, L:4)

FG signal output

Phase V floating power supply

Phase V output

VDC

CCW

FGS

High voltage power supply

FOB

SNS

Fault signal output (open drain)

Over current sense pin

Phase W floating power supply

Phase W output

Carrier frequency setting pin

Ground

GND

VCC

Ground

PGND

Low voltage power supply

Ground (current sense pin)

Note) Pin cut surface visible from the side of package is same voltage as the pin which name is same.

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Description of Blocks

1. Commutation Logic

When the hall frequency is about 1.4-Hz or less (e.g. when the motor starts up), or PC pin is “L”, the commutation mode

is 120° square wave drive with upper and lower switching (synchronous switching). The controller monitors the hall

frequency, and switches to upper switching when the hall frequency reaches or exceeds about 1.4-Hz over four

consecutive cycles and PC pin is “H”. Refer to the timing charts in figures 12 and 13.

Table 1. 120° Commutation (synchronous switching) Truth Table (CW)

--------------------

PWM

--------------------

PWM

--------------------

PWM

--------------------

PWM

--------------------

PWM

--------------------

PWM

2. Duty Control

The switching duty can be controlled by forcing DC voltage with value from V_SPMINto V_SPMAXto the VSP pin. When the

VSP voltage is higher than V_SPTST, the controller forces PC pin voltage to ground (Testing mode, maximum duty and

synchronous switching). The VSP pin is pulled down internally by a 200 kΩ resistor. Therefore, note the impedance when

setting the VSP voltage with a resistance voltage divider.

3. Carrier Frequency Setting

The carrier frequency setting can be freely adjusted by connecting an external

400

resistor between the RT pin and ground. The RT pin is biased to a constant

f_OSC[kHz ] 

R_T[kohm]

voltage, which determines the charge current to the internal capacitor. Carrier

frequencies can be set within a range from about 16 kHz to 50 kHz. Refer to the

formula to the right.

4. FG Signal Output

The number of FG output pulses can be switched in accordance with the number

of poles and the rotational speed of the motor. The FG signal is output from the FG

pin. The 12-pulse signal is generated from the three hall signals (exclusive NOR),

and the 4-pulse signal is the same as hall U signal. It is recommended to pull up

FGS pin to VREG voltage when malfunctioning because of the noise.

FGS

No. of pulse

5. Direction of Motor Rotation Setting

The direction of rotation can be switched by the CCW pin. When CCW pin is “H” or

open, the motor rotates at CCW direction. It is recommended to pull up CCW pin to

VREG voltage when malfunctioning because of the noise.

CCW

Direction

CCW

6. Hall Signal Comparator

The hall comparator provides voltage hysteresis to prevent noise malfunctions. The bias current to the hall elements

should be set to the input voltage amplitude from the element, at a value higher than the minimum input voltage, V_HALLMIN

We recommend connecting a ceramic capacitor with value from 100 pF to 0.01 µF, between the differential input pins of

the hall comparator. Note that the bias to hall elements must be set within the common mode input voltage range

V_HALLCM

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7. Output Duty Pulse Width Limiter

Pulse width duty is controlled during PWM switching in order to ensure the operation of internal power transistor. The

controller doesn’t output pulse of less than T_MIN(Minimum Pulse Width, 0.8µs minimum), nor output a duty pulse of D_MAX

or more. Dead time is forcibly provided to prevent internal power transistors to turn-on simultaneously in upper and lower

side in gate driver output (for example, UH and UL) of each arm. This will not overlap the minimum time T_DT(Dead Time,

1.6µs minimum). Because of this, the maximum duty of the synchronous switching mode is 84% (typical).

8. PWM Switching Arm Setting

The PWM switching arm can choose one from the synchronous switching or the upper switching. When PC is “L”, the

switching mode is the synchronous. And also when PC is “H”, the switching mode is the upper switching. However, when

the hall cycle is about 1.4-Hz or less, the switching mode keeps the synchronous even if PC is “H”. When the PWM

control is entering to the testing mode, the controller forces PC pin voltage to ground and synchronous switching mode.

