BU6823G [ROHM]
本IC可将时钟输入信号21:12分频并输出。非常适用于希望利用霍尔传感器信号生成的FG信号等，使用14极电机时输出相当于8极电机的FG信号的情况。;
| 型号： | BU6823G |
| 厂家： | 
ROHM |
| 描述： | 本IC可将时钟输入信号21:12分频并输出。非常适用于希望利用霍尔传感器信号生成的FG信号等，使用14极电机时输出相当于8极电机的FG信号的情况。 时钟 电机 传感器 |
| 文件： | 总15页 (文件大小：640K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
For Fan Motor Driver
Fractional Pulse Rate Converter
(Conversion Ratio, 21:12)
BU6823G
General Description
Key Specifications
This IC converts the input clock signal by 12/21 ratio and
output it. It is the best when need to output the FG signal
equivalent to the 8-pole motor when using the 14-pole
motor with the FG signal generated from the Hall sensor
signals.
◼ Input Frequency Range:
◼ Driver Output Current:
◼ Maximum Junction Temperature:
5 Hz to 5 kHz
±5 mA (Max)
+125 °C
Package
W(Typ) x D(Typ) x H(Max)
Features
SSOP5
2.90 mm x 2.80 mm x 1.25 mm
◼ 5V Power Supply
◼ Conversion Ratio, 21:12
◼ Input Frequency Range: 5 Hz to 5 kHz
◼ Small Package, SSOP5
Applications
◼ Air Conditioners, Air Purifiers, Water Pumps,
Dishwashers and Washing Machines
SSOP5
Typical Application Circuit
VCC
IN
OUT
Figure 1. Application Circuit Example
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package
..................................................................................................................................................................................1
Typical Application Circuit ...............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Block Diagram and Pin Configuration.............................................................................................................................................3
Pin Description................................................................................................................................................................................3
Description of Blocks ......................................................................................................................................................................3
Absolute Maximum Ratings ..........................................................................................................................................................4
Thermal Resistance........................................................................................................................................................................4
Recommended Operating Conditions ...........................................................................................................................................5
Electrical Characteristics.................................................................................................................................................................5
Typical Performance Curves (Reference Data) ..............................................................................................................................6
Timing Chart ...................................................................................................................................................................................8
I/O Equivalence Circuits..................................................................................................................................................................8
Operational Notes...........................................................................................................................................................................9
Ordering Information.....................................................................................................................................................................10
Marking Diagram ..........................................................................................................................................................................10
Physical Dimension and Packing Information...............................................................................................................................11
Revision History............................................................................................................................................................................12
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Block Diagram and Pin Configuration
VCC
VCC
5
GND (1)
GND (2)
OUT (3)
(5) VCC
(4) IN
UVLO
VREG
OSC
IN
PULSE RATE CONVERTER
LOGIC
OUT
4
3
1
2
GND
Figure 2. Block Diagram
Figure 3. Pin Configuration
(Top View)
Pin Description
Pin
Name
Function
Pin
Name
Function
1
2
3
GND
GND
OUT
Ground
5
-
VCC
-
Power supply
Ground
-
Converted signal output
4
IN
Signal input pin
Description of Blocks
1. Pulse Rate Conversion Logic
It divides the input clock signal by 12/21, and output the converted signal. Signal processing is performed with reference
to the fall edge of the input signal.
In addition, when the input signal frequency is out of range at signal conversion and it is judged to be too low frequency,
the internal logic circuit outputs no conversion signal (pass through). On the other hand, when it is judged to be too high
frequency, it outputs 35 kHz (Typ) signal.
2. Signal Input Pin
The IN pin is pulled up to VCC internally by a 500 kΩ (Typ) resistor. When using in conjunction with the open-collector /
drain output, the IN pin can be connected directly.
3. Signal Output Pin
The OUT pin is CMOS output. When connecting to the base pin of a bipolar transistor, please do not exceed the rated
current by taking countermeasure such as inserting a current limiting resistor.
4. Under Voltage Lock Out (UVLO) Circuit
To secure the lowest power supply voltage necessary to operate the internal circuit, and to prevent under voltage
malfunctions, an UVLO circuit is built into the internal circuit. When the power supply voltage falls to VUVL and below, the
internal circuit forces output low. When the voltage rises to VUVH and above, the UVLO circuit ends the lock out operation
and returns to normal operation.
