BU1571KN-E2 [ROHM]

Consumer Circuit, ROHS COMPLIANT, VQFN-36;
BU1571KN-E2
型号: BU1571KN-E2
厂家: ROHM    ROHM
描述:

Consumer Circuit, ROHS COMPLIANT, VQFN-36

商用集成电路
文件: 总11页 (文件大小:353K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Image Correction ICs  
Image Correction IC  
for Camera  
BU1571KN  
No.10060ECT01  
Description  
BU1571KN is AIE : Adaptive Image Enhancer (image processing technology by ROHM’s hardware).  
Provides unprecedented visibility under severe conditions, such as darkness or extreme backlighting.  
Features  
1) UXGA size (16001200) for input of image data up to 7.5 fps, SXGA size (12801024) for input of image data up to  
15 fps and VGA size (640480) for input of image data up to 30 fps.  
2) Input data format for YUV=4:2:2 8bit. Order of components may be adjusted by the register.  
3) Operation modes are image enhance mode, through mode, and sleep mode.  
4) Strength of image correction can be set to linear.  
5) Register can be set up with a 2-line serial interface.  
*Extra document is prepared separately about each register setup. Please refer to the Development Scheme on page 6.  
Application  
Security camera, Intercom with camera, Drive recorder, and Web camera etc.  
Lineup matrix  
Supply power source  
voltage  
Camera  
Interface  
Control  
Interface  
Output  
Interface  
Interrupt  
output  
Parameter  
Package  
VQFN36  
Supported up to  
Max 2M pixels.  
(1600×1200)  
8bit  
YUV=4:2:2  
Camera interface  
1.45-1.55(VDDCore)  
2.7-3.6(VDDIo)  
BU1571KN  
I2C BUS  
-
Absolute maximum ratings (Ta=25)  
Parameter  
Symbol  
Ratings  
Unit  
Supply power source voltage 1  
Supply power source voltage 2  
Input voltage  
VDDIO  
VDD  
VIN  
-0.3 ~ +4.2  
-0.3 ~ +2.1  
V
V
-0.3 ~ VDDIO+0.3  
-40 ~ +125  
450  
V
Storage temperature range  
Power dissipation  
Tstg  
mW  
PD  
*In the case exceeding 25, 4.5mW should be reduced at the rating 1.  
Recommended operating range  
Parameter  
Symbol  
Ratings  
Unit  
VDDIO  
VDD  
2.70 ~ 3.60(Typ:3.3V)  
1.45 ~ 1.55(Typ:1.50V)  
0 ~ VDDIO  
V
V
Supply power source voltage 1(IO)  
Supply power source voltage 2(CORE)  
Input voltage range  
VIN-VDDIO  
Topr  
V
-40 ~ +85  
Operating temperature range  
*Please supply power source in order of VDDVDDIO.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.06 - Rev.C  
1/8  
Technical Note  
BU1571KN  
Electric characteristics  
(Unless otherwise specified, VDD=1.50V,VDDIO=3.3V,GND=0.0V,Ta=25,fIN=52.0MHz)  
Limits  
TYP.  
Parameter  
Symbol  
fIN  
Unit  
Condition  
MIN.  
10.0  
MAX.  