Therefore, when PC pin pull-up to VREG pin, at least a resistor with a value 10k Ω or more. The VSP offset voltage

(Figure 32) is buffered to PCT pin, to connect an external resistor between PCT pin and ground. The internal bias current

is determined by PCT voltage and the resistor value - V_PCT/ R_PCT-, and mixed to PC pin. Because you can freely

determine the slope by the resistance ratio of PC pin and PCT pin, which allows you to adjust the voltage command

value to switch the synchronous switching or the upper switching. Please select the R_PCTvalue from 50 kΩ to 200 kΩ in

the range on the basis of 100 kΩ, because the PCT pin current capability is a 100 µA or less.

Upper/Lower

Upper

PCT

VPCT = VSP-VSPMIN

VSP

V^PC

VSPMIN

VPCT

RPCT

PC: H

PC: L

Upper SW

Upper/Lower SW

R^PCL

RPCT

1/2 VREG

VSP

Figure 4. PWM Switching Arm Setting

9. Current Limiter (CL) Circuit and Overcurrent Protection (OCP) Circuit

The current limiter circuit can be activated by connecting a low value resistor for current detection between the output

stage ground (PGND) and the controller ground (GND). When the SNS pin voltage reaches or surpasses the threshold

value (V_SNS, 0.5V typical), the controller forces all the upper switching arm inputs low (UH, VH, WH = L, L, L), thus

initiating the current limiter operation. When the SNS pin voltage swings below the ground, it is recommended to insert a

resistor - 1.5 kΩ or more - between SNS pin and PGND pin to prevent malfunction. Since this limiter circuit is not a latch

type, it returns to normal operation - synchronizing with the carrier frequency - once the SNS pin voltage falls below the

threshold voltage. A filter is built into the overcurrent detection circuit to prevent malfunctions, and does not activate when

a short pulse of less than T_MASKis present at the input.

When the SNS pin voltage reaches or surpasses the threshold value (V_OVER, 0.9V typical) because of the power fault or

the short circuit except the ground fault, the gate driver outputs low to the gate of all output MOSFETs, thus initiating the

overcurrent protection operation. Since this protection circuit is also not a latch type, it returns to normal operation

synchronizing with the carrier frequency.

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10. Under Voltage Lock Out (UVLO) Circuit

To secure the lowest power supply voltage necessary to operate the controller and the driver, and to prevent under

voltage malfunctions, the UVLO circuits are independently built into the upper side floating driver, the lower side driver

and the controller. When the supply voltage falls to V_CCUVLor below, the controller forces driver outputs low. When the

voltage rises to V_CCUVHor above, the UVLO circuit ends the lockout operation and returns the chip only after 32 carrier

periods (1.6ms for the default 20kHz frequency) to normal operation. Even if the controller returns to normal operation,

the output begins from the following control input signal.

The voltage monitor circuit (4.0V nominal) is built-in for the VREG voltage. Therefore, the UVLO circuit does not release

operation when the VREG voltage rising is delayed behind the VCC voltage rising even if VCC voltage becomes V_CCUVH

or more.

11. Thermal Shutdown (TSD) Circuit

The TSD circuit operates when the junction temperature of the controller exceeds the preset temperature (125°C

nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit,

the chip returns to normal operation when the junction temperature falls below the preset temperature (100°C nominal).

The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or

guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated,

and do not use the IC in an environment where activation of the circuit is assumed.

Moreover, it is not possible to follow the output MOSFET junction temperature rising rapidly because it is a gate driver

chip that monitors the temperature and it is likely not to function effectively.

12. Motor Lock Protection (MLP) Circuit

When the controller detects the motor locking during fixed time of 4 seconds nominal when each edge of the hall signal

doesn't input either, the controller forces all driver outputs low under a fixed time 20 seconds nominal, and self-returns to

normal operation. This circuit is enabled if the voltage force to VSP is over the duty minimum voltage V_SPMIN, and note

that the motor cannot start up when the controller doesn’t detect the motor rotation by the minimum duty control. Even if

the edge of the hall signal is inputted within range of the OFF state by this protection circuit, it is ignored. But if the VSP

is forced to ground level once, the protection can be canceled immediately.