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BU6823G
Absolute Maximum Ratings (Tj=25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VCC
VIN
7.0(Note 1)
-0.3 to VCC
10
±5(Note 1)
-55 to +125
125
V
V
Input Voltage
Maximum Input Frequency
Driver Outputs
fINMAX
IOMAX
Tstg
kHz
mA
°C
°C
Storage Temperature Range
Maximum Junction Temperature
Tjmax
(Note) All voltages are with respect to ground unless otherwise specified.
(Note 1) Do not exceed ASO.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
SSOP5
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
376.5
40
185.4
30
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
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Recommended Operating Conditions (Tj=25 °C)
Parameter
Supply Voltage
Symbol
Min
Typ
Max
Unit
VCC
Tj
4.5
-40
5
5.0
5.5
+110
5k
V
Junction Temperature
Input Frequency Range
Input Signal Duty Range
-
-
-
°C
Hz
%
fIN
FDUTY
15
85
(Note) All voltages are with respect to ground unless otherwise specified.
Electrical Characteristics (Unless otherwise specified VCC=5 V and Tj=25 °C)
Parameter
Power Supply
Symbol
Min
Typ
Max
Unit
Conditions
Quiescence Current
Input
ICCQ
0.3
0.46
1.0
mA
VIN=0 V
VIN=0 V
Input Bias Current
Input High Voltage
Input Low Voltage
Output
IIN
6
2.0
0
10
-
15
VCC
0.8
µA
V
VINH
VINL
-
V
Output High Voltage
Output Low Voltage
Under Voltage Lock Out
Release Voltage
Lockout Voltage
VOUTH
VOUTL
VCC-0.40
0
VCC-0.08
0.02
VCC
V
V
IO=-2 mA
IO=2 mA
0.30
VUVH
VUVL
3.3
2.7
3.6
3.0
3.9
3.3
V
V
(Note) All voltages are with respect to ground unless otherwise specified.
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BU6823G
Typical Performance Curves (Reference Data)
1.0
20
15
10
5
+110 °C
+25 °C
-40 °C
-40 °C
+25 °C
+110 °C
0.8
0.6
0.4
0.2
0
0
4.0
4.5
5.0
5.5
6.0
0
1
2
3
4
5
Supply Voltage : VCC [V]
Input Voltage : VIN [V]
Figure 4. Operating Current
(IN = 1kHz)
Figure 5. Input Bias Current
1.5
1.5
+110 °C
+25 °C
-40 °C
+110 °C
+25 °C
-40 °C
1.0
0.5
1.0
0.5
0.0
0.0
-0.5
-0.5
1
1.1
1.2
1.3
1.4
1.5
2.6
2.8
3
3.2
3.4
3.6
3.8
4
Input Voltage : VIN [V]
Supply Voltage : VCC [V]
Figure 6. Input Threshold Voltage
Figure 7. Under Voltage Lock Out
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BU6823G
Typical Performance Curves (Reference Data) - continued
0
0.4
0.3
0.2
0.1
0
-40 °C
+25 °C
+110 °C
+110 °C
+25 °C
-40 °C
-0.1
-0.2
-0.3
-0.4
0
1
2
3
4
5
0
1
2
3
4
5
Source Current : IO [mA]
Sink Current : IO [mA]
Figure 8. Output High Voltage
Figure 9. Output Low Voltage
40
30
20
10
0
5
4
3
2
1
0
-40 °C
+25 °C
+110 °C
-40 °C
+25 °C
+110 °C
0
10
20
30
40
0
1
2
3
4
5
Input Frequency : fIN [Hz]
Input Frequency : fIN [kHz]
Figure 10. Output vs Input Frequency Characteristics
(Low Frequency)
Figure 11. Output vs Input Frequency Characteristics
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BU6823G
Timing Chart
IN
OUT
Figure 12. Timing Chart
I/O Equivalence Circuits
VCC
VCC
IN
OUT
Figure 13. IN
Figure 14. OUT, VCC
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BU6823G
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
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BU6823G
Ordering Information
B U 6 8 2 3 G
-
TR
Part Number
Package
G: SSOP5
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
SSOP5(TOP VIEW)
Part Number Marking
LOT Number
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BU6823G
Physical Dimension and Packing Information
Package Name
SSOP5
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BU6823G
Revision History
Date
Revision
Changes
29.May.2018
30.Sep.2021
001
002
New Release
Page 1: Applications are added.
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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