52.0  
Input frequency  
-
MHz CAMCKI(DUTY45% ~ 55%)  
mA At enhance mode setting  
Operating consumption current  
Static consumption current  
Input ”H” current 1  
IDD1  
IDDst  
IIH1  
-
15  
-
At sleep mode setting,  
µA  
-
-
30  
10  
140  
10  
10  
input terminal=GND setting  
-10  
35  
-10  
-10  
-
µA VIH=VDDIO  
Input ”H” current 2  
IIH2  
70  
µA Pull-Down terminal, VIH=VDDIO  
µA VIL=GND  
Input ”L” current 1  
IIL1  
-
Input ”L” current 2  
IIL2  
-
µA Pull-Down terminal, VIL=GND  
VDDIO  
0.8  
VDDIO  
+0.3  
Normal input  
(including input mode of I/O terminal)  
Input ”H” voltage 1  
Input ”L” voltage 1  
VIH1  
VIL1  
VIH2  
VIL2  
Vhys  
VOH  
VOL  
-
V
VDDIO  
0.2  
Normal input  
(including input mode of I/O terminal)  
-0.3  
-
V
VDDIO  
0.85  
VDDIO  
+0.3  
Hysteresis input  
(RESETB, CAMCKI, SDA, SDC)  
Input ”H” voltage 2  
Input ”L” voltage 2  
-
V
VDDIO  
0.15  
Hysteresis input  
(RESETB, CAMCKI, SDA, SDC)  
-0.3  
-
-
0.5  
-
V
Hysteresis input  
(RESETB, CAMCKI, SDA, SDC)  
Hysteresis voltage width  
Output ”H” voltage  
-
V
VDDIO  
-0.4  
IOH=-1.0mA(DC)  
(including input mode of I/O terminal)  
VDDIO  
0.4  
V
IOL=1.0mA(DC)  
(including input mode of I/O terminal)  
Output ”L” voltage  
0.0  
-
V
Block Diagram  
Recommended Application Circuit  
CAMDI[7:0]  
YUV=4:2:2  
8
CAMDI[7:0]  
CAMHSI  
CAMDO[7:0]  
CAMDO[7:0]  
YUV=4:2:2  
CAMDO[7:0]  
CAMHSO  
CAMDI[7:0]  
Color  
Correction  
8
CAMHSO  
CAMVSO  
CAMCKO  
Image  
Processing  
IC  
CAMHSI  
CAMVSI  
CAMCKI  
BU1571KN  
CAMVSI  
CAMCKI  
Luminance  
Distinction  
CAMVSO  
Image  
Enhance  
Camera  
Module  
CAMCKO  
SDA SDC  
SDA  
SDC  
SDA  
SDC  
Serial  
Interface  
CAMHSI  
CAMVSI  
CAMHSO  
HOST  
CPU  
Timing  
Generator  
CAMVSO  
CAMCKO  
CAMCKI  
*Extra document is prepared separately about system evaluation. Please refer to the Development Scheme on page 6.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.06 - Rev.C  
2/8  
Technical Note  
BU1571KN  
Terminal functions  
PIN No. PIN Name In/Out Active Level Init  
Function explanation  
I/O type  
B*1  
1
CAMVSI  
N.C.  
In  
*
-
Vertical Timing Input (pull-down at sleep mode)  
2
3
CAMHSI  
CAMDI0  
CAMDI1  
CAMDI2  
CAMDI3  
CAMDI4  
CAMDI5  
CAMDI6  
CAMDI7  
VDDIO  
In  
In  
*
-
-
Horizontal Timing Input (pull-down at sleep mode)  
Data Input Bit 0 (pull-down at sleep mode)  
Data Input Bit 1 (pull-down at sleep mode)  
Data Input Bit 2 (pull-down at sleep mode)  
Data Input Bit 3 (pull-down at sleep mode)  
Data Input Bit 4 (pull-down at sleep mode)  
Data Input Bit 5 (pull-down at sleep mode)  
Data Input Bit 6 (pull-down at sleep mode)  
Data Input Bit 7 (pull-down at sleep mode)  
DIGITAL IO Power Source  
B*1  
B*1  
B*1  
B*1  
B*1  
B*1  
B*1  
B*1  
B*1  
-
4
DATA  
DATA  
DATA  
DATA  
DATA  
DATA  
DATA  
DATA  
PWR  
CLK  
5
In  
-
6
In  
-
7
In  
-
8
In  
-
9
In  
-
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
In  
-
In  
-
-
-
CAMCKI  
GND  
In  
-
Clock Input (pull-down at sleep mode)  
Common GROUND  
D*1  
-
-
GND  
PWR  
DATA  
CLK  
-
VDD  
-
-
CORE Power Source  
-
SDA  
In/Out  
In/Out  
Out  
Out  
In  
In  
-
In/Output Serial Data  
E
SDC  
In/Output Serial Clock  
E
TESTOUT  
CAMVSO  
N.C.  