13. Hall Signal Wrong Input Detection

Hall element abnormalities may cause incorrect inputs that vary from the normal logic. When all hall input signals go high

or low, the hall signal wrong input detection circuit forces all driver outputs low. And when the controller detects the

abnormal hall signals continuously for four times or more motor rotation, the controller forces all driver outputs low and

latches the state. It is released if the duty control voltage VSP is forced to ground level once.

14. Internal Voltage Regulator

VCC

The internal voltage regulator VREG is output for the bias of the hall

element and the phase control setting. However, when using the VREG

VREG

function, be aware of the I_OMAXvalue. If a capacitor is connected to the

ground in order to stabilize output, a value of 1 µF or more should be used.

In this case, be sure to confirm that there is no oscillation in the output.

HUP

HUN

HVP

HVN

HWP

HWN

Figure 5. VREG Output Pin Application Example

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15. Bootstrap Operation

VDC

OFF

VCC

OFF

Figure 6. Charging Period

Figure 7. Discharging Period

The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap

capacitor (C_B) as shown in the figure above. In a word, this operation is repeated while the output of an internal transistor

is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the VCC

power supply to C_Bthrough prevention of backflow diode D_X, it is approximately (VCC-1V). The resistance series

connection with D_Xhas the impedance of approximately 200 Ω. Because the total gate charge is needed only by the

carrier frequency in the upper switching section of 120° commutation driving, please set it after confirming actual

application operation.

16. Fault Signal Output

When the controller detects either state that should be protected the overcurrent (OCP) and the over temperature (TSD),

the FOB pin outputs low (open drain) and it returns to normal operation synchronizing with the carrier frequency. Even

when this function is not used, the FOB pin is pull-up to the voltage of 3V or more and at least a resistor with a value 10k

Ω or more. A filter is built into the fault signal input circuit to prevent malfunctions by the switching noise, and does not

activate when a short pulse of less than T_MASKis present at the input. The time to the fault operation is the sum total of

the propagation delay time of the detection circuit and the filter time, 1.6µs (typical).

VSP

Carrier Wave

XHO

YLO

1.6µs (Typ)

SNS

FOB

0.9V(Typ)

0.5V(Typ)

OCP threshold

CL threshold

Figure 8. Fault Operation ~ OCP ~ Timing Chart

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The release time from the protection operation can be

changed by inserting an external capacitor. Refer to

the formula below. Release time of 5ms or more is

recommended.

2.3

V_REG

t  ln(1

)RC [s]

VREG

FOB

0.01

0.10

1.00

Figure 9. Release Time Setting Application Circuit

Capacitance : C[µF]

Figure 10. Release Time (Reference Data @R=100kΩ)

17. Switching Time

XH, XL

V_DS

t_rr

t_on

t_d(on)

t_r

90%

I_D

10%

t_d(off)

t_off

t_f

Figure 11. Switching Time Definition

Parameter

Symbol

t_dH(on)

t_rH

Reference

800

Unit

Conditions

140

High Side Switching

Time

t_rrH

300

VDC=150V, VCC=15V, I_D=1.0A

Inductive load

t_dH(off)

t_fH

t_dL(on)

t_rL

480

The propagation delay time: Internal

gate driver input stage to the driver

IC output.

750

130

Low Side Switching

Time

t_rrL

280

t_dL(off)

t_fL

400

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Timing Chart (CW)

Hall Signals

HALL U

HALL V

HALL W

Spin Up (Hall Period < 1.4Hz)

PWM

PC=L, Hall Period >1.4Hz

PWM

VHPWM

PWM

VLPWM

PWM

PC=H, Hall Period >1.4Hz

PWM

VHPWM

PWM

FG Output (FGS=H)

Figure 12. Timing Chart (Clockwise)

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Timing Chart (CCW)

Hall Signals

HALL U

HALL V

HALL W

Spin Up (Hall Period < 1.4Hz)

PWM

PC=L, Hall Period >1.4Hz

PWM

VHPWM

PWM

VLPWM

PWM

PC=H, Hall Period >1.4Hz

PWM

VHPWM

PWM

FG Output (FGS=H)

Figure 13. Timing Chart (Counter Clockwise)

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Controller Outputs and Operation Mode Summary

Detected direction

Hall sensor frequency

PC pin

Forward (CW:U~V~W, CCW:U~W~V)

< 1.4Hz 1.4Hz <

Reverse (CW:U~W~V, CCW:U~V~W)

< 1.4Hz 1.4Hz <

Conditions

VSP < V_SPMIN

(Duty off)

Upper and lower arm off

V_SPMIN< VSP < V_SPMAX

(Control range)

Upper

switching

Normal

operation

Upper and lower

switching

Upper and lower

switching

Upper switching

V_SPTST< VSP

(Testing mode)

Upper and lower

switching

Current limiter ^{(Note 1)}

Overcurrent ^{(Note 2)}

TSD ^{(Note 2)}

Upper arm off

Upper and lower arm off

Protect

operation

External input ^{(Note 2)}

UVLO ^{(Note 3)}

Upper and lower arm off

Motor lock

Hall sensor abnormally

Upper and lower arm off and latch

(Note)

The controller monitors both edges of three hall sensors for detecting frequency.

(Note 1) It returns to normal operation by the carrier frequency synchronization.

(Note 2) It works together with the fault operation, and returns after the release time synchronizing with the carrier frequency.

(Note 3) It returns to normal operation after 32 cycles of the carrier oscillation period.

Absolute Maximum Ratings (Ta=25°C)

Parameter

Output MOSFET

Symbol

Ratings

250 ^{(Note 1)}

Unit

V_DSS

Supply Voltage

V_DC

-0.3 to +250 ^{(Note 1)}

-0.3 to +20

-0.3 to +5.5

±2.0 ^{(Note 1)}

±4.0 ^{(Note 1, 2)}

15 ^{(Note 1)}

Output Voltage

V_U, V_V, V_W

High Side Supply Pin Voltage

High Side Floating Supply Voltage

Low Side Supply Voltage

Duty Control Voltage

All Others

V_BU, V_BV, V_BW

V_BU-V_U, V_BV-V_V, V_BW-V_W

V_CC

V_SP

V_I/O

Driver Outputs (DC)

Driver Outputs (Pulse)

Fault Signal Output

I_OMAX(DC)

I_OMAX(PLS)

I_OMAX(FOB)

°C/W

°C

Power Dissipation

3.00 ^{(Note 3)}

Thermal Resistance

Operating Case Temperature

Storage Temperature

Junction Temperature

Ψ_JT

T_C

-20 to +100

-55 to +150

150

T_STG

T_jmax

(Note)

All voltages are with respect to ground.

(Note 1) Do not, however, exceed Pd or ASO.

(Note 2) Pulse Width ≤ 10µs, Duty cycle ≤ 1%

(Note 3) Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 24mW/°C above 25°C.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

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Recommended Operating Conditions (Tc=25°C)

Parameter

Supply Voltage

Symbol

Min

Typ

Max

200

16.5

Unit

V_DC

140

High Side Floating Supply Voltage

Low Side Supply Voltage

Bootstrap Capacitor

V_BU-V_U, V_BV-V_V, V_BW-V_W

13.5

1.0

0.5

V_CC

C_B

µF

Ω

VREG Bypass Capacitor

Shunt Resistor (PGND)

C_VREG

R_S

Junction Temperature

T_j

125

°C

(Note) All voltages are with respect to ground.

Electrical Characteristics (Driver part, unless otherwise specified, Ta=25°C and VCC=15V)

Parameter

Power Supply

Symbol

Min

Typ

Max

Unit

Conditions

HS Quiescence Current

LS Quiescence Current

Output MOSFET

I_BBQ

I_CCQ

150

1.3

µA

VSP=0V, each phase

VSP=0V

0.2

0.7

D-S Breakdown Voltage

Leak Current

V_(BR)DSS

I_DSS

R_DS(ON)

V_SD

250

µA

Ω

I_D=1mA, VSP=0V

V_DS=250V, VSP=0V

I_D=1.0A

100

1.30

1.5

DC On Resistance

Diode Forward Voltage

Bootstrap Diode

0.93

0.9

I_D=1.0A

Leak Current

I_LBD

V_FBD

R_BD

1.5

2.1

µA

V_BX=250V

Forward Voltage

1.8

200

I_BD=-5mA, including series-R

Series Resistance

Under Voltage Lock Out

HS Release Voltage

HS Lockout Voltage

Ω

V_BUVH

V_BUVL

9.5

8.5

10.0

9.0

10.5

9.5

V_BX- V_X

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Electrical Characteristics (Controller part, unless otherwise specified, Ta=25°C and VCC=15V)