High  
-
TEST Out Pin ( Keep Open )  
-
-
Vertical Timing Signal Output  
C
CAMHSO  
CAMDO0  
CAMDO1  
CAMDO2  
CAMDO3  
CAMDO4  
CAMDO5  
CAMDO6  
CAMDO7  
TEST1  
Out  
Out  
Out  
Out  
Out  
Out  
Out  
Out  
Out  
In  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Horizontal Timing Signal Output  
Data Output: Bit 0  
C
C
C
C
C
C
C
C
C
B
B
A
-
DATA  
DATA  
DATA  
DATA  
DATA  
DATA  
DATA  
DATA  
Low  
Data Output: Bit 1  
Data Output: Bit 2  
Data Output: Bit 3  
Data Output: Bit 4  
Data Output: Bit 5  
Data Output: Bit 6  
Data Output: Bit 7  
Test Mode Terminal 1 (Connect to GND)  
Test Mode Terminal 2 (Connect to GND)  
System Reset Signal  
DIGITAL IO Power Source  
Clock Output  
TEST2  
In  
Low  
RESETB  
VDDIO  
In  
Low  
-
PWR  
CLK  
CAMCKO  
GND  
Out  
-
C
-
GND  
PWR  
Common GROUND  
VDD  
-
CORE Power Source  
-
*”*” in the Active Level column indicates that it may be changed during set-up of the register. Init indicates pin status when released from reset.  
*1: Pull-down is ON during reset (initial status).  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.06 - Rev.C  
3/8  
Technical Note  
BU1571KN  
Equivalent Circuit Structures of input / output pins  
Type  
The equivalent circuit structure  
Type  
The equivalent circuit structure  
VDDIO  
VDDIO  
VDDIO  
Internal signal  
To internal  
To internal  
A
B
GND  
GND  
GND  
GND  
Input terminal with PULL-DOWN  
VDDIO  
Input terminal with Schmitt  
VDDIO  
VDDIO  
Internal signal  
To internal  
Internal signal  
C
D
GND  
GND  
GND  
GND  
Output terminal  
Hysteresis input terminal with PULL-DOWN  
VDDIO  
To  
VDDIO  
Internal signal  
VDDIO  
internal  
Internal signal  
Internal signal  
GND  
E
GND  
GND  
Hysteresis input / output terminal  
Terminal Layout  
(Bottom View)  
VDD  
GND  
CAMDI6  
CAMDI7  
VDDIO  
CAMCKI  
GND  
CAMCKO  
VDDIO  
RESETB  
TEST2  
TEST1  
VDD  
SDA  
SDC  
CAMDO7  
CAMDO6  
TESTOUT  
www.rohm.com  
2010.06 - Rev.C  
4/8  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU1571KN  
Timing Chart  
1. Two-line serial interface  
1.1 Two-line serial interface timing  
SDA  
tSU;DAT  
tLOW  
tBUF  
tHD;ST  
SDC  
tHD;STA  
tSU;STA  
tSU;STO  
tHD;DAT  
tHIGH  
Table 1 I2C Interface timing  
Symbol  
Parameter  
SDC Clock Frequency  
Hold-time(repetition)STARTconditions  
(The first clock pulse is generated after this period.)  
MIN.  
TYP. MAX. Unit  
fSCL  
0
-
-
400  
-
kHz  
µs  
tHD;STA  
0.6  
fLOW  
The "L" period of SDC clock  
The "H" period of SDC clock  
Setup time of repetitive STARTconditions  
Hold time of SDA  
1.3  
0.6  
0.6  
0
-
-
-
-
-
-
-
-
-
-
µs  
µs  
µs  
µs  
ns  
µs  
µs  
tHIGH  
tSU;STA  
tHD;DAT  
tSU;DAT  
tSU;STO  
tBUF  
Setup time of SDA  
100  
0.6  
1.3  
-
-
-
Setup time of the STOPconditions  
BUS free time between STOPconditions and the STARTconditions  
2. Camera module interface  
2.1. Camera module interface timing  
The input timing of camera image signal on camera I/F is shown in Table 2.  
Table 2. BU1571KN timing (Camera data input)  
CAMVSI  
CAMHSI  
CAMDI0  
Symbol  
tCMS  
Explanation  
MIN. TYP. MAX. UNIT  
CAMCKI Rise / Fall  
Camera set-up Time  
4
4
-
-
-
-
ns  
ns  
CAMDI7  
CAMCKI Rise / Fall  
Camera Hold Time  
tCMH  
CAMCKI  
(CKPOL=“1”)  
CAMCKI  
(CKPOL=“0”)  
tCMS  
tCMH  
The input timing of camera image signal on camera I/F is shown in Table 2.1-2.  
Table 2.  