Parameter

Power Supply

Symbol

Min

Typ

Max

Unit

Conditions

Supply Current

I_CC

0.8

4.5

1.7

5.0

3.0

5.5

VSP=0V

VREG Voltage

V_REG

I_O=-30mA

Hall Comparators

Input Bias Current

Common Mode Input

Minimum Input Level

Hysteresis Voltage P

Hysteresis Voltage N

Duty Control

I_HALL

-2.0

-0.1

2.0

µA

V_IN=0V

V_HALLCM

V_HALLMIN

V_HALLHY+

V_HALLHY-

V_REG-1.5

mV_p-p

-13

-5

-23

Input Bias Current

Duty Minimum Voltage

Duty Maximum Voltage

Test Mode Range

Minimum Output Duty

Maximum Output Duty

I_SP

1.8

5.1

8.2

2.1

5.4

2.4

5.7

µA

V_IN=5V

V_SPMIN

V_SPMAX

V_SPTST

D_MIN

F_OSC=20kHz

D_MAX

F_OSC=20kHz, upper switching

Mode Switch - FGS and CCW

Input Bias Current

I_IN

-70

-50

-30

V_REG

µA

V_IN=0V

Input High Voltage

V_INH

V_INL

Input Low Voltage

Fault Input/Output - FOB

Input High Voltage

V_FOBIH

V_FOBIL

V_FOBOL

V_REG

Input Low Voltage

Output Low Voltage

Monitor Output - FG

Output High Voltage

Output Low Voltage

Current Detection

Input Bias Current

0.07

0.60

I_O=5mA

V_MONH

V_MONL

V_REG-0.40

V_REG-0.08

0.02

V_REG

0.40

I_O=-2mA

I_O=2mA

I_SNS

V_SNS

-30

0.48

0.84

0.8

-20

0.50

0.90

1.0

-10

0.52

0.96

1.2

µA

V_IN=0V

Current Limiter Voltage

Overcurrent Voltage

Noise Masking Time

PWM Switching Arm Setting

Threshold Voltage

V_OVER

T_MASK

µs

V_PC

-0.05

0.05

1/2·V_REG, reference voltage

Carrier Frequency Oscillator

Carrier Frequency

F_OSC

kHz

R_T=20kΩ

Under Voltage Lock Out

LS Release Voltage

LS Lockout Voltage

V_CCUVH

V_CCUVL

11.5

10.5

12.0

11.0

12.5

11.5

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Typical Performance Curves (Reference data)

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

110°C

25°C

-40°C

110°C

25°C

-40°C

Supply Voltage : VCC [V]

Figure 14. Quiescence Current

(Low Side Drivers)

Figure 15. Low Side Drivers Operating Current

(F_PWM: 20kHz)

120

100

450

400

350

300

250

200

150

125°C

25°C

-40°C

125°C

25°C

-40°C

Supply Voltage : V_BX-V_X[V]

Figure 16. Quiescence Current

(High Side Driver, Each Phase)

Figure 17. High Side Driver Operating Current

(F_PWM: 20kHz, Each Phase)

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Typical Performance Curves (Reference data) - Continued

2.0

1.5

1.0

0.5

0.0

125°C

25°C

-40°C

25°C

125°C

0.0

0.5

1.0

1.5

2.0

2.5

0.0

0.5

1.0

1.5

2.0

2.5

Source Current : I_SD[A]

Drain Current : I_DS[A]

Figure 18. Output MOSFET ON Resistance

Figure 19. Output MOSFET Body Diode

1.2

125°C

25°C

-40°C

1.0

0.8

0.6

0.4

0.2

0.0

-40°C

25°C

125°C

Bootstrap Diode Current : I [mA]

Bootstrap Series Resistor Current : I [mA]

Figure 20. Bootstrap Diode Forward Voltage

Figure 21. Bootstrap Series Resistor

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Typical Performance Curves (Reference data) - Continued

200

125°C

25°C

-40°C

125°C

25°C

-40°C

EON

150

100

EOFF

0.0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5

2.0

Drain Current : I_O[A]

Figure 22. High Side Switching Loss

(VDC=150V)

Figure 23. High Side Recovery Loss

(VDC=150V)

200

150

100

125°C

25°C

-40°C

125°C

25°C

-40°C

EON

EOFF

0.0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5

2.0

Drain Current : I_O[A]

Figure 24. Low Side Switching Loss

(VDC=150V)

Figure 25. Low Side Recovery Loss

(VDC=150V)

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Typical Performance Curves (Reference data) - Continued

5.4

5.2

5.0

4.8

4.6

-40°C

25°C

110°C

-40°C

25°C

110°C

5.2

5.0

4.8

4.6

OUT

Supply Voltage : VCC [V]

Output Current : I

[mA]

Figure 26. VREG - VCC

Figure 27. VREG Drive Capability

200

150

100

110°C

25°C

-40°C

110°C

25°C

-40°C

110°C

25°C

-40°C

-1

-30

-15

HUP HUN

Differential Voltage : V

-V

[mV]

VSP Voltage : VSP [V]

Figure 28. Hall Comparator Hysteresis Voltage

Figure 29. VSP Input Bias Current

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Typical Performance Curves (Reference data) - Continued

100

1.5

1.0

0.5

0.0

-0.5

110°C

25°C

-40°C

110°C

25°C

-40°C

VSP Voltage : VSP [V]

Figure 30. Output Duty - VSP Voltage

(PC=H)

Figure 31. Testing Mode Threshold Voltage

110°C

25°C

-40°C

25°C

110°C

PCT

[V]

VSP Voltage : VSP [V]

PCT Voltage : V

Figure 32. VSP - PCT Offset Voltage

Figure 33. PCT - PC Linearity

(RPCT=RPC=100kΩ)

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Typical Performance Curves (Reference data) - Continued

1.5

1.0

0.5

25°C

110°C

-40°C

0.0

110°C

25°C

-40°C

-0.5

0.0

0.2

0.4

0.6

0.8

1.0

PC REG

(Normalized) : [V/V]

External Resistor : R [kohm]

Figure 34. PWM Switching Arm Threshold Voltage

Figure 35. Carrier Frequency - RT

0.0

0.8

0.6

0.4

0.2

0.0

110°C

25°C

-40°C

-0.2

-0.4

-0.6

-0.8

-40°C

25°C

110°C

OUT

[mA]

Output Current : I

[mA]

Output Current : I

Figure 36. High Side Output Voltage

(FG)

Figure 37. Low Side Output Voltage

(FG)

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Typical Performance Curves (Reference data) - Continued

1.5

1.0

0.5

0.0

-0.5

110°C

25°C

110°C

25°C

110°C

25°C

-40°C

1.5

1.7

1.9

2.1

2.3

2.5

2.7

Input Voltage : V [V]

Figure 38. Input Bias Current

(CCW, FGS)

Figure 39. Input Threshold Voltage

(CCW, FGS, FOB)

1.5

1.0

0.5

0.0

-0.5

110°C

25°C

-40°C

110°C

25°C

-40°C

0.48

0.49

0.50

0.51

0.52

SNS

[V]

SNS Input Voltage : V

[V]

Input Voltage : V

Figure 40. SNS Input Bias Current

Figure 41. Current Limiter Input Threshold Voltage

(SNS)

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Typical Performance Curves (Reference data) - Continued

1.5

1.0

0.5

0.0

-0.5

-40°C

25°C

110°C

1.0

0.5

0.0

-0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

105

120

135

150

Input Voltage : V_SNS[V]

Junction Temperature : Tj [°C]

Figure 42. OCP Input Threshold Voltage

(SNS)

Figure 43. Thermal Shutdown

1.5

1.0

0.5

0.0

-0.5

1.5

1.0

0.5

0.0

-0.5

110°C

25°C

-40°C

110°C

25°C

-40°C

125°C

25°C

-40°C

125°C

25°C

-40°C

Supply Voltage : V_BX- V_X[V]