Symbol  
Camera data output timing  
tPCLK  
Explanation  
MIN. TYP. MAX. UNIT  
CAMCKO  
tPCLK  
Clock Cycle  
19.2  
-
50  
-
-
55  
5
ns  
%
tPHH  
tPHL  
CAMVSO  
CAMHSO  
dPCLK Clock Duty  
45  
-
tPDV  
Decision of CAMDO from  
CAMCKO  
tPDV  
ns  
ns  
CAMDO[7:0]  
tPHL,  
tPHH  
Decision of CAMVSO or  
CAMHSO from CAMCKO  
-
-
5
www.rohm.com  
2010.06 - Rev.C  
5/8  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU1571KN  
Development Scheme  
This technical note is aimed at trying the connectivity in the hardware between customer’s system and our AIE Adaptive  
Image Enhancer series.  
We prepare various data and tools for every development STEP as follows other than this technical note, please contact the  
sales staff in your duty also including the support system.  
(1) Demonstration STEP  
(You can try the standard image processing functions by the standard Demonstration kit at once.)  
You can confirm on TV screen what carried out AIE processing of a camera image and the DVD video image.  
Standard Demonstration board kit  
Demonstration board(TV-INBU1571KNTV-OUT board)  
Demonstration board operation manual  
Demonstration software  
If the software for the trial board is installed in your Windows PC(Windows 2000/XP), more detailed setting is  
possible.  
USB cable  
(2) Confirmation STEP  
(We will respond to customer’s camera module.)  
Specifications  
We will provide specifications for AIE Adaptive Image Enhancer according to customer’s requirements.  
Function explanation  
We will deliver you the function explanation describing detailed functions, register settings, external interfaces,  
timing, and so forth of AIE Adaptive Image Enhancer according to your requests.  
Application note  
We will deliver you the detailed explanation data on application development of AIE Adaptive Image Enhancer  
according to your requests.  
(3) System check STEP  
(You can check the application operation as a system by the kit of system check tools and your camera module.)  
You can check the interface with your camera module and the application operation on the system check board using  
the tools for user’s only.  
System check tools kit  
Board for system evaluation  
Manual for system evaluation  
Macro command file for reference  
*You can check the detailed functions of the application operation by your PC using the macro command file.  
(4) Integrated check STEP with user’s system  
(You can check the application operation as a system on your system check board using the integrated check software.)  
You can check the application operation on the sample LSI-equipped system check board by your camera module using  
the integrated check software.  
On line SupportWe will answer your questions about the software development.  
www.rohm.com  
2010.06 - Rev.C  
6/8  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU1571KN  
Notes for use  
(1)Absolute Maximum Ratings  
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break  
down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode  
exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including  
the use of fuses, etc.  
(2)Operating conditions  
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical  
characteristics are guaranteed under the conditions of each parameter.  
(3)Reverse connection of power supply connector  
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to  
the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.  
(4)Power supply line  
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.  
In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the  
same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the  
diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the  
GND line, give consideration to design the patterns in a similar manner.  
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the  
same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used  
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.  
(5)GND voltage  
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore,  
check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.  
(6)Short circuit between terminals and erroneous mounting  
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break  
down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and  
the power supply or the GND terminal, the ICs can break down.  
(7)Operation in strong electromagnetic field  
Be noted that using ICs in the strong electromagnetic field can malfunction them.  
(8)Inspection with set PCB  
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore,  
be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig  
for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of  
the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static  
electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set  
PCB.  
(9)Input terminals  
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic  
element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.  
Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than  
the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when  
no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a  
voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.  
(10)Ground wiring pattern  
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from  
the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring  
pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention  
not to cause fluctuations in the GND wiring pattern of external parts as well.  
(11)External capacitor  
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in  
the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.  
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2010.06 - Rev.C  
7/8  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU1571KN  
Ordering part number  
B
D
1
5
7
1
K
N
-
E
2
Part No.  
Part No.  
Package  
KN:VQFN36  
Packaging and forming specification  
E2: Embossed tape and reel  
VQFN36  
6.2 0.1  
6.0 0.1  
<Tape and Reel information>  
(1.1)  
Tape  
Embossed carrier tape (with dry pack)  
27  
19  
28  
18  
10  
Quantity  
2500pcs  
E2  
36  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
1
9
0.22 0.05  
M
(
)
0.08  
+0.1  
0.05  
3-  
(0.  
0.6  
(0.5)  
-
0.3  
3
)
5)  
Notice :  
Do not use the dotted line area  
for soldering  
22  
Direction of feed  
1pin  
(0.  
0.5  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
(Unit : mm)  
www.rohm.com  
2010.06 - Rev.C  
8/8  
© 2010 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2014 ROHM Co., Ltd. All rights reserved.  

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