Supply Voltage : VCC [V]

Figure 44. Under Voltage Lock Out

(High Side Driver, Each Phase)

Figure 45. Under Voltage Lock Out

(Low Side Drivers)

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Application Example

VDC

GND

IC1

VCC

C13

VSP

C2~C4

HW HV HU

VREG

C11

R11

R13

C14

R5 C10 R12

R10

C12

DTR

Figure 46. Application Example (120° Commutation Driver)

Parts List

Parts

Value

Manufacturer

ROHM

Type

BM6213FS

Parts

Value

0.1µF

2200pF

10µF

2.2µF

0.1µF

2.2µF

100pF

0.1µF

Ratings

50V

250V

50V

Type

IC1

Ceramic

Hall elements

1kΩ

150Ω

20kΩ

100kΩ

0.5Ω

10kΩ

0Ω

MCR18EZPF1001

MCR18EZPJ151

MCR18EZPF2002

MCR18EZPF1003

MCR50JZHFL1R50 x 3

MCR18EZPF1002

MCR18EZPJ000

C10

C11

C12

C13

C14

R10

R11

R12

R13

0Ω

ROHM

MCR18EZPJ000

100kΩ

ROHM

MCR18EZPF1003

DTC124EUA

KDZ20B

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I/O Equivalence Circuits

VCC

VREG

250k

100k

VSP

VREG

SNS

Figure 47. RT

Figure 48. SNS

Figure 49. VSP

Figure 50. VREG, VCC

VREG

HUP

HUN

HVP

HVN

HWP

HWN

Figure 51. FG

Figure 52. HXP, HXN

VREG

100k

VREG

FGS

CCW

PCT

Figure 53. FGS, CCW

Figure 54. PC, PCT

VREG

VDC

FOB

VCC

Figure 55. FOB

PGND

Figure 56. VCC, PGND, VDC, BX(BU/BV/BW), X(U/V/W)

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital

and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.

Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the

capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,

pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to

back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not

cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor

characteristics, supply voltage, operating frequency and PCB wiring to name a few.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground

caused by large currents. Also ensure that the ground traces of external components do not cause variations on the

ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC

is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase

the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The

electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of

connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always

be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent

damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply

or ground line.

12. Regarding the Input Pin of the IC

Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins

that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the

IC.

When using this IC, the high voltage pins VDC, BU/U, BV/V and BW/W need a resin coating between these pins. It is

judged that the inter-pins distance is not enough. If any special mode in excess of absolute maximum ratings is to be

implemented with this product or its application circuits, it is important to take physical safety measures, such as providing

voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or

ASO. In the event a large capacitor is connected between the output and ground, and if VCC and VDC are short-circuited

with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC.

This IC contains the controller chip, P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor(NPN)

Pin A

Pin B

Pin A

P⁺

P Substrate

Parasitic

Elements

P Substrate

Parasitic

Elements

N Region

close-by

GND

Parasitic

Elements

Parasitic

Elements

Figure A-1. Example of IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature

and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation

(ASO).

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Physical Dimension, Tape and Reel Information

Package Name

SSOP-A54_36

22.0 0.2

(MAX 22.35 include BURR)

4 ⁺⁶

-4

0.27 0.1

(UNIT : mm)

PKG : SSOP-A54_36

0.8

0.38 0.1

0.1

Tape

Embossed carrier tape

1000pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

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Ordering Information

B M 6 2 1 3

F S -

E 2

ROHM Part Number

Package

FS : SSOP-A54_36

Packaging specification

E2 : Embossed carrier tape

BM6213 : 250V/2.0A, 120°

BM6214 : 250V/2.0A, 150°

BM6215 : 250V/2.0A, 180°sinusoidal

Marking Diagram

SSOP-A54_36

(TOP VIEW)

Part Number Marking

BM6213FS

1PIN MARK

LOT Number

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Revision History

Date

Revision

Changes

27.Jun.2016

001

New release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

BM6213FS - Web Page

Part Number

Package

Unit Quantity

BM6213FS

SSOP-A54_36

1000

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

1000

Taping

inquiry

Yes

BM6215FS-E2 [ROHM]

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